CA1255388A - Method of manufacturing cards having an electronic memory, and cards obtained by performing said method - Google Patents
Method of manufacturing cards having an electronic memory, and cards obtained by performing said methodInfo
- Publication number
- CA1255388A CA1255388A CA000505281A CA505281A CA1255388A CA 1255388 A CA1255388 A CA 1255388A CA 000505281 A CA000505281 A CA 000505281A CA 505281 A CA505281 A CA 505281A CA 1255388 A CA1255388 A CA 1255388A
- Authority
- CA
- Canada
- Prior art keywords
- hollow
- card
- bumps
- support
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Abstract
A B S T R A C T
A method of manufacturing cards having an electronic memory, and cards obtained by performing said method.
In order to improve fixing between an electronic module (140) and the body (120) of a credit card made of plastic material, a housing (122, 134) is provided in the card body with bumps (130, 132) projecting into the housing. The electronic module (140) is pressed against the bumps (130, 132) while being raised to the softening temperature of the material from which the bumps are made. The module is pressed until its contact tabs (148) are level with the face (126) of the body. Fixing is completed by causing a glue to penetrate by capillarity between the bottom (124), the insulating substrate (142) of the electronic module, and the bumps (130, 132). The invention is particularly applicable to prepaid credit cards.
A method of manufacturing cards having an electronic memory, and cards obtained by performing said method.
In order to improve fixing between an electronic module (140) and the body (120) of a credit card made of plastic material, a housing (122, 134) is provided in the card body with bumps (130, 132) projecting into the housing. The electronic module (140) is pressed against the bumps (130, 132) while being raised to the softening temperature of the material from which the bumps are made. The module is pressed until its contact tabs (148) are level with the face (126) of the body. Fixing is completed by causing a glue to penetrate by capillarity between the bottom (124), the insulating substrate (142) of the electronic module, and the bumps (130, 132). The invention is particularly applicable to prepaid credit cards.
Description
~2:5~3~
A method _ manufacturin~ cards having an electronic memory, and cards obtained by performing said method.
The prese~t invention relates to a mathod o* manufacturing cards having an electronic memory of the integrated circuit type, and to cards obtained by performing the said method.
BACK~ROUND OF THE INVENTION
Electronic memory cards enabling their owners to perform certain kinds of transaction are well-known. There are two broad categories of such cards. Some cards have an electronic circuit which is sufficien~y complsx to enable credit data to be reloaded into the card m~ory~ In other words, once the initial credit in the card has been spent, the user can have the card "reloaded" with a new amount of credit in return for suitable paymnt. A second or "prepaid" type of card contains a slmpler electro~ic circuit and the card is loaded once only with a given amount of credit. Once this credit has been spent by the user, the card must be thrown away.
Since prepaid cards are used once only, it will be understood that they must be as cheap as possible to 2C manufacturs in order to a~oid the cost of the card being ; excessive in relation to the necessar~ly small amount of credit which it iæ capable of storing. Low co~t is achieved, in part, by the slectronic circuit itself belng conslderably cheaper than the circuit used in a re-loadable card. However, the cost o~ manufacturing the card itself i5 a non-n~gligible quanti~y in the final cost of the card. Such a card is essentially constituted by a body made of plastic material, and an - electronic module lodged thsrein, ~aid module co~prising the - integrated circuit, contact tabs for providing conn~ction with a card reader, and el~ctrical connections betwean the integrated circuit and the contact tabs. The el~c ~ c mo~ule is fixed in the body of the card ln a manner which i9 capable of ensuring that the resulting assambly can pass bending tests to which the card i~ sub~ected. In a~tion, the thicknes~ of the card it standardized and this thichness is about ons - millimeter. It will be undarstood that thls small thickne~s increases the dif~iculty of installing and fixing ~n electronlc - -module ln the card.
:, : , .
.: ~: . .
:: ' .:
: : ,, ~.: ,-;
,,~ .
~;2553~
Various methods of implanting the electronic module in the body of the card have already been proposed. In a first method, the electronic module is placed between two layers of plastic material which constitute the card body, and the assembly is thermocompressed in order to obtain the final card shape, with the integrated circuit being buried in the body of the card.
In another method~ a prefabricated card body is taken and a cavity is machined therein to receive the electronic module which is held in place by glue. Such a technique is very diffi-cult to perform since the machining must be performed with high accuracy in order to ensure that the contact terminals of the electronic module are level with the surface of the card body after the module has been placed in the cavity.
In order to remedy these drawbacks, European patentapplication 128 822, published on December 19, 1984, proposes a method of implanting an electronic module in the body of the card by providing a cavity in the card body with the cavity being smaller than the outside dimensions of the electronic module, ;- the body of the card is then locally heated while the electronic module is pressed against the card body so that at least a portion ~;~ of the electronic module serves as a punch which defines parts of the card cavity. Partial melting of the plastic material ~, making up the card body provides very secure anchoring of the electronic module in the card body and in addition avoids any need for accurate machining of the body.
In order to further improve the implantation of the -::
electronic module in the card, preferred implementations of the present invention provide a method of implanting the electronic
A method _ manufacturin~ cards having an electronic memory, and cards obtained by performing said method.
The prese~t invention relates to a mathod o* manufacturing cards having an electronic memory of the integrated circuit type, and to cards obtained by performing the said method.
BACK~ROUND OF THE INVENTION
Electronic memory cards enabling their owners to perform certain kinds of transaction are well-known. There are two broad categories of such cards. Some cards have an electronic circuit which is sufficien~y complsx to enable credit data to be reloaded into the card m~ory~ In other words, once the initial credit in the card has been spent, the user can have the card "reloaded" with a new amount of credit in return for suitable paymnt. A second or "prepaid" type of card contains a slmpler electro~ic circuit and the card is loaded once only with a given amount of credit. Once this credit has been spent by the user, the card must be thrown away.
Since prepaid cards are used once only, it will be understood that they must be as cheap as possible to 2C manufacturs in order to a~oid the cost of the card being ; excessive in relation to the necessar~ly small amount of credit which it iæ capable of storing. Low co~t is achieved, in part, by the slectronic circuit itself belng conslderably cheaper than the circuit used in a re-loadable card. However, the cost o~ manufacturing the card itself i5 a non-n~gligible quanti~y in the final cost of the card. Such a card is essentially constituted by a body made of plastic material, and an - electronic module lodged thsrein, ~aid module co~prising the - integrated circuit, contact tabs for providing conn~ction with a card reader, and el~ctrical connections betwean the integrated circuit and the contact tabs. The el~c ~ c mo~ule is fixed in the body of the card ln a manner which i9 capable of ensuring that the resulting assambly can pass bending tests to which the card i~ sub~ected. In a~tion, the thicknes~ of the card it standardized and this thichness is about ons - millimeter. It will be undarstood that thls small thickne~s increases the dif~iculty of installing and fixing ~n electronlc - -module ln the card.
:, : , .
.: ~: . .
:: ' .:
: : ,, ~.: ,-;
,,~ .
~;2553~
Various methods of implanting the electronic module in the body of the card have already been proposed. In a first method, the electronic module is placed between two layers of plastic material which constitute the card body, and the assembly is thermocompressed in order to obtain the final card shape, with the integrated circuit being buried in the body of the card.
In another method~ a prefabricated card body is taken and a cavity is machined therein to receive the electronic module which is held in place by glue. Such a technique is very diffi-cult to perform since the machining must be performed with high accuracy in order to ensure that the contact terminals of the electronic module are level with the surface of the card body after the module has been placed in the cavity.
In order to remedy these drawbacks, European patentapplication 128 822, published on December 19, 1984, proposes a method of implanting an electronic module in the body of the card by providing a cavity in the card body with the cavity being smaller than the outside dimensions of the electronic module, ;- the body of the card is then locally heated while the electronic module is pressed against the card body so that at least a portion ~;~ of the electronic module serves as a punch which defines parts of the card cavity. Partial melting of the plastic material ~, making up the card body provides very secure anchoring of the electronic module in the card body and in addition avoids any need for accurate machining of the body.
In order to further improve the implantation of the -::
electronic module in the card, preferred implementations of the present invention provide a method of implanting the electronic
2-..~ :, ,, ~
:: :.-'. : . .
~s$~
module in the body of the card which does not require the body of the card to be machined to accurate dimensions, while still making it easy to control card deformation during the implantation of the e~ectronic module therein.
