Amkor Technology, Inc. (Amkor) is a provider of outsourced semiconductor packaging (assembly) and test services. The Company is offering a range of packaging and test technologies and services. Its packages are designed based on application and chip specific requirements, including the type of interconnection technology employed, size, thickness, and electrical, mechanical and thermal performance. It provides turnkey packaging and test solutions, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, assembly, test and drop shipment services. Its customers include Altera Corporation, Broadcom Corporation, Infineon Technologies AG, International Business Machines Corporation (IBM), LSI Corporation, Qualcomm Incorporated, Sony Corporation, ST Microelectronics, Pte., Texas Instruments, Inc. and Toshiba Corporation. As of December 31, 2010, it had approximately 225 customers.