CA1098597A - Solid state power combiner for transmitter - Google Patents

Solid state power combiner for transmitter

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Publication number
CA1098597A
CA1098597A CA303,007A CA303007A CA1098597A CA 1098597 A CA1098597 A CA 1098597A CA 303007 A CA303007 A CA 303007A CA 1098597 A CA1098597 A CA 1098597A
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CA
Canada
Prior art keywords
coaxial
cavity
diode
oscillators
oscillator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA303,007A
Other languages
French (fr)
Inventor
George Jerinic
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Raytheon Co
Original Assignee
Raytheon Co
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Filing date
Publication date
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Application granted granted Critical
Publication of CA1098597A publication Critical patent/CA1098597A/en
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Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03BGENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B9/00Generation of oscillations using transit-time effects
    • H03B9/12Generation of oscillations using transit-time effects using solid state devices, e.g. Gunn-effect devices
    • H03B9/14Generation of oscillations using transit-time effects using solid state devices, e.g. Gunn-effect devices and elements comprising distributed inductance and capacitance
    • H03B9/143Generation of oscillations using transit-time effects using solid state devices, e.g. Gunn-effect devices and elements comprising distributed inductance and capacitance using more than one solid state device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00Resonators of the waveguide type
    • H01P7/06Cavity resonators

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  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

SOLID STATE POWER COMBINER FOR TRANSMITTER

Abstract of the Disclosure An improved solid state transmitter (and elements therefor) adapted particularly well to pulsed operation at radio frequen-cies is disclosed. Such transmitter includes the combination of: A crystal-controlled oscillator producing a continuous wave output signal which, ultimately, determines the frequency of each transmitted pulse; a first oscillatory circuit, includ-ing a resonant cavity and at least one normally quiescent coaxial oscillator incorporating an IMPATT diode; a second oscillatory circuit, including a resonant right cylindrical cavity and a plurality of normally quiescent coaxial oscilla-tors coupled to such cavity around the periphery thereof, each one of such oscillators having an orthogonal bend formed therein so that the IMPATT diode in each such oscillator is.
located on a circle with a diameter substantially larger than the diameter of the resonant right cylindrical cavity; and an improved modulator for periodically actuating all of the IMPATT
diodes in such a manner that pulsed output of the first oscillatory circuit is produced which remains locked to the then existing continuous wave signal out of the crystal-controlled oscillator and the pulsed outputs of the coaxial oscillators in the second oscillatory circuit similarly are locked.

Description

Back~round of the Invention This inven~ion pertains generally to radio frequency oscil-lators and particularly to oscillators of such type which are adapted to combine the power out of a plurality of solid state devices.
It has been known for many years that radio frequency signals out of each one of a plurality of oscillatory circuits may, in effect, be added in so-called "combiner" circuits to produce a single radio frequency signal of high amplitude. With the develop-ment of solid state devices, such as IMPATT diodes, as the activeelements in oscillatory circuits, the interest in combiner circuits has increased. The average and peak power levels of these devices are high enough so that useful transmitter power le~els can be achieved by combining a practical number of devices in a suitable combiner circuit. Exemplary combiner circuits using solid state devices are shown in U. S. Paten1: No. 3,628,171 ~Kurokawa et al) and U. S. Patent No. 3J931,587 (Harp et al).
Both of the just-cited patcnts show combiner circuits with a plurality of IMPATT diodes operated as continuous wave ~CW) oscil-lators, each one of such diodes being in an oscillatory circuitwhich is coupled to a common cavlty. The requisite frequency and phase relationship between the radio fréquency oscillations of the different CW oscillators is determined in operation by the charac teris~ics of the common cavity.
Although ~either of the combiner circuits shown by Kurokawa et al and Harp et al is satisfactory in its "steady state" condition, i.e. when producing CW oscillations, a somewhat dlfferent situation obtains when either is used to produce pulses of radio frequency energy. Pulse~ design can be optimized for simultaneously achiev-ing stability of operation, combining efficiency and spectral puritY - 1 -Another problem with pulsed I~IPATT diode oscillators, no~
addressed in either of the cited patents, is that such devices require, for best operation, an electrical power supply which is effectively current-regulated in a particular manner. Specifi-cally, the electrical power supply must, if the spectral purity of each pulse is to be maintained, be adapted to compensate for an increase in the temperature of the junction of the I~ilPATT diode during the generation of each pulse. In addition, when pulsed operation is desired, the rise and ~all times of each pulse should be controllable to allow the spectrum of each radio frequency pulse to be shaped as desired.