SUMMARY OF THE INVENTION
The present invention provides a method of providing an electronic memory card comprising a body made of a thermoplastic material and having two main faces which are ~.
::`
~ 2a-:~`
' ~2~ 3~i3 substantially parallel to ~ach other, and an electronic module comprising:
a support which is g~nerally flat in shape having two main faces;
contact tabs disposed on a first o~ of said main faces of said support;
a semiconductor chip having an integrated circuit formed therein and dispossd on tha socond main face of said support;
and electrical connoctions fur connecting the terminals of said chip to said tabs, said met~od comprising the following steps:
a) a cavity is made in the body of said card, said cavity including a first hollow opening out into a ~irst one of said main faces of said body and having a bottom which is substantially parallsl to said main faces o said body, and a second hollow opening out into said bottom, said first and second hollows having dimensions in planes parallel to said main *acas of said body-which are greater respactively than the dimensions of said insulating support and the dimsnsio~s of said chip, said bottom having a plurality of bumps projectin~
into said first hollow and separated from one another and from said secsnd hollow by intercommunicatlng interstices, the distances between said first main facs of the body and said bottom and the tops of said bumps b4ing re~pectively greater than and less than the thicknass of said support;
b) said modhle is placed in said ca~ity in suoh a manner as to cau~e said chip to panetrate partially into said s~cond :~ hollow and to cause said support to p4netrate partially into
:: :.-'. : . .
~s$~
module in the body of the card which does not require the body of the card to be machined to accurate dimensions, while still making it easy to control card deformation during the implantation of the e~ectronic module therein.
SUMMARY OF THE INVENTION
The present invention provides a method of providing an electronic memory card comprising a body made of a thermoplastic material and having two main faces which are ~.
::`
~ 2a-:~`
' ~2~ 3~i3 substantially parallel to ~ach other, and an electronic module comprising:
a support which is g~nerally flat in shape having two main faces;
contact tabs disposed on a first o~ of said main faces of said support;
a semiconductor chip having an integrated circuit formed therein and dispossd on tha socond main face of said support;
and electrical connoctions fur connecting the terminals of said chip to said tabs, said met~od comprising the following steps:
a) a cavity is made in the body of said card, said cavity including a first hollow opening out into a ~irst one of said main faces of said body and having a bottom which is substantially parallsl to said main faces o said body, and a second hollow opening out into said bottom, said first and second hollows having dimensions in planes parallel to said main *acas of said body-which are greater respactively than the dimensions of said insulating support and the dimsnsio~s of said chip, said bottom having a plurality of bumps projectin~
into said first hollow and separated from one another and from said secsnd hollow by intercommunicatlng interstices, the distances between said first main facs of the body and said bottom and the tops of said bumps b4ing re~pectively greater than and less than the thicknass of said support;
b) said modhle is placed in said ca~ity in suoh a manner as to cau~e said chip to panetrate partially into said s~cond :~ hollow and to cause said support to p4netrate partially into
3~ said fir~t hollow, the portion of said su~port whlch is nQt covered b~ sald chip re~tlng on ~aid bumps;
~; ` c) said bumps are locally raised to their ~oftening temperat~re and pressure is appliod to sa~d electronic module to crush the tops of said bumps until sa~d ovntact tabs æe substantially in the same plane as said main ~ace of ~aid body, said support thu~ adherlng to said bump~; and ~,.'~ ., .
. _ ~ ' ., ~5~3~
d) an insulating glue is caused to penetrate at least into said interstices between said bottom and said insulating support in order to provide additional adherence batween said electronic module and said card body.
It can be seen that such a method provides an effective solution to the two above-specified conditions~ Firstly there is no need to machine the initial cavity in tha body of the card to a high degrea of accuracy sinca accurate positioning of the electronic ~dule relative to the body of the card is provided by the degree to which the tops of thH bumps provided in the c~vity are, in fact, crushed. It can also be seen the creep resulting from the bumps being crushed is entirely localized in the spaces between the bumps. Fur~harmore, since the crushing is limltad, the volumes of material sub~e~ted to creep are small. It may also be observod that the set of bumps defines channels for glue insertion which ~ncourage glue spreading by capillarity while limiting glue advance to the space lying between the lnsulating support of ~he electronic module and the face of the cavity which includes ~he bumps.
In a first implementation, the second hollow also open~
out into the second main face of the card, and step d) is performed after ~tep c).
In a second implemantation of the in~ent~on, the second cavity i~ a blind hole and a drop of glue is placed therein be~een steps b) and c).
e in~ention alsa provides elactronic m2mDry cards having a structure of the type whlch is obtained by psrforming ~he above-defined method ln accordance with one of it~ various possible implementations. - -BRIEF DESCRIPTION OF THE DRAWINGS
Implementations of the in~ention are d~scrlbad by way of ~ example with refarence to the accomp~nyln~ drawings, in which:
;~ Figure 1 is a vertical section through an electr~nic; -- -. module ~uitable for being implanted in`~he body o~ a card;
Figures 2 to 5 show the varlous operation~ performed on the body of the card in order to prepare it for the implantation o~ a module in accordance with a fir~t implementation of the i~v~nticn;
- --. _ .
. ~ .
3~3~
Figures 6 and 7 show steps o the first implementation of the method whers the elsctronic module is placed in the cavity provided by the steps illus-trated in Figures 2 to 5, Figurs 8 shows the final structure o~ a card made in accordance with a first implementation of the inv~ntion, wi~h the electronic module being fi~ed in its cavity; and Figures 9 to 12 illustrate a second implementation of the method in accordance with the invention. These figures show successive steps of the second implementation, with Figures 10 to 12 being vertical section views and with ~igure 9 being a plan view of a portion of the card seen from above.
DETAILED DESCRIPTION OF P~EFERRED IMYLEMENT~TIONS OF THE INVENTION
Reference is made initially bo Figure 1 in order to describe an electronic modul8 usable in the invention. The electronic module 20 is essentially constituted by an insulating ; support 22 made, for exa~ple, from th~ material sold under the trademark Mylar, or from any other insulating material. The ; support 20 supports a semiconductor chip having an integrated circuit 24 prcvided therein. Contact tabs 26 are provided on one of the faces of the insulating support 22 and the integrated circuit Z4 is located on the opposite face. In order to make the various connection~ batween the integrated circuit 24 and the contact tabs 26, the seoond face of the insulating support 22 is fitted with metallization 28 for providing electrical connections. In addition, plated-through hole~ such as 30 provide electrical connection between the conducbor tracks 28 and the contact tabs 26. Finally, the conduotive tracks 28 are connected to termlnals such as 32 of th~ integrated circuit 24 b~ means of conductor wires such as 34.
- 30 In a first implemantation o tha invention, the electr~nic module 20 is implanted in the body of th~ aard by m~ans-of steps which are now described with rof~rence to Fi ~ e~ 2 to 8.
The electronic moduie itself is described in greater detail in the above-me~tioned Eur~pean patent application~ - -As can be æeen in Figure 2, the startin~ material i~ a càrd body 40 made of a plastic material such as PVC and including an upp2r hollow 42-at the location where the ;. ~ - _ . . .
: ~ .
. . , ., .. - .,, .... _ .:
.
- .
, ;3~
el0ctronic module is to be implanted. me body o:E the card is genarally rectangular in shape and is deiimited by two main parallel faces, namely a top face 44 and a bottQm face 45. The bottvm 46 of the hollow 42 is substantially parallel to the top face 44 of the bod~ 40. This hollow opens out into the top face 44 of the card, i.a. into the faGe which ls to include the tabs for electrical connection to a card reader. The hollow 42 may be circular, for sxample, and has a dimen~ion e in ~he plane of the top face 44 which is slightly grsater than the corresponding dimension e' of the insulating support of the electronic module. The dep~h h-of the hollow 42 between the top face 44 o-f the card body and the bottom 46 o~ the hollow 42 is a little ~reater than the thlckness h' of the assembly constituted by the insulating substrata of ~he elsctronic module togsther with the metallizations provid~d there~n. In the $ollowing steps (see Figura 3) the botbom 46 of the hollow 42 is locally plastically deformed i~ order to creata a set of bumps such as 50. ~h~se bump~ ar~ formad in such a manner as to snsure that the average distance between the top fa~e 44 of the card body and the top faces of the b~ ps 50 (marked 1 in Figure 3) is less than the thicknes~ h' of ~he electronic module support. As can be seen mnre clearly in fi~ure 4, the bumps 50 have i~tersticas 52 left therebe~w~en, which intersticas are in c ~ cation with one an~ther. me bumps :~ ~5 50 ara about 0.2 mm to ab~ut 0.3 mm high.
