CA1127319A - Lead frames - Google Patents
Lead framesInfo
- Publication number
- CA1127319A CA1127319A CA344,452A CA344452A CA1127319A CA 1127319 A CA1127319 A CA 1127319A CA 344452 A CA344452 A CA 344452A CA 1127319 A CA1127319 A CA 1127319A
- Authority
- CA
- Canada
- Prior art keywords
- leads
- support member
- lead frame
- lead
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Transceivers (AREA)
Abstract
ABSTRACT
A lead frame is capable of use with integrated circuit chips of different sizes and having different numbers of terminal areas, in that it comprises a centrally located support member, and a plurality of leads having inner end portions which are integral with the support member and having outer portions forming a radiating pattern relative to the support member, at least one of the leads being a composite lead comprising a trunk lead and branch leads extending from side edges of the trunk lead at spaced intervals and at increasing distances from the support member, whereby the lead frame can be used with a relatively small chip by removing the support member and connecting the leads, excluding the trunk lead, to the terminal areas of the chip, and the lead frame can be used with larger sizes of chips by removing the support member and a portion of the trunk lead adjacent to the support member whereby branch and other leads can be connected to terminal areas of the chip.
A lead frame is capable of use with integrated circuit chips of different sizes and having different numbers of terminal areas, in that it comprises a centrally located support member, and a plurality of leads having inner end portions which are integral with the support member and having outer portions forming a radiating pattern relative to the support member, at least one of the leads being a composite lead comprising a trunk lead and branch leads extending from side edges of the trunk lead at spaced intervals and at increasing distances from the support member, whereby the lead frame can be used with a relatively small chip by removing the support member and connecting the leads, excluding the trunk lead, to the terminal areas of the chip, and the lead frame can be used with larger sizes of chips by removing the support member and a portion of the trunk lead adjacent to the support member whereby branch and other leads can be connected to terminal areas of the chip.
Description
7;~
This invention relates to lead frames, and lead frames having housings moulded thereon for use in packaging i.nt~grated circuit elements.
Integrated circuit ~lements are being produced in large n~mbers in the form of flat chips which are usually square and which have terminal areas located on one surface thereof, usually along edges of the chip. These chips are being produced in several sizes and having diff~rent numbers of terminal areas.
lo When a chip is pack~ged in a carrier, it is necessary to establish electrical connections to the terminal areas on the chip, and to provida conductors extending from the chip to the edge of the carrier so that ~he chip can be conn~cted to further circuitry.
In accordance with conventional packaging - techni.ques, it is normally necessary to provide a particular lead frame for each ch p size and terminal area requirement, and clearly this is a burdensome inconvenience to the integrated circuit element packaging industry. Clearly, substantial ec~nomies could be achieved if a singl~ standard lead frame and chip carrier could be used with chips in a range o~ sizes and chips having a range of numbers of terminal areas thereon.
~5 Accorcling to this invention there is provided a lead frame capable of us ~7ith integrated circuit chi~s of differen~ sizes and havin~ diff2rent numb2rs of
This invention relates to lead frames, and lead frames having housings moulded thereon for use in packaging i.nt~grated circuit elements.
Integrated circuit ~lements are being produced in large n~mbers in the form of flat chips which are usually square and which have terminal areas located on one surface thereof, usually along edges of the chip. These chips are being produced in several sizes and having diff~rent numbers of terminal areas.
lo When a chip is pack~ged in a carrier, it is necessary to establish electrical connections to the terminal areas on the chip, and to provida conductors extending from the chip to the edge of the carrier so that ~he chip can be conn~cted to further circuitry.
In accordance with conventional packaging - techni.ques, it is normally necessary to provide a particular lead frame for each ch p size and terminal area requirement, and clearly this is a burdensome inconvenience to the integrated circuit element packaging industry. Clearly, substantial ec~nomies could be achieved if a singl~ standard lead frame and chip carrier could be used with chips in a range o~ sizes and chips having a range of numbers of terminal areas thereon.
