CA1159160A - Pattern forming apparatus - Google Patents
Pattern forming apparatusInfo
- Publication number
- CA1159160A CA1159160A CA000398647A CA398647A CA1159160A CA 1159160 A CA1159160 A CA 1159160A CA 000398647 A CA000398647 A CA 000398647A CA 398647 A CA398647 A CA 398647A CA 1159160 A CA1159160 A CA 1159160A
- Authority
- CA
- Canada
- Prior art keywords
- pattern
- forming apparatus
- photoresist layer
- liquid
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
Abstract
ABSTRACT OF THE DISCLOSURE
There is disclosed a pattern forming apparatus for projecting a pattern which is formed on a reticle upon a photoresist layer on a substrate which comprises an illumination system for illuminating the pattern for forming an optical image, a reduction lenses for reducing the optical pattern image at a certain reduction ratio and projecting the reduced optical pattern image upon the photoresist layer formed on the substrate for exposing the photoresist layer, and liquid sustaining means for filling a gap between at least a portion of the reduction lenses and the photoresist layer with an optically transparent liquid having a refractive index of more than 1 (one).
There is disclosed a pattern forming apparatus for projecting a pattern which is formed on a reticle upon a photoresist layer on a substrate which comprises an illumination system for illuminating the pattern for forming an optical image, a reduction lenses for reducing the optical pattern image at a certain reduction ratio and projecting the reduced optical pattern image upon the photoresist layer formed on the substrate for exposing the photoresist layer, and liquid sustaining means for filling a gap between at least a portion of the reduction lenses and the photoresist layer with an optically transparent liquid having a refractive index of more than 1 (one).
Description
1 ~591~) 1 This invention relates t:o an apparatus for forming a pattern of a large scale integration semi-conductor element by utilizing a fine pattern.
Of processes in fabrication of semiconductors, lithography process for the formation of a fine pattern on a substrate is the most important and photolithography using light plays the leading role today in the lithography process.
In the lithography process, as larger integra-tion of the semiconductor elements prevails, it isrequired to improve resolution of the fine pattern and pattern alignment necessary for the formation of the fine pattern at a desired position.
With the photolithography, however, the wave-length of light for exposure constrains the resolutionto a limit in the formation of a fine pattern having a line width of about 1 ~m.
In order to assure the pattern alignment, it is also required to detect the position of the pattern to be formed on the substrate with high precision.
Description will be made hereinbelow in conjunction with the accompanying drawings, in which:
Fig. 1 is a fragmentary sectional view of a substrate useful in explaining disadvantages encountered in a prior art pattern forming apparatus;
1 E~ig. ~ is a schematic diagram showlng a fundamental construction of a pattern forming apparatus embodying the invention;
Flg. 3 is a schematic diagram of another embodiment of the invention; and Fig. 4 is a graph useful in explaining effects brought about by the pattern forming apparatus of the invention.
Referring to Fig. 1, a pattern 10 formed on a substrate 1 and to be detected for aligning the sub-strate 1 is covered with a photoresist layer 2 with an uneven surface. Therefore, refraction of light for pattern detection becomes irregular, thus impairing precise position detection.
This invention contemplates the elimination of the above drawbacks and has for its object to provide a novel pattern forming apparatus effective to improve resolution of a fine pattern and precision of the pattern alignment.
According to one aspect of the present inven-tion, there is provided a pattern forming apparatus for projecting a pattern, which is formed in advance on a reticle, upon a workpiece at a certain reduction ratio, comprising an illumination system for illuminating the pattern for forming an optical pattern image, reduction lenses for projecting the optical pattern image at a certain reduction ratio upon a photoresist iayer formed on a substrate to expose the photoresist layer, and 1 ~ 5 ~ o 1 liquid sustaining rneans for filling a yap between at leas-t a portion of the reduction lenses and the photo-resist layer with an opticall~ transparent liquid having a refractive index of move than l (one~.
Now, description will be made in detail, by way of example, on preferred embodiments of this inven-tion.
The fundamental principle of the present invention will first be descrlbed. In general, the resolution limit R (~m) of a pattern projection optics used for the pattern formation for semiconductor elements is expressed as, R = 0.61 x n x sln ~
where ~: wavelength (~m) of light in vacuum used for exposure, n: refractive index of ambient atmosphere in an exposure system, and sin ~: fixed value of reduction lenses.
For larger integration of semiconductor elements, the pattern for the formation of the semi-conductor element should be finely drawn and the resolution limit R of the pattern projection optics should be improved.
Accordingly, it has hitherto been contrived to minimize the exposure light wavelength or increase the o 1 fi~ed ~ialue sin ) o~ the reduction lenses. However, physical conditioll constrains ~he variatlon of these quantities to limits. It is found that the conven-tional pattern projection and exposure has assumed to carry out the e~posure in air or in vacuum in which n = 1 always stands. The prese~t invention makes it possible to drastically improve the resolution limit R by using an optically transparent liquid having a refractive index n of more than 1.
Specifically, a pattern forming apparatus 20 of the invention has a fundamental construction as shown in Fig. 2. The apparatus 20 comparises an illumination system 6 comprised of a lamp housing unit and condenser lenses (not shown), a reticle 5 provided with a pattern, reduction lenses 4, a semiconductor substrate 1 carried on a wafer stage (not shown) and having a surface on which a photoresist layer 2 is formed, a liquid layer 3 filling a gap between the photoresist layer 2 and at least a portion of the reduction lenses 4, and a pattern detector 7 for positioning the reticle 5 and the sub-strate 1.
In operation, a positioning pattern formed on the reticle 5 and a positioning pattern 10 formed on the substrate 1 are first brought into alignment by means of the pattern detector 7 through the reduction lenses 4. An optical path 11 in this alignment process is shown by solid lines. Then, the reticle 5 provided with a predetermined magnified pattern is illuminated ~ ~ s~
1 by the illumination sys-tem 6 to form an optical pa-ttern image o~. the magnified pattern. This optical pattern image is reduced and ~rojected b~ the reduction lenses 4 upon the photoresi.st layer 2 coated on the semiconduc-tor substrate 1 to e~pose the photoresist layer 2. An optical path 12 in this process is shown by dotted lines. After the first exposure process, the wafer stage carrying the semiconductor substrate 1 is moved tstepped) and a next exposure field is exposed (i.e.
exposure is repeated) in the same manner as the first exposure process. By repeating the exposure process, a predetermined pattern is formed over the entire area of the substrate 1. The pattern forming apparatus 20 of the type as described above is usually termed a reduction projection aligner, and its general construction is referred to as STEP & REPEAT CAMERA, for the detail of which reference may be made to US patent No. 4,057,347.
The pattern forming apparatus 20, according to an embodiment of the present invention is featured by the use of the liquid layer 3 formed and sustained between the reduction lenses 4 and the photoresist layer 2 as has already been described above. The present embodiment defines the pattern forming apparatus 20 by the construc-tion wherein the semiconductor substrate 1 provided with the photoresist layer 2 and a portion or a whole of the reduction lenses 4 are immersed in the liquid layer 3. This liquid layer 3 contains a liquid which can transmit the optical pattern image, that is, 9 ~
1 opticall~ transparent and has a refractive index of more than i (one). Needless to say, the liquid should not be reactlve with materials of the reductlon lenses 4, photoresist layer 2 and semiconductor substrate 1, i.e.
should have chemically s-table characteristics. Examplified as the liquid of this nature are trichlorotrifluoroethane (C2C13F3), chloro~enzene (C6H5Cl~, and water.
In order to form and sustain the liquid layer 3, the liquid is filled in a pool 19 and the reduction lenses 4 and the semiconductor substrate 1 are disposed in the pool 19. Alternatively, in accordance with another embodiment 20' of the invention as shown in Fig. 3, a member 9 may be provided which surrounds the reduction lenses 4 and forms and sustains the liquid layer 3, and the sustaining memker 9 may be equipped with a nozzle 13. Liquid supplied to the nozzle 13 in a direction of an arrow 8 may be drawn out toward the semiconductor substrate 1. With this modification also, the reduction lenses 4 and the photoresist layer 2 are put in immersion in the liquid layer 3.
Acccrding to the foregoing embodiments, when the refractive index n of atmosphere ambient of the exposure system is varied to be more than 1 (one) under the condition that a high resolution reduction lenses 4 usable and available for this invention has a fixed value as defined by sin ~ = 0.28 at a wavelength ~ =
0.436 ~m, the resolution limit R is improved as shown in Fig. 4.
V
1 Speci ically, while the conventional exposure in air achieves a resolvable line width or resolution limit R of 0.95 ~m, the use of a liquid of, for example, n = 1.36 or n = 1.53 such as trichlorotrifluoroethane or chlorobenzene permits a drastic irnprovement of the resolution limit R to 0.69 ~m or 0.62 ~m.
When the refractive indices of the photoresist layer 2 formed on the substrate 1 and of the liquid layer 3 are made equal or almost equal, there occurs no or almost no such error in position detection, which is ascribed to the unevenness of the photoresist layer and has occurred in the conventional system upon detection of the pattern 10 by the position detector 7, even with a photoresist layer 2 having an uneven surface as shown in Fig. 2. In other words, the optical affect of the unevenness of the photoresist layer 2 can be eliminated essentially by melting the optical interface at the photoresist surface in an optically uniform medium, thereby ensuring a stable and highly precise pattern detection.
The present invention is also advantageous in that since the liquid used in the invention can be kept clean by, for example, distillation. It is expected that failure due to the deposition of dusts contained in air to the surface of the photoresist layer 2, which - would occur in the conventional apparatus, can be prevented. Especially, when forming a fine exposure field of less than 1 ~m line width with a reduction projection 1 aligner, difficulties have been encountered ln removing fine dusts contained in air ~,~'r.ich may otherwise be deposited to the ~ine pattern. But, such difficulties can advantageollsly be overcome by the present invention.
Further, since the liquid layer 3 has a larger heat capacity than air, the substrate l can be less affected by temperature variatlons in the course of exposure and possible alignment error due to in-plane distortion of the substrate can be prevented in advance.
While -the foregoing embodiments have been described by way of the reduction projection aligner, the present invention may also be applied advantageously to a 1 : 1 projection aligner for forming a pattern on a substrate, and a checker or a measuring instrument for a fine pattern on a substrate.
Of processes in fabrication of semiconductors, lithography process for the formation of a fine pattern on a substrate is the most important and photolithography using light plays the leading role today in the lithography process.
In the lithography process, as larger integra-tion of the semiconductor elements prevails, it isrequired to improve resolution of the fine pattern and pattern alignment necessary for the formation of the fine pattern at a desired position.