:~ In the pres~ntly described impl~mentation, these bumps are in the form of radial ribs 50 extanding fnom the wall of ~he hollow 42 up to a common central portion 51. me bumps oould ~:: be differant in sha~e. For example they could be constituted ~ small p~gs regularly distributed over ~he botbom 46 of the hollow 42.
In the follc)wing step (~hown in Fi~e 5) a bDttom hollow . . 54 is drilled through frn the top hollow 42 to ~he blDt;tall face 45 of the oard bod~. For exan~ple, this hollow may al~ be 35 circular in~sectiorl having a dian~ter m whioh i~ slis~htly greater than the largest dimension m' of the integratad o~rouit as fitted with its con~ection wires 34. ~5 can be seen ~
.
. ~
. , ~'', , ' . ' `"" ' ;
.:
. .
~25~
Figure 5, the dimension m is considerably less than the dimension eO Thus, the set of hollows 42 and 54 constitutes a cavity 58 which passes through the card body 40 from one face to the other and which lncludes a relatively large portion 42 and a ralatively small portion 54, with these two portions being interconnected by tha remaining portion of the ~ottcm 46 of the top hollow 42, together with it~ bumps 50.
Reference is now made bo Figures 6 to 8 while describing how an electronic m3dule 20 is implanted in ~he card using a first implementation of the invention. In order to simplify these figures the electronic module 20 is shown therein as being constituted solely by its insulating support 22 and the electronic module 24, with the metallizations and o~,her details being omitted. Fur~her, in order to make the ~igurss more clear, they are not to scale'and th6 thicknesses are considerably exaggerated relative to dimansions in the plane of the card.
As can bs seen ln Figure 6, the eleatronic module is placed in tha cavity 58. More precisely, the insulating substrate 22 rests on the tops of the bumps 50 and the 2~ electronic module 24 penetrates partially ~to the bDttom portion 54 of the cavity 58. In addition, the face of the electronic module be~riny th~ contact tabs stands proud from the top face 44 of the card body.
In the next step, as 8hown in Figure 7, the tops of the 25 bumps 50 are raised to the softening t~mparature of the material from which they are cDnstibuted, l.e. to about 175C, and simultaneously the mcdule assembly is pressed against the tops of the bumps which have been raised tD their 80ftening : temperature until the top face of the ~nsulatiy substrate (i.e. the contact tabs ~hereon) becomes substantially l~val : with the top faca 44 of the card body. It will be unders~oDd that during this operation, creep occurs~Gnly in the material - localized in the bumps, which materiai migrates to o~cupy a very small portion o~ the i~terstices 52 betweffn the bumps. As a resùlt all modification to the shapa of khe card body is : limited to the portion of ths oard including the bumpR, i.e. ~o : an inside portion of the card. After deformation, the bumps 50 - are about 0.03 tD 0.05 mm high.
.
' " , .
-- - - .:
.
.. : :
',:, ~ .
"'..,.' , ~.. , ' :
.. .. . .
;;3~
Figure 7 also shows an assembly includi~g a tool 80 for performing these two operations. The body o~ the card is placed on a base 820 The tool 80 includes a fixed portion 84 whose bottom face 86 rests against the top face 44 of the card body all around the cavity 58. The tool includes a moving portion 88 capable of sliding relative to the fixed portion 84 in a bore 89 along a directian F, i.e. in a diraction perpendicular to the main faces of the card. The tool is essentially constituted by a botbGm face 90 in contact with the 10 insulating support 22 of the electro~ic module and a heater ele~ent is represented at 92 by a heater resistancs. In addition, the moving portion 8~ includes lu~s 9~ which come into abutment against an and-of-stroke bearing surface 98 provided on the fixed portiGn 84 of tha tcol 80. The heater resistance 92 is raised to a temperature of about 175C, thereby heating the insulating substrats 22 and thus transmitting heat to the material constltuting the bumps 50.
In addition, the moving portion 88 serves to apply a d~grse of pre~sure against tha electronic module 20. The str~ke of ~he 20 mov~ng portion is limitad by co~oparation batween the lugs 94 and the end-of-stroke bearing surface 98. These two parts are placsd SD that in the e~d-of-stroke position the top face of : the insulating substrate 22 ~s substantially at the same le~el as the top face 44 o~ the card body. At the Qnd of ~his step, the electronic module assembly is properly positioned relative to the card body. In addition, the partial melting of the tops :~ of the bumps 50 in con~act with the insulating substrate 22 provide~ a degree of adherence therebetween, thus provlding at least tQmpor ~ connection between the ~ 20 and the electrDnic module. In addition, in spite of the bumps 50 creeping, the interstices 52 all r~main in communioation with the cavity 58.
Figure 8 shows the last step of the math~d. The c æd ass~mbly including the electronic module 20 is turned ~Yer.
; - 35 This operation is made possible by virtue of the fact that the elec~ronic module is already fixed to the car~ body by the partial melting of the bumps. A drop 100 of-~nsulating epoxy ;
:
~ - , , - - ':
-:
~2~53~
glue is inserted into the cavity 58 und~r the effect ofgravity. Capillarity causes the glue to penetrate into tha intsrstices 52 betwsen the bumps 50. However, one of the effects of the capillarity is to limit the progress of the glua to the zone line between the insulating support 22 and the bottom of the top ca~ity 42. Th~re is ~hus no problem of the glue reaching the face 4~ of the card or of its reaching face of the electronic module where it includas the contact tabs.
It can be seen from the ab~ve description that the method in accordance with the invention has numerous advantages over the prior art. mere is no need for the card body to be machined to accurate dimensions in order to provida the cavity in which the electronic module is recaived. There is no need to pre-glue either the module or the cavi~y. There is thus no need to accurately control the ~uantity of glue which is used.
The so$taning of ths plastic material constituting ~he card body is very localized and ~ffects only a very small volume of ma-terial. The resulting creep is thus highly localized and, in ~; addition, dDes not affect the outside faces of ~he card whQse dimensions are required to satlsfy accurate -~tandards.
A second implementation of the method in accordance with the invention is de6cribed with refer~nce to Figures 9 to 12.
In this implementation, unlike the first implementation described above, the electronic modula ls received in a blind cavity which does not open out into the bottom face of the card ~ody, and this may be advantageous in some applic~tions.
The met ~ b~gins with a card bcdy 120 identical to that shown in Figure 2. The body has an u ~ hollow 122 whlch i8 rectangular in the pre~nt example, and which has a bottom 124 at a depth o about 200 ~ . The card body has a top main face 126 into which the ~ollow 122 op~ns out and a bottam maln fa~a 1~8.
Bumps having the shaps shGwn in Flgure 9 are than made to project into the hollow 122 from ~he bot~om 124 thereof. me bump~ are constitutsd by p~gs such as 130 which are placed 3ver the area of a rectangle together with ~ continuous 5urrounding rib 132, i.e. a rib constituting a rloRed loop and, in the presen~ example, rectangular in shape wh~n ~een from above.
- ' ' ' ' . . .
, . . .
. .
5~
Tho rib 132 completely surrounds the set of pegs 130. The bumps 130 and 132 are ob-tained by plastic deforma-t1on and their height is from 0.2 to 0.3 mm.
In the following steps a bottom hollow 134 is made in the middle of the bottom 124, and this hollow is blind, i.e. it does not open out into tha bottom face 128 of ths card body 120. Tha set of hollows 122 and 134 constitutes a cavity 136 for receiving tha electronic module. Figures ~ and 10 shGw that ~nside the zona delimited by the rib 132, the pegs 130 leave interstices 138 between one another, with all of ~he interstices being in commNnication with the bottom hollow 134.
In this second implementation, an ele~tronic mcdule 140 is used as shown in Figure 11. The electronic module 140 difers from the electronic module 120 shown in Figure 1 by its insulating support 142 including a window 144 in which the s~miconductor chip 146 is partially received. Ths back of -the chip 146 is diroctly glued by means of a conductive glue to one of the metallizations 148 deposited on the top face of the insulating support 142 and constituting the tabs for connection to a card reader. me electrical connection betwean the : . terminals of the chip 146 and the other contact tabs 148 are provided by means of conductor wires 150, with netallizat~ons 152 being deposited on the other faca of the in~ulatin~ ~upport and with plated-through holes 154 passins through the entire thickness of the insula~in~ support 142. A more detailed description of the eleotronic mcdule 140 may be found in ~he above-~entioned European patent application. This particular structure for an electronic module has th~ advantage of reduced overall thickness.