5~ ~

Summary of ~he Invention It has been sugges~ed by Kurokawa et al that a combiner cir-cuit may be made with a common rectangular cavity operating in a mode o~her than the TE mode, where N is an integer corres-OlN
ponding to half the number of combined devices. The specific example given by Kurokawa et al is a common rectangular cavity operating in the TE mode. Kurokawa et al also suggest that conventional mode suppressors may be used when the common cavity is dimensioned to support the TE ~or higher) mode. The common cylindrical cavity shown by Harp et al is operated in the T~l mode, although, presumably, mode suppressors could be incorporated to allow higher modes, e.g. the T~l mode, to be supported. In any event, because of the fact that the longitudinal axes of the diode oscillators and the cavity shown by Harp et al are parallel to each other, the maximum number of diode oscillators which may be coupled to a common cylindrical cavity with a given circum-ference is determined by the ratio of that dimension to the outside diameter of a diode oscillator. Such a limitation on the maximum number of diode oscillators in turn places an unwanted upper limit on the amount of radio frequency energy which may be combined.
Therefore, it is a primary object of this invention to provide an improved "solid state" transmitter utilizing pulsed IMPATT diodes (or other such devices) whose power is combined in a combiner circuit.
Another object of this invention is to provide an improved combiner circuit for IMPATT diodes wherein the frequency at which such diodes operate is determined by an "injection lock" technique whereby such frequency is controlled by a crystal oscillator.
Another object of this invention is to provide an improved combiner circuit for IMPATT diodes wherein the number of such diodes may be a~ least double the number of IMPATT diodes arranged according to the prior art.
Still another object of this invention is to provide an improved combiner circuit for IMPATT diodes wherein such diodes are biased during pulse operation in such a manner that the frequency of operation is substantially unaffected by change in the temperature of the junctions of such diodes.
The foregoing and other objects of this invention are generally at-tained by providing, in a solid state transmitter, a combiner circuit using a plurality of pulsed diode oscillators coupled to a cylindrical cavity, the radio frequency energy in such cavity being injection locked during each pulse to the radio frequency energy out of a c~ystal controlled oscillator (which is operated continuously). The pulses of radio frequency energy out of the puls-ed diode oscillators are periodically produced by applying direct current sig-nals to an IMPATT diode in each pulsed diode oscillator, such signals being derived from modulators which are adapted appropriately to bias the IMPATT
diodes. The invention also encompasses alternative combiner circuits wherein the number of pulsed diode oscillator circuits may be maximized.
In accordance with the invention there is provided an improved power combiner for radio frequency energy utilizing the combination of a cylindrical cavity with a plurality of coaxial oscillators coupled to such cavity aro~m~
the periphery thereof, such combiner comprising: (a) a cylindrical cavity dimensioned to resonate at a predetermined frequency in the TM mode of ON~
oscillation, where N is an integer; (b) a plurality of pairs of coaxial oscil-lators~ each one of such oscillators including a length of coaxial line with a center conductor and an outer conductor, disposed in a coupling relationship ~ith the cylindrical cavity about the periphery thereof, a first part of the length of coaxial line in each pair of coaxial oscillators being parallel to the longitudinal axis of the cylindrical cavity and a second part of the length of coaxial line being orthogonal to such axis.
., :.:, .
~ 'c.
~ 3 _ ~ _ .

.

Brief Descr_ption of the Drawings For a more complete understanding of this invention, reference is now made to the following description of embodiments of this invention illustrated in the accompanying drawings, wherein:
FIG. 1 is a block diagram, somewhat simplified, of a solid state transmitter in accordance with the concepts of this invention;
FIG. 2 is a cross-sectional view of an exemplary one of the diode oscillators used in the transmitter shown in FIG. l;
FIG. 3 is a schematic diagram of an exemplary one of the modulators used in the transmitter shown in FIG. l;
FIG. 4 is a sketch, somewha~ simplified, showing the physical relationship between the power combining and coaxial oscillator of : . FIG. l; and FIGS. 5A, 5B and 5C are sketches showing how the diode oscil-: lator shown in FIGS. 2 and 4 may be modified to increase the number o~ IMPATT diodes to be used in conjunction with an output cavity such as is shown in FIG. 1.
'~ ::

Description of ~he Preferred Embodiment Referring now ~o FIG. 1, it may be seen that a solid state transmitter 11 according to this invention comprises two stages (not numbered), each stage being associated generally with one of a pair of circulators 13, 15 of conventional construction. The first, or low power stage, associated with the circulator 13, comprises a cavity 17 to which a coaxial oscillator 19 is magnetically coupled ~as indicated by the broken lines). The second, or high power output stage associated with the circulator 15,comprises a cavity 21 to whicll each one of a plurality ~here nine in number) of coaxial oscillators 23 is magnetically coupled (as indicated by the broken lines). The coaxial oscillator 19 and the coaxial oscillators 23 ~shown in detail in FIG. 2) are actuated by output signals from modulators 25 which, in turn, are effective to apply biasing voltages from a D.C. power supply 27 to the coaxial oscillator 19 and the coaxial oscillators 23 whenever actuating signals from a synchronizer 29 are applied.
Cavities 17 and 21 here are cylindrical cavities illustrated in more detail hereinafter. Suffice it to ~ay here that such cavities preferably are dimensioned to support the TM mode of oscillation at the radio frequency to be propagated. Further, such cavities are proportioned to have a optimum Q and their inner walls are coated with a high conductivity material and/or polished to reduce ohmic losses.
To comp:Lete the illustrated transmitter, a crystal controlled oscillator 31 is connected as shown to the circulator 13 and an antenna assembly 33 is connected as shown to the circulator 15.
The crystal oscillator 31 may be of any conventional construction to produce continuous oscillations at the frequencies within the 30 locking bandwidths of cavities 17 and 21. The antenna assembly 33 .