With the photolithography, however, the wave-length of light for exposure constrains the resolutionto a limit in the formation of a fine pattern having a line width of about 1 ~m.
In order to assure the pattern alignment, it is also required to detect the position of the pattern to be formed on the substrate with high precision.
Description will be made hereinbelow in conjunction with the accompanying drawings, in which:
Fig. 1 is a fragmentary sectional view of a substrate useful in explaining disadvantages encountered in a prior art pattern forming apparatus;
1 E~ig. ~ is a schematic diagram showlng a fundamental construction of a pattern forming apparatus embodying the invention;
Flg. 3 is a schematic diagram of another embodiment of the invention; and Fig. 4 is a graph useful in explaining effects brought about by the pattern forming apparatus of the invention.
Referring to Fig. 1, a pattern 10 formed on a substrate 1 and to be detected for aligning the sub-strate 1 is covered with a photoresist layer 2 with an uneven surface. Therefore, refraction of light for pattern detection becomes irregular, thus impairing precise position detection.
This invention contemplates the elimination of the above drawbacks and has for its object to provide a novel pattern forming apparatus effective to improve resolution of a fine pattern and precision of the pattern alignment.
According to one aspect of the present inven-tion, there is provided a pattern forming apparatus for projecting a pattern, which is formed in advance on a reticle, upon a workpiece at a certain reduction ratio, comprising an illumination system for illuminating the pattern for forming an optical pattern image, reduction lenses for projecting the optical pattern image at a certain reduction ratio upon a photoresist iayer formed on a substrate to expose the photoresist layer, and 1 ~ 5 ~ o 1 liquid sustaining rneans for filling a yap between at leas-t a portion of the reduction lenses and the photo-resist layer with an opticall~ transparent liquid having a refractive index of move than l (one~.
Now, description will be made in detail, by way of example, on preferred embodiments of this inven-tion.
The fundamental principle of the present invention will first be descrlbed. In general, the resolution limit R (~m) of a pattern projection optics used for the pattern formation for semiconductor elements is expressed as, R = 0.61 x n x sln ~
where ~: wavelength (~m) of light in vacuum used for exposure, n: refractive index of ambient atmosphere in an exposure system, and sin ~: fixed value of reduction lenses.
For larger integration of semiconductor elements, the pattern for the formation of the semi-conductor element should be finely drawn and the resolution limit R of the pattern projection optics should be improved.
Accordingly, it has hitherto been contrived to minimize the exposure light wavelength or increase the o 1 fi~ed ~ialue sin ) o~ the reduction lenses. However, physical conditioll constrains ~he variatlon of these quantities to limits. It is found that the conven-tional pattern projection and exposure has assumed to carry out the e~posure in air or in vacuum in which n = 1 always stands. The prese~t invention makes it possible to drastically improve the resolution limit R by using an optically transparent liquid having a refractive index n of more than 1.
Specifically, a pattern forming apparatus 20 of the invention has a fundamental construction as shown in Fig. 2. The apparatus 20 comparises an illumination system 6 comprised of a lamp housing unit and condenser lenses (not shown), a reticle 5 provided with a pattern, reduction lenses 4, a semiconductor substrate 1 carried on a wafer stage (not shown) and having a surface on which a photoresist layer 2 is formed, a liquid layer 3 filling a gap between the photoresist layer 2 and at least a portion of the reduction lenses 4, and a pattern detector 7 for positioning the reticle 5 and the sub-strate 1.
In operation, a positioning pattern formed on the reticle 5 and a positioning pattern 10 formed on the substrate 1 are first brought into alignment by means of the pattern detector 7 through the reduction lenses 4. An optical path 11 in this alignment process is shown by solid lines. Then, the reticle 5 provided with a predetermined magnified pattern is illuminated ~ ~ s~
1 by the illumination sys-tem 6 to form an optical pa-ttern image o~. the magnified pattern. This optical pattern image is reduced and ~rojected b~ the reduction lenses 4 upon the photoresi.st layer 2 coated on the semiconduc-tor substrate 1 to e~pose the photoresist layer 2. An optical path 12 in this process is shown by dotted lines. After the first exposure process, the wafer stage carrying the semiconductor substrate 1 is moved tstepped) and a next exposure field is exposed (i.e.
exposure is repeated) in the same manner as the first exposure process. By repeating the exposure process, a predetermined pattern is formed over the entire area of the substrate 1. The pattern forming apparatus 20 of the type as described above is usually termed a reduction projection aligner, and its general construction is referred to as STEP & REPEAT CAMERA, for the detail of which reference may be made to US patent No. 4,057,347.
The pattern forming apparatus 20, according to an embodiment of the present invention is featured by the use of the liquid layer 3 formed and sustained between the reduction lenses 4 and the photoresist layer 2 as has already been described above. The present embodiment defines the pattern forming apparatus 20 by the construc-tion wherein the semiconductor substrate 1 provided with the photoresist layer 2 and a portion or a whole of the reduction lenses 4 are immersed in the liquid layer 3. This liquid layer 3 contains a liquid which can transmit the optical pattern image, that is, 9 ~
1 opticall~ transparent and has a refractive index of more than i (one). Needless to say, the liquid should not be reactlve with materials of the reductlon lenses 4, photoresist layer 2 and semiconductor substrate 1, i.e.
should have chemically s-table characteristics. Examplified as the liquid of this nature are trichlorotrifluoroethane (C2C13F3), chloro~enzene (C6H5Cl~, and water.
In order to form and sustain the liquid layer 3, the liquid is filled in a pool 19 and the reduction lenses 4 and the semiconductor substrate 1 are disposed in the pool 19. Alternatively, in accordance with another embodiment 20' of the invention as shown in Fig. 3, a member 9 may be provided which surrounds the reduction lenses 4 and forms and sustains the liquid layer 3, and the sustaining memker 9 may be equipped with a nozzle 13. Liquid supplied to the nozzle 13 in a direction of an arrow 8 may be drawn out toward the semiconductor substrate 1. With this modification also, the reduction lenses 4 and the photoresist layer 2 are put in immersion in the liquid layer 3.
Acccrding to the foregoing embodiments, when the refractive index n of atmosphere ambient of the exposure system is varied to be more than 1 (one) under the condition that a high resolution reduction lenses 4 usable and available for this invention has a fixed value as defined by sin ~ = 0.28 at a wavelength ~ =
0.436 ~m, the resolution limit R is improved as shown in Fig. 4.
V
1 Speci ically, while the conventional exposure in air achieves a resolvable line width or resolution limit R of 0.95 ~m, the use of a liquid of, for example, n = 1.36 or n = 1.53 such as trichlorotrifluoroethane or chlorobenzene permits a drastic irnprovement of the resolution limit R to 0.69 ~m or 0.62 ~m.
When the refractive indices of the photoresist layer 2 formed on the substrate 1 and of the liquid layer 3 are made equal or almost equal, there occurs no or almost no such error in position detection, which is ascribed to the unevenness of the photoresist layer and has occurred in the conventional system upon detection of the pattern 10 by the position detector 7, even with a photoresist layer 2 having an uneven surface as shown in Fig. 2. In other words, the optical affect of the unevenness of the photoresist layer 2 can be eliminated essentially by melting the optical interface at the photoresist surface in an optically uniform medium, thereby ensuring a stable and highly precise pattern detection.
The present invention is also advantageous in that since the liquid used in the invention can be kept clean by, for example, distillation. It is expected that failure due to the deposition of dusts contained in air to the surface of the photoresist layer 2, which - would occur in the conventional apparatus, can be prevented. Especially, when forming a fine exposure field of less than 1 ~m line width with a reduction projection 1 aligner, difficulties have been encountered ln removing fine dusts contained in air ~,~'r.ich may otherwise be deposited to the ~ine pattern. But, such difficulties can advantageollsly be overcome by the present invention.
Further, since the liquid layer 3 has a larger heat capacity than air, the substrate l can be less affected by temperature variatlons in the course of exposure and possible alignment error due to in-plane distortion of the substrate can be prevented in advance.
While -the foregoing embodiments have been described by way of the reduction projection aligner, the present invention may also be applied advantageously to a 1 : 1 projection aligner for forming a pattern on a substrate, and a checker or a measuring instrument for a fine pattern on a substrate.
Claims (6)
1. A pattern forming apparatus for projecting a pattern which is formed on a reticle upon a photoresist layer on a substrate, comprising:
an illumination system for illuminating said pattern and forming an optical pattern image;
reduction lenses for projecting said optical pattern image at a certain reduction ratio upon the photoresist layer formed on the substrate for exposing the photoresist layer; and liquid sustaining means for filling a gap between at least a portion of said reduction lenses and said photoresist layer with an optically transparent liquid having a refractive index of more than 1 (one).
an illumination system for illuminating said pattern and forming an optical pattern image;
reduction lenses for projecting said optical pattern image at a certain reduction ratio upon the photoresist layer formed on the substrate for exposing the photoresist layer; and liquid sustaining means for filling a gap between at least a portion of said reduction lenses and said photoresist layer with an optically transparent liquid having a refractive index of more than 1 (one).
2. A pattern forming apparatus according to Claim 1, wherein said liquid has substantially the same refractive index as that of a material of said photo-resist layer.
3. A pattern forming apparatus according to Claim 1, further comprising a pattern detector interposed between said illumination system and said reticle for detecting the alignment of pattern between said reticle and said substrate.
4. A pattern forming apparatus according to Claim 1, wherein said substrate comprises a semiconductor substrate.
5. A pattern forming apparatus according to Claim 1, wherein said liquid sustaining means comprises a nozzle for drawing in the liquid.
