Siliconware Precision Industries (ADR)  

(Public, NASDAQ:SPIL)   Watch this stock  
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8.49
+0.23 (2.78%)
Apr 27 - Close
NASDAQ real-time data - Disclaimer
Currency in USD
Range 8.41 - 8.58
52 week 6.30 - 9.17
Open 8.41
Vol / Avg. 1.54M/1.03M
Mkt cap 5.27B
P/E 13.92
Div/yield 0.30/3.53
EPS 0.61
Shares 3.12B
Beta 1.25
Inst. own 2%
Jun 16, 2015
Siliconware Precision Industries Co Ltd Annual Shareholders Meeting Add to calendar
Apr 29, 2015
Q1 2015 Siliconware Precision Industries Co Ltd Earnings Call - 8:00AM EDT - Add to calendar
Apr 29, 2015
Q1 2015 Siliconware Precision Industries Co Ltd Earnings Call (Chinese) - 2:30AM EDT - Add to calendar
Apr 29, 2015
Q1 2015 Siliconware Precision Industries Co Ltd Earnings Release - 2:30AM EDT - Add to calendar
Apr 7, 2015
March 2015 Siliconware Precision Industries Co Ltd Corporate Sales Release
Mar 25, 2015
Siliconware Precision Industries Co Ltd at Credit Suisse Asian Investment Conference
Mar 5, 2015
February 2015 Siliconware Precision Industries Co Ltd Corporate Sales Release
Feb 5, 2015
January 2015 Siliconware Precision Industries Co Ltd Corporate Sales Release
Jan 28, 2015
Q4 2014 Siliconware Precision Industries Co Ltd Earnings Call
Jan 28, 2015
Q4 2014 Siliconware Precision Industries Co Ltd Earnings Call (Chinese)
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Key stats and ratios

Q4 (Dec '14) 2014
Net profit margin 14.05% 14.12%
Operating margin 17.98% 16.62%
EBITD margin - 31.59%
Return on average assets 9.94% 10.13%
Return on average equity 17.22% 17.43%
Employees 22,799 -
CDP Score - -

Address

No. 123, Sec. 3 Section 3, Da Fong Road, Dafong Village Tantzu
TAICHUNG, 427
Taiwan
+886-4-25341525 (Phone)
+886-4-25346278 (Fax)

Website links

External links

Analyst Estimates - MarketWatch
SEC Filings - EDGAR Online
Major Holders - MSN Money

Description

Siliconware Precision Industries Co., Ltd. is principally engaged in the provision of semiconductor packaging and testing services. The Company operates its businesses through packaging services, which deals with plastic small outline integrated circuits (ICs), plastic quad flat packaging IC, ball grid array (BGA) ICs, quad flat no-lead ICs, chip scale packaging ICs and other IC products; bumping services, which offers 8- and 12-inch wafer bumping; testing services, which deals with 8- and 12-inch wafer sort testing, final testing and system level testing, as well as other business, which offers flash memory cards and other products. During the year ended December 31, 2013, the Company obtained approximately 81% of its total revenue from packaging services. It operates its businesses primarily in Taiwan and North America.

Officers and directors

Wenbo Lin Chairman of the Board, Executive Deputy General Manager
Bio & Compensation  - Reuters
Qiwen Cai Vice Chairman of the Board, General Manager
Bio & Compensation  - Reuters
Yanjun Zhang Senior Deputy General Manager, Director
Bio & Compensation  - Reuters
Jianhua Chen Deputy General Manager
Bio & Compensation  - Reuters
Shufen Chen Deputy General Manager
Bio & Compensation  - Reuters
Yongchuan Gu Deputy General Manager
Bio & Compensation  - Reuters
Kunyi Jian Senior Deputy General Manager
Bio & Compensation  - Reuters
Yumeng Lin Deputy General Manager
Bio & Compensation  - Reuters
Guanghua Ma Deputy General Manager
Bio & Compensation  - Reuters
Yusheng Wu Deputy General Manager
Bio & Compensation  - Reuters