~5 Accorcling to this invention there is provided a lead frame capable of us ~7ith integrated circuit chi~s of differen~ sizes and havin~ diff2rent numb2rs of
- 2 -g201 terminal areas, the lead frame comprising a centrally located s~pport member, and a plurality of leads having inner end portions which are int~gral ~ith the support member and havinc3 outer portions forming a radiating pattern relative to the.support member, at least one of the leads being a composite lead comprising a trunk lead and branch leads extending from side edges of the trunk lead a-t spaced int2rvals and at increasing distances from the support member, lG whereby the lead frame can be used with a relativPly small chip by removing the support member and connecting ths leads, excluding the trunk lead, to the terminal areas of the chip, and the lead fralne ca~ be used with larger sizes of chîps by removing the support member and a portion of the trunk lead adjac~nt to the support member whereby branch and,other leads can be connected to terminal areas of the chip, This invention will now be described by way of example with xeference to the drawings, in which:-Figure 1 is a perspective view of a section of a strip of in egrated circuit element packages;
Figure 2 is a plall view of a lead frame in accordance with the invention;
Figures 3 to 5 ar~ views similar to Figure 2, illustrating the manner in which chips of different sizes and re~uiring differ~nt numhers of leads can
Figure 2 is a plall view of a lead frame in accordance with the invention;
Figures 3 to 5 ar~ views similar to Figure 2, illustrating the manner in which chips of different sizes and re~uiring differ~nt numhers of leads can
3~
be accommodated by the lead frame of Figure 2;
Figure 6 is a plan view looking in the direction of the arrows VIin Figure 7, of a chip carrier housing moulded on to a lead frame;
Figure 7 is a view taken along the line VII - VII in Figure 6;
Figure 8 is a view taken along the line VIII - VIII in Figure 7;
Figure 9 is a plan view in the direction of the arrows IX - IX in Figure 7, but with a chip mounted in the housing;
Figure 10 is a view taken along line X - X in Figure 9; and Figure 11 is a view similar to Figure 10 but with the leads formed into their final condition.
Figure 1 shows a continuous strip comprising a lead frame strip 1 and chip carrier housings 2 moulded on to the lead frame strip 1 in surround-ing relationship to each lead frame.
In the description which follows, an individual lead frame of the strip 1, as shown in Figure 2, is first described, and this description is followed by a description of a chip carrier housing 2 and the manner in which a chip can be packaged in the housing 2 and the terminal areas of the chip connected to the leads of the lead frame.
As shown in Figure 2, the lead frame strip 1 comprises a continuous strip of conductive metal provided with pilot holes 3 at regularly spaced ~lZ'~31~
' 9201 in~erval~ adjacent to the side edcJ~s, and an index hole 4 adjacent to each lead frame for the purpose of orienting the lead frame durin~ manufacture of a complete assembly.
The lead frame shown in Figure 2 compri~es a square central support member S, and leads 6 and 7 radiating from the support member 5. ' The leads 6 are desig~ated simple leads since each comprises a single strip of metal lo extending from one edae of the support member 5.
Each simple lead 6 has an inner end portion 8 which extends normally from one edge of the ~upport member.
5, an intermediate portion 9~ and an outer end portion 10. ~he intermediate portions 9 at e,ach side of the support member 5 diverge from each other', and the outer end portions 10 extend parallel to each other. The lead frame of Figure 2 is symmetrical about ~ertical and hori.zontal axis, as seen in the dxawing. Each lead frame in the strip 1 is separated from adjacent lead frames by a narrow transversely ext~nding portion 11 of the stock metal, as shown in Figure 2.
The leads 7 are designated composite leads, and each comprises a trunk lead 12 which extends from a corner of the central support member 5 at an angle of 45 degre~s'to the inn~r end portions 8 of the'adjacen~ simple leads 6. Each composite lead 7 . 92~1 furthex comprises a pluralit~-o b~anch leads -13 ~ach of ~Ihich has an inner end portion 14 which extends from on~ side ed.g~ of ~he associated trunk lead 12 and parallel to adjacen~ inner end por~ions 14 of immediately adjacent simple laads 6. Each branch lead 13 also has an intermediate portion 15 which forms part of an intermediate radiat.ing lead patt~rn, and an outer end portion 16 which extends parallel to the outer end portions.10 of the simple lo leads 6~ The outer end portions of the composi.te leads 7 ar~ provided with triangular openings 17 which provid~ an improved interlock betw~en a chip carrier housing and the lead frame when the houslng is moulded on to the lead frame.