6. A pattern forming apparatus according to Claim 1, wherein said liquid is trichlorotrifluoroethane or chlorobenzene.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP37977/81 | 1981-03-18 | ||
JP56037977A JPS57153433A (en) | 1981-03-18 | 1981-03-18 | Manufacturing device for semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1159160A true CA1159160A (en) | 1983-12-20 |
Family
ID=12512621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA000398647A Expired CA1159160A (en) | 1981-03-18 | 1982-03-17 | Pattern forming apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US4480910A (en) |
EP (1) | EP0060729B1 (en) |
JP (1) | JPS57153433A (en) |
CA (1) | CA1159160A (en) |
DE (1) | DE3272511D1 (en) |
Families Citing this family (439)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8919617D0 (en) * | 1989-08-30 | 1989-10-11 | Crosfield Electronics Ltd | Film transparency holder |
JP2753930B2 (en) * | 1992-11-27 | 1998-05-20 | キヤノン株式会社 | Immersion type projection exposure equipment |
JP3221226B2 (en) * | 1994-03-30 | 2001-10-22 | キヤノン株式会社 | Illumination apparatus and projection exposure apparatus using the same |
AU2747999A (en) * | 1998-03-26 | 1999-10-18 | Nikon Corporation | Projection exposure method and system |
US7187503B2 (en) * | 1999-12-29 | 2007-03-06 | Carl Zeiss Smt Ag | Refractive projection objective for immersion lithography |
KR100866818B1 (en) * | 2000-12-11 | 2008-11-04 | 가부시키가이샤 니콘 | Projection optical system and exposure apparatus comprising the same |
WO2002091078A1 (en) * | 2001-05-07 | 2002-11-14 | Massachusetts Institute Of Technology | Methods and apparatus employing an index matching medium |
DE10210899A1 (en) * | 2002-03-08 | 2003-09-18 | Zeiss Carl Smt Ag | Refractive projection lens for immersion lithography |
US7092069B2 (en) * | 2002-03-08 | 2006-08-15 | Carl Zeiss Smt Ag | Projection exposure method and projection exposure system |
TWI242691B (en) * | 2002-08-23 | 2005-11-01 | Nikon Corp | Projection optical system and method for photolithography and exposure apparatus and method using same |
US6788477B2 (en) | 2002-10-22 | 2004-09-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for method for immersion lithography |
CN101349876B (en) | 2002-11-12 | 2010-12-01 | Asml荷兰有限公司 | Immersion lithographic apparatus and device manufacturing method |
US9482966B2 (en) | 2002-11-12 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
SG121822A1 (en) * | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
US7372541B2 (en) | 2002-11-12 | 2008-05-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
CN100568101C (en) | 2002-11-12 | 2009-12-09 | Asml荷兰有限公司 | Lithographic equipment and device making method |
US7110081B2 (en) | 2002-11-12 | 2006-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1420298B1 (en) * | 2002-11-12 | 2013-02-20 | ASML Netherlands B.V. | Lithographic apparatus |
DE60335595D1 (en) * | 2002-11-12 | 2011-02-17 | Asml Netherlands Bv | Immersion lithographic apparatus and method of making a device |
EP1429188B1 (en) * | 2002-11-12 | 2013-06-19 | ASML Netherlands B.V. | Lithographic projection apparatus |
KR100585476B1 (en) * | 2002-11-12 | 2006-06-07 | 에이에스엠엘 네델란즈 비.브이. | Lithographic Apparatus and Device Manufacturing Method |
US10503084B2 (en) | 2002-11-12 | 2019-12-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
SG131766A1 (en) * | 2002-11-18 | 2007-05-28 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
DE10253679A1 (en) * | 2002-11-18 | 2004-06-03 | Infineon Technologies Ag | Optical arrangement used in the production of semiconductor components comprises a lens system arranged behind a mask, and a medium having a specified refractive index lying between the mask and the lens system |
TWI255971B (en) * | 2002-11-29 | 2006-06-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
DE10258718A1 (en) * | 2002-12-09 | 2004-06-24 | Carl Zeiss Smt Ag | Projection lens, in particular for microlithography, and method for tuning a projection lens |
WO2004053955A1 (en) | 2002-12-10 | 2004-06-24 | Nikon Corporation | Exposure system and device producing method |
CN1717776A (en) | 2002-12-10 | 2006-01-04 | 株式会社尼康 | Optical device and projection exposure apparatus using such optical device |
US7242455B2 (en) | 2002-12-10 | 2007-07-10 | Nikon Corporation | Exposure apparatus and method for producing device |
AU2003289271A1 (en) * | 2002-12-10 | 2004-06-30 | Nikon Corporation | Exposure apparatus, exposure method and method for manufacturing device |
DE10257766A1 (en) * | 2002-12-10 | 2004-07-15 | Carl Zeiss Smt Ag | Method for setting a desired optical property of a projection lens and microlithographic projection exposure system |
SG171468A1 (en) | 2002-12-10 | 2011-06-29 | Nikon Corp | Exposure apparatus and method for producing device |
SG150388A1 (en) * | 2002-12-10 | 2009-03-30 | Nikon Corp | Exposure apparatus and method for producing device |
JP4352874B2 (en) | 2002-12-10 | 2009-10-28 | 株式会社ニコン | Exposure apparatus and device manufacturing method |
US7948604B2 (en) | 2002-12-10 | 2011-05-24 | Nikon Corporation | Exposure apparatus and method for producing device |
EP1429190B1 (en) * | 2002-12-10 | 2012-05-09 | Canon Kabushiki Kaisha | Exposure apparatus and method |
US7514699B2 (en) * | 2002-12-19 | 2009-04-07 | Koninklijke Philips Electronics N.V. | Method and device for irradiating spots on a layer |
WO2004057590A1 (en) * | 2002-12-19 | 2004-07-08 | Koninklijke Philips Electronics N.V. | Method and device for irradiating spots on a layer |
DE10261775A1 (en) * | 2002-12-20 | 2004-07-01 | Carl Zeiss Smt Ag | Device for the optical measurement of an imaging system |
KR101381538B1 (en) * | 2003-02-26 | 2014-04-04 | 가부시키가이샤 니콘 | Exposure apparatus and method, and method of manufacturing device |
CN101354539B (en) * | 2003-02-26 | 2011-01-26 | 株式会社尼康 | Exposure apparatus and method for producing device |
WO2004086470A1 (en) | 2003-03-25 | 2004-10-07 | Nikon Corporation | Exposure system and device production method |
AU2003219097A1 (en) * | 2003-03-26 | 2004-10-18 | Carl Zeiss Smt Ag | Device for the low-deformation replaceable mounting of an optical element |
WO2004090956A1 (en) | 2003-04-07 | 2004-10-21 | Nikon Corporation | Exposure apparatus and method for manufacturing device |
KR20110104084A (en) | 2003-04-09 | 2011-09-21 | 가부시키가이샤 니콘 | Immersion lithography fluid control system |
KR101124179B1 (en) | 2003-04-09 | 2012-03-27 | 가부시키가이샤 니콘 | Exposure method and apparatus, and device manufacturing method |
WO2004090633A2 (en) * | 2003-04-10 | 2004-10-21 | Nikon Corporation | An electro-osmotic element for an immersion lithography apparatus |
EP2950148B1 (en) | 2003-04-10 | 2016-09-21 | Nikon Corporation | Environmental system including vaccum scavenge for an immersion lithography apparatus |
KR101431938B1 (en) | 2003-04-10 | 2014-08-19 | 가부시키가이샤 니콘 | Environmental system including a transport region for an immersion lithography apparatus |
KR101129213B1 (en) | 2003-04-10 | 2012-03-27 | 가부시키가이샤 니콘 | Run-off path to collect liquid for an immersion lithography apparatus |
SG139736A1 (en) | 2003-04-11 | 2008-02-29 | Nikon Corp | Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly |
WO2004092830A2 (en) | 2003-04-11 | 2004-10-28 | Nikon Corporation | Liquid jet and recovery system for immersion lithography |
SG2013077797A (en) | 2003-04-11 | 2017-02-27 | Nippon Kogaku Kk | Cleanup method for optics in immersion lithography |
EP1614000B1 (en) | 2003-04-17 | 2012-01-18 | Nikon Corporation | Immersion lithographic apparatus |
SG160223A1 (en) | 2003-05-06 | 2010-04-29 | Nikon Corp | Projection optical system, exposure apparatus, and exposure method |
US7348575B2 (en) | 2003-05-06 | 2008-03-25 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
JP4025683B2 (en) * | 2003-05-09 | 2007-12-26 | 松下電器産業株式会社 | Pattern forming method and exposure apparatus |
TWI295414B (en) * | 2003-05-13 | 2008-04-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
KR20060009356A (en) | 2003-05-15 | 2006-01-31 | 가부시키가이샤 니콘 | Exposure apparatus and method for manufacturing device |
TWI503865B (en) * | 2003-05-23 | 2015-10-11 | 尼康股份有限公司 | A method of manufacturing an exposure apparatus and an element |
TWI463533B (en) | 2003-05-23 | 2014-12-01 | 尼康股份有限公司 | An exposure method, an exposure apparatus, and an element manufacturing method |
KR20110110320A (en) * | 2003-05-28 | 2011-10-06 | 가부시키가이샤 니콘 | Exposure method, exposure device, and device manufacturing method |
TWI347741B (en) * | 2003-05-30 | 2011-08-21 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
EP1482372B1 (en) | 2003-05-30 | 2014-10-08 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7213963B2 (en) | 2003-06-09 | 2007-05-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1486827B1 (en) * | 2003-06-11 | 2011-11-02 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7317504B2 (en) | 2004-04-08 | 2008-01-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP3104396B1 (en) | 2003-06-13 | 2018-03-21 | Nikon Corporation | Exposure method, substrate stage, exposure apparatus, and device manufacturing method |
KR101265450B1 (en) | 2003-06-19 | 2013-05-16 | 가부시키가이샤 니콘 | Exposure device and device producing method |
US6867844B2 (en) | 2003-06-19 | 2005-03-15 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
JP2005019616A (en) | 2003-06-25 | 2005-01-20 | Canon Inc | Immersion type exposure apparatus |
DE60308161T2 (en) | 2003-06-27 | 2007-08-09 | Asml Netherlands B.V. | Lithographic apparatus and method for making an article |
US6809794B1 (en) * | 2003-06-27 | 2004-10-26 | Asml Holding N.V. | Immersion photolithography system and method using inverted wafer-projection optics interface |
EP1498778A1 (en) * | 2003-06-27 | 2005-01-19 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
DE60321779D1 (en) * | 2003-06-30 | 2008-08-07 | Asml Netherlands Bv | Lithographic apparatus and method for making an article |
EP1494074A1 (en) * | 2003-06-30 | 2005-01-05 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7236232B2 (en) * | 2003-07-01 | 2007-06-26 | Nikon Corporation | Using isotopically specified fluids as optical elements |