-also may be of conventional construction. However, it is pre-ferred that the antenna assembly 33 be a monopulse array antenna with the output of the circulator 15 being connected through isolator means ~not shown) to the sum port of the arithmetic unit (not shown) of such an array antenna. The difference ports of the arithmetic unit would then be connected to the difference channe].s of a monopulse receiver ~not shown) and the proper port of the isolating means would be connected to the sum channel of such receiver.
It will now be recognized that, in operation, the output of the crystal oscillator 31 is continuously applied, through the circulator 13, to the cavity 17. Oscillations at the frequency of the crystal controlled oscillator 31 are,therefore,continuously induced in the cavity 17. It follows, then, that whenever the coaxial oscillator 19 is pulsed, the resulting pulsed oscillations are locked to those produced by crystal controlled oscillator 31.
That is to say, the center line of the pulsed spectrum of coaxial oscillator 19 is locked to the frequency determined by the crystal controlIed oscillator 31. The output of the cavity 17 is passed 20 through the circulators 13, 15 to the cavity 21. Coaxial oscil-lators 23, in turn, are forced to resonate in phase with each o~her at the resonant frequency of ~he cavity 21. The powers of the coaxial oscillators 23 are, therefore, combined in the caYity 21. When the pulsed oscillations from cavity 17 are present the high power spectrum from cavity 21 aligns itself with the spectrum of such oscillations. The pulsed oscillations out of cavity 21 are then an approximate amplified replica of the pulsed oscilla-tions out of cavity 17.

;3~

It will be obvious to one of skill in the art that the resonant frequencies of the cavities 17, 71 used in the solid state transmitter ll should, for best operation, be the same as the frequency of the output of the crystal controlled oscillator 31. Further, it wiil be obvious that any misalignment experienced in any practical case must be less than the locking bandwidths of the combinations of the cavity 17 with the coaxial oscillator l9 and the cavity 21 with the coaxial oscillators 23. I.ocking band-width is inversely proportional to the locking gain. Por the typical gains (10-15 dB per stage) used in the solid state transmitter 11 the bandwidth of the combination of the cavity 17 with the coaxial oscillator 19 is several tenths of a percent and the combination of the cavity 21 with the coaxial oscillators 23 under three percent.
It will be obvious to one of skill in the art that wide ambient temperature variation and maximum temperature are two factors affecting transmit~er design. Upon turn-on, the IMPATT
dio~e junction temperature in each one of the coaxial oscillators 19, 23 rises above ambient by Z00C in a fraction of a second. At junction temperatures above 220C the IMPATT diode reliability is reduced by approximately one-half for every 10C increase in temperature. While the foregoing suggest that a temperature control arrangement of some type should be employed, it has been ; found to be adequate simply to juxtapose cavities 17 and 21 and to provide cooling coils of a conventional type ~not shown in FIG. 1) for a coolant ~such as water) to dissipate the heat generated at the junctions of the IMPATT diodes in the coaxial oscillators 19, 23.
Referring now to PIG. 2, it may be seen that each one of the 30 coaxial oscillators 19, 23 of FIG. 1 comprises an Ih~PATT diode 40 ~ 7 mounted in a section of coaxial line ~not numbered). Each such line is here fabricated by forming a substantially cylindrical opening in a block (no~ numbered) o~ aluminum to make an outer conductor 42 with a center conductor 44 supported therein in a manner to be described. The IMPATT diode 40 is mounted bet~een a heat sink 46 ~which is supported by the outer conductor 42, as shown) and a metallic cup 48 slidably supported on the center con-ductor 44. The IMPATT diode 40 preferably is maintained in posi-tion by bonding with a conducting epoxy in a depression ~no~
shown) in the metallic cup 4S, and by soldering in an opening (not numbered) in the heat sink 46.
An insulating sleeve 50 is disposed, as shown, to isolate the metallic cup 48 rom the outer conductor42 and the heat sink 46. The latter is held in place l)y a threaded member 52. A spring 54 is disFosed between the metallic cup 48 and the center conductor 44.
A first impedance transformer (not numbered) here made up o the metallic cup ~8, the insulating s:Leeve 50 and a sleeve 55 ~here made of beryllium copper), is disposed as shown adjacent to the IMPATT diode 40. A second impedance transformer tnot numbered)l here comprising a sleeve 56 o~ any appropriate dielectric material bonded to the center conductor 44 and slidably disposed within the outer conductor 4Z, is also emplaced as shown. The purpose of the two impedance transformers will be discussed in more detail hereinafter. A termination load 58, here tapered and positioned as shown against a conforming shoulder ~not numbered) in the outer conductor 42, is slidably mounted on the center conductor 44. The termination load 58 is held in place against the conforming shoulder by an insulating cup 60, such cup being forced against the termination load 58 by a threaded metallic member 62. The material of the termination load 58 here is the material known as -"ECCOSORB", (a trademark of Emerson ~ Cuming, Incorporated, ~licrowave Products Division, Canton, Massachusetts).