The dimanæions of the alectronic mQdule 140 hav~ the same relationship to the dimensions of the caYlty 136 ~s hava already been described with r~feran~ to the first implementation of ' the inven~ion.
In the following step a drop 156 of epoxy glue is plac~d in the bottsm hollcw 134. The me~hod ~hen continues in axaGtiy the same way as the first impl~mentation of the i~v~nti~n as ~; dsscribed w~th refer~nce to Figurss 6 and 7. The electroni~ - -, - ~ , ~L~25~53~3~
modul~ 140 is placed in the cavi~y 136 in such a manner as to cause the insulating support 142 to have its metallizations 152 resting on the tops of the bumps 130, 132.
Then, a tool identic~l to that shown in Figure 7 is used to heat the electronic module 140 and to ~pply suitable pressure thereto for softenin~ the bump-consti~uting material and for crushing the bumps in th~ manner de~cribed in detai~
with raference to Figure 7. It should also be added (as can be seen in Figure 11) that tha rib 132 i~ placed so as to ba located, in part, opposite to the plated-through holes 154 in the alectronic module 140. ~hen the rib 132 is crushe~, plastic material rises (1553 into at least a portion of e~ch plated-~hrough hole 154. This serves to improve the connection between the module and the card body.
In a ~inal step, the electronic ~odule is finally glued to the card body. This is done by turning th9 card over, as shown in Figure 12. The bottcm face 128 of the card bo~y is then lightly heated level with ~he cavity 136 to about 40C. This heating, together with the card being turned ~ver, enables the drop of epoxy glue 156 to disperse and to ~ver the chip 146 and its wires 150, thereby mechanically co ~ lidating them. In addition, the glue fills the inter tices 138 betwesn the insulatlng support 42 and the b~ttom 124 of the hollow 122 by virtue of capillarity. me proyres~ of the glue is limited by the presence of the rib 132. At plat~d-through holes, progress of the glua i~ limited by sNrface tansion due to said holes which are smalI in size and whlch are at least partially filled - by plastic material 155.
Another way of providing gluing whan using a bllnd c~vity 3~ consists in pr~vi~ing two holes passing through the insulatlny support 142 of tha elec~ronic module at points located lnsids the rib 132. Glue is in~ected through ~ne-of these holes an~
the l~val of ~he glue in ~he cavity is observ~d through-the other. ~hen the glue is l~vel with the outside face of the lnsulating substrate in the second hole, glua in~ection is stopped. On solidifying, the glue fills ~he cavity and clos0s both h3las.
: ~ , " .
, - . , . - ~
,,, . . , .. . , . ~
.
.:`
. .:
:~
:
~s~
It will be understood that the second implementation of the method in accordance with the invention has the same advantages as the first implementation. The second implemPntation has the additional advantage of leaving the back of the card intact. Further, the presence of a continuous rib 132 as one of the bumps ensuras that none of tha glue rises towards the top face 126 of ~he card since the rib constitutes a continuous barrier opposing glu~ advance.
It must also be understood that the special shape of the bumps 130 and 132 shown in Figures 9 and 10 could be used in the first implementation instead of the radial ribs 50.
It must be emphasized that the method has num2rous advantages relative to prior methods. Firstly the fixing of an electronic module in the card is imprcved since it is obtained both by the presence of the glue and by adherence of the plastic material bo the module. Further, the final size of the contact tabs relati~e to the top face of ~he card body can be - accurately controlled regardless o tha characterlstics of the plastic material constituting the card.
- -.
- - , - ' ', ' .
- -, .
' .~
.:,:
: . -. ~, . .
~; ` c) said bumps are locally raised to their ~oftening temperat~re and pressure is appliod to sa~d electronic module to crush the tops of said bumps until sa~d ovntact tabs æe substantially in the same plane as said main ~ace of ~aid body, said support thu~ adherlng to said bump~; and ~,.'~ ., .
. _ ~ ' ., ~5~3~
d) an insulating glue is caused to penetrate at least into said interstices between said bottom and said insulating support in order to provide additional adherence batween said electronic module and said card body.
It can be seen that such a method provides an effective solution to the two above-specified conditions~ Firstly there is no need to machine the initial cavity in tha body of the card to a high degrea of accuracy sinca accurate positioning of the electronic ~dule relative to the body of the card is provided by the degree to which the tops of thH bumps provided in the c~vity are, in fact, crushed. It can also be seen the creep resulting from the bumps being crushed is entirely localized in the spaces between the bumps. Fur~harmore, since the crushing is limltad, the volumes of material sub~e~ted to creep are small. It may also be observod that the set of bumps defines channels for glue insertion which ~ncourage glue spreading by capillarity while limiting glue advance to the space lying between the lnsulating support of ~he electronic module and the face of the cavity which includes ~he bumps.
In a first implementation, the second hollow also open~
out into the second main face of the card, and step d) is performed after ~tep c).
In a second implemantation of the in~ent~on, the second cavity i~ a blind hole and a drop of glue is placed therein be~een steps b) and c).
e in~ention alsa provides elactronic m2mDry cards having a structure of the type whlch is obtained by psrforming ~he above-defined method ln accordance with one of it~ various possible implementations. - -BRIEF DESCRIPTION OF THE DRAWINGS
Implementations of the in~ention are d~scrlbad by way of ~ example with refarence to the accomp~nyln~ drawings, in which:
;~ Figure 1 is a vertical section through an electr~nic; -- -. module ~uitable for being implanted in`~he body o~ a card;
Figures 2 to 5 show the varlous operation~ performed on the body of the card in order to prepare it for the implantation o~ a module in accordance with a fir~t implementation of the i~v~nticn;
- --. _ .
. ~ .
3~3~
Figures 6 and 7 show steps o the first implementation of the method whers the elsctronic module is placed in the cavity provided by the steps illus-trated in Figures 2 to 5, Figurs 8 shows the final structure o~ a card made in accordance with a first implementation of the inv~ntion, wi~h the electronic module being fi~ed in its cavity; and Figures 9 to 12 illustrate a second implementation of the method in accordance with the invention. These figures show successive steps of the second implementation, with Figures 10 to 12 being vertical section views and with ~igure 9 being a plan view of a portion of the card seen from above.
DETAILED DESCRIPTION OF P~EFERRED IMYLEMENT~TIONS OF THE INVENTION
Reference is made initially bo Figure 1 in order to describe an electronic modul8 usable in the invention. The electronic module 20 is essentially constituted by an insulating ; support 22 made, for exa~ple, from th~ material sold under the trademark Mylar, or from any other insulating material. The ; support 20 supports a semiconductor chip having an integrated circuit 24 prcvided therein. Contact tabs 26 are provided on one of the faces of the insulating support 22 and the integrated circuit Z4 is located on the opposite face. In order to make the various connection~ batween the integrated circuit 24 and the contact tabs 26, the seoond face of the insulating support 22 is fitted with metallization 28 for providing electrical connections. In addition, plated-through hole~ such as 30 provide electrical connection between the conducbor tracks 28 and the contact tabs 26. Finally, the conduotive tracks 28 are connected to termlnals such as 32 of th~ integrated circuit 24 b~ means of conductor wires such as 34.
- 30 In a first implemantation o tha invention, the electr~nic module 20 is implanted in the body of th~ aard by m~ans-of steps which are now described with rof~rence to Fi ~ e~ 2 to 8.
The electronic moduie itself is described in greater detail in the above-me~tioned Eur~pean patent application~ - -As can be æeen in Figure 2, the startin~ material i~ a càrd body 40 made of a plastic material such as PVC and including an upp2r hollow 42-at the location where the ;. ~ - _ . . .
: ~ .
. . , ., .. - .,, .... _ .:
.
- .