JP4697138B2 (en) * | 2003-07-08 | 2011-06-08 | 株式会社ニコン | Immersion lithography apparatus, immersion lithography method, and device manufacturing method |
KR101209540B1 (en) * | 2003-07-09 | 2012-12-07 | 가부시키가이샤 니콘 | Exposure apparatus and method for manufacturing device |
KR101296501B1 (en) * | 2003-07-09 | 2013-08-13 | 가부시키가이샤 니콘 | Exposure apparatus and method for manufacturing device |
CN102944981A (en) * | 2003-07-09 | 2013-02-27 | 株式会社尼康 | Exposure apparatus, and device fabricating method |
EP2264531B1 (en) | 2003-07-09 | 2013-01-16 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7738074B2 (en) | 2003-07-16 | 2010-06-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1500982A1 (en) | 2003-07-24 | 2005-01-26 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4524669B2 (en) * | 2003-07-25 | 2010-08-18 | 株式会社ニコン | Projection optical system inspection method and inspection apparatus |
US7006209B2 (en) * | 2003-07-25 | 2006-02-28 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring and controlling imaging in immersion lithography systems |
EP1503244A1 (en) | 2003-07-28 | 2005-02-02 | ASML Netherlands B.V. | Lithographic projection apparatus and device manufacturing method |
US7326522B2 (en) | 2004-02-11 | 2008-02-05 | Asml Netherlands B.V. | Device manufacturing method and a substrate |
CN102323724B (en) | 2003-07-28 | 2014-08-13 | 株式会社尼康 | Liquid immersion exposure apparatus, producing method thereof, exposure apparatus and device producing method |
US7175968B2 (en) * | 2003-07-28 | 2007-02-13 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and a substrate |
US7779781B2 (en) | 2003-07-31 | 2010-08-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7700267B2 (en) * | 2003-08-11 | 2010-04-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion fluid for immersion lithography, and method of performing immersion lithography |
US7061578B2 (en) * | 2003-08-11 | 2006-06-13 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring and controlling imaging in immersion lithography systems |
TWI244683B (en) * | 2003-08-11 | 2005-12-01 | Taiwan Semiconductor Mfg | Immersion fluid for immersion lithography, and method of performing immersion lithography |
US7579135B2 (en) * | 2003-08-11 | 2009-08-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lithography apparatus for manufacture of integrated circuits |
WO2005020299A1 (en) * | 2003-08-21 | 2005-03-03 | Nikon Corporation | Exposure apparatus, exposure method, and device producing method |
EP2284615B1 (en) | 2003-08-26 | 2013-01-16 | Nikon Corporation | Exposure apparatus |
US8149381B2 (en) | 2003-08-26 | 2012-04-03 | Nikon Corporation | Optical element and exposure apparatus |
CN101303536B (en) | 2003-08-29 | 2011-02-09 | 株式会社尼康 | Exposure apparatus and device producing method |
EP2261740B1 (en) | 2003-08-29 | 2014-07-09 | ASML Netherlands BV | Lithographic apparatus |
TWI245163B (en) | 2003-08-29 | 2005-12-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
US6954256B2 (en) | 2003-08-29 | 2005-10-11 | Asml Netherlands B.V. | Gradient immersion lithography |
TWI263859B (en) | 2003-08-29 | 2006-10-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
US7014966B2 (en) * | 2003-09-02 | 2006-03-21 | Advanced Micro Devices, Inc. | Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems |
CN101430508B (en) | 2003-09-03 | 2011-08-10 | 株式会社尼康 | Device and method for supplying fluid for immersion lithography |
JP4517367B2 (en) * | 2003-09-03 | 2010-08-04 | 株式会社ニコン | Exposure apparatus and device manufacturing method |
US7166418B2 (en) | 2003-09-03 | 2007-01-23 | Matsushita Electric Industrial Co., Ltd. | Sulfonamide compound, polymer compound, resist material and pattern formation method |
WO2005029559A1 (en) * | 2003-09-19 | 2005-03-31 | Nikon Corporation | Exposure apparatus and device producing method |
JP4438747B2 (en) * | 2003-09-26 | 2010-03-24 | 株式会社ニコン | Projection exposure apparatus, projection exposure apparatus cleaning method, maintenance method, and device manufacturing method |
DE60302897T2 (en) * | 2003-09-29 | 2006-08-03 | Asml Netherlands B.V. | Lithographic apparatus and method of making a device |
KR101335736B1 (en) * | 2003-09-29 | 2013-12-02 | 가부시키가이샤 니콘 | Exposure apparatus, exposure method, and device manufacturing method |
KR101311046B1 (en) * | 2003-09-29 | 2013-09-24 | 가부시키가이샤 니콘 | Projection exposure device, projection exposure method, and device manufacturing method |
EP1519230A1 (en) * | 2003-09-29 | 2005-03-30 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7158211B2 (en) * | 2003-09-29 | 2007-01-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1670042A4 (en) * | 2003-09-29 | 2008-01-30 | Nikon Corp | Liquid immersion type lens system and projection aligner, device production method |
US7056646B1 (en) * | 2003-10-01 | 2006-06-06 | Advanced Micro Devices, Inc. | Use of base developers as immersion lithography fluid |
US7169530B2 (en) | 2003-10-02 | 2007-01-30 | Matsushita Electric Industrial Co., Ltd. | Polymer compound, resist material and pattern formation method |
US7369217B2 (en) * | 2003-10-03 | 2008-05-06 | Micronic Laser Systems Ab | Method and device for immersion lithography |
ITMI20031914A1 (en) * | 2003-10-03 | 2005-04-04 | Solvay Solexis Spa | Perfluoropolyethers. |
JP4335213B2 (en) | 2003-10-08 | 2009-09-30 | 株式会社蔵王ニコン | Substrate transport apparatus, exposure apparatus, and device manufacturing method |
JP2005136364A (en) * | 2003-10-08 | 2005-05-26 | Zao Nikon Co Ltd | Substrate carrying device, exposure device and device manufacturing method |
KR101361892B1 (en) | 2003-10-08 | 2014-02-12 | 가부시키가이샤 자오 니콘 | Substrate carrying apparatus, substrate carrying method, exposure apparatus, exposure method, and method for producing device |
TWI553701B (en) | 2003-10-09 | 2016-10-11 | 尼康股份有限公司 | Exposure apparatus and exposure method, component manufacturing method |
EP1524557A1 (en) * | 2003-10-15 | 2005-04-20 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1524558A1 (en) * | 2003-10-15 | 2005-04-20 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR101129946B1 (en) * | 2003-10-22 | 2012-03-27 | 칼 짜이스 에스엠티 게엠베하 | Refractive projection objective for immersion lithography |
EP1679738A4 (en) * | 2003-10-28 | 2008-08-06 | Nikon Corp | Exposure apparatus, exposure method, and device producing method |
TWI474132B (en) | 2003-10-28 | 2015-02-21 | 尼康股份有限公司 | Optical illumination device, projection exposure device, exposure method and device manufacturing method |
US7352433B2 (en) | 2003-10-28 | 2008-04-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7411653B2 (en) | 2003-10-28 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus |
EP3392713A1 (en) | 2003-10-31 | 2018-10-24 | Nikon Corporation | Immersion exposure apparatus and method |
US7113259B2 (en) * | 2003-10-31 | 2006-09-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1531362A3 (en) * | 2003-11-13 | 2007-07-25 | Matsushita Electric Industrial Co., Ltd. | Semiconductor manufacturing apparatus and pattern formation method |
US7528929B2 (en) | 2003-11-14 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI612338B (en) | 2003-11-20 | 2018-01-21 | 尼康股份有限公司 | Optical illuminating apparatus, exposure device, exposure method, and device manufacturing method |
US7545481B2 (en) * | 2003-11-24 | 2009-06-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP3139214B1 (en) | 2003-12-03 | 2019-01-30 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
JP2005175034A (en) * | 2003-12-09 | 2005-06-30 | Canon Inc | Aligner |
KR101281397B1 (en) | 2003-12-15 | 2013-07-02 | 가부시키가이샤 니콘 | Stage system, exposure apparatus and exposure method |
KR101111363B1 (en) * | 2003-12-15 | 2012-04-12 | 가부시키가이샤 니콘 | Projection exposure apparatus, stage apparatus, and exposure method |
JP2005183438A (en) * | 2003-12-16 | 2005-07-07 | Matsushita Electric Ind Co Ltd | Method of forming pattern |
US7460206B2 (en) * | 2003-12-19 | 2008-12-02 | Carl Zeiss Smt Ag | Projection objective for immersion lithography |
US7589818B2 (en) * | 2003-12-23 | 2009-09-15 | Asml Netherlands B.V. | Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus |
US7394521B2 (en) * | 2003-12-23 | 2008-07-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
ATE467902T1 (en) * | 2004-01-05 | 2010-05-15 | Nikon Corp | EXPOSURE DEVICE, EXPOSURE METHOD AND COMPONENT PRODUCTION METHOD |
JP4253592B2 (en) * | 2004-01-06 | 2009-04-15 | オリンパス株式会社 | Immersion objective lens, fluorescence analyzer and inverted microscope. |
EP1706793B1 (en) | 2004-01-20 | 2010-03-03 | Carl Zeiss SMT AG | Exposure apparatus and measuring device for a projection lens |
TWI259319B (en) * | 2004-01-23 | 2006-08-01 | Air Prod & Chem | Immersion lithography fluids |
US20050161644A1 (en) * | 2004-01-23 | 2005-07-28 | Peng Zhang | Immersion lithography fluids |
WO2005071717A1 (en) * | 2004-01-26 | 2005-08-04 | Nikon Corporation | Exposure apparatus and device producing method |
US7589822B2 (en) | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
US8852850B2 (en) * | 2004-02-03 | 2014-10-07 | Rochester Institute Of Technology | Method of photolithography using a fluid and a system thereof |
KR101276392B1 (en) | 2004-02-03 | 2013-06-19 | 가부시키가이샤 니콘 | Exposure apparatus and method of producing device |
EP3267469B1 (en) | 2004-02-04 | 2018-08-15 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US20070058146A1 (en) * | 2004-02-04 | 2007-03-15 | Nikon Corporation | Exposure apparatus, exposure method, position control method, and method for producing device |
TWI360837B (en) | 2004-02-06 | 2012-03-21 | Nikon Corp | Polarization changing device, optical illumination |
US7050146B2 (en) | 2004-02-09 | 2006-05-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4018647B2 (en) * | 2004-02-09 | 2007-12-05 | キヤノン株式会社 | Projection exposure apparatus and device manufacturing method |
WO2005076322A1 (en) * | 2004-02-09 | 2005-08-18 | Yoshihiko Okamoto | Aligner and semiconductor device manufacturing method using the aligner |
US20080151200A1 (en) * | 2004-02-19 | 2008-06-26 | Nikon Corporation | Exposure Apparatus and Device Manufacturing Method |
US20070030467A1 (en) * | 2004-02-19 | 2007-02-08 | Nikon Corporation | Exposure apparatus, exposure method, and device fabricating method |