The particular lead frame according to the invention, shown in Figure 2, has a total of twenty-eight ~imple leads 6, seven extending from each of the side edges of the support me~ber 5, and four composite leads 7, each havlng ten branch leads 13 extending therefrom, five extending from each side edge of each composi.~e lead., In use of th~ lead frame,of F~gure 2, an opening i5 provided in the centre of the lead.frame of a size dependent llpon ~he physical dimensions of the chlp to be mounted, and the number of leads requi.red for the chiD.
I~ the lead frame i5 used ln pac};a~ing a 273~ -g201 relativeiy small chip which re~ui.res only t~rent,~-zic3ht leads, t.he support memb~x 5 onl~ is xemoved from , the lead frame, a5 shown i.n Figure 3, and tlle seven simple leads 6 at ~ach side of this ope.nin~ are 5 connec~ed ~o the terminal areas of the chip.
If it is desired to mount a chip of a larg~r size requiring forty-four leads, an openinc3 as shown in Figure 4 is provided in the centre of the lead frame by removing the centre support member 5, por~ions of ~,he innsr end portions 8 of the si.mple leads 6, and a portion of ~ach trunk lead 12 adjacent to thç support member 5~ Upon removal of these inner end portions of the trunk leads 12, some of the branch leads 13 become separated fxom the trunk lead 12 and can be used to establish electrical connections to the chip.
If a relatively large inte~rated circuit chip is being mounted, an opening as shown in Figure 5 ! iS provided by removal of the support member 5 and the trunk leads 12 to render all of the branch leads - 13 available for establishinc3 connections to the chip so that a total of ixt,y-e1ght ].eads (forty branch leads 13 and twenty-eight simple leads 6) are pxovided for the chip.
. 25 A lead frame as described above can be used with chip carrier hous1nc~s of many different types and can be used in any desi~ed manufacturin~ processes "
-.: 7 -~ ~ ~73~
for producing chi.p carrier assem~lies. Ho~ever, ~- there will now be descr.ibed a specific pre-moulded housing arrangement which permits ~he accommodation of chips of dif~erent s~zes.
Referrins to Figures 6 to lO, housings 18 are moulded on to the strip l by a suitable injection moulding apparatus and may be of any suitable tharmoplastic material, such as polyphenylnene sulfide resln. Suitable filling materials, such as glass fibres, can ke used with the resin to provide improved hardness or other desired characteristics in the housings.
Each housing 18 comprises a square frame-like structure whlch surrounds the centre of the lead frame and ~hich extends beyond both major surfaces of the strip l. A relatively thin ~ek l9 extends inwardly from the internal side walls of the housing 18 towards the centre of the lead frame, and an opening 20 is provided in this web 19, which opening 20 is centrally located with respect to the support member 5 of the lead frame. A small central opening 21 is also provided in the support membar 5 of the lead frame as shown ! the openings 20 and 21 receiving cores used in the moulding process.
The inner end portions 8 and 14 of the leads 6 and 13 are embedded in the w~b l9 bu~ their downwardl~ ¦
facing surfaces are e~posed as shown in Figures 8 and t 11~731~
lo t and the interm2diate portions 9 and 15 of the ,~ .
leads 6 and 13 are totall~ embedded in the side walls of the housing 18 as clearly shown in Figure 7.
The upper (as se~n in the drawings) surface 5 of the housing 18 is form~d with a recess 22, while the lower surface has a similar but smaller recess 23 adjacen~ the strip 1 which recess 23 opens into a slightly largar recess 24. Furthex recesses 25 are provided in the lower surace around the periphexy lG ther~of.
In th~ manufacture of a chip carrie.r assembly a portion o the web. 19 and the support member 5 of the lead frame are removed by a suitable punch and die to provide an enlarged opening in the web 15 19, as shown in Fiyure 10.