The threads on the threaded metallic member 62 are such as to mate with a corresponding threaded portion (not numbered) on the center conductor 4~. An insulating adjustment member 64 is placed on a formed qnd (no* numbered) of the center conductor 44.
Finally, a bias wire 66 is supported in a feedthrough 68 ~here any conveniently formed insulating material) passing, as shown, through the outer conductor 42. The inner end of the bias wire 66 is connected in any convenient fashion (as by soldering) to the threaded metallic member 62. Finally, the outer conductor 42 is opened into a cavity 70.
It may be seen from the foregoing description that: ~a) if the bias wire 66 is connected to a source of electrical power ~as one of the modulators 25 of FIG. 1)~ a voltage may be applied, through the threaded metallic member 62, the center conductor 44, the spring 54 and the metallic cup 48 to one ele~trode of the IMPATT diode 40; and (b) the distance between ~he sleeve 56 and the sleeve 55 may be changed by rotation of the insulating adjust-ment member 64.
The voltage applied in this case through the bias wire66 ultimately to the IMPATT diode 40 is derived from one of the modulators 25 (PIG. 1) in a manner to be described hereinafter.
Suffice it to say here that that element is arranged to produce:
~a) a pedestal voltage (meaning a constant D.C. voltage) to bias the IMPATT diode 40 at a level somewhat below the level required for avalanche breakdown; and (b) at a selected pulse repetition frequency, voltage pulses which are added to the pedestal voltage, thereby periodically *o raise the level of the bias across the IMPATT diode 40 to a level higher than the level at which ~ 7 avalanche breakdown occurs. Typically, with an IMPATT diode such as that designated "Part No. 5082-0710" ~an X-band double drift IMPATT diode) by the Hewlett Packard Company of Palo Alto, California, the pedestal voltage is in the order of 125 V.~.C.) ~d the pulses in the order of 25 V. for 100 to 1,000 nanoseconds ~ith a duty cycle of 30%. The current drawn from the modulator 25 ~FIG. 1) is controlled to compensate for ~he frequency change in the output of an IhlPATT diode due to heating of its junction during each pulse. Thus, in the present case (where the level of the radio frequency power out of a combiner circuit using nine coaxial oscillators is to be in ~he order of 100 watts with a minimum of frequency chirp) the current in each pulse to each one o the coaxial oscillators is increased ~as described in connection with FIG. 3) as each voltage pulse is applied to the pedestal voltage.
Finally, because the spectral purity of the radio frequency signal out of any pulsed oscillatory circuit is influenced by the shape of the leading and trailing edges of the modulating signals in such a circuit, the modula~ors 25 (FIG. 1) are arranged to provide ~as described in connec~ion with FIG. 3) pulses with leading and trailing edges which have adjustable rise and fall times.
The purpose of the first and the second impedance trans~ormers is to match~ at the desired frequency of operation, the relatively - low impedance of the IMPATT diode 40 during each pulse to the relatively hi~h impedance of the cavity 70. The principles under-lying the way in which such impedance matching ~ay be effected are clearly shown in an art1cle enti~led "The Single Cavity Multiple Device Oscillator" by Kaneyuki Kurokawa appearing in the IEEE
Transactions on Microwave Theory and Techniques, Volume MTT-19, No. 10, October 1971. The gist of the article just cited is that, assuming a "well-defined" admittance for each IhlPATT diode, the ~ t7 parameters of a single stage impedance transformer may be defined to meet the necessary conditions for oscillations, which include the following~ roviding a load equal to the negative of the diode impedance at the desired operating frequency; ~ii) present-ing a proper phase angle between thc load and diode impedance characteristics; and ~iii) preventing oscillation at undesired frequencies. While the approach taken in the just-cited article makes it possible to design a wor~ing combiner circuit using a cavity to combine the outputs of a plurality of coaxial oscil-la~ors, such a design is difficult to implement in practice.
The use of only a single stage impedance transformer ~whichinherently is a narrow band device) makes it diffic~ult to simul-; taneously satisfy all of the criteria necessary for successful operation because of its limited flexibility. The difficulty is compounded when a plurality of IMPATT diodes is operated in a pulsed mode in a plurality of co;axial oscillators. That is to say, when (as here) power from e,ach one of a plurality of IMPATT
diodes ~each havin~ different admittances varying in a nonlinear fashion with RF power and DC bias current) is to be combined periodically~ i~ is almost impossible to avoid conditions whichresult in unsatisfactory operation.
In order to provide additional tuning means which may be manipulated to satisfy Kurokawa's criteria for oscillation and to allow for individual diodè tuning adjustments, a cascaded set of coaxial transformers, including one moveable transformer, is used in each diode line.
It wlll be remembered that the IMPATT diode 40 and the first impedance transformer are parts of a Imitary subassembly when emplaced in ~he coaxial oscillator. It will also be remembered that the position of the second impedance transformer relative to - , , -- - , , ., . . .. .: , , , . . . : ..