TWI371657B (en) | 2004-02-20 | 2012-09-01 | Fujifilm Corp | Positive resist composition for immersion exposure and method of pattern formation with the same |
WO2005081063A1 (en) * | 2004-02-20 | 2005-09-01 | Daikin Industries, Ltd. | Resist laminate used for immersion lithography |
TWI471900B (en) * | 2004-02-20 | 2015-02-01 | 尼康股份有限公司 | Exposure method, exposure apparatus, exposure system, and device manufacturing method |
EP1727188A4 (en) * | 2004-02-20 | 2008-11-26 | Nikon Corp | Exposure apparatus, supply method and recovery method, exposure method, and device producing method |
JP4365236B2 (en) | 2004-02-20 | 2009-11-18 | 富士フイルム株式会社 | Resist composition for immersion exposure and pattern forming method using the same |
US8488102B2 (en) * | 2004-03-18 | 2013-07-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion fluid for immersion lithography, and method of performing immersion lithography |
US7906268B2 (en) | 2004-03-18 | 2011-03-15 | Fujifilm Corporation | Positive resist composition for immersion exposure and pattern-forming method using the same |
TWI628697B (en) | 2004-03-25 | 2018-07-01 | 尼康股份有限公司 | Exposure apparatus, and device manufacturing method |
WO2005093792A1 (en) * | 2004-03-25 | 2005-10-06 | Nikon Corporation | Exposure equipment, exposure method and device manufacturing method |
JPWO2005096354A1 (en) * | 2004-03-30 | 2008-02-21 | 株式会社ニコン | Exposure apparatus, exposure method and device manufacturing method, and surface shape detection apparatus |
US7227619B2 (en) * | 2004-04-01 | 2007-06-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7034917B2 (en) * | 2004-04-01 | 2006-04-25 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufactured thereby |
US7295283B2 (en) * | 2004-04-02 | 2007-11-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7898642B2 (en) | 2004-04-14 | 2011-03-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR101330370B1 (en) | 2004-04-19 | 2013-11-15 | 가부시키가이샤 니콘 | Exposure apparatus and device producing method |
US7379159B2 (en) | 2004-05-03 | 2008-05-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2005111722A2 (en) | 2004-05-04 | 2005-11-24 | Nikon Corporation | Apparatus and method for providing fluid for immersion lithography |
US7091502B2 (en) * | 2004-05-12 | 2006-08-15 | Taiwan Semiconductor Manufacturing, Co., Ltd. | Apparatus and method for immersion lithography |
ATE450813T1 (en) | 2004-05-17 | 2009-12-15 | Fujifilm Corp | METHOD FOR GENERATING A PATTERN |
US7616383B2 (en) * | 2004-05-18 | 2009-11-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7486381B2 (en) * | 2004-05-21 | 2009-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR101257960B1 (en) | 2004-06-04 | 2013-04-24 | 칼 짜이스 에스엠테 게엠베하 | System for measuring the image quality of an optical imaging system |
US20070103661A1 (en) * | 2004-06-04 | 2007-05-10 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
KR101264936B1 (en) * | 2004-06-04 | 2013-05-15 | 가부시키가이샤 니콘 | Exposure apparatus exposure method and device producing method |
EP1780786A4 (en) * | 2004-06-07 | 2009-11-25 | Nikon Corp | Stage apparatus, exposure apparatus, and exposure method |
SG10201710046XA (en) * | 2004-06-09 | 2018-01-30 | Nippon Kogaku Kk | Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate |
KR101433496B1 (en) * | 2004-06-09 | 2014-08-22 | 가부시키가이샤 니콘 | Exposure system and device production method |
US20070222959A1 (en) * | 2004-06-10 | 2007-09-27 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US20070139628A1 (en) * | 2004-06-10 | 2007-06-21 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
JP4543767B2 (en) * | 2004-06-10 | 2010-09-15 | 株式会社ニコン | Exposure apparatus and device manufacturing method |
US8717533B2 (en) | 2004-06-10 | 2014-05-06 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
CN101685269B (en) | 2004-06-10 | 2011-09-14 | 尼康股份有限公司 | Exposure apparatus and device producing method |
US8508713B2 (en) * | 2004-06-10 | 2013-08-13 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8482716B2 (en) | 2004-06-10 | 2013-07-09 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8373843B2 (en) * | 2004-06-10 | 2013-02-12 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
JP4551701B2 (en) | 2004-06-14 | 2010-09-29 | 富士フイルム株式会社 | Protective film forming composition for immersion exposure and pattern forming method using the same |
US7481867B2 (en) | 2004-06-16 | 2009-01-27 | Edwards Limited | Vacuum system for immersion photolithography |
KR101378688B1 (en) | 2004-06-21 | 2014-03-27 | 가부시키가이샤 니콘 | Exposure equipment and device manufacturing method |
WO2005124833A1 (en) * | 2004-06-21 | 2005-12-29 | Nikon Corporation | Exposure device, exposure device member cleaning method, exposure device maintenance method, maintenance device, and device manufacturing method |
US8698998B2 (en) * | 2004-06-21 | 2014-04-15 | Nikon Corporation | Exposure apparatus, method for cleaning member thereof, maintenance method for exposure apparatus, maintenance device, and method for producing device |
US7057702B2 (en) * | 2004-06-23 | 2006-06-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
CN100547488C (en) * | 2004-06-23 | 2009-10-07 | 台湾积体电路制造股份有限公司 | The manufacture method of immersion optical projection system and integrated circuit (IC) wafer |
TWI368825B (en) | 2004-07-07 | 2012-07-21 | Fujifilm Corp | Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same |
US7463330B2 (en) | 2004-07-07 | 2008-12-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4551704B2 (en) | 2004-07-08 | 2010-09-29 | 富士フイルム株式会社 | Protective film forming composition for immersion exposure and pattern forming method using the same |
DE102004033195A1 (en) * | 2004-07-09 | 2006-02-23 | Leica Microsystems Semiconductor Gmbh | Device for inspecting a microscopic component |
US8654308B2 (en) * | 2004-07-12 | 2014-02-18 | Nikon Corporation | Method for determining exposure condition, exposure method, exposure apparatus, and method for manufacturing device |
KR101202230B1 (en) | 2004-07-12 | 2012-11-16 | 가부시키가이샤 니콘 | Exposure equipment and device manufacturing method |
US20070268470A1 (en) * | 2004-07-16 | 2007-11-22 | Nikon Corporation | Support Method and Support Structure of Optical Member, Optical Unit, Exposure Apparatus, and Device Manufacturing Method |
US7161663B2 (en) * | 2004-07-22 | 2007-01-09 | Asml Netherlands B.V. | Lithographic apparatus |
ATE470235T1 (en) * | 2004-08-03 | 2010-06-15 | Nikon Corp | EXPOSURE DEVICES, EXPOSURE PROCESSES AND COMPONENT PRODUCTION PROCESSES |
TW200615716A (en) * | 2004-08-05 | 2006-05-16 | Nikon Corp | Stage device and exposure device |
JP4621451B2 (en) * | 2004-08-11 | 2011-01-26 | 富士フイルム株式会社 | Protective film forming composition for immersion exposure and pattern forming method using the same |
US7304715B2 (en) | 2004-08-13 | 2007-12-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2006019124A1 (en) * | 2004-08-18 | 2006-02-23 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7701550B2 (en) | 2004-08-19 | 2010-04-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20060044533A1 (en) * | 2004-08-27 | 2006-03-02 | Asmlholding N.V. | System and method for reducing disturbances caused by movement in an immersion lithography system |
EP1804279A4 (en) * | 2004-09-17 | 2008-04-09 | Nikon Corp | Substrate for exposure, exposure method and device manufacturing method |
KR101506100B1 (en) * | 2004-09-17 | 2015-03-26 | 가부시키가이샤 니콘 | Exposure apparatus, exposure method, and method for manufacturing device |
KR101106496B1 (en) | 2004-09-17 | 2012-01-20 | 가부시키가이샤 니콘 | Substrate holding apparatus, exposure apparatus and device manufacturing method |
US7133114B2 (en) * | 2004-09-20 | 2006-11-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20060060653A1 (en) * | 2004-09-23 | 2006-03-23 | Carl Wittenberg | Scanner system and method for simultaneously acquiring data images from multiple object planes |
US7522261B2 (en) * | 2004-09-24 | 2009-04-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7355674B2 (en) * | 2004-09-28 | 2008-04-08 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and computer program product |
US7894040B2 (en) * | 2004-10-05 | 2011-02-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7209213B2 (en) * | 2004-10-07 | 2007-04-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2006040890A1 (en) * | 2004-10-08 | 2006-04-20 | Nikon Corporation | Exposure device and device manufacturing method |
JP4448767B2 (en) | 2004-10-08 | 2010-04-14 | 富士フイルム株式会社 | Positive resist composition and pattern forming method using the same |
WO2006041086A1 (en) * | 2004-10-13 | 2006-04-20 | Nikon Corporation | Exposure device, exposure method, and device manufacturing method |
CN100477083C (en) * | 2004-10-13 | 2009-04-08 | 株式会社尼康 | Exposing device, exposing method, and assembly manufacturing method |
EP1806772B1 (en) * | 2004-10-15 | 2014-08-06 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7119876B2 (en) * | 2004-10-18 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7379155B2 (en) | 2004-10-18 | 2008-05-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20070242248A1 (en) * | 2004-10-26 | 2007-10-18 | Nikon Corporation | Substrate processing method, exposure apparatus, and method for producing device |
KR101236120B1 (en) * | 2004-10-26 | 2013-02-28 | 가부시키가이샤 니콘 | Substrate processing method, exposure apparatus and method for manufacturing device |
SG157357A1 (en) * | 2004-11-01 | 2009-12-29 | Nikon Corp | Exposure apparatus and device fabricating method |
KR20070085214A (en) | 2004-11-11 | 2007-08-27 | 가부시키가이샤 니콘 | Exposure method, device manufacturing method, and substrate |
US7414699B2 (en) * | 2004-11-12 | 2008-08-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7251013B2 (en) | 2004-11-12 | 2007-07-31 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7583357B2 (en) * | 2004-11-12 | 2009-09-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7423720B2 (en) | 2004-11-12 | 2008-09-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7411657B2 (en) * | 2004-11-17 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI536429B (en) * | 2004-11-18 | 2016-06-01 | 尼康股份有限公司 | A position measuring method, a position control method, a measuring method, a loading method, an exposure method and an exposure apparatus, and a device manufacturing method |
