Siliconware Precision Industries (ADR)  

(Public, NASDAQ:SPIL)   Watch this stock  
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6.96
-0.01 (-0.14%)
Apr 22 - Close
NASDAQ real-time data - Disclaimer
Currency in USD
Range 6.91 - 6.99
52 week 5.11 - 7.15
Open 6.99
Vol / Avg. 0.00/742,816.00
Mkt cap 4.36B
P/E 22.34
Div/yield 0.23/3.25
EPS 0.31
Shares 627.00M
Beta 1.35
Inst. own 9%
Jun 20, 2014
Siliconware Precision Industries Co Ltd Annual General Meeting Add to calendar
Apr 30, 2014
Q1 2014 Siliconware Precision Industries Co Ltd Earnings Conference Call - 2:30AM EDT - Add to calendar
Apr 30, 2014
Q1 2014 Siliconware Precision Industries Co Ltd Earnings Release - 2:30AM EDT - Add to calendar
Apr 7, 2014
Siliconware Precision Industries Co Ltd Sales Release - March 2014
Mar 19, 2014
Siliconware Precision Industries Co Ltd at Bank of America Merrill Lynch Taiwan, Technology & Beyond (One on One Meeting)
Mar 5, 2014
Siliconware Precision Industries Co Ltd Sales Release - February 2014
Mar 5, 2014
Siliconware Precision Industries Co Ltd at Barclays Asia Smart Mobility Corporate Days - New York
Feb 10, 2014
Siliconware Precision Industries Co Ltd Sales Release - January 2014
Jan 27, 2014
Q4 2013 Siliconware Precision Industries Co Ltd Earnings Conference Call (Mandarin and English)
Jan 27, 2014
Q4 2013 Siliconware Precision Industries Co Ltd Earnings Release
More events from DailyFinance »    

Key stats and ratios

Q4 (Dec '13) 2013
Net profit margin 11.99% 8.50%
Operating margin 13.87% 11.28%
EBITD margin - 27.35%
Return on average assets 8.93% 6.09%
Return on average equity 14.76% 9.67%
Employees 22,831 -
CDP Score - -

Address

No. 123, Sec. 3 Section 3, Da Fong Road, Dafong Village Tantzu
TAICHUNG, 427
Taiwan
+886-42-5341525 (Phone)
+886-42-5346278 (Fax)

Website links

External links

Analyst Estimates - MarketWatch
SEC Filings - EDGAR Online
Major Holders - MSN Money

Description

Siliconware Precision Industries Co., Ltd. is principally engaged in the provision of semiconductor packaging and testing services. The Company operates its businesses through packaging services, which deals with ball grid array (BGA) integrated circuits (ICs), flip-chip BGA ICs and other IC products; bumping services, which offers 8- and 12-inch wafer bumping; testing services, which deals with 8- and 12-inch wafer sort testing, final testing and system level testing, as well as other business, which offers flash memory cards and other products. During the year ended December 31, 2011, the Company obtained approximately 85% of its total revenue from packaging services. It operates its businesses primarily in Taiwan and North America.

Officers and directors

Wenbo Lin Chairman of the Board, Executive Deputy General Manager
Bio & Compensation  - Reuters
Qiwen Cai Vice Chairman of the Board, General Manager
Bio & Compensation  - Reuters
Yanjun Zhang Senior Deputy General Manager, Director
Bio & Compensation  - Reuters
Jianhua Chen Deputy General Manager
Bio & Compensation  - Reuters
Shufen Chen Deputy General Manager
Bio & Compensation  - Reuters
Yongchuan Gu Deputy General Manager
Bio & Compensation  - Reuters
Kunyi Jian Senior Deputy General Manager
Bio & Compensation  - Reuters
Yumeng Lin Deputy General Manager
Bio & Compensation  - Reuters
Guanghua Ma Deputy General Manager
Bio & Compensation  - Reuters
Yusheng Wu Deputy General Manager
Bio & Compensation  - Reuters