5~

~he firs~ transformer is adjustable. With such an arrangement, even though a deviation in the actual impedance of the IMPATT
diode from its nominal value may induce a corresponding change in the impedance at the output of the first impedance transformer, compensation may be accomplished by adjusting the position of the second impedance transformer relative to the first impedance transformer. Such adjustment, of course, is effective to change the input impedance to the second impedance -transformer, thereby inally to cause the proper match between ~he output impedance of tha~ transformer and the input impedance of the cavity 70. It will be noted here that the adjustment of the position of the second impedance transformer relative to the first impedance transformer is accomplished simply by rotation of the adjustment member 64. This means that there is no opening required in the outer conductor 42 for access to the sleeve 56. Such an opening would, of course, constitute a discontinuity to perturb the electrical ~ield inside the coaxial oscillator.

Referring now to FIG. 3, it may be seen ~hat an exemplary one of t]~e modulators 25 ~FIG. 1) comprises a voltage amplifier (VA) which, in response to control pulses From the synchronizer 29 ~FIG. l)s drives a current source "A" and a current source "B".
The voltage amplifier VA is a temperature compensated cascaded amplifier having two transistors, Ql and Q2, as the active elements therein (here, respectively, a type 2N3866 and a type 2N2222A). The control pulses ~which here typically are in the order of 800 nanoseconds in length at repetition fre4uencies between 362 KHz and 435 KHz)are passed to the base of the transistor Ql through a coupling resistor RlA. The emitter of the tr.msist.or Ql is connected through a biasing resistor RlB
and the parallel combination of a capacitor C5 and a diode D5 to ground. The diode D5 here is a type ~N3611 diode to allow the desired temperature compensation to be effected. The collector o the transistor Ql is connected through a coupling resistor R2B to the emitter of the transistor Q2. The base of the transistor Q2 is connected to a diode D3 ~here a type IN4148 diode) and a dropping resistor R3 to a 40 volt tap ~not shown) in the D.C. power supply 27 ~FIG. 1). The junction of the diode D3 and~the resistor R3 is connected through zener diodes Dl and D2 to ground. The diodes Dl and D2 here are type IN751A zener diodes. A bypass capacitor Cl is connected across the diode D2.
The junction of the diodes Dl and D2 is also connected through a switching diode ~4 to the junction between the collector of the transistor Ql and the coupling resistor R2B. In addition, a parallel combination o a resistor R2A and a capacitor C3 is connected rom the junction of the diode D3 and the base of the transistor Q2 to ground. The collector of the transistor Q2 is connected to the parallel combinatioin o~ potentiometers P~5A, R5B

.

and resistor R6 back to the 40 volt ~ap on the D.C. power supply 27 (FIG. 1)~ The collector of the transistor Q2 is also connected as shown to a capaci~or C6 and the serial combination o~ a capac-itor C7 and a potentiometer R7 back to ~he 40 ~olt tap on the D.C. power supply 27 (FIG. 1). The taps on the potentiometers R5A and R5B are connected, respectively as shown, through resis-tors R8A and R8B to current source "A" and current source "B".
Because such current sources are identical in construc~ion only one will be described. Thus, the second lead of ~he resistor R8A is connected to the lase of a transistor Q3A, here a type 2N3468 transistor. The emitter of the transistor Q3A is connected through a dropping resistor R~3EA) to the 40 volt tap in the D.C. power supply 27 (FIG. 1) and directly to the base of a transistor Q4A. The latter here is a type 2N5161 transistor.
The emitter of the transistor Q4A is connected through a dropping resistor R(4E~) to the 40 volt tap of D.C. power supply 27 ; tFIG. 1) and directly to the base of a transistor Q5A, here a type 2N5162 transistor. The emitter of the transistor Q5A is connected through a dropping resistor ~5EA) to the 40 volt tap of the D.C.
power supply 27 (FIG. 1) and to a zener diode D~A) poled as shown.
The latter here is a type lN4757 zener diode. The collectors of the transistors Q3A, Q4A, QSA and the second electrode of the zener diode D(A) are connected together as shown to an input terminal of a pulse transformer T~A) having a 1:1 turns ratio.
The second input terminal of the pulse transformer T~A) is connected to ground. A serial combination of a resistor R~FA) and a diode D(FA) is connected across the secondary terminals of the pulse transformer T~A) along with oppositely polarized diodes D(PA) and D~LA). The just mentioned diodes all are type lN4454 diodes. The junction of the resistor R~FA) and the diode D(LA~

-is connec~ed to a tap (not shown) on the D.C. power supply 27 (FIG. l)hereinafter referred to as the 120 volt tap. Finally, the output of the current source "A" ~labelled output "A") is taken at the junction between the diodes D(PA) and D~LA).
Before an explanation of the just described circuit is under-taken it will be appreciated that some simplification has been made. In particular, fuzes to protect the current sollrce "Al' and current source "B" 7 arrangements for testing and parallel combinations of elements have been omitted.
- 10 The signal into the transistor Ql is effective to change the current flow through transistor Q2 in accordance with the setting of the potentiometer R7 which, in turn, controls the time constant of the combination of capacitor C7 and potentiometer R7. Such c.hange in current through the transistor Q2 then is reflected as a change in drive to the base of the transistor Q3A by reason of the setting of the potentiometer RSA. The combination of the transistors Q3A, Q4A and QSA is in effect similar in operation to a conventional Darlington circuit. The drive to the base of the transistor Q3A determines the current level finally attained by such circuit. The diodes D(PA) and D~LA) constitute a two-way clamp whereby the voltage of output "A" is held at the level of the 120 volt tap in the D.C. power supply 27 (FIG. 1) at all times except when a control pulse from the synchronizer 29 ~FIG. 1) is present. The serial combination of the resistor R~FA) and diode D~FA) is effec~ive to quench any transient which may occur at the end o each control pulse from the synchronizer 29 ~FIG. 1).

~ 7 Referring no~ to FIG. 4, it will be noted that~ because the coaxial oscillator 19 ~FIG. 1) is here substantially the same as the coaxial oscillator shown in FIG. 2, a detailed description of the elements making up the coaxial oscillator 19 is not necessary to an understanding of this invention. Further, it will be noted that the cavity 17 (FIG. 1) corresponds with the cavity 70.
With the foregoing in mind, it may be seen that the cavity 70 is here formed by bolting together an upper body block 71 and a lower body block 73 ~the two such blocks preferably being flanged as shown and fabricated from aluminum). The lower surface of the cavity 70 is that portion (not numbered) of the lower body block 73 defined by a centrally located counterbore ~not numbered) shown in the upper body block 71. In the embodiment of the inven-tion being described, the counterbore in the upper body block 71 is dimensioned to support the TM 010 mode at the frequency of interest. A cylindrical hole ~not numbered) parallel to the longitudinal axes of the upper body block 71 and the lower body block 73 is bored through such blocks, the axis of such cylin-drical hole intersecting a circle, C. The radius of the circle, C, here is the same as the radius of the counterbore in the upper body block 71. It will be observed that the portions of the upper body block 71 and the lower body block 73 surrounding the cylin-drical hole through the upper body block 71 and the lower body block 73 and the surfaces defining the cavity 70 may be highly polished or plated in any convenient manner with a material, such as copper or silver, which is highly conductive to reduce ohmic losses.
The lower body block 73 is extended as shown to provide room for an annular slot 75. A cover plate 75A is then positioned over the open side of the annular slot 75 and secured in any .

