Amkor Technology, Inc. (Amkor) is a provider of outsourced semiconductor packaging (assembly) and test services. The Company offers a range of packaging and test technologies and services. Its packages are designed based on application and chip specific requirements, including the type of interconnection technology employed, size, thickness, and electrical, mechanical and thermal performance. It provides turnkey packaging and test solutions, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, assembly, test and drop shipment services. It provides a range of test engineering services from test program development to full product characterization for radio frequency mixed signal, logic and memory devices. Amkor is a provider of radio frequency test services. In July 2013, the Company completed the acquisition of Toshiba Corp�s wholly owned subsidiary Toshiba Electronics Malaysia Sdn. Bhd., which is engaged in semiconductor packaging operation in Malaysia.