FormFactor, Inc.  

(Public, NASDAQ:FORM)   Watch this stock  
Find more results for FORM
9.68
-0.17 (-1.73%)
After Hours: 9.68 0.00 (0.00%)
Jul 28, 4:55PM EDT  
NASDAQ real-time data - Disclaimer
Currency in USD
Range 9.67 - 9.84
52 week 5.66 - 10.14
Open 9.81
Vol / Avg. 144,683.00/494,916.00
Mkt cap 578.29M
P/E     -
Div/yield     -
EPS -0.28
Shares 59.44M
Beta 1.21
Inst. own 95%
Aug 2, 2016
Q2 2016 FormFactor Inc Earnings Call - 4:30PM EDT - Add to calendar
Aug 2, 2016
Q2 2016 FormFactor Inc Earnings Release Add to calendar
Jul 13, 2016
FormFactor Inc at CEO Investor Summit
Jun 7, 2016
FormFactor Inc at Stifel Technology Internet & Media Conference
Jun 2, 2016
FormFactor Inc at Cowen Technology, Media & Telecom Conference
Jun 1, 2016
FormFactor Inc at DA Davidson Technology Forum
May 25, 2016
FormFactor Inc at B. Riley Investor Conference
May 20, 2016
FormFactor Inc Annual Shareholders Meeting
More events from DailyFinance »    

Key stats and ratios

Q1 (Mar '16) 2015
Net profit margin -25.74% -0.54%
Operating margin -25.32% -1.45%
EBITD margin - 7.17%
Return on average assets -16.20% -0.44%
Return on average equity -19.06% -0.52%
Employees 958 -
CDP Score - -

Address

7005 Southfront Rd
LIVERMORE, CA 94551-8201
United States - Map
+1-925-2433522 (Phone)
+1-925-2904010 (Fax)

Website links

External links

Analyst Estimates - MarketWatch
SEC Filings - EDGAR Online
Major Holders - MSN Money

Description

FormFactor, Inc. designs, develops, manufactures, sells and supports semiconductor probe card products. The Company is a supplier of probe cards to the manufacturers of dynamic random-access memory (DRAM), flash memory devices, microprocessor, chipset and other system on chip (SoC) devices. Semiconductor manufacturers use its probe cards to perform wafer test, which is the testing of the semiconductor die, or chips. The Company's products utilize a range of technologies, including micro-electromechanical systems (MEMS) technologies, automation systems, various product architectures and design tools. Its MEMS technologies enable manufacturing of multi-material composite spring-like electrically-conductive contact elements. These contact elements, such as its MicroSpring contacts, optimize the relative amounts of force on, and across, a chip's bond pad, solder bump or copper pillar during the test process, and maintain their shape and position over a range of compression.

Officers and directors

Thomas St. Dennis Executive Chairman of the Board
Age: 62
Bio & Compensation  - Reuters
Michael D. Slessor Chief Executive Officer, Director
Age: 46
Bio & Compensation  - Reuters
Michael M. Ludwig Chief Financial Officer
Age: 54
Bio & Compensation  - Reuters
Richard DeLateur Lead Independent Director
Age: 58
Bio & Compensation  - Reuters
Raymond A. Link CPA Independent Director
Age: 62
Bio & Compensation  - Reuters
Lothar Maier Independent Director
Age: 61
Bio & Compensation  - Reuters
Edward Rogas Jr. Independent Director
Age: 75
Bio & Compensation  - Reuters
Kelley Steven-Waiss Independent Director
Age: 46
Bio & Compensation  - Reuters