convenient manner. An inlet pipe 77 and an outlet pipe 79 are connected in any convenient fashion as sho~n to allow a coolant ~such as water) to be fed from the pressure side of a pump (not shown) through the annular slot 75 to the suction side of àuch pump. It will be appreciated by one of skill in the art that the purpose of the illustrated cooling arrangement just described is to remove heat generated within the I~PATT diode 40. In this connection it is here noted that the center conductor ~ and the heat sink 46 are in proximity to the IMP~TT diode ~0. For this reason, both are made from oxygen-free high concuctivity ~OFHC) copper. As is known, OFHC copper is particularly well suited to resist thermal cracking.
A probe and tuning arrangement 80 here is positioned along the longitudinal a~is of the upper body block 71. Such arrange-ment here includes a probe section 82 within a tuning section 84, the two sec~ions being mounted to be adjustable (either together or independently) in a manner now to be described.
The probe section 82 comprises a section of conventional coaxial line, .e. a coaxial line having a center conductor ~3, a dielectric spacer 85 and a sheath 87, rotatably and slidably supported on the longitudinal axis of the cavity 70. To effect such support of the probe section 80 (and also to provide a similar type of support for the tuning section 84) a probe adjust-ing member 89, here a metallic body machined to the shape shown, is threaded into a mating thread in a tuning adjusting member 91.
The latter is also a metallic body machined to the shape shown, threaded into a mating thread in the upper body block 71 and journalled in a bearing ~not numbered) formed in the upper block 71. It is noted here that a choke section 93 preferably is for~led in the tuning adjusting member 91. ~ lock screw 95 threaded as shown into a mating thread in the tuning adjusting member 91 is positioned as desired either to lock the probe adjusting member 89 and the tuning adjusting member 91 together or to allow those members to be moved independently of each other.
It will be appreciated that the lower end of the center conductor 83 must be electrically insulated from the tuning section 84. Such insulation is provided, as shown, by the lower part of the dielectric spacer 85 which is not removed when the lower part of the sheath 87 is removed. It will also be appre-ciated that the coaxial line ~not numbered) in the probe adjusting member 89 must be connected to a transmission line (not shown) to allow, for example, a locking signal to be injected into the cavity 70 and radio frequency energy to be extracted from the cavity 70. To accomplish this, the upper end of the center conductor 83 is exposed and a conventional coaxial connector 97 is mounted on the probe adjusting member as shown. A con~entional double female adapter ~not shown) may then be used to complete the requisite connection to a transmission Iine, terminated with a coaxial connector similar to the coaxial connec~or 97.
It will now be apparent that the three adjustment points in the just-described locking cavity and locking oscillator arrange-ment are all accessible from the top. Therefore, in applications where space is at a premium, mounting problems are made less dif-ficult to solve.
It will be appreciated that a plurality of coaxial oscil-lators similar to that illustrated in ~IG. 4 could be disposed about the circumference of the circle, C. The total number of such oscillators is, of course, limited by the ratio of the largest diameter, d~ of the coaxial oscillator to the circum-ference of the circle, C. With coaxial oscillators operating in X-band and a cavity supporting the TM mode, it has been found that, as indicated in FIG. 1, up to fifteen to sixteen coaxial resonators may be positioned.

