CA2016716A1 - Shield gas wave soldering - Google Patents

Shield gas wave soldering

Info

Publication number
CA2016716A1
CA2016716A1 CA2016716A CA2016716A CA2016716A1 CA 2016716 A1 CA2016716 A1 CA 2016716A1 CA 2016716 A CA2016716 A CA 2016716A CA 2016716 A CA2016716 A CA 2016716A CA 2016716 A1 CA2016716 A1 CA 2016716A1
Authority
CA
Canada
Prior art keywords
shield gas
solder
wave
wave soldering
gas wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2016716A
Other languages
French (fr)
Other versions
CA2016716C (en
Inventor
Carlos A. Deambrosio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electrovert Ltd
Original Assignee
Electrovert Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrovert Ltd filed Critical Electrovert Ltd
Publication of CA2016716A1 publication Critical patent/CA2016716A1/en
Application granted granted Critical
Publication of CA2016716C publication Critical patent/CA2016716C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0661—Oscillating baths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Abstract

A wave soldering apparatus and process occurs in an atmosphere which substantially excludes oxygen. By providing a pressurized effect on an element to be soldered while passing through a solder wave, fluxless soldering is accomplished avoiding the necessity to remove flux residues.
The element is preheated in a shield gas atmosphere substantially excluding oxygen, moved in a predetermined path so that at least a portion of the element passes through the solder wave which is oscillated while the element is in the solder wave and maintained in the shield gas until solder on the element has solidified.
CA002016716A 1989-11-22 1990-05-14 Shield gas wave soldering Expired - Fee Related CA2016716C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/441,009 US5044542A (en) 1989-11-22 1989-11-22 Shield gas wave soldering
US441,009 1989-11-22

Publications (2)

Publication Number Publication Date
CA2016716A1 true CA2016716A1 (en) 1991-05-22
CA2016716C CA2016716C (en) 1997-06-17

Family

ID=23751121

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002016716A Expired - Fee Related CA2016716C (en) 1989-11-22 1990-05-14 Shield gas wave soldering

Country Status (4)

