Siliconware Precision Industries Co., Ltd. provides semiconductor packaging and testing services. The Company offers a range of packaging and testing solutions, including packages, substrate packages and lead-frame packages, as well as testing for logic and mixed signal devices. It provides packaging and testing services to approximately 100 customers across the world. The Company focuses on customers in the personal computer, communications, consumer integrated circuits and non-commodity memory semiconductor markets. It provides services in Taiwan through its facilities located in Taichung, Hsinchu and Changhua. The Company offers Ball Grid Array (BGA), Chip Scale Package (CSP), Memory Card, Multi-Package and Stacked Die. Its technologies include Thin Wafer Technology, Thin Molding Technology, Fingerprint Sensor Assembly Technology and Fine Pitch Wire Bonding Technology. It provides a range of services, including assembly services, test services and bumping services.