Entorian Technologies, Inc. (Entorian), formerly Staktek Holdings, Inc., is a provider of electronic systems and sub-systems for enterprise, consumer and other markets. The Company's thin, small outline package (TSOP) and ball grid array (BGA) memory stacking solutions seek to increase operational performance by doubling, tripling or quadrupling the amount of memory in the same physical footprint as required by standard packaging technologies. Its ArctiCore technology is a module technology using a double-sided, multi-layer flexible circuit folded around an aluminum core and is designed for thermal, mechanical and electrical performance. The Company's other memory module technologies enable custom, as well as JEDEC-standard registered dual in-line memory module (R-DIMM), fully buffered dual in-line memory module (FB-DIMM) and small outline dual in-line memory modules (SO-DIMMs).