Siliconware Precision Industries (ADR)  

(Public, NASDAQ:SPIL)   Watch this stock  
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-0.04 (-0.54%)
Oct 27 - Close
NASDAQ real-time data - Disclaimer
Currency in USD
Range 7.34 - 7.43
52 week 6.55 - 8.36
Open 7.41
Vol / Avg. 109,011.00/262,297.00
Mkt cap 4.66B
P/E 21.74
Div/yield 0.59/8.04
EPS 0.34
Shares 3.12B
Beta 0.73
Inst. own 1%
Oct 19, 2016
Q3 2016 Siliconware Precision Industries Co Ltd Earnings Release (Estimated)
Oct 5, 2016
September 2016 Siliconware Precision Industries Co Ltd Corporate Sales Release
Sep 5, 2016
August 2016 Siliconware Precision Industries Co Ltd Corporate Sales Release
Aug 5, 2016
July 2016 Siliconware Precision Industries Co Ltd Corporate Sales Release
More events from DailyFinance »    

Key stats and ratios

Q2 (Jun '16) 2015
Net profit margin 12.96% 10.58%
Operating margin 13.12% 13.84%
EBITD margin - 32.31%
Return on average assets 9.04% 6.93%
Return on average equity 16.65% 12.28%
Employees 23,611 -
CDP Score - 98 C


No. 123, Sec. 3 Section 3, Da Fong Road, Dafong Village Tantzu
+886-42-5341525 (Phone)
+886-4-25346278 (Fax)

Website links

External links

Analyst Estimates - MarketWatch
SEC Filings - EDGAR Online
Major Holders - MSN Money


Siliconware Precision Industries Co., Ltd. provides semiconductor packaging and testing services. The Company offers a range of packaging and testing solutions, including packages, substrate packages and lead-frame packages, as well as testing for logic and mixed signal devices. It provides packaging and testing services to approximately 100 customers across the world. The Company focuses on customers in the personal computer, communications, consumer integrated circuits and non-commodity memory semiconductor markets. It provides services in Taiwan through its facilities located in Taichung, Hsinchu and Changhua. The Company offers Ball Grid Array (BGA), Chip Scale Package (CSP), Memory Card, Multi-Package and Stacked Die. Its technologies include Thin Wafer Technology, Thin Molding Technology, Fingerprint Sensor Assembly Technology and Fine Pitch Wire Bonding Technology. It provides a range of services, including assembly services, test services and bumping services.

Officers and directors

Wenbo Lin Chairman of the Board, Executive Deputy General Manager
Bio & Compensation  - Reuters
Qiwen Cai Vice Chairman of the Board, General Manager
Bio & Compensation  - Reuters
Yanjun Zhang Senior Deputy General Manager, Director
Bio & Compensation  - Reuters
Jianhua Chen Deputy General Manager
Bio & Compensation  - Reuters
Shufen Chen Deputy General Manager
Bio & Compensation  - Reuters
Yongchuan Gu Deputy General Manager
Bio & Compensation  - Reuters
Kunyi Jian Senior Deputy General Manager
Bio & Compensation  - Reuters
Quanfeng Li Deputy General Manager
Bio & Compensation  - Reuters
Yumeng Lin Deputy General Manager
Bio & Compensation  - Reuters
Guanghua Ma Deputy General Manager
Bio & Compensation  - Reuters