Country Link
US (1) US5044542A (en)
AU (1) AU6716790A (en)
CA (1) CA2016716C (en)
WO (1) WO1991007248A1 (en)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5121874A (en) * 1989-11-22 1992-06-16 Electrovert Ltd. Shield gas wave soldering
US5230460A (en) * 1990-06-13 1993-07-27 Electrovert Ltd. High volume convection preheater for wave soldering
US5228614A (en) * 1990-07-09 1993-07-20 Electrovert Ltd. Solder nozzle with gas knife jet
FR2670986B1 (en) * 1990-12-20 1996-08-02 Air Liquide WELDING BATH INERTAGE DEVICE OF A WAVE WELDING MACHINE.
US5176307A (en) * 1991-02-22 1993-01-05 Praxair Technology, Inc. Wave soldering in a protective atmosphere enclosure over a solder pot
NL9101383A (en) * 1991-08-13 1993-03-01 Soltec Bv SOLDERING DEVICE WITH LOW OXYGEN GAS BLANKET.
DE4136806A1 (en) * 1991-11-08 1993-05-13 Ernst Hohnerlein Soldering tunnel - has gas flow into the soldering zone enhanced using nozzles with slit-shaped outlet
US5240169A (en) * 1991-12-06 1993-08-31 Electrovert Ltd. Gas shrouded wave soldering with gas knife
US5397049A (en) * 1991-12-06 1995-03-14 Electrovert Ltd. Gas shrouded solder wave with reduced solder splatter
US5292055A (en) * 1991-12-06 1994-03-08 Electrovert Ltd. Gas shrouded wave improvement
FR2700779B1 (en) * 1993-01-22 1995-03-10 Lorraine Laminage Method for purifying a coating bath of metallurgical products with a metal alloy, and installation for implementing this method.
WO1994023888A1 (en) * 1993-02-05 1994-10-27 Electrovert Ltd. Non lead soldering in a substantially oxygen free atmosphere
JP2567336B2 (en) * 1993-04-23 1996-12-25 一郎 川勝 Soldering equipment in an inert atmosphere
DE69427954T2 (en) * 1993-05-27 2002-04-04 Dainippon Printing Co Ltd METHOD AND DEVICE FOR THE LIQUID ORDER
US5568894A (en) 1993-06-04 1996-10-29 Electrovert Ltd. Applying flux to a solder wave for wave soldering an element
TW332007U (en) * 1993-06-22 1998-05-11 Ciba Geigy Corp Continuous drier for board-shaped Continuous piece material and coating installation comprising such a continuous drier
US5364007A (en) * 1993-10-12 1994-11-15 Air Products And Chemicals, Inc. Inert gas delivery for reflow solder furnaces
US5409159A (en) * 1994-02-28 1995-04-25 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and methods for inerting solder during wave soldering operations
US5725667A (en) * 1996-03-01 1998-03-10 Xerox Corporation Dip coating apparatus having a single coating vessel
US5720815A (en) * 1996-03-01 1998-02-24 Xerox Corporation Dip coating apparatus having solution displacement apparatus
DE19749187A1 (en) * 1997-11-07 1999-05-12 Messer Griesheim Gmbh Soldering device
DE19749184B4 (en) * 1997-11-07 2007-03-01 Air Liquide Deutschland Gmbh soldering device
DE19749185A1 (en) * 1997-11-07 1999-05-12 Messer Griesheim Gmbh Gas distribution that can be connected to a gas supply
NL1009615C2 (en) * 1998-07-10 2000-01-28 Soltec Bv Method and device for separating solder-floating dross.
US6315189B1 (en) * 1998-10-13 2001-11-13 Texas Instruments Incorporated Semiconductor package lead plating method and apparatus
US6234380B1 (en) 1998-10-29 2001-05-22 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and method for inerting a wave soldering installation
DE19912718C1 (en) * 1999-03-20 2000-02-03 Messer Griesheim Gmbh Soldering device for flat component group e.g. ball grid array components
JP2001251047A (en) * 2000-03-07 2001-09-14 Senju Metal Ind Co Ltd Method of soldering printed board and automatic soldering apparatus
JP2001267733A (en) * 2000-03-17 2001-09-28 Mitsumi Electric Co Ltd Soldering method
EP1405687B1 (en) * 2000-09-26 2009-12-09 Panasonic Corporation Method and device for flow soldering
JP3942623B2 (en) * 2005-12-12 2007-07-11 富士通テン株式会社 Flat dip device and method of soldering flat dip device
DE502007006711D1 (en) * 2006-05-23 2011-04-28 Linde Ag Apparatus and method for wave soldering
ES2331294B2 (en) * 2006-12-08 2010-09-14 Fujitsu Ten Limited APPARATUS AND METHOD FOR WELDING A FLAT WORK PIECE.
JP5343566B2 (en) * 2009-01-08 2013-11-13 富士通株式会社 Joining method and reflow apparatus
DE102011106762A1 (en) * 2011-07-05 2013-01-10 Sensor-Technik Wiedemann Gmbh Method for wave soldering of e.g. printed circuit boards in wave soldering station to connect cooling bodies, involves preheating products for even heat distribution via solder masks, which consist of infrared transparent material portions
DE102012022669B4 (en) * 2012-11-21 2022-10-13 Illinois Tool Works Inc. selective soldering system
US9370838B2 (en) 2014-08-21 2016-06-21 Illinois Tool Works Inc. Wave soldering nozzle system and method of wave soldering
JP6666071B2 (en) * 2015-04-03 2020-03-13 セイテック株式会社 Local soldering method
US10029326B2 (en) 2016-10-26 2018-07-24 Illinois Tool Works Inc. Wave soldering nozzle having automatic adjustable throat width
US10780516B2 (en) 2018-06-14 2020-09-22 Illinois Tool Works Inc. Wave solder nozzle with automated adjustable sliding plate to vary solder wave width
US11389888B2 (en) 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA648531A (en) * 1962-09-11 M. Fox William Fabrication of semiconductor devices
CA1002391A (en) * 1974-10-07 1976-12-28 Electrovert Ltd. - Electrovert Ltee Wave-soldering of printed circuits
JPS5395854A (en) * 1977-02-02 1978-08-22 Asahi Glass Co Ltd Method and apparatus for soldering with no flux
JPS5927771A (en) * 1982-08-09 1984-02-14 Hitachi Ltd Soldering device
DE3309648A1 (en) * 1983-03-15 1984-09-20 Siemens AG, 1000 Berlin und 8000 München METHOD FOR SOLDERING PLATE-SHAPED CIRCUIT CARRIERS WITHIN A PROTECTIVE GAS SOLDERING DEVICE
US4538757A (en) * 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere
US4580716A (en) * 1984-10-17 1986-04-08 Rca Corporation Apparatus and method for vapor phase solder reflow
US4684056A (en) * 1985-05-03 1987-08-04 Electrovert Limited Vibratory wave soldering
DE8520254U1 (en) * 1985-07-11 1985-10-31 Siemens AG, 1000 Berlin und 8000 München Soldering device for soldering electronic flat assemblies in a soldering chamber filled with inert gas
JPS6224859A (en) * 1985-07-24 1987-02-02 Kenji Kondo Soldering device
US4697230A (en) * 1986-06-23 1987-09-29 Westinghouse Electric Corp. AC power supplied static switching apparatus having energy recovery capability
US4696226A (en) * 1986-08-28 1987-09-29 Witmer Warner H Fluid barrier curtain system
JPS63174778A (en) * 1987-01-11 1988-07-19 Daiichi Tsusho:Kk Automatic soldering method and its device
KR920008948B1 (en) * 1987-02-12 1992-10-12 니혼 덴네쯔 게이기 가부시끼가이샤 Soldering apparatus
NL8701237A (en) * 1987-05-22 1988-12-16 Soltec Bv Apparatus for applying conductive adhesive, such as solder, to a printed circuit board.
DE3737563A1 (en) * 1987-11-05 1989-05-18 Ernst Hohnerlein SOLDERING MACHINE
US4821947A (en) * 1988-02-08 1989-04-18 Union Carbide Corporation Fluxless application of a metal-comprising coating
DE3813931C2 (en) * 1988-04-25 1995-05-04 Resma Gmbh Fuegetechnik Indust Inert gas soldering method and device for carrying out this method

Also Published As

Publication number Publication date
WO1991007248A1 (en) 1991-05-30
US5044542A (en) 1991-09-03
CA2016716C (en) 1997-06-17
AU6716790A (en) 1991-06-13

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Legal Events

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EEER Examination request
MKLA Lapsed