Siliconware Precision Industries (ADR)  

(Public, NASDAQ:SPIL)   Watch this stock  
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6.67
+0.05 (0.76%)
May 5 - Close
NASDAQ real-time data - Disclaimer
Currency in USD
Range 6.60 - 6.88
52 week 4.91 - 8.37
Open 6.68
Vol / Avg. 882,410.00/811,807.00
Mkt cap 3.92B
P/E 15.93
Div/yield 0.46/6.87
EPS 0.42
Shares 3.12B
Beta 0.77
Inst. own 1%
Jul 29, 2016
Q2 2016 Siliconware Precision Industries Co Ltd Earnings Release Add to calendar
May 15, 2016
Siliconware Precision Industries Co Ltd Annual Shareholders Meeting - 9:30PM EDT - Add to calendar
May 5, 2016
April 2016 Siliconware Precision Industries Co Ltd Corporate Sales Release (Estimated)
Apr 28, 2016
Q1 2016 Siliconware Precision Industries Co Ltd Earnings Call
Apr 28, 2016
Q1 2016 Siliconware Precision Industries Co Ltd Earnings Call (Chinese)
Apr 28, 2016
Q1 2016 Siliconware Precision Industries Co Ltd Earnings Release
Apr 7, 2016
March 2016 Siliconware Precision Industries Co Ltd Corporate Sales Release
Mar 7, 2016
February 2016 Siliconware Precision Industries Co Ltd Corporate Sales Release
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Key stats and ratios

Q4 (Dec '15) 2015
Net profit margin -1.02% 10.58%
Operating margin 7.30% 13.84%
EBITD margin - 32.31%
Return on average assets -0.70% 6.93%
Return on average equity -1.22% 12.28%
Employees 23,611 -
CDP Score - 98 C

Address

No. 123, Sec. 3 Section 3, Da Fong Road, Dafong Village Tantzu
TAICHUNG, 427
Taiwan
+886-42-5341525 (Phone)
+886-4-25346278 (Fax)

Website links

External links

Analyst Estimates - MarketWatch
SEC Filings - EDGAR Online
Major Holders - MSN Money

Description

Siliconware Precision Industries Co., Ltd. is an independent provider of semiconductor packaging and testing services. The Company offers packaging and testing solutions, including advanced packages, substrate packages and lead-frame packages, as well as testing for logic and mixed signal devices. It also offers its customers turnkey service, from packaging and testing to shipment service. It focuses on customers in the personal computer, communications, consumer integrated circuits and non-commodity memory semiconductor markets. It develops advanced packaging technologies, such as flip-chip and wafer bumping technologies. It provides testing services, such as wafer probing, final testing, tooling design and other testing services. It provides final testing services for a range of logic and mixed signal and radio frequency integrated circuit packages and other integrated circuit packages, including complex and high-performance integrated circuits, as well as lower-performance ones.

Officers and directors

Wenbo Lin Chairman of the Board, Executive Deputy General Manager
Bio & Compensation  - Reuters
Qiwen Cai Vice Chairman of the Board, General Manager
Bio & Compensation  - Reuters
Yanjun Zhang Senior Deputy General Manager, Director
Bio & Compensation  - Reuters
Jianhua Chen Deputy General Manager
Bio & Compensation  - Reuters
Shufen Chen Deputy General Manager
Bio & Compensation  - Reuters
Yongchuan Gu Deputy General Manager
Bio & Compensation  - Reuters
Kunyi Jian Senior Deputy General Manager
Bio & Compensation  - Reuters
Quanfeng Li Deputy General Manager
Bio & Compensation  - Reuters
Yumeng Lin Deputy General Manager
Bio & Compensation  - Reuters
Guanghua Ma Deputy General Manager
Bio & Compensation  - Reuters