KR101166008B1 (en) * | 2004-11-19 | 2012-07-18 | 가부시키가이샤 니콘 | Maintenance method, exposure method, exposure apparatus, and device producing method |
US7119035B2 (en) * | 2004-11-22 | 2006-10-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method using specific contact angle for immersion lithography |
US7732123B2 (en) * | 2004-11-23 | 2010-06-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion photolithography with megasonic rinse |
US7145630B2 (en) * | 2004-11-23 | 2006-12-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2006057263A1 (en) * | 2004-11-25 | 2006-06-01 | Nikon Corporation | Mobile body system, exposure apparatus, and method of producing device |
US7256121B2 (en) * | 2004-12-02 | 2007-08-14 | Texas Instruments Incorporated | Contact resistance reduction by new barrier stack process |
EP1843384A4 (en) * | 2004-12-02 | 2010-04-28 | Nikon Corp | Exposure device and device manufacturing method |
US7161654B2 (en) * | 2004-12-02 | 2007-01-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4720747B2 (en) * | 2004-12-02 | 2011-07-13 | 株式会社ニコン | Exposure apparatus, exposure method, and device manufacturing method |
US7446850B2 (en) * | 2004-12-03 | 2008-11-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR20070100865A (en) * | 2004-12-06 | 2007-10-12 | 가부시키가이샤 니콘 | Substrate processing method, exposure method, exposure apparatus, and method for manufacturing device |
WO2006062065A1 (en) * | 2004-12-06 | 2006-06-15 | Nikon Corporation | Maintenance method, maintenance apparatus, exposure apparatus and device manufacturing method |
US7196770B2 (en) * | 2004-12-07 | 2007-03-27 | Asml Netherlands B.V. | Prewetting of substrate before immersion exposure |
US7248334B2 (en) * | 2004-12-07 | 2007-07-24 | Asml Netherlands B.V. | Sensor shield |
JPWO2006062096A1 (en) * | 2004-12-07 | 2008-06-12 | 株式会社ニコン | Exposure apparatus and device manufacturing method |
US7397533B2 (en) | 2004-12-07 | 2008-07-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7365827B2 (en) * | 2004-12-08 | 2008-04-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4752473B2 (en) | 2004-12-09 | 2011-08-17 | 株式会社ニコン | Exposure apparatus, exposure method, and device manufacturing method |
US7352440B2 (en) | 2004-12-10 | 2008-04-01 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
WO2006064851A1 (en) | 2004-12-15 | 2006-06-22 | Nikon Corporation | Substrate holding apparatus, exposure apparatus and device manufacturing method |
US7403261B2 (en) * | 2004-12-15 | 2008-07-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7528931B2 (en) | 2004-12-20 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7880860B2 (en) | 2004-12-20 | 2011-02-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7491661B2 (en) * | 2004-12-28 | 2009-02-17 | Asml Netherlands B.V. | Device manufacturing method, top coat material and substrate |
US7405805B2 (en) * | 2004-12-28 | 2008-07-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20060147821A1 (en) | 2004-12-30 | 2006-07-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7450217B2 (en) * | 2005-01-12 | 2008-11-11 | Asml Netherlands B.V. | Exposure apparatus, coatings for exposure apparatus, lithographic apparatus, device manufacturing method, and device manufactured thereby |
SG124351A1 (en) | 2005-01-14 | 2006-08-30 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
SG124359A1 (en) | 2005-01-14 | 2006-08-30 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
JPWO2006077859A1 (en) * | 2005-01-18 | 2008-06-19 | 株式会社ニコン | Liquid removal apparatus, exposure apparatus, and device manufacturing method |
US7947421B2 (en) | 2005-01-24 | 2011-05-24 | Fujifilm Corporation | Positive resist composition for immersion exposure and pattern-forming method using the same |
US8692973B2 (en) | 2005-01-31 | 2014-04-08 | Nikon Corporation | Exposure apparatus and method for producing device |
JP4565271B2 (en) * | 2005-01-31 | 2010-10-20 | 株式会社ニコン | Exposure method, exposure apparatus, and device manufacturing method |
WO2006080516A1 (en) | 2005-01-31 | 2006-08-03 | Nikon Corporation | Exposure apparatus and method for manufacturing device |
KR101140755B1 (en) | 2005-02-10 | 2012-05-03 | 에이에스엠엘 네델란즈 비.브이. | Immersion liquid, exposure apparatus, and exposure process |
US20070258068A1 (en) * | 2005-02-17 | 2007-11-08 | Hiroto Horikawa | Exposure Apparatus, Exposure Method, and Device Fabricating Method |
US7378025B2 (en) * | 2005-02-22 | 2008-05-27 | Asml Netherlands B.V. | Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method |
US8018573B2 (en) | 2005-02-22 | 2011-09-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7224431B2 (en) * | 2005-02-22 | 2007-05-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7282701B2 (en) * | 2005-02-28 | 2007-10-16 | Asml Netherlands B.V. | Sensor for use in a lithographic apparatus |
US7428038B2 (en) | 2005-02-28 | 2008-09-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid |
US7324185B2 (en) | 2005-03-04 | 2008-01-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8741537B2 (en) | 2005-03-04 | 2014-06-03 | Fujifilm Corporation | Positive resist composition and pattern-forming method using the same |
US7684010B2 (en) * | 2005-03-09 | 2010-03-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing |
WO2006101024A1 (en) * | 2005-03-18 | 2006-09-28 | Nikon Corporation | Exposure method, exposure apparatus, device manufacturing method and exposure apparatus evaluating method |
JP4844186B2 (en) * | 2005-03-18 | 2011-12-28 | 株式会社ニコン | Plate member, substrate holding apparatus, exposure apparatus and exposure method, and device manufacturing method |
US7330238B2 (en) * | 2005-03-28 | 2008-02-12 | Asml Netherlands, B.V. | Lithographic apparatus, immersion projection apparatus and device manufacturing method |
EP1865540A4 (en) * | 2005-03-30 | 2010-03-17 | Nikon Corp | Exposure apparatus, exposure method, and device producing method |
WO2006106832A1 (en) * | 2005-03-30 | 2006-10-12 | Nikon Corporation | Method for determining exposure conditions, exposure method, exposure device, and apparatus for producing device |
TW200644079A (en) * | 2005-03-31 | 2006-12-16 | Nikon Corp | Exposure apparatus, exposure method, and device production method |
KR20070115863A (en) * | 2005-03-31 | 2007-12-06 | 가부시키가이샤 니콘 | Exposure method, exposure apparatus and device manufacturing method |
US7411654B2 (en) | 2005-04-05 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
USRE43576E1 (en) | 2005-04-08 | 2012-08-14 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
US7291850B2 (en) * | 2005-04-08 | 2007-11-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1873816A4 (en) * | 2005-04-18 | 2010-11-24 | Nikon Corp | Exposure device, exposure method, and device manufacturing method |
US20060232753A1 (en) * | 2005-04-19 | 2006-10-19 | Asml Holding N.V. | Liquid immersion lithography system with tilted liquid flow |
KR101396620B1 (en) | 2005-04-25 | 2014-05-16 | 가부시키가이샤 니콘 | Exposure method, exposure apparatus and device manufacturing method |
EP1879219A4 (en) * | 2005-04-27 | 2012-08-08 | Nikon Corp | Exposure method, exposure apparatus, method for manufacturing device, and film evaluation method |
TW200702939A (en) * | 2005-04-28 | 2007-01-16 | Nikon Corp | Exposure method, exposure apparatus, and device producing method |
KR20070122445A (en) | 2005-04-28 | 2007-12-31 | 가부시키가이샤 니콘 | Exposure method, exposure apparatus and device manufacturing method |
EP1720072B1 (en) | 2005-05-01 | 2019-06-05 | Rohm and Haas Electronic Materials, L.L.C. | Compositons and processes for immersion lithography |
US7317507B2 (en) * | 2005-05-03 | 2008-01-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8248577B2 (en) | 2005-05-03 | 2012-08-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7433016B2 (en) | 2005-05-03 | 2008-10-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR101455551B1 (en) | 2005-05-12 | 2014-10-27 | 가부시키가이샤 니콘 | Projection optical system, exposure apparatus and exposure method |
US20070085989A1 (en) * | 2005-06-21 | 2007-04-19 | Nikon Corporation | Exposure apparatus and exposure method, maintenance method, and device manufacturing method |
US7751027B2 (en) | 2005-06-21 | 2010-07-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7652746B2 (en) * | 2005-06-21 | 2010-01-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7924416B2 (en) * | 2005-06-22 | 2011-04-12 | Nikon Corporation | Measurement apparatus, exposure apparatus, and device manufacturing method |
US7834974B2 (en) * | 2005-06-28 | 2010-11-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7474379B2 (en) | 2005-06-28 | 2009-01-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20090033896A1 (en) * | 2005-06-28 | 2009-02-05 | Hiroyuki Nagasaka | Exposure apparatus and method, and device manufacturing method |
US20080204682A1 (en) * | 2005-06-28 | 2008-08-28 | Nikon Corporation | Exposure method and exposure apparatus, and device manufacturing method |
US7468779B2 (en) * | 2005-06-28 | 2008-12-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20090033890A1 (en) * | 2005-06-29 | 2009-02-05 | Nikon Corporation | Exposure apparatus, substrate processing method, and device producing method |
US7522258B2 (en) | 2005-06-29 | 2009-04-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method utilizing movement of clean air to reduce contamination |
JP2007012375A (en) * | 2005-06-29 | 2007-01-18 | Toyota Motor Corp | Fuel cell, method of manufacturing electrode catalyst layer, and operation method thereof |
US8179517B2 (en) * | 2005-06-30 | 2012-05-15 | Nikon Corporation | Exposure apparatus and method, maintenance method for exposure apparatus, and device manufacturing method |
JP4861767B2 (en) | 2005-07-26 | 2012-01-25 | 富士フイルム株式会社 | Positive resist composition and pattern forming method using the same |
US7535644B2 (en) * | 2005-08-12 | 2009-05-19 | Asml Netherlands B.V. | Lens element, lithographic apparatus, device manufacturing method, and device manufactured thereby |
