DISCO CORPORATION is a Japan-based company engaged in the manufacture and sale of semiconductor manufacturing devices and precision processing tools. The Company operates in three business segments. The Precision Processing System segment manufactures, sells, maintains and provides related services of semiconductor manufacturing equipment and precision processing tools, including dicing saws, laser saws, grinders, polishers, dry etchers, surface planer, dicing blades, grinding wheels and dry polishing wheels. The Industrial Grinding and Cutting Products segment manufactures and sells diamond wheels and grindstones for grinding and cutting. The Precision Processing Components segment mainly manufactures and sells the components of precision processing equipment. As of March 31, 2014, the Company had 21 subsidiaries and one associated company.