Tessera Technologies, Inc.  

(Public, NASDAQ:TSRA)   Watch this stock  
Find more results for TSRA
-0.30 (-0.88%)
Real-time:   9:47AM EDT
NASDAQ real-time data - Disclaimer
Currency in USD
Range 33.01 - 33.18
52 week 24.84 - 43.71
Open 33.09
Vol / Avg. 3,371.00/497,842.00
Mkt cap 1.72B
P/E 8.81
Div/yield 0.20/2.42
EPS 3.75
Shares 52.12M
Beta 1.25
Inst. own 98%
Oct 28, 2015
Q3 2015 Tessera Technologies Inc Earnings Release (Estimated) - 4:00PM EDT - Add to calendar
Sep 17, 2015
Tessera Technologies Inc at Credit Suisse Small & Mid Cap Conference
Aug 3, 2015
Q2 2015 Tessera Technologies Inc Earnings Call - Webcast
Aug 3, 2015
Q2 2015 Tessera Technologies Inc Earnings Release
More events from DailyFinance »    

Key stats and ratios

Q2 (Jun '15) 2014
Net profit margin 40.15% 62.75%
Operating margin 57.37% 59.43%
EBITD margin - 72.02%
Return on average assets 18.23% 32.95%
Return on average equity 19.08% 35.64%
Employees 203 -
CDP Score - -


3025 Orchard Pkwy
SAN JOSE, CA 95134-2017
United States - Map
+1-408-3216000 (Phone)
+1-408-3218257 (Fax)

Website links

External links

Analyst Estimates - MarketWatch
SEC Filings - EDGAR Online
Major Holders - MSN Money


Tessera Technologies, Inc. is a holding company. The Company operates its business through its subsidiaries, which include Invensas Corporation (Invensas), which is engaged in semiconductor interconnect innovation and intellectual property licensing, and FotoNation Limited (FotoNation), which provides face-oriented imaging technologies. Its technologies include semiconductor packaging and interconnect solutions, and products and solutions for mobile and imaging, including its LifeFocus, FaceTools, FacePower, FotoSavvy, DigitalAperture, face beautification, red-eye removal, high dynamic range, autofocus, panorama and image stabilization intellectual property. Its packaging capabilities include a low-temperature wafer bonding technology platform that manages the delivery of 2.5-dimensional (2.5D) and three-dimensional integrated circuit (3D-IC) solutions. The Company’s 2.5D and 3D-IC solutions include ZiBond direct bonding and DBI hybrid bonding technologies.

Officers and directors

Thomas A. Lacey Chief Executive Officer, Director
Bio & Compensation  - Reuters
Robert J. Andersen Chief Financial Officer, Executive Vice President
Age: 50
Bio & Compensation  - Reuters
Craig Mitchell Chief Technology Officer, President of Invensas Corporation
Age: 43
Bio & Compensation  - Reuters
Richard S. Hill Non-Executive Chairman of the Board
Age: 63
Bio & Compensation  - Reuters
Tudor Brown Independent Director
Age: 56
Bio & Compensation  - Reuters
John Chenault Independent Director
Age: 67
Bio & Compensation  - Reuters
George Andrew Riedel Independent Director
Age: 57
Bio & Compensation  - Reuters
Christopher A. Seams Independent Director
Age: 52
Bio & Compensation  - Reuters