US8054445B2 (en) * | 2005-08-16 | 2011-11-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7580112B2 (en) * | 2005-08-25 | 2009-08-25 | Nikon Corporation | Containment system for immersion fluid in an immersion lithography apparatus |
US8070145B2 (en) | 2005-08-26 | 2011-12-06 | Nikon Corporation | Holding unit, assembly system, sputtering unit, and processing method and processing unit |
US7812926B2 (en) * | 2005-08-31 | 2010-10-12 | Nikon Corporation | Optical element, exposure apparatus based on the use of the same, exposure method, and method for producing microdevice |
US8111374B2 (en) * | 2005-09-09 | 2012-02-07 | Nikon Corporation | Analysis method, exposure method, and device manufacturing method |
CN101258581B (en) * | 2005-09-09 | 2011-05-11 | 株式会社尼康 | Exposure apparatus, exposure method, and device production method |
TWI403843B (en) | 2005-09-13 | 2013-08-01 | Fujifilm Corp | Positive resist composition and pattern-forming method using the same |
JP4562628B2 (en) | 2005-09-20 | 2010-10-13 | 富士フイルム株式会社 | Positive resist composition and pattern forming method using the same |
US20070070323A1 (en) * | 2005-09-21 | 2007-03-29 | Nikon Corporation | Exposure apparatus, exposure method, and device fabricating method |
US7357768B2 (en) * | 2005-09-22 | 2008-04-15 | William Marshall | Recliner exerciser |
JP4568668B2 (en) | 2005-09-22 | 2010-10-27 | 富士フイルム株式会社 | Positive resist composition for immersion exposure and pattern forming method using the same |
US7411658B2 (en) | 2005-10-06 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7420188B2 (en) * | 2005-10-14 | 2008-09-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Exposure method and apparatus for immersion lithography |
US7986395B2 (en) * | 2005-10-24 | 2011-07-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion lithography apparatus and methods |
US20070127135A1 (en) * | 2005-11-01 | 2007-06-07 | Nikon Corporation | Exposure apparatus, exposure method and device manufacturing method |
US20070127002A1 (en) * | 2005-11-09 | 2007-06-07 | Nikon Corporation | Exposure apparatus and method, and device manufacturing method |
US7804577B2 (en) | 2005-11-16 | 2010-09-28 | Asml Netherlands B.V. | Lithographic apparatus |
US7656501B2 (en) * | 2005-11-16 | 2010-02-02 | Asml Netherlands B.V. | Lithographic apparatus |
US7864292B2 (en) | 2005-11-16 | 2011-01-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2007142181A (en) | 2005-11-18 | 2007-06-07 | Toshiba Corp | Substrate processing method and rinse device |
US7803516B2 (en) * | 2005-11-21 | 2010-09-28 | Nikon Corporation | Exposure method, device manufacturing method using the same, exposure apparatus, and substrate processing method and apparatus |
US7633073B2 (en) * | 2005-11-23 | 2009-12-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7773195B2 (en) * | 2005-11-29 | 2010-08-10 | Asml Holding N.V. | System and method to increase surface tension and contact angle in immersion lithography |
US8125610B2 (en) * | 2005-12-02 | 2012-02-28 | ASML Metherlands B.V. | Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus |
KR100768849B1 (en) * | 2005-12-06 | 2007-10-22 | 엘지전자 주식회사 | Power supply apparatus and method for line conection type fuel cell system |
JP4881687B2 (en) | 2005-12-09 | 2012-02-22 | 富士フイルム株式会社 | Positive resist composition and pattern forming method using the same |
EP3537217B1 (en) | 2005-12-09 | 2022-08-31 | FUJIFILM Corporation | Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition |
JP4691442B2 (en) | 2005-12-09 | 2011-06-01 | 富士フイルム株式会社 | Positive resist composition and pattern forming method using the same |
JP4881686B2 (en) | 2005-12-09 | 2012-02-22 | 富士フイルム株式会社 | Positive resist composition and pattern forming method using the same |
US8426101B2 (en) | 2005-12-21 | 2013-04-23 | Fujifilm Corporation | Photosensitive composition, pattern-forming method using the photosensitve composition and compound in the photosensitive composition |
US7420194B2 (en) | 2005-12-27 | 2008-09-02 | Asml Netherlands B.V. | Lithographic apparatus and substrate edge seal |
TWI479266B (en) | 2005-12-27 | 2015-04-01 | Fujifilm Corp | Positive resist composition and pattern forming method using the same |
US7839483B2 (en) * | 2005-12-28 | 2010-11-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and a control system |
US8411271B2 (en) * | 2005-12-28 | 2013-04-02 | Nikon Corporation | Pattern forming method, pattern forming apparatus, and device manufacturing method |
JP4866605B2 (en) | 2005-12-28 | 2012-02-01 | 富士フイルム株式会社 | Photosensitive composition, pattern forming method using the photosensitive composition, and compound used in the photosensitive composition |
US8404427B2 (en) | 2005-12-28 | 2013-03-26 | Fujifilm Corporation | Photosensitive composition, and pattern-forming method and resist film using the photosensitive composition |
US7649611B2 (en) | 2005-12-30 | 2010-01-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2007083758A1 (en) * | 2006-01-19 | 2007-07-26 | Nikon Corporation | Moving body drive method, moving body drive system, pattern formation method, pattern formation device, exposure method, exposure device, and device fabrication method |
US7848516B2 (en) * | 2006-01-20 | 2010-12-07 | Chiou-Haun Lee | Diffused symmetric encryption/decryption method with asymmetric keys |
JP5114022B2 (en) | 2006-01-23 | 2013-01-09 | 富士フイルム株式会社 | Pattern formation method |
JP5114021B2 (en) | 2006-01-23 | 2013-01-09 | 富士フイルム株式会社 | Pattern formation method |
US8134681B2 (en) * | 2006-02-17 | 2012-03-13 | Nikon Corporation | Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium |
JP4682057B2 (en) | 2006-02-20 | 2011-05-11 | 富士フイルム株式会社 | Photosensitive composition, pattern forming method using the photosensitive composition, and compound used in the photosensitive composition |
EP2003681B1 (en) | 2006-02-21 | 2014-11-12 | Nikon Corporation | Measuring apparatus, measuring method, pattern forming apparatus, pattern forming method, and device manufacturing method |
JP5115859B2 (en) | 2006-02-21 | 2013-01-09 | 株式会社ニコン | Pattern forming apparatus, exposure apparatus, exposure method, and device manufacturing method |
JP5195417B2 (en) * | 2006-02-21 | 2013-05-08 | 株式会社ニコン | Pattern forming apparatus, exposure apparatus, exposure method, and device manufacturing method |
US7893047B2 (en) * | 2006-03-03 | 2011-02-22 | Arch Chemicals, Inc. | Biocide composition comprising pyrithione and pyrrole derivatives |
JP4682064B2 (en) | 2006-03-09 | 2011-05-11 | 富士フイルム株式会社 | Photosensitive composition, pattern forming method using the composition, and compound used in the composition |
US8045134B2 (en) | 2006-03-13 | 2011-10-25 | Asml Netherlands B.V. | Lithographic apparatus, control system and device manufacturing method |
WO2007105645A1 (en) * | 2006-03-13 | 2007-09-20 | Nikon Corporation | Exposure apparatus, maintenance method, exposure method and device manufacturing method |
US9477158B2 (en) | 2006-04-14 | 2016-10-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
DE102006021797A1 (en) | 2006-05-09 | 2007-11-15 | Carl Zeiss Smt Ag | Optical imaging device with thermal damping |
US8477283B2 (en) * | 2006-05-10 | 2013-07-02 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7969548B2 (en) * | 2006-05-22 | 2011-06-28 | Asml Netherlands B.V. | Lithographic apparatus and lithographic apparatus cleaning method |
WO2007139017A1 (en) * | 2006-05-29 | 2007-12-06 | Nikon Corporation | Liquid recovery member, substrate holding member, exposure apparatus and device manufacturing method |
US8564759B2 (en) * | 2006-06-29 | 2013-10-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for immersion lithography |
JP4911682B2 (en) | 2006-07-20 | 2012-04-04 | 富士フイルム株式会社 | Exposure equipment |
WO2008026593A1 (en) * | 2006-08-30 | 2008-03-06 | Nikon Corporation | Exposure apparatus, device production method, cleaning method, and cleaning member |
TWI596444B (en) * | 2006-08-31 | 2017-08-21 | 尼康股份有限公司 | Exposure method and device, and device manufacturing method |
KR101902723B1 (en) | 2006-08-31 | 2018-09-28 | 가부시키가이샤 니콘 | Mobile body drive method and mobile body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
TWI534561B (en) | 2006-08-31 | 2016-05-21 | 尼康股份有限公司 | Mobile body drive system and moving body driving method, pattern forming apparatus and method, exposure apparatus and method, component manufacturing method, and method of determining |
EP3361317A1 (en) | 2006-09-01 | 2018-08-15 | Nikon Corporation | Exposure apparatus and exposure method |
TWI434326B (en) | 2006-09-01 | 2014-04-11 | 尼康股份有限公司 | Mobile body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, component manufacturing method, and correcting method |
US7872730B2 (en) * | 2006-09-15 | 2011-01-18 | Nikon Corporation | Immersion exposure apparatus and immersion exposure method, and device manufacturing method |
KR101400824B1 (en) | 2006-09-25 | 2014-05-29 | 후지필름 가부시키가이샤 | Resist composition, resin for use in the resist composition, compound for use in the synthesis of the resin, and pattern-forming method usign the resist composition |
JP5055971B2 (en) * | 2006-11-16 | 2012-10-24 | 株式会社ニコン | Surface treatment method, surface treatment apparatus, exposure method, exposure apparatus, and device manufacturing method |
US7973910B2 (en) * | 2006-11-17 | 2011-07-05 | Nikon Corporation | Stage apparatus and exposure apparatus |
US8045135B2 (en) | 2006-11-22 | 2011-10-25 | Asml Netherlands B.V. | Lithographic apparatus with a fluid combining unit and related device manufacturing method |
US8040490B2 (en) * | 2006-12-01 | 2011-10-18 | Nikon Corporation | Liquid immersion exposure apparatus, exposure method, and method for producing device |
US8013975B2 (en) * | 2006-12-01 | 2011-09-06 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US20080156356A1 (en) * | 2006-12-05 | 2008-07-03 | Nikon Corporation | Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method |
US9632425B2 (en) | 2006-12-07 | 2017-04-25 | Asml Holding N.V. | Lithographic apparatus, a dryer and a method of removing liquid from a surface |
US8634053B2 (en) | 2006-12-07 | 2014-01-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7791709B2 (en) * | 2006-12-08 | 2010-09-07 | Asml Netherlands B.V. | Substrate support and lithographic process |