, ;3~
el0ctronic module is to be implanted. me body o:E the card is genarally rectangular in shape and is deiimited by two main parallel faces, namely a top face 44 and a bottQm face 45. The bottvm 46 of the hollow 42 is substantially parallel to the top face 44 of the bod~ 40. This hollow opens out into the top face 44 of the card, i.a. into the faGe which ls to include the tabs for electrical connection to a card reader. The hollow 42 may be circular, for sxample, and has a dimen~ion e in ~he plane of the top face 44 which is slightly grsater than the corresponding dimension e' of the insulating support of the electronic module. The dep~h h-of the hollow 42 between the top face 44 o-f the card body and the bottom 46 o~ the hollow 42 is a little ~reater than the thlckness h' of the assembly constituted by the insulating substrata of ~he elsctronic module togsther with the metallizations provid~d there~n. In the $ollowing steps (see Figura 3) the botbom 46 of the hollow 42 is locally plastically deformed i~ order to creata a set of bumps such as 50. ~h~se bump~ ar~ formad in such a manner as to snsure that the average distance between the top fa~e 44 of the card body and the top faces of the b~ ps 50 (marked 1 in Figure 3) is less than the thicknes~ h' of ~he electronic module support. As can be seen mnre clearly in fi~ure 4, the bumps 50 have i~tersticas 52 left therebe~w~en, which intersticas are in c ~ cation with one an~ther. me bumps :~ ~5 50 ara about 0.2 mm to ab~ut 0.3 mm high.
:~ In the pres~ntly described impl~mentation, these bumps are in the form of radial ribs 50 extanding fnom the wall of ~he hollow 42 up to a common central portion 51. me bumps oould ~:: be differant in sha~e. For example they could be constituted ~ small p~gs regularly distributed over ~he botbom 46 of the hollow 42.
In the follc)wing step (~hown in Fi~e 5) a bDttom hollow . . 54 is drilled through frn the top hollow 42 to ~he blDt;tall face 45 of the oard bod~. For exan~ple, this hollow may al~ be 35 circular in~sectiorl having a dian~ter m whioh i~ slis~htly greater than the largest dimension m' of the integratad o~rouit as fitted with its con~ection wires 34. ~5 can be seen ~
.
. ~
. , ~'', , ' . ' `"" ' ;
.:
. .
~25~
Figure 5, the dimension m is considerably less than the dimension eO Thus, the set of hollows 42 and 54 constitutes a cavity 58 which passes through the card body 40 from one face to the other and which lncludes a relatively large portion 42 and a ralatively small portion 54, with these two portions being interconnected by tha remaining portion of the ~ottcm 46 of the top hollow 42, together with it~ bumps 50.
Reference is now made bo Figures 6 to 8 while describing how an electronic m3dule 20 is implanted in ~he card using a first implementation of the invention. In order to simplify these figures the electronic module 20 is shown therein as being constituted solely by its insulating support 22 and the electronic module 24, with the metallizations and o~,her details being omitted. Fur~her, in order to make the ~igurss more clear, they are not to scale'and th6 thicknesses are considerably exaggerated relative to dimansions in the plane of the card.
As can bs seen ln Figure 6, the eleatronic module is placed in tha cavity 58. More precisely, the insulating substrate 22 rests on the tops of the bumps 50 and the 2~ electronic module 24 penetrates partially ~to the bDttom portion 54 of the cavity 58. In addition, the face of the electronic module be~riny th~ contact tabs stands proud from the top face 44 of the card body.
In the next step, as 8hown in Figure 7, the tops of the 25 bumps 50 are raised to the softening t~mparature of the material from which they are cDnstibuted, l.e. to about 175C, and simultaneously the mcdule assembly is pressed against the tops of the bumps which have been raised tD their 80ftening : temperature until the top face of the ~nsulatiy substrate (i.e. the contact tabs ~hereon) becomes substantially l~val : with the top faca 44 of the card body. It will be unders~oDd that during this operation, creep occurs~Gnly in the material - localized in the bumps, which materiai migrates to o~cupy a very small portion o~ the i~terstices 52 betweffn the bumps. As a resùlt all modification to the shapa of khe card body is : limited to the portion of ths oard including the bumpR, i.e. ~o : an inside portion of the card. After deformation, the bumps 50 - are about 0.03 tD 0.05 mm high.
.
' " , .
-- - - .:
.
.. : :
',:, ~ .
"'..,.' , ~.. , ' :
.. .. . .
;;3~
Figure 7 also shows an assembly includi~g a tool 80 for performing these two operations. The body o~ the card is placed on a base 820 The tool 80 includes a fixed portion 84 whose bottom face 86 rests against the top face 44 of the card body all around the cavity 58. The tool includes a moving portion 88 capable of sliding relative to the fixed portion 84 in a bore 89 along a directian F, i.e. in a diraction perpendicular to the main faces of the card. The tool is essentially constituted by a botbGm face 90 in contact with the 10 insulating support 22 of the electro~ic module and a heater ele~ent is represented at 92 by a heater resistancs. In addition, the moving portion 8~ includes lu~s 9~ which come into abutment against an and-of-stroke bearing surface 98 provided on the fixed portiGn 84 of tha tcol 80. The heater resistance 92 is raised to a temperature of about 175C, thereby heating the insulating substrats 22 and thus transmitting heat to the material constltuting the bumps 50.
In addition, the moving portion 88 serves to apply a d~grse of pre~sure against tha electronic module 20. The str~ke of ~he 20 mov~ng portion is limitad by co~oparation batween the lugs 94 and the end-of-stroke bearing surface 98. These two parts are placsd SD that in the e~d-of-stroke position the top face of : the insulating substrate 22 ~s substantially at the same le~el as the top face 44 o~ the card body. At the Qnd of ~his step, the electronic module assembly is properly positioned relative to the card body. In addition, the partial melting of the tops :~ of the bumps 50 in con~act with the insulating substrate 22 provide~ a degree of adherence therebetween, thus provlding at least tQmpor ~ connection between the ~ 20 and the electrDnic module. In addition, in spite of the bumps 50 creeping, the interstices 52 all r~main in communioation with the cavity 58.
Figure 8 shows the last step of the math~d. The c æd ass~mbly including the electronic module 20 is turned ~Yer.
; - 35 This operation is made possible by virtue of the fact that the elec~ronic module is already fixed to the car~ body by the partial melting of the bumps. A drop 100 of-~nsulating epoxy ;
:
~ - , , - - ':
-:
~2~53~
glue is inserted into the cavity 58 und~r the effect ofgravity. Capillarity causes the glue to penetrate into tha intsrstices 52 betwsen the bumps 50. However, one of the effects of the capillarity is to limit the progress of the glua to the zone line between the insulating support 22 and the bottom of the top ca~ity 42. Th~re is ~hus no problem of the glue reaching the face 4~ of the card or of its reaching face of the electronic module where it includas the contact tabs.
It can be seen from the ab~ve description that the method in accordance with the invention has numerous advantages over the prior art. mere is no need for the card body to be machined to accurate dimensions in order to provida the cavity in which the electronic module is recaived. There is no need to pre-glue either the module or the cavi~y. There is thus no need to accurately control the ~uantity of glue which is used.
The so$taning of ths plastic material constituting ~he card body is very localized and ~ffects only a very small volume of ma-terial. The resulting creep is thus highly localized and, in ~; addition, dDes not affect the outside faces of ~he card whQse dimensions are required to satlsfy accurate -~tandards.
A second implementation of the method in accordance with the invention is de6cribed with refer~nce to Figures 9 to 12.
In this implementation, unlike the first implementation described above, the electronic modula ls received in a blind cavity which does not open out into the bottom face of the card ~ody, and this may be advantageous in some applic~tions.
The met ~ b~gins with a card bcdy 120 identical to that shown in Figure 2. The body has an u ~ hollow 122 whlch i8 rectangular in the pre~nt example, and which has a bottom 124 at a depth o about 200 ~ . The card body has a top main face 126 into which the ~ollow 122 op~ns out and a bottam maln fa~a 1~8.
Bumps having the shaps shGwn in Flgure 9 are than made to project into the hollow 122 from ~he bot~om 124 thereof. me bump~ are constitutsd by p~gs such as 130 which are placed 3ver the area of a rectangle together with ~ continuous 5urrounding rib 132, i.e. a rib constituting a rloRed loop and, in the presen~ example, rectangular in shape wh~n ~een from above.
- ' ' ' ' . . .
, . . .
. .
5~
Tho rib 132 completely surrounds the set of pegs 130. The bumps 130 and 132 are ob-tained by plastic deforma-t1on and their height is from 0.2 to 0.3 mm.
