Amkor Technology, Inc. (Amkor) is a provider of outsourced semiconductor packaging and test services. The Company offers a range of packaging and test technologies and services. Its packages are designed based on application and chip specific requirements, including the type of interconnection technology employed, size, thickness, and electrical, mechanical and thermal performance. It provides turnkey packaging and test solutions, including semiconductor wafer bump, wafer probe, wafer back grind, package design, and assembly, test and drop shipment services. Its customers are Altera Corporation, Broadcom Corporation, LSI Corporation, Qualcomm Incorporated, Global Foundries Inc., Taiwan Semiconductor Manufacturing Company Limited, ST Microelectronics, Pte., Texas Instruments, Inc., Toshiba Corporation, Intel Corporation and Micron Technology. The Company serves various end markets, including communications, consumer, networking, automotive, industrial and computing.