Tessera Technologies, Inc.  

(Public, NASDAQ:TSRA)   Watch this stock  
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26.57
-0.02 (-0.08%)
Feb 12 - Close
NASDAQ real-time data - Disclaimer
Currency in USD
Range 26.44 - 27.04
52 week 26.21 - 43.71
Open 26.86
Vol / Avg. 1.54M/422,090.00
Mkt cap 1.35B
P/E 11.96
Div/yield 0.20/3.01
EPS 2.22
Shares 51.00M
Beta 1.25
Inst. own 100%
May 3, 2016
Q1 2016 Tessera Technologies Inc Earnings Release (Estimated) - 4:00PM EDT - Add to calendar
Apr 29, 2016
Tessera Technologies Inc Annual Shareholders Meeting (Estimated) - 2:00PM EDT - Add to calendar
Feb 2, 2016
Q4 2015 Tessera Technologies Inc Earnings Call
Feb 2, 2016
Q4 2015 Tessera Technologies Inc Earnings Release
Jan 14, 2016
Tessera Technologies Inc at Needham Growth Conference
More events from DailyFinance »    

Key stats and ratios

Q4 (Dec '15) 2015
Net profit margin 36.94% 42.85%
Operating margin 54.10% 59.35%
EBITD margin - 72.07%
Return on average assets 16.81% 20.98%
Return on average equity 17.60% 22.17%
Employees 203 -
CDP Score - -

Address

3025 Orchard Pkwy
SAN JOSE, CA 95134-2017
United States - Map
+1-408-3216000 (Phone)
+1-408-3218257 (Fax)

Website links

External links

Analyst Estimates - MarketWatch
SEC Filings - EDGAR Online
Major Holders - MSN Money

Description

Tessera Technologies, Inc. is a holding company. The Company operates its business through its subsidiaries, which include Invensas Corporation (Invensas), which is engaged in semiconductor interconnect innovation and intellectual property licensing, and FotoNation Limited (FotoNation), which provides face-oriented imaging technologies. Its technologies include semiconductor packaging and interconnect solutions, and products and solutions for mobile and imaging, including its LifeFocus, FaceTools, FacePower, FotoSavvy, DigitalAperture, face beautification, red-eye removal, high dynamic range, autofocus, panorama and image stabilization intellectual property. Its packaging capabilities include a low-temperature wafer bonding technology platform that manages the delivery of 2.5-dimensional (2.5D) and three-dimensional integrated circuit (3D-IC) solutions. The Company’s 2.5D and 3D-IC solutions include ZiBond direct bonding and DBI hybrid bonding technologies.

Officers and directors

Thomas A. Lacey Chief Executive Officer, Director
Age: 56
Bio & Compensation  - Reuters
Robert J Andersen Chief Financial Officer, Executive Vice President
Age: 50
Bio & Compensation  - Reuters
Craig Mitchell President of Invensas Corporation
Age: 43
Bio & Compensation  - Reuters
Steven L. Teig Chief Technology Officer
Age: 47
Bio & Compensation  - Reuters
Richard S. Hill Non-Executive Chairman of the Board
Age: 64
Bio & Compensation  - Reuters
Tudor Brown Independent Director
Age: 56
Bio & Compensation  - Reuters
John Chenault Independent Director
Age: 67
Bio & Compensation  - Reuters
George Andrew Riedel Independent Director
Age: 57
Bio & Compensation  - Reuters
Christopher A. Seams Independent Director
Age: 52
Bio & Compensation  - Reuters