. A chip 100 (Figure 10) is bonded to a suitabl~3 heat sink 101 wh~ ch is dimensioned to be received in the recess 22, and which i,s then posi'cioned i.n the recess 22 a~ shown in Figure 10. L.ips 26 formed around the recess 22 are then the~nally reforn~ed, as fihown in Figure 10, so tha, they extend over marginal po.rtions of the heat sink 101 and retain it in the chip carr.ier housing 18. The terlninal areas of the chip ar~ then electri.cally connected in any suitable w~y to tha ends of the leads, Figure 10 showing conventiollal wixe bond connectj.ons 102 extending ~rom ths chip 100 to the leads~ It _ g _ LZ7~
will be no~ed that the chip is positioned imm~diately O~
adjacent to tha leads of the lead frame so ~hat the ex~remely fin.e wires 102 are ~xtremely short.
The manufacturin~ process is completed by 5 filling the central openi.ny of the housing 18 with a suitahle matPrlal such as a silicone material, mounting a hott~om ~losure member 103 (Figure 10) in the r~cess 24, and forming lips 27 on the lower surface of the housing over the closure member 103 to retain it in place.
The operati.ons described above can be carried out while the outer end portions 10 and 16 of the leads are in~egral with tne metal strip 1, and after these operations have been carried out, th~
leads are severed froM the metal strip 1 and formed such that their free ends are reversely bent to be.
received in the recesses 25 in the housing 18, as sho~m in Figure 11.
Lead frames in accordance with the invention can be used for chips of other than the square configuration shown in the drawings. Square chips are ~idely used, but chips need not be produced in a square configuration, and a lead frame in accordance with the invention can have simple and composite leads 6, 7 and 13 arranged around a suitably shaped centr~ support me~mher 5 for chips o~ any shape.
, -- lo --~ .
be accommodated by the lead frame of Figure 2;
Figure 6 is a plan view looking in the direction of the arrows VIin Figure 7, of a chip carrier housing moulded on to a lead frame;
Figure 7 is a view taken along the line VII - VII in Figure 6;
Figure 8 is a view taken along the line VIII - VIII in Figure 7;
Figure 9 is a plan view in the direction of the arrows IX - IX in Figure 7, but with a chip mounted in the housing;
Figure 10 is a view taken along line X - X in Figure 9; and Figure 11 is a view similar to Figure 10 but with the leads formed into their final condition.
Figure 1 shows a continuous strip comprising a lead frame strip 1 and chip carrier housings 2 moulded on to the lead frame strip 1 in surround-ing relationship to each lead frame.
In the description which follows, an individual lead frame of the strip 1, as shown in Figure 2, is first described, and this description is followed by a description of a chip carrier housing 2 and the manner in which a chip can be packaged in the housing 2 and the terminal areas of the chip connected to the leads of the lead frame.
As shown in Figure 2, the lead frame strip 1 comprises a continuous strip of conductive metal provided with pilot holes 3 at regularly spaced ~lZ'~31~
' 9201 in~erval~ adjacent to the side edcJ~s, and an index hole 4 adjacent to each lead frame for the purpose of orienting the lead frame durin~ manufacture of a complete assembly.
The lead frame shown in Figure 2 compri~es a square central support member S, and leads 6 and 7 radiating from the support member 5. ' The leads 6 are desig~ated simple leads since each comprises a single strip of metal lo extending from one edae of the support member 5.
Each simple lead 6 has an inner end portion 8 which extends normally from one edge of the ~upport member.
5, an intermediate portion 9~ and an outer end portion 10. ~he intermediate portions 9 at e,ach side of the support member 5 diverge from each other', and the outer end portions 10 extend parallel to each other. The lead frame of Figure 2 is symmetrical about ~ertical and hori.zontal axis, as seen in the dxawing. Each lead frame in the strip 1 is separated from adjacent lead frames by a narrow transversely ext~nding portion 11 of the stock metal, as shown in Figure 2.
The leads 7 are designated composite leads, and each comprises a trunk lead 12 which extends from a corner of the central support member 5 at an angle of 45 degre~s'to the inn~r end portions 8 of the'adjacen~ simple leads 6. Each composite lead 7 . 92~1 furthex comprises a pluralit~-o b~anch leads -13 ~ach of ~Ihich has an inner end portion 14 which extends from on~ side ed.g~ of ~he associated trunk lead 12 and parallel to adjacen~ inner end por~ions 14 of immediately adjacent simple laads 6. Each branch lead 13 also has an intermediate portion 15 which forms part of an intermediate radiat.ing lead patt~rn, and an outer end portion 16 which extends parallel to the outer end portions.10 of the simple lo leads 6~ The outer end portions of the composi.te leads 7 ar~ provided with triangular openings 17 which provid~ an improved interlock betw~en a chip carrier housing and the lead frame when the houslng is moulded on to the lead frame.
