Siliconware Precision Industries (ADR)  

(Public, NASDAQ:SPIL)   Watch this stock  
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5.83
0.00 (0.00%)
Jul 28 - Close
NASDAQ real-time data - Disclaimer
Currency in USD
Range 5.80 - 5.91
52 week 5.71 - 9.17
Open 5.88
Vol / Avg. 1.46M/975,254.00
Mkt cap 3.68B
P/E 9.83
Div/yield 0.48/8.31
EPS 0.59
Shares 3.12B
Beta 1.31
Inst. own 2%
Aug 3, 2015
July 2015 Siliconware Precision Industries Co Ltd Corporate Sales Release (Estimated) - 1:30AM EDT - Add to calendar
Jul 29, 2015
Q2 2015 Siliconware Precision Industries Co Ltd Earnings Call - 8:00AM EDT - Add to calendar
Jul 29, 2015
Q2 2015 Siliconware Precision Industries Co Ltd Earnings Call (Chinese) - 2:30AM EDT - Add to calendar
Jul 29, 2015
Q2 2015 Siliconware Precision Industries Co Ltd Earnings Release - 2:30AM EDT - Add to calendar
Jul 6, 2015
June 2015 Siliconware Precision Industries Co Ltd Corporate Sales Release
Jun 23, 2015
Siliconware Precision Industries Co Ltd at UBS Taiwan Conference
Jun 15, 2015
Siliconware Precision Industries Co Ltd Annual Shareholders Meeting
Jun 5, 2015
May 2015 Siliconware Precision Industries Co Ltd Corporate Sales Release
May 14, 2015
Siliconware Precision Industries Co Ltd at Macquarie North Asia Corporate Day
May 5, 2015
April 2015 Siliconware Precision Industries Co Ltd Corporate Sales Release
More events from DailyFinance »    

Key stats and ratios

Q1 (Mar '15) 2014
Net profit margin 12.57% 13.50%
Operating margin 16.67% 16.45%
EBITD margin - 32.03%
Return on average assets 8.16% 9.69%
Return on average equity 14.38% 16.91%
Employees 23,611 -
CDP Score - -

Address

No. 123, Sec. 3 Section 3, Da Fong Road, Dafong Village Tantzu
TAICHUNG, 427
Taiwan
+886-42-5341525 (Phone)
+886-4-25346278 (Fax)

Website links

External links

Analyst Estimates - MarketWatch
SEC Filings - EDGAR Online
Major Holders - MSN Money

Description

Siliconware Precision Industries Co., Ltd. is an independent provider of semiconductor packaging and testing services. The Company offers packaging and testing solutions, including advanced packages, substrate packages and lead-frame packages, as well as testing for logic and mixed signal devices. It also offers its customers turnkey service, from packaging and testing to shipment service. It focuses on customers in the personal computer, communications, consumer integrated circuits and non-commodity memory semiconductor markets. It develops advanced packaging technologies, such as flip-chip and wafer bumping technologies. It provides testing services, such as wafer probing, final testing, tooling design and other testing services. It provides final testing services for a range of logic and mixed signal and radio frequency integrated circuit packages and other integrated circuit packages, including complex and high-performance integrated circuits, as well as lower-performance ones.

Officers and directors

Wenbo Lin Chairman of the Board, Executive Deputy General Manager
Bio & Compensation  - Reuters
Qiwen Cai Vice Chairman of the Board, General Manager
Bio & Compensation  - Reuters
Yanjun Zhang Senior Deputy General Manager, Director
Bio & Compensation  - Reuters
Jianhua Chen Deputy General Manager
Bio & Compensation  - Reuters
Shufen Chen Deputy General Manager
Bio & Compensation  - Reuters
Yongchuan Gu Deputy General Manager
Bio & Compensation  - Reuters
Kunyi Jian Senior Deputy General Manager
Bio & Compensation  - Reuters
Yumeng Lin Deputy General Manager
Bio & Compensation  - Reuters
Guanghua Ma Deputy General Manager
Bio & Compensation  - Reuters
Yusheng Wu Deputy General Manager
Bio & Compensation  - Reuters