Referring now to FIG. 5A, it may be seen that a desired increase in the number of diode (or coaxial) oscillators disposed in a coupling relationship about the periphery of a cylindrical cavity is here effected by changing the shape of each diode oscil-lator and modifying the~way in which the cylindrical cavity is formed. Thus, in FIG. 5A it may be seen that the center conductor of each one of a pair of diode oscillators U,L is made up of two orthogonally disposed sections, e.g. center conductor 44AU and center conductor 44BU for diode oscillator U and center conductor 10 44AL and center conductor 44BL for diode oscillator L, joined in any convenient manner and centrally supported within orthogonally disposed bores ~not numbered) in either an upper body block 71U
or a lower body block 71L. The bores in which center conductors 44AU and 44AL are supported are parallel to the longitudinal axis of the cavity 70A, and preferably are centered at a common point on the circumference of such ca~ity. The bores in which the center conductors 44BU and 44BL are mounted are radial to the ca~ity 70A and are centered, as shown, to intersect, respectively, the bores for the center conductors 44AU and 44AL. The cavity 70A is here formed by forming opposing counterbores in the upper block 71U and the lower block 7IL. It will now be apparent that, with the radius of the cavity 70A the same as the radius of the cavity 70 ~FIG. 4) and the dlameters of the diode oscillators U, L the same as the diameter of the coaxial oscillator shown in FIG. 4, twice the number of such oscillators may be disposed in a coupling relationship with the cavity 70A than with the cavity 70.
Because the~;center conductors of the diode oscillators being described are bent, the way in which the elements making up each such oscillator are mounted must, perforce, differ from the way in which corresponding elements in the coaxial oscillator described in connection with FIG. 4 are mounted.
With the foregoing in mind, it will be seen that, in diode oscillator U, the center conductor 4~BIJ is sim~ly passed through an appropriately sized hole (not numbered) in a termination load 60'.
Such load is shaped as shown and cemented in the radial bore in the upper body block 71U. The free end of the center conductor 44BU
then serves the same purpose as the bias ~ire 66 ~FIG. 4).
The center conductor 44AU is passed through a sleeve 56' which is similar in construction and purpose to the sleeve 56 ~FIG. 4). In this case, however, a sliding fit is provided between the center conductor 44AU and the sleeve 56'. Also, a slot (not numbered) is formed through the wall o~ the upper body block 71U adjacent to the sleeve 56'. It may be seen, there~ore, that the position of the sleeve 56' along the length of the center conductor 44AU may be adjusted without changing the relative positions of such conductor and the cavity 70A.
A depression ~not shown) is formed in the free end of the center conductor 44AU to accommodate one terminal of an IMPATT
diode 40. A conducting epoxy then may be used to provide a low resistance contact between the center conductor 44AU and the IMPATT diode 40. The second electrode of the IMPATT diode 40 is connected in the same way as illus~rated in FIG. 2, i.e. such second electrode is soldered in an opening (not numbered) in a heat sink 46 which is held in place by a threaded member 52. An insulating sleeve 50' bonded to the heat sink 46 and fitted around the center conductor 44AU completes the illustrated diode oscil-lator U.
: It will be recognized that the insulating sleeve 50', the sleeve 56' and the termination load 60' serve to support the center conductors 44AU, 44BU so tha-t a bias voltage may be applied to the IMPATT diode 40. In addition, the insulating sleeve 50' and the sleeve 56' serve the same function as the two impedance transformers discussed in connection Wit}l FIG. 2. In the present case, however, the position of the sleeve 56' is adjusted through the opening in the upper body block 71U rather than by rotation of the adjustment member 64 ~FIG. 2).
The diode oscillator L is made in the same way as the diode oscillator U.
Although the bores in which the center conductors 44AU and 44AL are mounted are shown to be colinear, it will be evident that such an arrangement may be modified. That is, the only requirement here is that the bores be parallel to the longi-tudinal axis of the cavity 70A with their centerlines intersecting a circle so center conductor 44AU may be offset from center con-ductor 44AL.
Before reerring specifically to FIGS. 5A, 5B and 5C, it will be noted that no cooling arrangement has been shown and that elements in the coaxial oscilla~ors which are the same as the elements illustrated in FIGS. 2 and 4 have been identified by the same numeral as in FIG. 2.
Referring now to FIGS. 5B and 5C, another modification is : shown to increase the number of diode oscillators which may be coupled to a cylindrical cavity of a given size. In this case the number of diode oscillators is llmited by the ratio of the diameter, d, of each such oscillator to the circumference, 2~R', of a circle greater than the circumference, 2~R, of the cavity.
To effect the foregoing, advantage is taken of the well known fact that the dimensions (meaning the radii of the inner and outer conductors) of a coaxial line may be changed without affecting the characteristic impedance of such a line. That is~

?~

so long as the ratio between the inner radius of the outer con-ductor and the radius of the inner conductor are constant, the characteristic impedance of a coaxial line is constant. There-fore, it is possible to proportion the radii of the inner and outer conductors of a coaxial line so that one portion of such line ~here the portion extending from a termination load past a cavity) is relatively small and a second portion (here the portion including an IMPATT diode) is sized to accommodate such a diode in an oscillatory circuit.
With ~he foregoing in mind it may be seen in FIGS. 5B and 5C that an upper body block 71U' is machined to support a probe and tuning arrangement 80 (which may be the same as described hereinbefore) and a plurality of bores (not numbered) centered on a circle of radius R and parallel to the longitudinal axis of th0 upper body block 71U'. Such bores, as indicated, are extended into a lower body block 71L'. The radius of each bore is less than one-half the diameter, d, determined by the diameter of an ; IMPATT diode 40.
The walls and bottom side of a cavity 70B are formed by a counterbore of radius R in the lower body block 71L'. That block in turn is flared at a convenient angle, say 45, to ;ts longi-tudinal axis. A plurality of shaped bores (not numbered) is formed ~as shown clearly in FIG. SC) in the flared portion of the lower body block 71L', each one of such shaped boTes inter-secting a corresponding one of the plurality of bores through the upper body block 71U' and a portion of the lower body block 71L'.
It will now be evident that the surfaces of each snaped bore and its corresponding bore make up the outer conductor of a coaxial line.
The outer portion of each shaped bore is machined to
- 2~ -~ , ~