The particular lead frame according to the invention, shown in Figure 2, has a total of twenty-eight ~imple leads 6, seven extending from each of the side edges of the support me~ber 5, and four composite leads 7, each havlng ten branch leads 13 extending therefrom, five extending from each side edge of each composi.~e lead., In use of th~ lead frame,of F~gure 2, an opening i5 provided in the centre of the lead.frame of a size dependent llpon ~he physical dimensions of the chlp to be mounted, and the number of leads requi.red for the chiD.
I~ the lead frame i5 used ln pac};a~ing a 273~ -g201 relativeiy small chip which re~ui.res only t~rent,~-zic3ht leads, t.he support memb~x 5 onl~ is xemoved from , the lead frame, a5 shown i.n Figure 3, and tlle seven simple leads 6 at ~ach side of this ope.nin~ are 5 connec~ed ~o the terminal areas of the chip.
If it is desired to mount a chip of a larg~r size requiring forty-four leads, an openinc3 as shown in Figure 4 is provided in the centre of the lead frame by removing the centre support member 5, por~ions of ~,he innsr end portions 8 of the si.mple leads 6, and a portion of ~ach trunk lead 12 adjacent to thç support member 5~ Upon removal of these inner end portions of the trunk leads 12, some of the branch leads 13 become separated fxom the trunk lead 12 and can be used to establish electrical connections to the chip.
If a relatively large inte~rated circuit chip is being mounted, an opening as shown in Figure 5 ! iS provided by removal of the support member 5 and the trunk leads 12 to render all of the branch leads - 13 available for establishinc3 connections to the chip so that a total of ixt,y-e1ght ].eads (forty branch leads 13 and twenty-eight simple leads 6) are pxovided for the chip.
. 25 A lead frame as described above can be used with chip carrier hous1nc~s of many different types and can be used in any desi~ed manufacturin~ processes "
-.: 7 -~ ~ ~73~
for producing chi.p carrier assem~lies. Ho~ever, ~- there will now be descr.ibed a specific pre-moulded housing arrangement which permits ~he accommodation of chips of dif~erent s~zes.
Referrins to Figures 6 to lO, housings 18 are moulded on to the strip l by a suitable injection moulding apparatus and may be of any suitable tharmoplastic material, such as polyphenylnene sulfide resln. Suitable filling materials, such as glass fibres, can ke used with the resin to provide improved hardness or other desired characteristics in the housings.
Each housing 18 comprises a square frame-like structure whlch surrounds the centre of the lead frame and ~hich extends beyond both major surfaces of the strip l. A relatively thin ~ek l9 extends inwardly from the internal side walls of the housing 18 towards the centre of the lead frame, and an opening 20 is provided in this web 19, which opening 20 is centrally located with respect to the support member 5 of the lead frame. A small central opening 21 is also provided in the support membar 5 of the lead frame as shown ! the openings 20 and 21 receiving cores used in the moulding process.
The inner end portions 8 and 14 of the leads 6 and 13 are embedded in the w~b l9 bu~ their downwardl~ ¦
facing surfaces are e~posed as shown in Figures 8 and t 11~731~
lo t and the interm2diate portions 9 and 15 of the ,~ .
leads 6 and 13 are totall~ embedded in the side walls of the housing 18 as clearly shown in Figure 7.
The upper (as se~n in the drawings) surface 5 of the housing 18 is form~d with a recess 22, while the lower surface has a similar but smaller recess 23 adjacen~ the strip 1 which recess 23 opens into a slightly largar recess 24. Furthex recesses 25 are provided in the lower surace around the periphexy lG ther~of.
In th~ manufacture of a chip carrie.r assembly a portion o the web. 19 and the support member 5 of the lead frame are removed by a suitable punch and die to provide an enlarged opening in the web 15 19, as shown in Fiyure 10.
