Amkor Technology, Inc.  

(Public, NASDAQ:AMKR)   Watch this stock  
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-0.03 (-0.55%)
Real-time:   3:58PM EDT
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Currency in USD
Range 6.24 - 6.46
52 week 4.08 - 7.05
Open 6.35
Vol / Avg. 481,243.00/777,271.00
Mkt cap 1.46B
P/E 54.85
Div/yield     -
EPS 0.11
Shares 237.37M
Beta 2.25
Inst. own 34%
Aug 1, 2016
Q2 2016 Amkor Technology Inc Earnings Call - 5:00PM EDT - Add to calendar
Aug 1, 2016
Q2 2016 Amkor Technology Inc Earnings Release - 4:00PM EDT - Add to calendar
Jun 10, 2016
Amkor Technology Inc at Citi Small and Mid Cap Conference
May 17, 2016
Amkor Technology Inc at Goldman Sachs Leveraged Financial Conference
May 4, 2016
Amkor Technology Inc Annual Shareholders Meeting
More events from DailyFinance »    

Key stats and ratios

Q1 (Mar '16) 2015
Net profit margin -0.05% 1.37%
Operating margin 2.54% 4.90%
EBITD margin - 22.85%
Return on average assets -0.04% 1.03%
Return on average equity -0.29% 4.88%
Employees 22,200 -
CDP Score - -


2045 East Innovation Circle
TEMPE, AZ 85284
United States - Map
+1-480-8215000 (Phone)
+1-480-8218276 (Fax)

Website links

External links

Analyst Estimates - MarketWatch
SEC Filings - EDGAR Online
Major Holders - MSN Money


Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology employed, size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. Fabless semiconductor companies focuses on the semiconductor design process and manufacturing process. Its packages employ wirebond, flip chip, copper clip and other interconnect technologies. It uses leadframe and substrate package carriers, and performs a range of test services.

Officers and directors

James J. Kim Executive Chairman of the Board
Age: 58
Bio & Compensation  - Reuters
Stephen Douglas Kelley President, Chief Executive Officer, Director
Age: 52
Bio & Compensation  - Reuters
John T. Kim Vice Chairman of the Board
Age: 45
Bio & Compensation  - Reuters
Joanne Solomon Chief Financial Officer, Executive Vice President
Age: 49
Bio & Compensation  - Reuters
Choon Heung Lee Executive Vice President, Chief Technology Officer, Executive Vice President - Worldwide Manufacturing Operations, President - Amkor Technology Korea
Age: 56
Bio & Compensation  - Reuters
Gil C. Tily Executive Vice President, Chief Administrative Officer, General Counsel, Corporate Secretary
Age: 61
Bio & Compensation  - Reuters
John Charles Stone Executive Vice President - Global Sales and Marketing
Age: 58
Bio & Compensation  - Reuters
Giel Rutten Executive Vice President - Advanced Products
Age: 57
Bio & Compensation  - Reuters
Winston J. Churchill Jr. Lead Independent Director
Age: 75
Bio & Compensation  - Reuters
Susan Y. Kim Director
Age: 48
Bio & Compensation  - Reuters