Kulicke and Soffa Industries Inc.  

(Public, NASDAQ:KLIC)   Watch this stock  
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15.83
+0.29 (1.87%)
Mar 30 - Close
NASDAQ real-time data - Disclaimer
Currency in USD
Range 15.43 - 15.92
52 week 11.74 - 16.54
Open 15.58
Vol / Avg. 0.00/469,012.00
Mkt cap 1.19B
P/E 16.88
Div/yield     -
EPS 0.94
Shares 76.77M
Beta 1.40
Inst. own 82%
May 5, 2015
Q2 2015 Kulicke and Soffa Industries Inc Earnings Release - 9:30AM EDT - Add to calendar
May 5, 2015
Q2 2015 Kulicke and Soffa Industries Inc Earnings Call - 8:00AM EDT - Add to calendar
Feb 3, 2015
Kulicke and Soffa Industries Inc Annual Shareholders Meeting - Webcast
Jan 28, 2015
Q1 2015 Kulicke and Soffa Industries Inc Earnings Release
Jan 28, 2015
Q1 2015 Kulicke and Soffa Industries Inc Earnings Call
Jan 5, 2015
Kulicke and Soffa Industries Inc M&A Call - Assembl�on B.V. Acquisition
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Key stats and ratios

Q4 (Dec '14) 2014
Net profit margin 7.30% 11.08%
Operating margin 9.05% 13.54%
EBITD margin - 15.92%
Return on average assets 3.36% 6.97%
Return on average equity 3.98% 8.37%
Employees 1,943 -
CDP Score - -

Address

23A Serangoon North Avenue 5 #01-01 K&S Corporate Headquarters
FORT WASHINGTON, 554369
Singapore
+1-215-7846000 (Phone)

Website links

External links

Analyst Estimates - MarketWatch
SEC Filings - EDGAR Online
Major Holders - MSN Money

Description

Kulicke and Soffa Industries, Inc. (K&S), designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (IC), high and low powered discrete devices, light-emitting diodes (LEDs), and power modules. The Company also service, maintain, repair and upgrade its equipment. Its customers consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers. The Company operates in two business segments: Equipment and Expendable Tools. The Company�s Equipment segment manufactures and sells a line of ball bonders, heavy wire wedge bonders and wafer level bonders. Expendable Tools segment manufactures and sells a variety of expendable tools for a range of semiconductor packaging applications. Its Expendable Tools segment products include: capillaries, bonding wedges and dicing blades.

Officers and directors

Garrett E. Pierce Independent Chairman of the Board
Age: 70
Bio & Compensation  - Reuters
Bruno Guilmart President, Chief Executive Officer, Director
Age: 54
Bio & Compensation  - Reuters
Jonathan H. Chou Chief Financial Officer, Senior Vice President
Age: 50
Bio & Compensation  - Reuters
Lester A. Wong Senior Vice President - Legal Affairs, General Counsel
Age: 47
Bio & Compensation  - Reuters
Yih-Neng Lee Senior Vice President - Global Sales and Service
Age: 55
Bio & Compensation  - Reuters
Irene Lee Senior Vice President, Global Operations and Chief Quality Officer
Bio & Compensation  - Reuters
Soo Li Lam Principal Accounting Officer, Vice President, Controller
Age: 48
Bio & Compensation  - Reuters
Chan Pin Chong Vice President -Wedge Bonder Business Unit
Bio & Compensation  - Reuters
Deepak K. Sood Vice President - Global Engineering
Age: 52
Bio & Compensation  - Reuters
Nelson Wong Vice President - Ball and Die Bonder Business Unit Management
Age: 53
Bio & Compensation  - Reuters