. A chip 100 (Figure 10) is bonded to a suitabl~3 heat sink 101 wh~ ch is dimensioned to be received in the recess 22, and which i,s then posi'cioned i.n the recess 22 a~ shown in Figure 10. L.ips 26 formed around the recess 22 are then the~nally reforn~ed, as fihown in Figure 10, so tha, they extend over marginal po.rtions of the heat sink 101 and retain it in the chip carr.ier housing 18. The terlninal areas of the chip ar~ then electri.cally connected in any suitable w~y to tha ends of the leads, Figure 10 showing conventiollal wixe bond connectj.ons 102 extending ~rom ths chip 100 to the leads~ It _ g _ LZ7~
will be no~ed that the chip is positioned imm~diately O~
adjacent to tha leads of the lead frame so ~hat the ex~remely fin.e wires 102 are ~xtremely short.
The manufacturin~ process is completed by 5 filling the central openi.ny of the housing 18 with a suitahle matPrlal such as a silicone material, mounting a hott~om ~losure member 103 (Figure 10) in the r~cess 24, and forming lips 27 on the lower surface of the housing over the closure member 103 to retain it in place.
The operati.ons described above can be carried out while the outer end portions 10 and 16 of the leads are in~egral with tne metal strip 1, and after these operations have been carried out, th~
leads are severed froM the metal strip 1 and formed such that their free ends are reversely bent to be.
received in the recesses 25 in the housing 18, as sho~m in Figure 11.
Lead frames in accordance with the invention can be used for chips of other than the square configuration shown in the drawings. Square chips are ~idely used, but chips need not be produced in a square configuration, and a lead frame in accordance with the invention can have simple and composite leads 6, 7 and 13 arranged around a suitably shaped centr~ support me~mher 5 for chips o~ any shape.
, -- lo --~ .
Claims (5)
1. A lead frame capable of use with integrated circuit chips of different sizes and having different numbers of terminal areas, the lead frame comprising a centrally located support member, and a plurality of leads having inner and portions which are integral with the support member and having outer portions forming a radiating pattern relative to the support member, at least one of the leads being a composite lead comprising a trunk lead and branch leads extending from side edges of the trunk lead at spaced intervals and at increasing distances from the support member, whereby the lead frame can be used with a relatively small chip by removing he support member and connecting the leads, excluding the trunk lead, to the terminal areas of the chip, and the lead frame can be used with larger sizes of chips by removing the support member and a portion of the trunk lead adjacent to the support member whereby branch and other leads can be connected to terminal areas of the chip.
2. A lead frame as claimed in Claim 1, including a plurality of said composite leads extending from the support member at spaced angular intervals.
3. A lead frame as claimed in Claim 2, wherein the support member is rectangular, there being four composite leads extending one from each corner of the support member.
4. A lead frame as claimed in claim 1, 2 or 3 including a plurality of simple leads, extending normally from the edges of the support member, said branch leads extending parallel to inner end portions of adjacent simple leads.