In the following steps a bottom hollow 134 is made in the middle of the bottom 124, and this hollow is blind, i.e. it does not open out into tha bottom face 128 of ths card body 120. Tha set of hollows 122 and 134 constitutes a cavity 136 for receiving tha electronic module. Figures ~ and 10 shGw that ~nside the zona delimited by the rib 132, the pegs 130 leave interstices 138 between one another, with all of ~he interstices being in commNnication with the bottom hollow 134.
In this second implementation, an ele~tronic mcdule 140 is used as shown in Figure 11. The electronic module 140 difers from the electronic module 120 shown in Figure 1 by its insulating support 142 including a window 144 in which the s~miconductor chip 146 is partially received. Ths back of -the chip 146 is diroctly glued by means of a conductive glue to one of the metallizations 148 deposited on the top face of the insulating support 142 and constituting the tabs for connection to a card reader. me electrical connection betwean the : . terminals of the chip 146 and the other contact tabs 148 are provided by means of conductor wires 150, with netallizat~ons 152 being deposited on the other faca of the in~ulatin~ ~upport and with plated-through holes 154 passins through the entire thickness of the insula~in~ support 142. A more detailed description of the eleotronic mcdule 140 may be found in ~he above-~entioned European patent application. This particular structure for an electronic module has th~ advantage of reduced overall thickness.
The dimanæions of the alectronic mQdule 140 hav~ the same relationship to the dimensions of the caYlty 136 ~s hava already been described with r~feran~ to the first implementation of ' the inven~ion.
In the following step a drop 156 of epoxy glue is plac~d in the bottsm hollcw 134. The me~hod ~hen continues in axaGtiy the same way as the first impl~mentation of the i~v~nti~n as ~; dsscribed w~th refer~nce to Figurss 6 and 7. The electroni~ - -, - ~ , ~L~25~53~3~
modul~ 140 is placed in the cavi~y 136 in such a manner as to cause the insulating support 142 to have its metallizations 152 resting on the tops of the bumps 130, 132.
Then, a tool identic~l to that shown in Figure 7 is used to heat the electronic module 140 and to ~pply suitable pressure thereto for softenin~ the bump-consti~uting material and for crushing the bumps in th~ manner de~cribed in detai~
with raference to Figure 7. It should also be added (as can be seen in Figure 11) that tha rib 132 i~ placed so as to ba located, in part, opposite to the plated-through holes 154 in the alectronic module 140. ~hen the rib 132 is crushe~, plastic material rises (1553 into at least a portion of e~ch plated-~hrough hole 154. This serves to improve the connection between the module and the card body.
In a ~inal step, the electronic ~odule is finally glued to the card body. This is done by turning th9 card over, as shown in Figure 12. The bottcm face 128 of the card bo~y is then lightly heated level with ~he cavity 136 to about 40C. This heating, together with the card being turned ~ver, enables the drop of epoxy glue 156 to disperse and to ~ver the chip 146 and its wires 150, thereby mechanically co ~ lidating them. In addition, the glue fills the inter tices 138 betwesn the insulatlng support 42 and the b~ttom 124 of the hollow 122 by virtue of capillarity. me proyres~ of the glue is limited by the presence of the rib 132. At plat~d-through holes, progress of the glua i~ limited by sNrface tansion due to said holes which are smalI in size and whlch are at least partially filled - by plastic material 155.
Another way of providing gluing whan using a bllnd c~vity 3~ consists in pr~vi~ing two holes passing through the insulatlny support 142 of tha elec~ronic module at points located lnsids the rib 132. Glue is in~ected through ~ne-of these holes an~
the l~val of ~he glue in ~he cavity is observ~d through-the other. ~hen the glue is l~vel with the outside face of the lnsulating substrate in the second hole, glua in~ection is stopped. On solidifying, the glue fills ~he cavity and clos0s both h3las.
: ~ , " .
, - . , . - ~
,,, . . , .. . , . ~
.
.:`
. .:
:~
:
~s~
It will be understood that the second implementation of the method in accordance with the invention has the same advantages as the first implementation. The second implemPntation has the additional advantage of leaving the back of the card intact. Further, the presence of a continuous rib 132 as one of the bumps ensuras that none of tha glue rises towards the top face 126 of ~he card since the rib constitutes a continuous barrier opposing glu~ advance.
It must also be understood that the special shape of the bumps 130 and 132 shown in Figures 9 and 10 could be used in the first implementation instead of the radial ribs 50.
It must be emphasized that the method has num2rous advantages relative to prior methods. Firstly the fixing of an electronic module in the card is imprcved since it is obtained both by the presence of the glue and by adherence of the plastic material bo the module. Further, the final size of the contact tabs relati~e to the top face of ~he card body can be - accurately controlled regardless o tha characterlstics of the plastic material constituting the card.
- -.
- - , - ' ', ' .
- -, .
' .~
.:,:
: . -. ~, . .
Claims (13)
1/ A method of providing an electronic memory card comprising a body made of a thermoplastic material and having two main faces which are substantially parallel to each other, and an electronic module comprising:
a support which is generally flat in shape having two main faces;
contact tabs disposed in a first one of said main faces of said support;
a semiconductor chip having an integrated circuit formed therein and disposed on the second main face of said support;
and electrical connections for connecting the terminals of said chip to said tabs, said method comprising the following steps:
a) a cavity is made in the body of said card, said cavity including a first hollow opening out into a first one of said main faces of said body and having a bottom which is substantially parallel to said main faces of said body, and a second hollow opening out into said bottom, said first and second hollows having dimensions in planes parallel to said main faces of said body which are greater respectively than the dimensions of said insulating support and the dimensions of said chip, said bottom having a plurality of bumps projecting into said first hollow and separated from one another and from said second hollow by intercommunicating interstices, the distances between said first main face of the body and said bottom and the tops of said bumps being respectively greater than and less than the thickness of said support;
b) said module is placed in said cavity in such a manner as to cause said chip to penetrate partially into said second hollow and to cause said support to penetrate partially into said first hollow, the portion of said support which is not covered by said chip resting on said bumps, c) said bumps are locally raised to their softening temperature and pressure is applied to said electronic module to crush the tops of said bumps until said contact tabs are substantially in the same plane as said main face of said body, said support thus adhering to said bumps; and d) an insulating glue is caused to penetrate at least into said interstices between said bottom and said insulating support in order to provide additional adherence between said electronic module and said card body.
a support which is generally flat in shape having two main faces;
contact tabs disposed in a first one of said main faces of said support;
a semiconductor chip having an integrated circuit formed therein and disposed on the second main face of said support;
and electrical connections for connecting the terminals of said chip to said tabs, said method comprising the following steps:
a) a cavity is made in the body of said card, said cavity including a first hollow opening out into a first one of said main faces of said body and having a bottom which is substantially parallel to said main faces of said body, and a second hollow opening out into said bottom, said first and second hollows having dimensions in planes parallel to said main faces of said body which are greater respectively than the dimensions of said insulating support and the dimensions of said chip, said bottom having a plurality of bumps projecting into said first hollow and separated from one another and from said second hollow by intercommunicating interstices, the distances between said first main face of the body and said bottom and the tops of said bumps being respectively greater than and less than the thickness of said support;
b) said module is placed in said cavity in such a manner as to cause said chip to penetrate partially into said second hollow and to cause said support to penetrate partially into said first hollow, the portion of said support which is not covered by said chip resting on said bumps, c) said bumps are locally raised to their softening temperature and pressure is applied to said electronic module to crush the tops of said bumps until said contact tabs are substantially in the same plane as said main face of said body, said support thus adhering to said bumps; and d) an insulating glue is caused to penetrate at least into said interstices between said bottom and said insulating support in order to provide additional adherence between said electronic module and said card body.
2/ A method according to claim 1, wherein step c) is performed by heating said support to bring said bumps to their softening temperature and by simultaneously applying pressure to said insulating support.
3/ A method according to claim 1, wherein said second hollow also opens out into said second main face of said body.
4/ A method according to claim 3, wherein step d) is performed by inserting insulating glue via said second hollow, which glue penetrates by capillarity into said interstices between said support and said bottom.
5/ A method according to claim 1, wherein step a) is performed by initially providing said first hollow, then forming said bumps on its bottom, and then providing said second hollow.
6/ A method according to claim 1, wherein said second hollow is blind.