accommodate an I~IPATT diode 40 and a first and a second impedance transformer in the same way as described in connection t~ith FIG. 5A.
The inner portion of each shaped bore is the same size as the bore with which it mates. Between the inner and the outer portion of each shaped bore there is a transition comprising a conical frustum.
A center conductor 44B having the cross-sectional shape shown in FIG. 5C is supported in a coupling rela~ionship with the cavity 70B within each pair of bores and shaped bores. The upper end of the center conductor 44B is supported by a termination load 60' and the lower end of the center conductor 44B is sup-ported by ~he sleeve 58' and the insulating sleeve 56'. The center conductor 44B is shaped so that, at any point along its length, the ratio of its radius to the radius of the shaped bore (or the bore) is constant.
It will now be apparent that, with a given diameter, d, as determined by the IMPATT diode 40 and a cavity 70~ of a given circumference, a greater number of diode oscillators may be coupled to the cavity 70B than would be the case if the diode oscillators were configured as shown in FIGS. 2 and 4.
; Having described preferred embodiments of this invention, it will now be apparent to one of skill in the art that many changes may be made without departing from the inventive concepts. For example, although only IMPATT diodes have been mentioned as the active elements, the described oscillatory circuits are well adapted to use with other known types of solid state diode oscil-; lating devices. Further, while the crystal controlled locking oscillator shown in FIG. l is here a CW device, it is obvious that such an oscillator may be replaced with a pulse oscillator.

Also, while the solid state transmitter of FIG. 1 is shown ~o combine the power from two oscillator stages, it is equally obvious that three or more stages could be combined in like manner. Finally, the positions of the termination loads and IMPATT diodes shown in FIG. 5A could be interchanged. It is felt, therefore, that this invention should not be restricted to its disclosed embodiment, but rather should be limited only by the spirit and scope of the appended claims.

Claims (2)

What is claimed is:
1. An improved power combiner for radio frequency energy utilizing the combination of a cylindrical cavity with a plurality of coaxial oscillators coupled to such cavity around the periphery thereof, such combiner comprising:
(a) a cylindrical cavity dimensioned to resonate at a predetermined frequency in the TM mode of ONO
oscillation, where N is an integer;
(b) a plurality of pairs of coaxial oscillators, each one of such oscillators including a length of coaxial line with a center conductor and an outer conductor, disposed in a coupling relationship with the cylindrical cavity about the periphery thereof, a first part of the length of coaxial line in each pair of coaxial oscillators being parallel to the longitudinal axis of the cylindrical cavity and a second part of the length of coaxial line being orthogonal to such axis.
2. An improved power combiner as in claim 1 wherein the longitudinal center lines of first parts of the lengths of coaxial line in each pair of coaxial oscillators are colinear.
CA303,007A 1977-06-30 1978-05-10 Solid state power combiner for transmitter Expired CA1098597A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/814,743 US4172240A (en) 1977-06-30 1977-06-30 Cylindrical cavity power combiner for a plurality of coaxial oscillators
US814,743 1977-06-30

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CA1098597A true CA1098597A (en) 1981-03-31

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CA (1) CA1098597A (en)
DE (1) DE2828874C2 (en)
FR (1) FR2396430A1 (en)
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Publication number Priority date Publication date Assignee Title
JPS4852655A (en) * 1971-11-06 1973-07-24
US4453139A (en) * 1981-11-12 1984-06-05 Ford Aerospace & Communications Corporation Frequency offset multiple cavity power combiner
US4468633A (en) * 1982-04-28 1984-08-28 The Bendix Corporation Adjustable microwave power combiner for a plurality of coaxially mounted impatt diodes
US4471325A (en) * 1982-07-19 1984-09-11 Raytheon Company Power combiner with reentrant coaxial diode oscillators
US4652882A (en) * 1982-09-30 1987-03-24 Raytheon Company Receiver with wide dynamic range
US4583058A (en) * 1983-11-21 1986-04-15 Raytheon Company Broadband power combiner
US4661790A (en) * 1983-12-19 1987-04-28 Motorola, Inc. Radio frequency filter having a temperature compensated ceramic resonator
US4588963A (en) * 1983-12-20 1986-05-13 Hughes Aircraft Company Microwave power combiner with alternating diode modules
JPS62293968A (en) * 1986-06-11 1987-12-21 Hitachi Ltd Main circuit of power converter
JPH02281698A (en) * 1989-04-21 1990-11-19 Matsushita Electric Ind Co Ltd Case device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2038491A5 (en) * 1969-03-17 1971-01-08 Radiotechnique Compelec
US3605034A (en) * 1969-08-28 1971-09-14 Sperry Rand Corp Coaxial cavity negative resistance amplifiers and oscillators
US3628171A (en) * 1970-08-07 1971-12-14 Bell Telephone Labor Inc Microwave power combining oscillator circuits
US3931587A (en) * 1973-01-19 1976-01-06 Hughes Aircraft Company Microwave power accumulator
US3873934A (en) * 1974-05-13 1975-03-25 Hughes Aircraft Co Devices for coupling microwave diode oscillators and amplifiers to power accumulation structures
FR2346896A1 (en) * 1975-11-21 1977-10-28 Thomson Csf NEGATIVE RESISTANCE HYPERFREQUENCY CIRCUIT INCLUDING ONE OR MORE PAIRS OF DIODES AND DEVICES USING THIS CIRCUIT
US4034314A (en) * 1976-06-24 1977-07-05 Motorola, Inc. Microwave diode coaxial circuit oscillator improvement
US4090152A (en) * 1977-07-05 1978-05-16 Motorola, Inc. Push-pull oscillator circuit with power combining cavity

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DE2828874C2 (en) 1983-10-20
GB1575489A (en) 1980-09-24
JPS5414141A (en) 1979-02-02
JPS5928284B2 (en) 1984-07-12
US4172240A (en) 1979-10-23
FR2396430A1 (en) 1979-01-26
DE2828874A1 (en) 1979-01-18
FR2396430B1 (en) 1984-10-26

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