5. In combination, a lead frame as claimed in claim 1, 2 or 3 and an electrically insulating housing moulded thereon, the housing comprising a frame-like structure moulded on to intermediate portions of the leads, inner end portions of the leads extending inwardly from side wall portions of the housing, and a web moulded integrally with the frame, the web extending from the side wall portions of the housing substantially to the centre of the lead frame, the inner end portions of the leads being supported by the web, whereby an integrated circuit chip having dimensions which lie within a predetermined range can be mounted in the housing by removing a portion of the web and portions of the inner end portions of the leads to form an open-ing in the web dimensioned to receive the chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14,397 | 1979-02-23 | ||
| US06/014,397 US4195193A (en) | 1979-02-23 | 1979-02-23 | Lead frame and chip carrier housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1127319A true CA1127319A (en) | 1982-07-06 |
Family
ID=21765252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA344,452A Expired CA1127319A (en) | 1979-02-23 | 1980-01-28 | Lead frames |
Country Status (18)
| Country | Link |
|---|---|
| US (1) | US4195193A (en) |
| EP (1) | EP0015111B1 (en) |
| JP (1) | JPS55117263A (en) |
| AR (1) | AR220032A1 (en) |
| AT (1) | ATE2034T1 (en) |
| AU (1) | AU528043B2 (en) |
| BR (1) | BR8000587A (en) |
| CA (1) | CA1127319A (en) |
| DE (1) | DE3061294D1 (en) |
| DK (1) | DK155260C (en) |
| ES (1) | ES8103478A1 (en) |
| FI (1) | FI70348C (en) |
| HK (1) | HK4685A (en) |
| IL (1) | IL59455A (en) |
| MX (1) | MX147540A (en) |
| NO (1) | NO154363C (en) |
| NZ (1) | NZ192695A (en) |
| SG (1) | SG44684G (en) |
Families Citing this family (77)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3535863A (en) * | 1968-01-15 | 1970-10-27 | Hugh Albert Caughlin | Swath separator |
| US4303934A (en) * | 1979-08-30 | 1981-12-01 | Burr-Brown Research Corp. | Molded lead frame dual in line package including a hybrid circuit |
| US4338621A (en) * | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
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| US3676748A (en) * | 1970-04-01 | 1972-07-11 | Fuji Electrochemical Co Ltd | Frame structures for electronic circuits |
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-
1979
- 1979-02-23 US US06/014,397 patent/US4195193A/en not_active Expired - Lifetime
-
1980
- 1980-01-23 NZ NZ192695A patent/NZ192695A/en unknown
- 1980-01-28 CA CA344,452A patent/CA1127319A/en not_active Expired
- 1980-01-30 BR BR8000587A patent/BR8000587A/en not_active IP Right Cessation
- 1980-01-30 AU AU55047/80A patent/AU528043B2/en not_active Ceased
- 1980-01-30 NO NO800226A patent/NO154363C/en unknown
- 1980-02-08 FI FI800397A patent/FI70348C/en not_active IP Right Cessation
- 1980-02-12 DE DE8080300398T patent/DE3061294D1/en not_active Expired
- 1980-02-12 AT AT80300398T patent/ATE2034T1/en not_active IP Right Cessation
- 1980-02-12 EP EP80300398A patent/EP0015111B1/en not_active Expired
- 1980-02-20 MX MX181239A patent/MX147540A/en unknown
- 1980-02-20 ES ES488758A patent/ES8103478A1/en not_active Expired
- 1980-02-21 JP JP2106280A patent/JPS55117263A/en active Granted
- 1980-02-22 IL IL59455A patent/IL59455A/en not_active IP Right Cessation
- 1980-02-22 DK DK076580A patent/DK155260C/en not_active IP Right Cessation
- 1980-02-22 AR AR280068A patent/AR220032A1/en active
-
1984
- 1984-06-19 SG SG44684A patent/SG44684G/en unknown
-
1985
- 1985-01-17 HK HK46/85A patent/HK4685A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NO800226L (en) | 1980-08-25 |
| BR8000587A (en) | 1980-10-21 |
| ES488758A0 (en) | 1981-02-16 |
| ATE2034T1 (en) | 1982-12-15 |
| JPS55117263A (en) | 1980-09-09 |
| AU5504780A (en) | 1980-08-28 |
| HK4685A (en) | 1985-01-25 |
| DK155260B (en) | 1989-03-13 |
| JPH026225B2 (en) | 1990-02-08 |
| FI70348C (en) | 1986-09-15 |
| EP0015111A1 (en) | 1980-09-03 |
| AU528043B2 (en) | 1983-04-14 |
| ES8103478A1 (en) | 1981-02-16 |
| DE3061294D1 (en) | 1983-01-20 |
| NO154363C (en) | 1986-09-03 |
| MX147540A (en) | 1982-12-13 |
| DK76580A (en) | 1980-08-24 |
| IL59455A (en) | 1982-07-30 |
| DK155260C (en) | 1989-07-24 |
| FI70348B (en) | 1986-02-28 |
| NZ192695A (en) | 1982-08-17 |
| EP0015111B1 (en) | 1982-12-15 |
| FI800397A (en) | 1980-08-24 |
| NO154363B (en) | 1986-05-26 |
| SG44684G (en) | 1985-03-08 |
| AR220032A1 (en) | 1980-09-30 |
| US4195193A (en) | 1980-03-25 |
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