Siliconware Precision Industries (ADR)  

(Public, NASDAQ:SPIL)   Watch this stock  
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7.43
-0.03 (-0.40%)
After Hours: 7.43 0.00 (0.00%)
Jul 28, 4:00PM EDT  
NASDAQ real-time data - Disclaimer
Currency in USD
Range 7.43 - 7.51
52 week 4.91 - 8.36
Open 7.49
Vol / Avg. 70,645.00/306,103.00
Mkt cap 4.67B
P/E 20.20
Div/yield 0.59/7.97
EPS 0.37
Shares 3.12B
Beta 0.76
Inst. own 1%
Oct 4, 2016
Q3 2016 Siliconware Precision Industries Co Ltd Earnings Release (Estimated) Add to calendar
Jul 27, 2016
Q2 2016 Siliconware Precision Industries Co Ltd Earnings Release
Jul 5, 2016
June 2016 Siliconware Precision Industries Co Ltd Corporate Sales Release
Jun 6, 2016
May 2016 Siliconware Precision Industries Co Ltd Corporate Sales Release
May 15, 2016
Siliconware Precision Industries Co Ltd Annual Shareholders Meeting
May 5, 2016
April 2016 Siliconware Precision Industries Co Ltd Corporate Sales Release
More events from DailyFinance »    

Key stats and ratios

Q1 (Mar '16) 2015
Net profit margin 8.31% 10.58%
Operating margin 9.75% 13.84%
EBITD margin - 32.31%
Return on average assets 5.23% 6.93%
Return on average equity 9.00% 12.28%
Employees 23,611 -
CDP Score - 98 C

Address

No. 123, Sec. 3 Section 3, Da Fong Road, Dafong Village Tantzu
TAICHUNG, 427
Taiwan
+886-42-5341525 (Phone)
+886-4-25346278 (Fax)

Website links

External links

Analyst Estimates - MarketWatch
SEC Filings - EDGAR Online
Major Holders - MSN Money

Description

Siliconware Precision Industries Co., Ltd. provides semiconductor packaging and testing services. The Company offers a range of packaging and testing solutions, including packages, substrate packages and lead-frame packages, as well as testing for logic and mixed signal devices. It provides packaging and testing services to approximately 100 customers across the world. The Company focuses on customers in the personal computer, communications, consumer integrated circuits and non-commodity memory semiconductor markets. It provides services in Taiwan through its facilities located in Taichung, Hsinchu and Changhua. The Company offers Ball Grid Array (BGA), Chip Scale Package (CSP), Memory Card, Multi-Package and Stacked Die. Its technologies include Thin Wafer Technology, Thin Molding Technology, Fingerprint Sensor Assembly Technology and Fine Pitch Wire Bonding Technology. It provides a range of services, including assembly services, test services and bumping services.

Officers and directors

Wenbo Lin Chairman of the Board, Executive Deputy General Manager
Bio & Compensation  - Reuters
Qiwen Cai Vice Chairman of the Board, General Manager
Bio & Compensation  - Reuters
Yanjun Zhang Senior Deputy General Manager, Director
Bio & Compensation  - Reuters
Jianhua Chen Deputy General Manager
Bio & Compensation  - Reuters
Shufen Chen Deputy General Manager
Bio & Compensation  - Reuters
Yongchuan Gu Deputy General Manager
Bio & Compensation  - Reuters
Kunyi Jian Senior Deputy General Manager
Bio & Compensation  - Reuters
Quanfeng Li Deputy General Manager
Bio & Compensation  - Reuters
Yumeng Lin Deputy General Manager
Bio & Compensation  - Reuters
Guanghua Ma Deputy General Manager
Bio & Compensation  - Reuters