7/ A method according to claim 6, wherein insulating glue is-deposited in said second hollow prior to step b) and wherein step d) is performed by turning the card over so that said second hollow is above said first hollow and by healing said second face of said card body over said second hollow.
8/ A method according to claim 1, wherein said bumps comprise a rib disposed in a closed loop and a plurality of pegs projecting from that portion of said bottom which is situated between said rib and said second hollow.
9/ A method according to claim 3, wherein said projections comprise a rib disposed in a closed loop and a plurality of pegs projecting from that portion of said bottom which is situated between said rib and said second hollow.
10/ An electronic memory card comprising:
a body made of thermoplastic material and having a cavity constituted by a first hollow opening out into a first main face of the card body and a second hollow opening out into the bottom of said first hollow;
an electronic module lodged in said cavity, said module comprising an insulating support situated in said first hollow and having contact tabs on its outside face disposed substantially in the same plane as said first main face of said card body, and provided with a semiconductor chip on its inside face, together with electrical connections; and a plurality of bumps projecting from said bottom and adhering to said inside face of said support, the space lying between said bottom, sand support, and said bumps, being substantially filled with an insulating glue.
a body made of thermoplastic material and having a cavity constituted by a first hollow opening out into a first main face of the card body and a second hollow opening out into the bottom of said first hollow;
an electronic module lodged in said cavity, said module comprising an insulating support situated in said first hollow and having contact tabs on its outside face disposed substantially in the same plane as said first main face of said card body, and provided with a semiconductor chip on its inside face, together with electrical connections; and a plurality of bumps projecting from said bottom and adhering to said inside face of said support, the space lying between said bottom, sand support, and said bumps, being substantially filled with an insulating glue.
11/ A card according to claim 10, wherein said second hollow is blind and wherein said glue also covers, at least partially, said chip and said connections.
12/ A card according to claim 10, wherein said second hollow opens out into the second main face of said card body, with the portion of said second hollow which is not occupied by said chip being filled with said insulating glue.
13/ A card according to claim 10, wherein said bumps comprise a rib disposed along a closed loop together with a plurality of pegs projecting from the portion of said bottom of said first hollow which is situated between said second hollow and said rib.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR85/04658 | 1985-03-28 | ||
| FR8504658A FR2579799B1 (en) | 1985-03-28 | 1985-03-28 | METHOD FOR MANUFACTURING ELECTRONIC MEMORY CARDS AND CARDS OBTAINED ACCORDING TO SAID METHOD |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1255388A true CA1255388A (en) | 1989-06-06 |
Family
ID=9317687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000505281A Expired CA1255388A (en) | 1985-03-28 | 1986-03-27 | Method of manufacturing cards having an electronic memory, and cards obtained by performing said method |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4737620A (en) |
| EP (1) | EP0197847B1 (en) |
| JP (1) | JPS61227094A (en) |
| AT (1) | ATE48484T1 (en) |
| CA (1) | CA1255388A (en) |
| DE (1) | DE3667345D1 (en) |
| ES (2) | ES8706990A1 (en) |
| FR (1) | FR2579799B1 (en) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2502511B2 (en) * | 1986-02-06 | 1996-05-29 | 日立マクセル株式会社 | Method for manufacturing semiconductor device |
| US4996411A (en) * | 1986-07-24 | 1991-02-26 | Schlumberger Industries | Method of manufacturing a card having electronic memory and a card obtained by performing said method |
| FR2605144B1 (en) | 1986-10-14 | 1989-02-24 | Flonic Sa | PROCESS FOR PRODUCING CARDS WITH ELECTRONIC MEMORY AND CARDS OBTAINED BY IMPLEMENTING SAID METHOD |
| FR2613510A1 (en) * | 1987-03-31 | 1988-10-07 | Flonic Sa | Method of producing electronic memory cards and memory cards thus obtained |
| CH672285A5 (en) * | 1987-04-14 | 1989-11-15 | Landis & Gyr Ag | |
| JP2562476B2 (en) * | 1987-06-11 | 1996-12-11 | 大日本印刷株式会社 | 1C card manufacturing method |
| FR2617666B1 (en) * | 1987-07-02 | 1989-10-27 | Bull Cp8 | ELECTRONIC MICROCIRCUIT CARD AND MANUFACTURING METHOD THEREOF |
| US4921160A (en) * | 1988-02-29 | 1990-05-01 | American Telephone And Telegraph Company | Personal data card and method of constructing the same |
| FR2629236B1 (en) * | 1988-03-22 | 1991-09-27 | Schlumberger Ind Sa | PROCESS FOR REALIZING AN ELECTRONIC MEMORY CARD AND CARD AS OBTAINED BY IMPLEMENTING SAID METHOD |
| US5030407A (en) * | 1988-04-28 | 1991-07-09 | Schlumberger Industries | Method of making cards having graphics elements thereon |
| FR2636453B1 (en) * | 1988-09-14 | 1992-01-17 | Sgs Thomson Microelectronics | METHOD FOR ENCAPSULATING INTEGRATED CIRCUITS IN PARTICULAR FOR CHIP CARDS |
| JPH0687484B2 (en) * | 1989-04-06 | 1994-11-02 | 三菱電機株式会社 | IC card module |
| FR2650530B1 (en) * | 1989-08-07 | 1991-11-29 | Schlumberger Ind Sa | METHOD FOR REALIZING CARD BODIES WITH GRAPHICS |
| US5282113A (en) * | 1990-03-05 | 1994-01-25 | Hitachi Maxell, Ltd. | Memory card with a plurality of contact spaces |
| FR2664076A1 (en) * | 1990-03-28 | 1992-01-03 | Schlumberger Ind Sa | METHOD FOR MANUFACTURING ELECTRONIC MEMORY CARD |
| EP0472768A1 (en) * | 1990-08-30 | 1992-03-04 | Siemens Aktiengesellschaft | Method and attaching a chip module to an IC-card |
| FR2668096B1 (en) * | 1990-10-19 | 1993-01-22 | Schlumberger Ind Sa | METHOD FOR MANUFACTURING A MEMORY CARD CAPABLE OF RECEIVING A PHOTOGRAPHIC IMAGE AND CARD THUS OBTAINED. |
| WO1992020506A1 (en) * | 1991-05-10 | 1992-11-26 | GAO Gesellschaft für Automation und Organisation mbH | Process and device for manufacturing plastic mouldings having wall regions of reduced thickness |
| FR2677785A1 (en) * | 1991-06-17 | 1992-12-18 | Philips Composants | METHOD FOR MANUFACTURING A MICROCIRCUIT CARD |
| DE4126874C2 (en) * | 1991-08-14 | 1997-05-22 | Orga Kartensysteme Gmbh | Data carrier with integrated circuit |
| DE9110057U1 (en) * | 1991-08-14 | 1992-02-20 | Orga Kartensysteme Gmbh, 6072 Dreieich, De | |
| DE4140529C2 (en) * | 1991-12-09 | 1997-07-31 | Gao Ges Automation Org | Process for printing cards with a blind hole and device for carrying out the process |
| DE4142409A1 (en) * | 1991-12-20 | 1993-07-01 | Gao Ges Automation Org | METHOD FOR PRINTING CARDS WITH BAGHOLE RECESSING AND DEVICE FOR IMPLEMENTING THE METHOD |
| FR2695854B1 (en) * | 1992-09-22 | 1994-12-09 | Leroux Ets Gilles | Device for milling cavities in plastic cards and inserting integrated circuits in said cavities. |
| FR2702067B1 (en) * | 1993-02-23 | 1995-04-14 | Schlumberger Ind Sa | Method and device for manufacturing memory cards. |
| CH688696A5 (en) * | 1993-03-17 | 1998-01-15 | François Droz | Card with electronic component and coil mfr. for use as bank card, access card |
| AU684174B2 (en) * | 1994-05-27 | 1997-12-04 | Assa Abloy Ab | Method for fabricating an electronic module and electronic module obtained thereby |
| US5837992A (en) * | 1994-07-15 | 1998-11-17 | Shinko Nameplate Co., Ltd. | Memory card and its manufacturing method |