JP4554665B2 (en) | 2006-12-25 | 2010-09-29 | 富士フイルム株式会社 | PATTERN FORMATION METHOD, POSITIVE RESIST COMPOSITION FOR MULTIPLE DEVELOPMENT USED FOR THE PATTERN FORMATION METHOD, NEGATIVE DEVELOPMENT SOLUTION USED FOR THE PATTERN FORMATION METHOD, AND NEGATIVE DEVELOPMENT RINSE SOLUTION USED FOR THE PATTERN FORMATION METHOD |
JP2008209889A (en) | 2007-01-31 | 2008-09-11 | Fujifilm Corp | Positive resist composition and pattern forming method using the positive resist composition |
US8654305B2 (en) | 2007-02-15 | 2014-02-18 | Asml Holding N.V. | Systems and methods for insitu lens cleaning in immersion lithography |
US8817226B2 (en) | 2007-02-15 | 2014-08-26 | Asml Holding N.V. | Systems and methods for insitu lens cleaning using ozone in immersion lithography |
US8237911B2 (en) | 2007-03-15 | 2012-08-07 | Nikon Corporation | Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine |
JP4839253B2 (en) | 2007-03-28 | 2011-12-21 | 富士フイルム株式会社 | Positive resist composition and pattern forming method |
US7998654B2 (en) | 2007-03-28 | 2011-08-16 | Fujifilm Corporation | Positive resist composition and pattern-forming method |
US7635554B2 (en) | 2007-03-28 | 2009-12-22 | Fujifilm Corporation | Positive resist composition and pattern forming method |
JP4621754B2 (en) | 2007-03-28 | 2011-01-26 | 富士フイルム株式会社 | Positive resist composition and pattern forming method |
EP1975714A1 (en) | 2007-03-28 | 2008-10-01 | FUJIFILM Corporation | Positive resist composition and pattern forming method |
US8877421B2 (en) | 2007-03-28 | 2014-11-04 | Fujifilm Corporation | Positive resist composition and pattern-forming method |
US8034547B2 (en) | 2007-04-13 | 2011-10-11 | Fujifilm Corporation | Pattern forming method, resist composition to be used in the pattern forming method, negative developing solution to be used in the pattern forming method and rinsing solution for negative development to be used in the pattern forming method |
JP4562784B2 (en) | 2007-04-13 | 2010-10-13 | 富士フイルム株式会社 | PATTERN FORMING METHOD, RESIST COMPOSITION, DEVELOPER AND RINSE SOLUTION USED FOR THE PATTERN FORMING METHOD |
US7866330B2 (en) * | 2007-05-04 | 2011-01-11 | Asml Netherlands B.V. | Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method |
US8011377B2 (en) * | 2007-05-04 | 2011-09-06 | Asml Netherlands B.V. | Cleaning device and a lithographic apparatus cleaning method |
US8947629B2 (en) | 2007-05-04 | 2015-02-03 | Asml Netherlands B.V. | Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method |
US7900641B2 (en) | 2007-05-04 | 2011-03-08 | Asml Netherlands B.V. | Cleaning device and a lithographic apparatus cleaning method |
JP4558064B2 (en) | 2007-05-15 | 2010-10-06 | 富士フイルム株式会社 | Pattern formation method |
US8164736B2 (en) * | 2007-05-29 | 2012-04-24 | Nikon Corporation | Exposure method, exposure apparatus, and method for producing device |
JP4617337B2 (en) | 2007-06-12 | 2011-01-26 | 富士フイルム株式会社 | Pattern formation method |
JP4590431B2 (en) | 2007-06-12 | 2010-12-01 | 富士フイルム株式会社 | Pattern formation method |
US8632942B2 (en) | 2007-06-12 | 2014-01-21 | Fujifilm Corporation | Method of forming patterns |
US8617794B2 (en) | 2007-06-12 | 2013-12-31 | Fujifilm Corporation | Method of forming patterns |
US9046782B2 (en) | 2007-06-12 | 2015-06-02 | Fujifilm Corporation | Resist composition for negative tone development and pattern forming method using the same |
US8507174B2 (en) | 2007-08-10 | 2013-08-13 | Fujifilm Corporation | Positive resist composition, pattern forming method using the composition, and compound for use in the composition |
JP5449675B2 (en) | 2007-09-21 | 2014-03-19 | 富士フイルム株式会社 | Photosensitive composition, pattern forming method using the photosensitive composition, and compound used in the photosensitive composition |
JP5267029B2 (en) | 2007-10-12 | 2013-08-21 | 株式会社ニコン | Illumination optical apparatus, exposure apparatus, and device manufacturing method |
US8379187B2 (en) | 2007-10-24 | 2013-02-19 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
US9116346B2 (en) | 2007-11-06 | 2015-08-25 | Nikon Corporation | Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method |
JP2009122325A (en) | 2007-11-14 | 2009-06-04 | Fujifilm Corp | Topcoat composition, alkali developer-soluble topcoat film using the same and pattern forming method using the same |
NL1036186A1 (en) * | 2007-12-03 | 2009-06-04 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
KR101448152B1 (en) * | 2008-03-26 | 2014-10-07 | 삼성전자주식회사 | Distance measuring sensor having vertical photogate and three dimensional color image sensor having the same |
JP5097166B2 (en) | 2008-05-28 | 2012-12-12 | エーエスエムエル ネザーランズ ビー.ブイ. | Lithographic apparatus and method of operating the apparatus |
JP5530651B2 (en) | 2008-07-14 | 2014-06-25 | 富士フイルム株式会社 | Actinic ray-sensitive or radiation-sensitive resin composition, and pattern formation method using the composition |
NL2003363A (en) * | 2008-09-10 | 2010-03-15 | Asml Netherlands Bv | Lithographic apparatus, method of manufacturing an article for a lithographic apparatus and device manufacturing method. |
JP5377172B2 (en) | 2009-03-31 | 2013-12-25 | 富士フイルム株式会社 | Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using the same |
JP5586294B2 (en) | 2009-03-31 | 2014-09-10 | 富士フイルム株式会社 | Actinic ray-sensitive or radiation-sensitive resin composition, and pattern formation method using the composition |
JP5544130B2 (en) | 2009-09-01 | 2014-07-09 | 富士フイルム株式会社 | Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using the same |
NL2005207A (en) * | 2009-09-28 | 2011-03-29 | Asml Netherlands Bv | Heat pipe, lithographic apparatus and device manufacturing method. |
EP2381310B1 (en) | 2010-04-22 | 2015-05-06 | ASML Netherlands BV | Fluid handling structure and lithographic apparatus |
DE102011003140A1 (en) * | 2011-01-25 | 2012-07-26 | Hamilton Bonaduz Ag | Optical analysis method for liquid in a sample container and analysis device for carrying out the method |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2073287A (en) * | 1934-04-17 | 1937-03-09 | Eastman Kodak Co | Method and apparatus for reproducing sound |
US3115815A (en) * | 1960-11-07 | 1963-12-31 | Visual Graphics Corp | Photographic composing device and method |
GB1114597A (en) * | 1965-08-19 | 1968-05-22 | Newman And Guardia Ltd | Improvements in or relating to optical gates |
GB1242527A (en) * | 1967-10-20 | 1971-08-11 | Kodak Ltd | Optical instruments |
US3554641A (en) * | 1968-08-08 | 1971-01-12 | Movielab Inc | Apparatus and process for the liquid gate printing of a photographic film |
US3614223A (en) * | 1969-07-03 | 1971-10-19 | Eastman Kodak Co | Liquid gate |
JPS5411704B1 (en) * | 1971-03-22 | 1979-05-17 | ||
US3893763A (en) * | 1974-01-31 | 1975-07-08 | Eastman Kodak Co | Liquid gate for individual film frame printing |
JPS52109875A (en) * | 1976-02-25 | 1977-09-14 | Hitachi Ltd | Position matching system for mask and wafer and its unit |
US4209250A (en) * | 1978-12-26 | 1980-06-24 | James Randall P | System for making multiple original holograms or copies of a hologram and method |
ATE1462T1 (en) * | 1979-07-27 | 1982-08-15 | Werner W. Dr. Tabarelli | OPTICAL LITHOGRAPHY PROCESS AND DEVICE FOR COPYING A PATTERN ONTO A SEMICONDUCTOR DISC. |
FR2474708B1 (en) * | 1980-01-24 | 1987-02-20 | Dme | HIGH-RESOLUTION MICROPHOTOLITHOGRAPHY PROCESS |
-
1981
- 1981-03-18 JP JP56037977A patent/JPS57153433A/en active Granted
-
1982
- 1982-03-15 US US06/358,436 patent/US4480910A/en not_active Expired - Lifetime
- 1982-03-17 DE DE8282301377T patent/DE3272511D1/en not_active Expired
- 1982-03-17 EP EP82301377A patent/EP0060729B1/en not_active Expired
- 1982-03-17 CA CA000398647A patent/CA1159160A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0060729A2 (en) | 1982-09-22 |
JPS57153433A (en) | 1982-09-22 |
DE3272511D1 (en) | 1986-09-18 |
EP0060729A3 (en) | 1983-03-16 |
EP0060729B1 (en) | 1986-08-13 |
JPS6349893B2 (en) | 1988-10-06 |
US4480910A (en) | 1984-11-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA1159160A (en) | Pattern forming apparatus | |
US7522264B2 (en) | Projection exposure apparatus, device manufacturing method, and sensor unit | |
US4811055A (en) | Projection exposure apparatus | |
US8018657B2 (en) | Optical arrangement of autofocus elements for use with immersion lithography | |
US6280886B1 (en) | Clean-enclosure window to protect photolithographic mask | |
US7846848B2 (en) | Cluster tool with integrated metrology chamber for transparent substrates | |
EP0793073B1 (en) | Surface position detecting method and scanning exposure method using the same | |
US20060110667A1 (en) | Method of fabrication of semiconductor integrated circuit device and mask fabrication method | |
US5770338A (en) | Phase shifting overlay mark that measures exposure energy and focus | |
US6459491B1 (en) | Non-intrusive pellicle height measurement system | |
KR20180057813A (en) | Phase shift mask for extreme ultraviolet lithography | |
US6569579B2 (en) | Semiconductor mask alignment system utilizing pellicle with zero layer image placement indicator | |
KR19990045161A (en) | Positioning and Projection Exposure Equipment | |
Nyyssonen | Calibration of optical systems for linewidth measurements on wafers | |
US6778285B1 (en) | Automatic in situ pellicle height measurement system | |
JP2901201B2 (en) | Photo mask | |
US4964146A (en) | Pattern transistor mask and method of using the same | |
JPS61114529A (en) | Exposure and exposing device | |
JPH11176726A (en) | Aligning method, lithographic system using the method and method for manufacturing device using the aligning method | |
US20050106475A1 (en) | Lithographic mask, and method for covering a mask layer | |
US7655384B2 (en) | Methods for reducing spherical aberration effects in photolithography | |
Bossung et al. | Optical advances in projection photolithography | |
US6567153B1 (en) | Multiple image photolithography system and method | |
US6741333B2 (en) | Multiple image photolithography system and method | |
Luis et al. | New optical metrology technique for measuring the shape of a lithography photo mask |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKEX | Expiry |