| DE4431605C2 (en) * | 1994-09-05 | 1998-06-04 | Siemens Ag | Method for producing a chip card module for contactless chip cards |
| FR2727542B1 (en) * | 1994-11-25 | 1997-01-03 | Droz Francois | CARD INCORPORATING AT LEAST ONE ELECTRONIC ELEMENT |
| DE4443767A1 (en) * | 1994-12-08 | 1996-06-13 | Giesecke & Devrient Gmbh | Electronic module and data carrier with electrical module |
| US5952713A (en) * | 1994-12-27 | 1999-09-14 | Takahira; Kenichi | Non-contact type IC card |
| DE19502398A1 (en) * | 1995-01-26 | 1996-08-01 | Giesecke & Devrient Gmbh | Method for mounting an electronic module in a card body |
| AU1750995A (en) * | 1995-01-27 | 1996-08-14 | Interprint Formularios Ltda. | Memory card and method of producing same |
| DE19601389A1 (en) * | 1996-01-16 | 1997-07-24 | Siemens Ag | Chip card body |
| DE69612574T2 (en) * | 1996-08-05 | 2001-10-18 | Gemplus Gemenos | IMPROVEMENT OF A MEMORY CARD PRODUCTION METHOD |
| DE19701165C1 (en) * | 1997-01-15 | 1998-04-09 | Siemens Ag | Chip card module |
| US5955021A (en) * | 1997-05-19 | 1999-09-21 | Cardxx, Llc | Method of making smart cards |
| KR100255108B1 (en) * | 1997-06-18 | 2000-05-01 | Samsung Electronics Co Ltd | Chip card |
| DE19749243C1 (en) * | 1997-11-07 | 1998-11-19 | Richard Herbst | Injection-encapsulation of component on resilient carrier, to make e.g. a smart card |
| FR2774198B1 (en) * | 1998-01-27 | 2001-08-31 | Solaic Sa | METHOD FOR FIXING AN ELECTRONIC MODULE IN A CAVITY OF A PORTABLE OBJECT BODY, IN PARTICULAR A CARD BODY, BY ULTRASOUND |
| DE19816066A1 (en) * | 1998-04-09 | 1999-10-14 | Philips Patentverwaltung | Foil as a carrier for integrated circuits |
| FR2803434A1 (en) * | 1999-12-30 | 2001-07-06 | Schlumberger Systems & Service | Method for protection of integrated circuit mounted in cavity of card body, and required tool, for use in manufacture of contactless chip cards |
| FR2805067B1 (en) | 2000-02-15 | 2003-09-12 | Bourgogne Grasset | ELECTRONIC CHIP TOKEN AND METHODS OF MANUFACTURING SUCH A TOKEN |
| DE10006515C5 (en) * | 2000-02-15 | 2004-09-16 | Datacard Corp., Minnetonka | Method for installing chips in card bodies |
| JP4516179B2 (en) * | 2000-05-22 | 2010-08-04 | 大日本印刷株式会社 | Contact and non-contact IC card manufacturing method and manufacturing apparatus |
| US6857552B2 (en) * | 2003-04-17 | 2005-02-22 | Intercard Limited | Method and apparatus for making smart card solder contacts |
| US20090091424A1 (en) * | 2007-10-05 | 2009-04-09 | Manfred Rietzler | Transponder inlay for a personal document and method of manufacturing same |
| ITRM20090236A1 (en) * | 2009-05-12 | 2010-11-13 | Gep S P A | STABLE PLACEMENT SYSTEM OF THE SILICON CHIP MODULE IN THE GENERATED CABLE ON THE INLAY THROUGH SYNTHETIC ADHESIVE MATERIAL STORAGE |
| FR2968432B1 (en) | 2010-12-06 | 2012-12-28 | Oberthur Technologies | METHOD FOR INPUTTING A MODULE IN A MICROCIRCUIT CARD |
| US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
| US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
| PL3491584T3 (en) * | 2016-07-27 | 2022-11-07 | Composecure Llc | Overmolded electronic components for transaction cards and methods of making thereof |
| US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
| US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| FI3679523T3 (en) | 2017-09-07 | 2023-05-05 | Composecure Llc | Transaction card with embedded electronic components and process for manufacture |
| CA3079539A1 (en) | 2017-10-18 | 2019-04-25 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4216577A (en) * | 1975-12-31 | 1980-08-12 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card |
| DE3029939A1 (en) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | ID CARD WITH IC COMPONENT AND METHOD FOR THEIR PRODUCTION |
| DE3153769C2 (en) * | 1981-04-14 | 1995-10-26 | Gao Ges Automation Org | Plastics identity card with an internal integrated circuit |
| US4483067A (en) * | 1981-09-11 | 1984-11-20 | U.S. Philips Corporation | Method of manufacturing an identification card and an identification manufactured, for example, by this method |
| FR2538930B1 (en) * | 1983-01-05 | 1989-05-19 | Seiichiro Aigo | INFORMATION CARD |
| DE3466108D1 (en) * | 1983-06-09 | 1987-10-15 | Flonic Sa | Method of producing memory cards, and cards obtained thereby |
-
1985
- 1985-03-28 FR FR8504658A patent/FR2579799B1/en not_active Expired - Lifetime
-
1986
- 1986-03-25 US US06/844,039 patent/US4737620A/en not_active Expired - Lifetime
- 1986-03-25 ES ES553359A patent/ES8706990A1/en not_active Expired
- 1986-03-26 JP JP61068246A patent/JPS61227094A/en active Pending
- 1986-03-27 EP EP86400670A patent/EP0197847B1/en not_active Expired
- 1986-03-27 CA CA000505281A patent/CA1255388A/en not_active Expired
- 1986-03-27 AT AT86400670T patent/ATE48484T1/en not_active IP Right Cessation
- 1986-03-27 DE DE8686400670T patent/DE3667345D1/en not_active Expired - Lifetime
-
1987
- 1987-03-16 ES ES1987297137U patent/ES297137Y/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61227094A (en) | 1986-10-09 |
| EP0197847B1 (en) | 1989-12-06 |
| DE3667345D1 (en) | 1990-01-11 |
| ES8706990A1 (en) | 1987-06-16 |
| ATE48484T1 (en) | 1989-12-15 |
| FR2579799A1 (en) | 1986-10-03 |
| FR2579799B1 (en) | 1990-06-22 |
| US4737620A (en) | 1988-04-12 |
| ES297137Y (en) | 1989-10-16 |
| ES297137U (en) | 1989-04-01 |
| EP0197847A1 (en) | 1986-10-15 |
| ES553359A0 (en) | 1987-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1255388A (en) | Method of manufacturing cards having an electronic memory, and cards obtained by performing said method | |
| US4996411A (en) | Method of manufacturing a card having electronic memory and a card obtained by performing said method | |
| KR100395843B1 (en) | Chip module especially for implantation in chip card body | |
| DE69839276T2 (en) | METHOD FOR PRODUCING A CHIP CARD, SUITABLE FOR CONTACTED OR CONTACTLESS OPERATION | |
| US6239484B1 (en) | Underfill of chip-under-chip semiconductor modules | |
| RU2265886C1 (en) | Method for contacting semiconductor micro-circuits in chip cards | |
| US4774633A (en) | Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electronic microcircuit card incorporating said device | |
| US5847930A (en) | Edge terminals for electronic circuit modules | |
| US5735040A (en) | Method of making IC card | |
| CA1188805A (en) | Identification card with integrated circuit | |
| EP1753098B1 (en) | Memory Card Adaptor | |
| US5376824A (en) | Method and an encapsulation for encapsulating electrical or electronic components or assemblies | |
| JPH0222098A (en) | Manufacture of electronic memory card and card obtained by executing said method | |
| EP3475882B1 (en) | Integrated circuit modules and smart cards incorporating the same | |
| GB1567784A (en) | Portable card for systems for processing electrical signals and a method of manufacturing such a card | |
| AU603142B2 (en) | A method of making cards, in particular memory cards | |
| US6713677B2 (en) | Housing assembly for an electronic device and method of packaging an electronic device | |
| JPS6329959A (en) | Method of mounting conductor track and network for circuit carrier of electronic mechanical clock mechanism and the network | |
| EP1198002B1 (en) | Electric or Electronic Component and Method of Manufacturing the Same | |
| EP1346316B1 (en) | Electronic data storage medium | |
| AU4043699A (en) | Method for producing an integrated circuit card and card produced according to said method | |
| US5986890A (en) | Semifinished product with an electronic module | |
| EP1143379B1 (en) | Method of realising a mixed chip card | |
| DE19647845C2 (en) | Method of making a smart card | |
| JPH1024685A (en) | Ic card and manufacture thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |