CA2036241C - Thin film electrical component - Google Patents
Thin film electrical component Download PDFInfo
- Publication number
- CA2036241C CA2036241C CA002036241A CA2036241A CA2036241C CA 2036241 C CA2036241 C CA 2036241C CA 002036241 A CA002036241 A CA 002036241A CA 2036241 A CA2036241 A CA 2036241A CA 2036241 C CA2036241 C CA 2036241C
- Authority
- CA
- Canada
- Prior art keywords
- metal layer
- carrier plate
- substrate
- glass carrier
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/07—Endoradiosondes
- A61B5/076—Permanent implantations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B2018/00053—Mechanical features of the instrument of device
- A61B2018/00107—Coatings on the energy applicator
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M2205/00—General characteristics of the apparatus
- A61M2205/02—General characteristics of the apparatus characterised by a particular materials
- A61M2205/0244—Micromachined materials, e.g. made from silicon wafers, microelectromechanical systems [MEMS] or comprising nanotechnology
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M2205/00—General characteristics of the apparatus
- A61M2205/33—Controlling, regulating or measuring
- A61M2205/3303—Using a biosensor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1414—Ceramic, glass, glasslike, vitreous
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31562—Next to polyamide [nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31623—Next to polyamide or polyimide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Abstract
A biocompatible thin film electrical component is configured for use in a human body or other ionic liquid environment. A polyimide substrate is bonded to a glass carrier plate sized for handling by automatic equipment and a multiple-layer metal conductor is deposited on the substrate and patterned to define an electrical circuit or biosensor. The polyimide and the glass establish a bond therebetween that withstands handling yet is broken using biocompatible releasing agents and techniques. The polyimide substrate and glass carrier plate preferably have similar thermal expansion properties to reduce the likelihood of fracture and delamination problems during release of the substrate from the carrier plate. An insulation layer covers the metal conductor and, in one embodiment, is made of a polyimide having a cure temperature lower than the temperature at which interdiffusion occurs in the metal layers in the conductor.
Description
2Q36~41 THIN FILM ELECTRICAL COMPONENT
Background and Summary of th Invention The present invention relates to thin film electrical components, and particularly, to a flexible, micro-miniature, waterproof, biocompatible, thin film circuit package that can be patterned to function as a connector, sensor, or other electrical component. More particularly, the present invention relates to improvements in handling and configuring thin film circuit packages during manufacture.
A thin film is typically a film of O.Olum to 0.5um deposited on a glass, ceramic, or semiconductor substrate to form, for example, a capacitor, resistor, coil, or other circuit component. Thin film integrated circuits consist entirely of thin films deposited in a patterned relationship on a substrate.
One aim of the present invention is to develop an improved biocompatible thin film sensor or circuit suitable for use in the human body. It has been observed that satisfactory biocompatible thin film sensors or circuits cannot generally be produced by relying exclusively on the materials and techniques used to make conventional thin film structures.
Testing and monitoring of many biological conditions in the human body or other ionic liquid environments would be enhanced by the development of a waterproof thin film biosensor of miniature size and flexible character. However, conventional thin film structures are not generally designed to be _2_ biocompatible with the human body and are made using processes which are not suitable for use with biomaterials. Also, conventional thin film structures are not flexible.
A silicon wafer typically provides the foundation, platform, or carrier plate on which a conventional thin film .structure is built. Automatic handling equipment is used to move the silicon wafer between manufacturing stations as a thin film structure is developed layer-by-layer on the silicon wafer. In this invention, the first thin film layer bonded to the silicon wafer carrier plate is used as a substrate of the thin film structure. Once the thin film structure is constructed, the silicon wafer carrier plate is released from attachment to the substrate of the thin film structure and discarded.
A thin film structure can be damaged during the release of the thin film structure from its silicon wafer carrier plate if the structure is made of any material which is incompatible with the acid etching solution or other release agent used to break the bonds coupling the substrate of the thin film structure to its silicon wafer carrier plate. It has been observed that ' many biomaterials of the type that could be used in the construction of a biologically compatible thin film structure are damaged or lose function upon exposure to conventional silicon wafer-releasing agents. The etching~solutions normally used to dissolve a silicdh wafer carrier plate are not compatible with biomaterials contained in a biocompatible thin film structure.
It has also been observed that thin film metal conductors deposited on a polymer substrate coupled to a carrier plate tend to fracture and delaminate upon release of the polymer substrate from its carrier plate foundation. It is thought that any difference in the coefficients of thermal expansion of the polymer substrate and its carrier plate foundation leads to the development of internal stresses in the polymer substrate as it is heat-cured, because its coefficient of thermal expansion is different from the carrier plate. Thin film structure fracture and delamination problems can result unless careful attention is given to the thermal expansion coefficients of the carrier plate foundation and substrate materials used to construct the 1~ thin film structure.
Conventional thin film structures are known to contain an adhesion metal film to enhance bonding of a noble metal film to its underlying polymer substrate.
Such an adhesion metal film layer is a useful bonding tool because noble metals used to form electrical circuits in thin film structures do not adhere well directly to polymer substrates. For that reason, the adhesion metal layer is situated between the polymer substrate and the noble metal film layer.
It has been observed that thin film structures _ suffer performance losses because of interdiffusion of abutting adjacent adhesion and noble metal film layers during any high-temperature processing of the thin film structure, for example, during heat-curing of a polymer precursor solution to provide a polymer insulation layer on the metal film layers. Performance losses include, for example, loss of flexibility of the thin film structure itself and development of metal film layer adhesion problems. In addition to these mechanical problems, metal interdiffusion can cause changes to occur in the electrical properties of the noble metal layer.
The common solution to the metal interdiffusion problem in the semiconductor industry is the addition of a refractory metal layer (e. g., tungsten or tantalum) between the adhesion and noble metal film layers. This extra layer acts as an interdiffusion barrier.
Processing of a thin film structure, however, is severely complicated by the deposition and patterning of such an additional refractory metal film layer.
One object of the present invention is to provide a biologically compatible thin film electrical component suitable for use in the human body or any other ionic liquid environment.
Another object of the present invention is to provide a thin film electrical component configured and patterned to function as a biosensor includable in a medical device implanted in a human body and a method of making this thin film electrical component to preserve its biosensor function capability.
Still another object of the present invention is to provide a thin film structure which can be fabricated without the occurrence of stress damage at the release of the thin film structure substrate from its carrier plate foundation.
Yet another object of the present invention is to provide a thin film structure that can be insulated without interdiffusion of metal film layers contained in the thin film structure.
According to the present invention, a thin film electrical component includes a rigid glass carrier plate, a substrate bonded to the rigid glass carrie r plate, and means for providing an electrical circuit.
The substrate comprises a polymer establishing a bond with the rigid glass carrier plate that is broken upon immersion of the substrate and the rigid glass carrier plate in either a boiling water bath or a room temperature physiologic saline bath to release the substrate from attachment to the rigid glass carrier plate. The means for providing an electrical circuit is bonded to the substrate and undisrupted during release of the substrate attachment to the rigid glass carrier plate.
One feature of the present invention is the provision of a thin film electrical component in which the polymer substrate can be released from its carrier plate without the use of any release agent or technique that could damage biomaterials contained in the substrate or means for providing an electrical circuit formed on the substrate. The selection of the proper glass for the carrier plate and the proper polymer for the substrate is critical. In particular, a polymer that develops a bond to glass that is strong enough only to withstand circuit fabrication processes but may be broken with biocompatible boiling water or biocompatible _6_ warm saline exposure is an important feature of the invention. Advantageously, the use of non-biocompatible silicon-etching release agents is avoided.
Those skilled in the art will recognize that an unmodified PMDA-ODA type polyimide is generally considered,to be inferior compared to other possible substrate materials because of its marginal adhesive strength when bonded to most carrier plate foundations.
Thus, for most thin film applications, adhesion-promoting agents are added to it so that this polyimide is modified to improve its bonding capability. Nevertheless, in the present invention, marginal adhesive strength is desirable to permit the glass carrier plate to be released from the polyimide substrate using biocompatible releasing agents and techniques. Thus, in the preferred embodiment, the polymer substrate comprises an unmodified PMDA-ODA type polyimide.
In preferred embodiments, the rigid glass carrier plate comprises a low-expansion type glass having a characteristic coefficient of thermal expansion and the polymer forming the substrate comprises a polyimide having a coefficient of thermal expansion that is substantially equivalent to the coefficient of thermal expansion of the Iow-expansion glass. Such a match in thermal expansion coefficients will cause the rigid glass carrier plate and the polymer substrate carrying the means for providing an electrical circuit to expand at about the same rate during exposure of the thin film structure to an elevated temperature.
Advantageously, separation of the means for providing an electrical circuit from the substrate is avoided during release of the polymer substrate from attachment to the rigid glass carrier plate.
Accordingly, another feature of the present invention is that the carrier plate glass and the substrate polymer are carefully selected so that their coefficients of thermal expansion are about the same.
Advantageously, thermal matching of this type reduces the likelihood that serious fracture and delamination problems will arise during release of the polymer substrate from the glass carrier plate.
Yet another feature of the present invention is the provision of a polymer insulation layer with a relatively low cure temperature. Without metal interdiffusion considerations, a logical choice for this insulation layer might be a photoimageable polyimide because the layer can be patterned without the use of additional photoresist steps. Unfortunately, currently available photoimageable polyimides require a high-cure temperature (450°C) to drive out the photosensitizers.
In the preferred embodiment, a BTDA-ODA polyimide is used, with positive photoresist, to form the patterned insulation coating. This material can be cured as low as 250°C, causing significantly less interdiffusion and resulting problems.
' In the preferred embodiment, one type of polyimide is used to provide the polymer substrate and a different type of polyimide is used to provide the polymer insulator. The selection of the "substrate"
_g_ polyimide is governed by its releasability and thermal-expansion compatibility with a glass carrier plate. For example, either a PMDA-ODA or BPDA-PPD type polyimide is suitable. On the other hand, the selection of the °'insulator" polyimide is governed by the magnitude of its cure temperature compared to the minimum temperature at which metals in the thin film electrical component begin to interdiffuse and by its adhesive strength to the underlying polymer and metal layer. For example, as noted above, a BTDA-ODA
polyimide is suitable.
Also according to the present invention, a _ method is provided of making a thin film electrical component. The method comprises the steps of providing a rigid glass carrier plate having a flat surface, coating the flat surface with a first polyamic acid precursor solution, and curing the first polyamic acid precursor solution using heat at a first temperature to provide a layer of polyimide film bonded to the flat surface. In a preferred embodiment of the present invention, the polyimide film has a coefficient of thermal expansion that is substantially equivalent to the coefficient of thermal expansion of the rigid glass carrier plate so that creation of internal stresses in the polyimide film during curing is avoided. In certain other embodiments, glass carrier plates and polyimide films having substantially different coefficients of thermal expansion can be used.
Preferably, the coating step further comprises the steps of dispensing the first polyamic acid _g_ precursor solution onto the flat surface of the rigid glass carrier plate, and spinning the rigid glass carrier plate about an axis orthogonal to the flat surface to create a smooth polyamic acid precursor solution coating of substantially uniform thickness across the flat surface. This is a conventional spin-coating process commonly used in the semiconductor industry. The rigid glass carrier plate is spun at a speed between 1,000 and 6,000 revolutions per minute during the spinning step.
The method further includes the steps of forming means for providing an electrical circuit on the polyimide film, and exposing the rigid glass carrier plate, the polyimide film, and the means for providing an electrical circuit to either a hot water bath or a body temperature physiologic saline bath for a period of time sufficient to break the bond connecting the polyimide film to the rigid glass carrier plate. The warm saline bath provides a biocompatible releasing agent which operates to cause the polyimide film to be released from the rigid glass carrier plate without separating the means for providing an electrical circuit from the polyimide film.
An electrical circu~.t is provided in the thin film electrical component by depositing a first adhesive metal layer on the polyimide film, a noble metal layer on the first adhesive metal layer, and a second adhesive metal layer on the noble metal layer to sandwich the noble metal layer between the first and second adhesive metal layers, and patterning the deposited noble metal layer and first and second adhesive metal layers to define means on the polyimide film for providing an electrical circuit. Next, a second polyamic acid precursor solution is provided on the means for providing an electrical circuit by dispensing the second polyamic acid precursor solution onto the means for providing an electrical circuit, and spinning an assembly comprising the rigid glass carrier plate, the polyimide film, the means for providing an electrical circuit about an axis orthogonal to the flat surface of the rigid glass carrier plate. The assembly is spun to create a coating of second polyamic acid precursor solution on predetermined exposed portions of the polyimide film and the means for providing an electrical circuit.
The second polyamic acid precursor solution is then cured using heat at a second temperature to provide a polyimide insulation coating on the means for providing an electrical circuit. In cases where interdiffusion between noble and adhesive metal layers is a problem, the second temperature is less than a characteristic minimum temperature at which interdiffusion of the noble metal layer and the first and second adhesive metal layers occurs so that substantial interdiffusion of the noble metal layer and the first and second adhesive metal layers is avoided during heat curing of the second polyamic acid precursor solution.
Additional objects, features, and advantages of the invention will become apparent to those skilled in the art upon consideration of the following detailed description of a preferred embodiment exemplifying the best mode of carrying out the invention as presently perceived.
Brief Description of the Drawings The detailed description particularly refers to the accompanying figures in which:
Fig. 1 is a diagrammatic sectional view of a glass carrier plate during deposition of a polymer precursor solution onto a flat surface of the glass carrier plate;
Fig. 2 is a diagrammatic elevation view of a polymer substrate on the glass carrier plate of Fig. 1;.
Fig. 3 is a diagrammatic view of a metal composite conductor consisting of three metal layers on the polymer substrate of Fig. 2;
Fig. 9 is a top plan view of the component of Fig. 3 showing configuration of the multiple-layer metal conductor to provide a circuit element;
Fig. 5 is a diagrammatic sectional view of the component of Fig. 4 showing an access opening formed in the top metal layer and an insulation coating covering portions of the metal conductor;
Fig. 6 is a top plan view of the component of Fig. 5 showing a pair of uninsulated lead-attachment sites;
Fig. 7 is a diagrammatic sectional view of the component of Figs. 5 and 6 immersed in a liquid bath to release the glass carrier plate from attachment to the polymer substrate;
Fig. 8 is a diagrammatic sectional view of a component in accordance with another embodiment of the invention; and Fig. 9 is a top plan view of the component of Fig. 8 showing a pair of uninsulated lead-attachment sites.
Detailed Description of the Drawings A process for making a thin film electrical component is illustrated in Figs. 1-7. The finished component is illustrated in Fig. 7. As shown in Fig. 1, a clean glass plate 10 is used at the beginning of the manufacturing process to provide a rigid carrier plate or foundation for the thin film electrical component. A
"photomask" blank is preferred because of its precise flatness and smoothness and thermal stability. In the preferred embodiment, the plate 10 is a low-expansion glass consisting essentially of 60% Si02, 18% R0, 150 A1203, 5% B203, 1% Na20, and 1% K20. It will be understood that RO stands for "unknown metal oxide impurities."
Square or circular glass plates may be used to provide plate 10 with outside dimensions ranging from 3 inches (7.62 cm) to 6 inches (15.24 cm) and thicknesses of from about 0.030 inches (0.076 cm) to 0.090 inches (0.228 cm). A standard "silicon wafer or photomask" size can be selected for plate 10 to accommodate automatic handling and processing equipment. Glass plate 10 can~be cleaned using a conventional cleaning solution prior to use and may be reused indefinitely.
Referring to Figs. 1 and 2, a polymer substrate 11 is formed by spin-coating liquid polyamic acid 12 onto a top flat surface 14 of the rigid quartz-glass plate 10 as the plate 10 is spun about an axis 16 that is orthogonal to the f7.at surface 14. Illustratively, the glass carrier plate 10 is spun at a speed between 1,000 and 6,000 revolutions per minute. This spin-coating technique is desirable because it results in a smooth and uniform coating.
The polyamic acid precursor solution 12 on glass plate 10 is imidized using a two-stage heat cure process to provide a polymer substrate 11 comprising a flat, uniform sheet of polyimide. Substrate lI is made of a polymer that has desirable electrical properties, a surface that metal can be deposited onto, and desirable release properties. PMDA-ODA (pyro-mellitic dianhydride oxydianaline) type polyimide without adhesion-promotion additives is the preferred polymer. This material bonds very weakly to glass and such bonds may be broken with boiling water or warm saline exposure. However, the bond between the polyimide and the glass is sufficient to withstand thin film circuit fabrication processes.
For example, the bonding of this type of polyimide to glass is sufficient to withstand typical photolithographic processes such as baking, acid etching, photoresist developing, and sputtering.
Further, the coefficient of thermal expansion of the polyimide is about the same as the coefficient of thermal expansion of the preferred glass plate 10 so that fracture and delamination problems will not adversely affect the thin film electrical component upon release of the polyimide substrate 11 from the glass carrier plate 10.
The thickness of polymer substrate 11 can be in the range of 10 to 100 um. This is controlled by the viscosity of the polyamic acid precursor solution 12 and the spin speed of the glass carrier plate 10. Thick coatings (greater than approximately 25 um) of polyimide are achieved by multiple coat-cure cycles. In another embodiment, a pre-made KAPTONO sheet is used to provide polymer substrate 11 instead of a spin-coated liquid polyamic acid 12 subjected to a two-stage heat cure process.
The metal layers are deposited and patterned as shown in Figs. 3 and 4. A flexible conductor 18 is formed on the tap surface 20 of polymer substrate 11 and includes a first adhesive metal layer 22 bonded to top surface 20, a noble metal layer 24 bonded to first adhesive metal layer 22, and a second adhesive metal layer 26 bonded to the noble metal layer 24 to trap the noble metal layer 24 between the first and second adhesive metal layers 22, 26.
The three metal layers 22, 24, and 26 are deposited successively using standard thin film vacuum deposition methods. D.C. magnetron sputtering is the preferred method because of its relatively high deposition rate and ability to form highly adhesive films. Gold is the preferred noble metal because of its high ductility, although platinum and palladium are suitable alternatives. Chromium is the preferred adhesive metal, although titanium, tungsten; and tantalum are suitable alternatives. The adhesive metal layers are about 0.01 um to 0.02 um thick and the noble metal layer is about 0.1 pm to 0.2 um thick.
It will be appreciated that it is not necessary to include a refractory metal layer at the interface between each adhesive and noble metal layer because of the selection of a polymer insulator coating having a low heat-cure temperature as described below.
To provide an electrical component on the substrate 11, the metal layers 22, 24, and 26 can be patterned using a variety of standard photolithography processes (not shown). A representative circuit pattern 27 (e.g., a resistor) is shown in Fig. 4. It will be appreciated that circuit pattern 27 could be any electrical element, integrated circuit, sensor, or other component depending upon the intended function of the thin film structure.
A suitable photolithography process generally involves the application of a photoresist or masking material by spin coating. This material is baked until dry. The material is then exposed to ultraviolet light through a mask which contains the circuitry patterns.
The photoresist is developed, leaving only selected areas masked. Exposed metal may be removed by wet chemical or dry plasma etch. The photoresist can then be stripped by solvent dip or plasma etching. In a preferred embodiment, positive photoresist, wet etching, and solvent stripping is used. Line widths and spaces as small as 5 um have been made and dimensions as small as 1 um are possible.
_1p_ An ins.:lator cover Z3 is needed to insulate the conductor 20 electrically and prevent exposure of the potentially corrosive adhesive metal to liquids. The same pdtteLnlng prOCeSS t:'1at Wds usad t0 define the electrical circuit 27 in conductor 18 is now usable to remove the top adhesive metal lay=. 20' in areas of the conductor 20 that will be uninsulated. As shown in Fig.
S, the. second adhesive metal layer 26 is formed to include a pair o' access openings 30 thenein to e~nose a portion of the underlying noble metal layer 24 to provide a lead-attachment site 32 on the nobl=_ metal layer 24. The metal in layer 20' is removed about 5-10 um beyond the intended locat_on of the insulation opening edge 34. This distance must be sufficient to ensure coverage o~ adhesive metal edge 30 but minimal so that most of the insulation layer 28 is in contact with the adhesive metal. Polyimide substrate and insulation layers 11, 28 do not adhere well to the noble metal 24 directly. It is this precise alignment step that makes the use of spun-on substrates preferable in the present invention. It is difficult to hold. free-standing films sufficiently flat to ensure alignment accuracies of S to 10 microns across a 3 inch (7.0'2 cm) to 6 inch (15.24 cm) sheet. As shown in Fig. 5, the polyimide coating defining insulator cover 28 includes a wall 31 that extends into the access opening 30 formed in the second adhesive metal layer 26 to contact the noble metal layer 22.
The insulation layer 28 is deposited and .
patterned. In one preferred embodiment, the insulation
Background and Summary of th Invention The present invention relates to thin film electrical components, and particularly, to a flexible, micro-miniature, waterproof, biocompatible, thin film circuit package that can be patterned to function as a connector, sensor, or other electrical component. More particularly, the present invention relates to improvements in handling and configuring thin film circuit packages during manufacture.
A thin film is typically a film of O.Olum to 0.5um deposited on a glass, ceramic, or semiconductor substrate to form, for example, a capacitor, resistor, coil, or other circuit component. Thin film integrated circuits consist entirely of thin films deposited in a patterned relationship on a substrate.
One aim of the present invention is to develop an improved biocompatible thin film sensor or circuit suitable for use in the human body. It has been observed that satisfactory biocompatible thin film sensors or circuits cannot generally be produced by relying exclusively on the materials and techniques used to make conventional thin film structures.
Testing and monitoring of many biological conditions in the human body or other ionic liquid environments would be enhanced by the development of a waterproof thin film biosensor of miniature size and flexible character. However, conventional thin film structures are not generally designed to be _2_ biocompatible with the human body and are made using processes which are not suitable for use with biomaterials. Also, conventional thin film structures are not flexible.
A silicon wafer typically provides the foundation, platform, or carrier plate on which a conventional thin film .structure is built. Automatic handling equipment is used to move the silicon wafer between manufacturing stations as a thin film structure is developed layer-by-layer on the silicon wafer. In this invention, the first thin film layer bonded to the silicon wafer carrier plate is used as a substrate of the thin film structure. Once the thin film structure is constructed, the silicon wafer carrier plate is released from attachment to the substrate of the thin film structure and discarded.
A thin film structure can be damaged during the release of the thin film structure from its silicon wafer carrier plate if the structure is made of any material which is incompatible with the acid etching solution or other release agent used to break the bonds coupling the substrate of the thin film structure to its silicon wafer carrier plate. It has been observed that ' many biomaterials of the type that could be used in the construction of a biologically compatible thin film structure are damaged or lose function upon exposure to conventional silicon wafer-releasing agents. The etching~solutions normally used to dissolve a silicdh wafer carrier plate are not compatible with biomaterials contained in a biocompatible thin film structure.
It has also been observed that thin film metal conductors deposited on a polymer substrate coupled to a carrier plate tend to fracture and delaminate upon release of the polymer substrate from its carrier plate foundation. It is thought that any difference in the coefficients of thermal expansion of the polymer substrate and its carrier plate foundation leads to the development of internal stresses in the polymer substrate as it is heat-cured, because its coefficient of thermal expansion is different from the carrier plate. Thin film structure fracture and delamination problems can result unless careful attention is given to the thermal expansion coefficients of the carrier plate foundation and substrate materials used to construct the 1~ thin film structure.
Conventional thin film structures are known to contain an adhesion metal film to enhance bonding of a noble metal film to its underlying polymer substrate.
Such an adhesion metal film layer is a useful bonding tool because noble metals used to form electrical circuits in thin film structures do not adhere well directly to polymer substrates. For that reason, the adhesion metal layer is situated between the polymer substrate and the noble metal film layer.
It has been observed that thin film structures _ suffer performance losses because of interdiffusion of abutting adjacent adhesion and noble metal film layers during any high-temperature processing of the thin film structure, for example, during heat-curing of a polymer precursor solution to provide a polymer insulation layer on the metal film layers. Performance losses include, for example, loss of flexibility of the thin film structure itself and development of metal film layer adhesion problems. In addition to these mechanical problems, metal interdiffusion can cause changes to occur in the electrical properties of the noble metal layer.
The common solution to the metal interdiffusion problem in the semiconductor industry is the addition of a refractory metal layer (e. g., tungsten or tantalum) between the adhesion and noble metal film layers. This extra layer acts as an interdiffusion barrier.
Processing of a thin film structure, however, is severely complicated by the deposition and patterning of such an additional refractory metal film layer.
One object of the present invention is to provide a biologically compatible thin film electrical component suitable for use in the human body or any other ionic liquid environment.
Another object of the present invention is to provide a thin film electrical component configured and patterned to function as a biosensor includable in a medical device implanted in a human body and a method of making this thin film electrical component to preserve its biosensor function capability.
Still another object of the present invention is to provide a thin film structure which can be fabricated without the occurrence of stress damage at the release of the thin film structure substrate from its carrier plate foundation.
Yet another object of the present invention is to provide a thin film structure that can be insulated without interdiffusion of metal film layers contained in the thin film structure.
According to the present invention, a thin film electrical component includes a rigid glass carrier plate, a substrate bonded to the rigid glass carrie r plate, and means for providing an electrical circuit.
The substrate comprises a polymer establishing a bond with the rigid glass carrier plate that is broken upon immersion of the substrate and the rigid glass carrier plate in either a boiling water bath or a room temperature physiologic saline bath to release the substrate from attachment to the rigid glass carrier plate. The means for providing an electrical circuit is bonded to the substrate and undisrupted during release of the substrate attachment to the rigid glass carrier plate.
One feature of the present invention is the provision of a thin film electrical component in which the polymer substrate can be released from its carrier plate without the use of any release agent or technique that could damage biomaterials contained in the substrate or means for providing an electrical circuit formed on the substrate. The selection of the proper glass for the carrier plate and the proper polymer for the substrate is critical. In particular, a polymer that develops a bond to glass that is strong enough only to withstand circuit fabrication processes but may be broken with biocompatible boiling water or biocompatible _6_ warm saline exposure is an important feature of the invention. Advantageously, the use of non-biocompatible silicon-etching release agents is avoided.
Those skilled in the art will recognize that an unmodified PMDA-ODA type polyimide is generally considered,to be inferior compared to other possible substrate materials because of its marginal adhesive strength when bonded to most carrier plate foundations.
Thus, for most thin film applications, adhesion-promoting agents are added to it so that this polyimide is modified to improve its bonding capability. Nevertheless, in the present invention, marginal adhesive strength is desirable to permit the glass carrier plate to be released from the polyimide substrate using biocompatible releasing agents and techniques. Thus, in the preferred embodiment, the polymer substrate comprises an unmodified PMDA-ODA type polyimide.
In preferred embodiments, the rigid glass carrier plate comprises a low-expansion type glass having a characteristic coefficient of thermal expansion and the polymer forming the substrate comprises a polyimide having a coefficient of thermal expansion that is substantially equivalent to the coefficient of thermal expansion of the Iow-expansion glass. Such a match in thermal expansion coefficients will cause the rigid glass carrier plate and the polymer substrate carrying the means for providing an electrical circuit to expand at about the same rate during exposure of the thin film structure to an elevated temperature.
Advantageously, separation of the means for providing an electrical circuit from the substrate is avoided during release of the polymer substrate from attachment to the rigid glass carrier plate.
Accordingly, another feature of the present invention is that the carrier plate glass and the substrate polymer are carefully selected so that their coefficients of thermal expansion are about the same.
Advantageously, thermal matching of this type reduces the likelihood that serious fracture and delamination problems will arise during release of the polymer substrate from the glass carrier plate.
Yet another feature of the present invention is the provision of a polymer insulation layer with a relatively low cure temperature. Without metal interdiffusion considerations, a logical choice for this insulation layer might be a photoimageable polyimide because the layer can be patterned without the use of additional photoresist steps. Unfortunately, currently available photoimageable polyimides require a high-cure temperature (450°C) to drive out the photosensitizers.
In the preferred embodiment, a BTDA-ODA polyimide is used, with positive photoresist, to form the patterned insulation coating. This material can be cured as low as 250°C, causing significantly less interdiffusion and resulting problems.
' In the preferred embodiment, one type of polyimide is used to provide the polymer substrate and a different type of polyimide is used to provide the polymer insulator. The selection of the "substrate"
_g_ polyimide is governed by its releasability and thermal-expansion compatibility with a glass carrier plate. For example, either a PMDA-ODA or BPDA-PPD type polyimide is suitable. On the other hand, the selection of the °'insulator" polyimide is governed by the magnitude of its cure temperature compared to the minimum temperature at which metals in the thin film electrical component begin to interdiffuse and by its adhesive strength to the underlying polymer and metal layer. For example, as noted above, a BTDA-ODA
polyimide is suitable.
Also according to the present invention, a _ method is provided of making a thin film electrical component. The method comprises the steps of providing a rigid glass carrier plate having a flat surface, coating the flat surface with a first polyamic acid precursor solution, and curing the first polyamic acid precursor solution using heat at a first temperature to provide a layer of polyimide film bonded to the flat surface. In a preferred embodiment of the present invention, the polyimide film has a coefficient of thermal expansion that is substantially equivalent to the coefficient of thermal expansion of the rigid glass carrier plate so that creation of internal stresses in the polyimide film during curing is avoided. In certain other embodiments, glass carrier plates and polyimide films having substantially different coefficients of thermal expansion can be used.
Preferably, the coating step further comprises the steps of dispensing the first polyamic acid _g_ precursor solution onto the flat surface of the rigid glass carrier plate, and spinning the rigid glass carrier plate about an axis orthogonal to the flat surface to create a smooth polyamic acid precursor solution coating of substantially uniform thickness across the flat surface. This is a conventional spin-coating process commonly used in the semiconductor industry. The rigid glass carrier plate is spun at a speed between 1,000 and 6,000 revolutions per minute during the spinning step.
The method further includes the steps of forming means for providing an electrical circuit on the polyimide film, and exposing the rigid glass carrier plate, the polyimide film, and the means for providing an electrical circuit to either a hot water bath or a body temperature physiologic saline bath for a period of time sufficient to break the bond connecting the polyimide film to the rigid glass carrier plate. The warm saline bath provides a biocompatible releasing agent which operates to cause the polyimide film to be released from the rigid glass carrier plate without separating the means for providing an electrical circuit from the polyimide film.
An electrical circu~.t is provided in the thin film electrical component by depositing a first adhesive metal layer on the polyimide film, a noble metal layer on the first adhesive metal layer, and a second adhesive metal layer on the noble metal layer to sandwich the noble metal layer between the first and second adhesive metal layers, and patterning the deposited noble metal layer and first and second adhesive metal layers to define means on the polyimide film for providing an electrical circuit. Next, a second polyamic acid precursor solution is provided on the means for providing an electrical circuit by dispensing the second polyamic acid precursor solution onto the means for providing an electrical circuit, and spinning an assembly comprising the rigid glass carrier plate, the polyimide film, the means for providing an electrical circuit about an axis orthogonal to the flat surface of the rigid glass carrier plate. The assembly is spun to create a coating of second polyamic acid precursor solution on predetermined exposed portions of the polyimide film and the means for providing an electrical circuit.
The second polyamic acid precursor solution is then cured using heat at a second temperature to provide a polyimide insulation coating on the means for providing an electrical circuit. In cases where interdiffusion between noble and adhesive metal layers is a problem, the second temperature is less than a characteristic minimum temperature at which interdiffusion of the noble metal layer and the first and second adhesive metal layers occurs so that substantial interdiffusion of the noble metal layer and the first and second adhesive metal layers is avoided during heat curing of the second polyamic acid precursor solution.
Additional objects, features, and advantages of the invention will become apparent to those skilled in the art upon consideration of the following detailed description of a preferred embodiment exemplifying the best mode of carrying out the invention as presently perceived.
Brief Description of the Drawings The detailed description particularly refers to the accompanying figures in which:
Fig. 1 is a diagrammatic sectional view of a glass carrier plate during deposition of a polymer precursor solution onto a flat surface of the glass carrier plate;
Fig. 2 is a diagrammatic elevation view of a polymer substrate on the glass carrier plate of Fig. 1;.
Fig. 3 is a diagrammatic view of a metal composite conductor consisting of three metal layers on the polymer substrate of Fig. 2;
Fig. 9 is a top plan view of the component of Fig. 3 showing configuration of the multiple-layer metal conductor to provide a circuit element;
Fig. 5 is a diagrammatic sectional view of the component of Fig. 4 showing an access opening formed in the top metal layer and an insulation coating covering portions of the metal conductor;
Fig. 6 is a top plan view of the component of Fig. 5 showing a pair of uninsulated lead-attachment sites;
Fig. 7 is a diagrammatic sectional view of the component of Figs. 5 and 6 immersed in a liquid bath to release the glass carrier plate from attachment to the polymer substrate;
Fig. 8 is a diagrammatic sectional view of a component in accordance with another embodiment of the invention; and Fig. 9 is a top plan view of the component of Fig. 8 showing a pair of uninsulated lead-attachment sites.
Detailed Description of the Drawings A process for making a thin film electrical component is illustrated in Figs. 1-7. The finished component is illustrated in Fig. 7. As shown in Fig. 1, a clean glass plate 10 is used at the beginning of the manufacturing process to provide a rigid carrier plate or foundation for the thin film electrical component. A
"photomask" blank is preferred because of its precise flatness and smoothness and thermal stability. In the preferred embodiment, the plate 10 is a low-expansion glass consisting essentially of 60% Si02, 18% R0, 150 A1203, 5% B203, 1% Na20, and 1% K20. It will be understood that RO stands for "unknown metal oxide impurities."
Square or circular glass plates may be used to provide plate 10 with outside dimensions ranging from 3 inches (7.62 cm) to 6 inches (15.24 cm) and thicknesses of from about 0.030 inches (0.076 cm) to 0.090 inches (0.228 cm). A standard "silicon wafer or photomask" size can be selected for plate 10 to accommodate automatic handling and processing equipment. Glass plate 10 can~be cleaned using a conventional cleaning solution prior to use and may be reused indefinitely.
Referring to Figs. 1 and 2, a polymer substrate 11 is formed by spin-coating liquid polyamic acid 12 onto a top flat surface 14 of the rigid quartz-glass plate 10 as the plate 10 is spun about an axis 16 that is orthogonal to the f7.at surface 14. Illustratively, the glass carrier plate 10 is spun at a speed between 1,000 and 6,000 revolutions per minute. This spin-coating technique is desirable because it results in a smooth and uniform coating.
The polyamic acid precursor solution 12 on glass plate 10 is imidized using a two-stage heat cure process to provide a polymer substrate 11 comprising a flat, uniform sheet of polyimide. Substrate lI is made of a polymer that has desirable electrical properties, a surface that metal can be deposited onto, and desirable release properties. PMDA-ODA (pyro-mellitic dianhydride oxydianaline) type polyimide without adhesion-promotion additives is the preferred polymer. This material bonds very weakly to glass and such bonds may be broken with boiling water or warm saline exposure. However, the bond between the polyimide and the glass is sufficient to withstand thin film circuit fabrication processes.
For example, the bonding of this type of polyimide to glass is sufficient to withstand typical photolithographic processes such as baking, acid etching, photoresist developing, and sputtering.
Further, the coefficient of thermal expansion of the polyimide is about the same as the coefficient of thermal expansion of the preferred glass plate 10 so that fracture and delamination problems will not adversely affect the thin film electrical component upon release of the polyimide substrate 11 from the glass carrier plate 10.
The thickness of polymer substrate 11 can be in the range of 10 to 100 um. This is controlled by the viscosity of the polyamic acid precursor solution 12 and the spin speed of the glass carrier plate 10. Thick coatings (greater than approximately 25 um) of polyimide are achieved by multiple coat-cure cycles. In another embodiment, a pre-made KAPTONO sheet is used to provide polymer substrate 11 instead of a spin-coated liquid polyamic acid 12 subjected to a two-stage heat cure process.
The metal layers are deposited and patterned as shown in Figs. 3 and 4. A flexible conductor 18 is formed on the tap surface 20 of polymer substrate 11 and includes a first adhesive metal layer 22 bonded to top surface 20, a noble metal layer 24 bonded to first adhesive metal layer 22, and a second adhesive metal layer 26 bonded to the noble metal layer 24 to trap the noble metal layer 24 between the first and second adhesive metal layers 22, 26.
The three metal layers 22, 24, and 26 are deposited successively using standard thin film vacuum deposition methods. D.C. magnetron sputtering is the preferred method because of its relatively high deposition rate and ability to form highly adhesive films. Gold is the preferred noble metal because of its high ductility, although platinum and palladium are suitable alternatives. Chromium is the preferred adhesive metal, although titanium, tungsten; and tantalum are suitable alternatives. The adhesive metal layers are about 0.01 um to 0.02 um thick and the noble metal layer is about 0.1 pm to 0.2 um thick.
It will be appreciated that it is not necessary to include a refractory metal layer at the interface between each adhesive and noble metal layer because of the selection of a polymer insulator coating having a low heat-cure temperature as described below.
To provide an electrical component on the substrate 11, the metal layers 22, 24, and 26 can be patterned using a variety of standard photolithography processes (not shown). A representative circuit pattern 27 (e.g., a resistor) is shown in Fig. 4. It will be appreciated that circuit pattern 27 could be any electrical element, integrated circuit, sensor, or other component depending upon the intended function of the thin film structure.
A suitable photolithography process generally involves the application of a photoresist or masking material by spin coating. This material is baked until dry. The material is then exposed to ultraviolet light through a mask which contains the circuitry patterns.
The photoresist is developed, leaving only selected areas masked. Exposed metal may be removed by wet chemical or dry plasma etch. The photoresist can then be stripped by solvent dip or plasma etching. In a preferred embodiment, positive photoresist, wet etching, and solvent stripping is used. Line widths and spaces as small as 5 um have been made and dimensions as small as 1 um are possible.
_1p_ An ins.:lator cover Z3 is needed to insulate the conductor 20 electrically and prevent exposure of the potentially corrosive adhesive metal to liquids. The same pdtteLnlng prOCeSS t:'1at Wds usad t0 define the electrical circuit 27 in conductor 18 is now usable to remove the top adhesive metal lay=. 20' in areas of the conductor 20 that will be uninsulated. As shown in Fig.
S, the. second adhesive metal layer 26 is formed to include a pair o' access openings 30 thenein to e~nose a portion of the underlying noble metal layer 24 to provide a lead-attachment site 32 on the nobl=_ metal layer 24. The metal in layer 20' is removed about 5-10 um beyond the intended locat_on of the insulation opening edge 34. This distance must be sufficient to ensure coverage o~ adhesive metal edge 30 but minimal so that most of the insulation layer 28 is in contact with the adhesive metal. Polyimide substrate and insulation layers 11, 28 do not adhere well to the noble metal 24 directly. It is this precise alignment step that makes the use of spun-on substrates preferable in the present invention. It is difficult to hold. free-standing films sufficiently flat to ensure alignment accuracies of S to 10 microns across a 3 inch (7.0'2 cm) to 6 inch (15.24 cm) sheet. As shown in Fig. 5, the polyimide coating defining insulator cover 28 includes a wall 31 that extends into the access opening 30 formed in the second adhesive metal layer 26 to contact the noble metal layer 22.
The insulation layer 28 is deposited and .
patterned. In one preferred embodiment, the insulation
2~36~41 layer 28 is comprised of a BTDA-ODA type polyimide which can be cured at a temperature as low as 250°C to minimize the opportunity for metal interdiffusion problems in conductor 20 to develop. Coating thicknesses of 1-25 um can be used to provide insulation layer 28. Alternatively, a P1~A-ODA type polyimide can be used to provide insulation layer 28.
Photoimageable polyimides are preferred because non-photoimageable polyimides require more processing steps.
The insulation layer 28 is fabricated by spin-coating a polyamic acid precursor solution on conductor 20 as mounted on polymer substrate 11, curing the precursor solution to form the chosen polyimide at a temperature that is less than the minimum temperature at which interdiffusion of the noble metal layer 24 and the adhesive metal layers 22, 26 occurs,, applying photoresist, etching, and stripping. Advantageously, substantial interdiffusion of the noble metal layer 24 and adhesive metal layers is avoided by curing the polyamic acid precursor solution-forming insulator cover 28 at a low temperature. It will be appreciated that the cure temperature of the polymer precursor used to form the polymer substrate 11 is not limited to this low temperature because it is heat-cured before any of the metal layers 22, 24, and 26 are deposited thereon.
It~has been discovered during work on the present invention that if gold and chromium are employed as the noble and adhesion metals, respectively, interdiffusion (which leads to sensor cracking) between ~~~~2~~.
the noble and adhesion metal layers does not occur even when a polyimide having a high cure temperature is used to provide insulation layer 28. If a gold/chromium metal combination is used, high and low temperature polyimides can be used to provide insulation layer 28.
It has been observed that a metal layer interdiffusion problem exists if any of the other noble or adhesion metals listed above are substituted for gold or chromium, e.g., platinum for gold or titanium for chromium. Accordingly, the gold/chromium combination is the best mode at present.
In another embodiment of the present invention illustrated in Figs. 8 and 9, these elements referenced by numbers identical to those in Figs. 1-7 perform the same or similar function. The primary features distinguishing this embodiment from the previous embodiment is the use of a room temperature vulcanizing polymer to form the insulation layer and the absence of an adhesive metal layer between the noble metal layer and the insulation layer.
A conformal coating is used to form insulation layer 128 as shown in Figs. 8 and 9. In a preferred embodiment, this coating is a synthetic polymer elastomer consisting essentially of a silicone resin such as dimethyl siloxane and an adhesion promoter such as methoxy silane. A suitable coating material is MS-460T" resin available from Miller-Stephenson Chemical Company, Inc. of Danbury, Connecticut. This resin is available in solution for spin-on application or aerosol for spray-on application. Use of the spray-on technique is preferred because it is more amenable to mass production.
The silicone resin used to provide insulation layer 128 is a one-part system that cures in place at room temperature. It is an alternative to heat-cure polymers of the type curable only at the high temperatures that can cause metal interdiffusion problems. As noted above, there are some thin film applications where the metal conductors cannot be ZO exposed to the high temperatures required to cure the polymer insulation layer film.
Another advantage of conformal coating materials, particularly silicone resins, is that they axe more hydrophobic than other materials such as polyimides. The hydrophobic nature of conformal coatings, particularly the silicones, results in a lower amount of moisture pickup. Also, the preferred conformal coating adheres well to gold, which eliminates the need for a layer of adhesive metal between the noble metal layer 24 and the insulation layer 128. This decreases the number of processing steps required for fabrication of the thin film electrical component and, in turn, decreases the cost of producing the component.
Access openings 134 are easily formed in the insulation layer 128 after it cures. These openings can be created, for example, using either a dry plasma etch or by masking these areas prior to application of the conformal coating to the noble metal layer 24. The conformal coating 128 is a flexible material well-suited for use in a thin film electrical component that must be able to be flexed in use.
The final step is to release the polymer substrate 11 from the rigid glass carrier plate 10 as shown in Fig. 7. Two methods are suitable: 3 hour immersion in a 100°C water bath or 24-hour immersion in a 37°C physiologic saline bath. These times and temperatures may be varied slightly while still achieving the ,same result. The boiling water method is the most expeditious process for production. The body temperature saline process is useful where temperature sensitive materials such as enzymes, antibodies, or other biomaterials have been attached to the circuitry.
An additional step can be added before the _ substrate 11 is released from glass carrier plate 10.
The outline of the thin film electrical component may be cut out with high accuracy using an excimer laser. The ultraviolet wavelength of this laser cuts polyimide rapidly but does not damage glass used to provide the carrier plate 10. In addition, this cutting mechanism generates no mechanical or thermal disruption which could damage biomaterials.
Very thin, flexible substrates are required for biosensors. A biosensor must be small enough to fit into a hypodermic needle or a venous or arterial catheter and withstand some flexing. This type of substrate is not easily handled or held flat, two necessities for cost-effective photolithographic production., Biosensor substrates must also be free of contaminants and be biocompatible. All of these requirements are met by a thin film electrical component in accordance with the present invention. High purity -2i-liquid polymer precursors ara available and relatively inert biologically when cured. GI35S plates are available with very good flatness and can be loaded into =rarious cassette mechanisms =er automatic handling and traps=ers. Also, d means is provided ror releasing the then fLlm StrllCt~~r° withOUt damage t0 010mdterldlS.
- Fle:sibility is a main advantage of the circuitry used to construct the thin film electrical component of the present invention. Curved and three-dimensional thin film structures can be built as a result of the Llexible cha_-dcter of the conductor 1g.
The flexibility of the thin _ilm electrical component ma;~es it easily adaptable to provide a sensor compliable with d surface to be measured cr d connector. By contrast, typical thin film or semiconductor substrates such as silicon, alumind, and silicon dioxide are very brittle in such thin sections.
The small conductor and insulator feature size results in very small overall device size. This is particularly advantageous for portable or implanted devices. It is also useful for high-density connectors such as those that interface directly with integrated circuitry. There is at Least a ten-fold reduction in size compared to standard flex circuitry.
The waterproof nature of this circuit gives it the advantage of being able to operate in many adverse environments not suitable for traditional circuitry.
These include: fresh water, salt water, physiologic saline (body fluid), boiling water, and steam. This_ opens many medical, industrial, and marine applications.
~~~~~4i Polyimide is relative inexpensive compared to silicon and other typical microcircuit foundation materials. This means that one can afford to make the connecting leads on the same substrate as the active circuitry, thereby eliminating wire bonds and connectors. Polyimide has been shown to be biologically inert. Liquid polyamic acid is available in higher purity levels than sheet polyimide.
Many electrical components can be made simply by patterning the metal and insulation layers 22, 24, 26, and 28. These include resistors, capacitors, connectors, antennae. contact pads, electrodes, heaters, inductors, fuses, and thermistors.
In addition, piezoelectric, photoresistive, or magnetic films may be applied yielding sensing elements for force, light, and magnetic fields. The noble metal surface 24 can be electroplated to form electrochemically useful detection electrodes (i.e., platinum, silver/silver-chloride). Active devices (optoelectronic components, transistors. integrated circuits) may be attached to the circuit to achieve amplification, regulation, or other functions.
An area of wide application is implanted medical devices. These could be electrochemical sensors, electrodes, or other physical sensors for strain, temperature, or fluid conductivity. Stimulating electrodes for the cochlea, heart, brain, or spinal column could also be made. The geometries allow such devices to be built to fit inside small size catheters and hypodermic needles.
~03624~
Although the invention has been described in detail with reference to certain preferred embodiments, variations. and modifications exist within the scope and spirit of the invention as described and defined in the following claims.
Photoimageable polyimides are preferred because non-photoimageable polyimides require more processing steps.
The insulation layer 28 is fabricated by spin-coating a polyamic acid precursor solution on conductor 20 as mounted on polymer substrate 11, curing the precursor solution to form the chosen polyimide at a temperature that is less than the minimum temperature at which interdiffusion of the noble metal layer 24 and the adhesive metal layers 22, 26 occurs,, applying photoresist, etching, and stripping. Advantageously, substantial interdiffusion of the noble metal layer 24 and adhesive metal layers is avoided by curing the polyamic acid precursor solution-forming insulator cover 28 at a low temperature. It will be appreciated that the cure temperature of the polymer precursor used to form the polymer substrate 11 is not limited to this low temperature because it is heat-cured before any of the metal layers 22, 24, and 26 are deposited thereon.
It~has been discovered during work on the present invention that if gold and chromium are employed as the noble and adhesion metals, respectively, interdiffusion (which leads to sensor cracking) between ~~~~2~~.
the noble and adhesion metal layers does not occur even when a polyimide having a high cure temperature is used to provide insulation layer 28. If a gold/chromium metal combination is used, high and low temperature polyimides can be used to provide insulation layer 28.
It has been observed that a metal layer interdiffusion problem exists if any of the other noble or adhesion metals listed above are substituted for gold or chromium, e.g., platinum for gold or titanium for chromium. Accordingly, the gold/chromium combination is the best mode at present.
In another embodiment of the present invention illustrated in Figs. 8 and 9, these elements referenced by numbers identical to those in Figs. 1-7 perform the same or similar function. The primary features distinguishing this embodiment from the previous embodiment is the use of a room temperature vulcanizing polymer to form the insulation layer and the absence of an adhesive metal layer between the noble metal layer and the insulation layer.
A conformal coating is used to form insulation layer 128 as shown in Figs. 8 and 9. In a preferred embodiment, this coating is a synthetic polymer elastomer consisting essentially of a silicone resin such as dimethyl siloxane and an adhesion promoter such as methoxy silane. A suitable coating material is MS-460T" resin available from Miller-Stephenson Chemical Company, Inc. of Danbury, Connecticut. This resin is available in solution for spin-on application or aerosol for spray-on application. Use of the spray-on technique is preferred because it is more amenable to mass production.
The silicone resin used to provide insulation layer 128 is a one-part system that cures in place at room temperature. It is an alternative to heat-cure polymers of the type curable only at the high temperatures that can cause metal interdiffusion problems. As noted above, there are some thin film applications where the metal conductors cannot be ZO exposed to the high temperatures required to cure the polymer insulation layer film.
Another advantage of conformal coating materials, particularly silicone resins, is that they axe more hydrophobic than other materials such as polyimides. The hydrophobic nature of conformal coatings, particularly the silicones, results in a lower amount of moisture pickup. Also, the preferred conformal coating adheres well to gold, which eliminates the need for a layer of adhesive metal between the noble metal layer 24 and the insulation layer 128. This decreases the number of processing steps required for fabrication of the thin film electrical component and, in turn, decreases the cost of producing the component.
Access openings 134 are easily formed in the insulation layer 128 after it cures. These openings can be created, for example, using either a dry plasma etch or by masking these areas prior to application of the conformal coating to the noble metal layer 24. The conformal coating 128 is a flexible material well-suited for use in a thin film electrical component that must be able to be flexed in use.
The final step is to release the polymer substrate 11 from the rigid glass carrier plate 10 as shown in Fig. 7. Two methods are suitable: 3 hour immersion in a 100°C water bath or 24-hour immersion in a 37°C physiologic saline bath. These times and temperatures may be varied slightly while still achieving the ,same result. The boiling water method is the most expeditious process for production. The body temperature saline process is useful where temperature sensitive materials such as enzymes, antibodies, or other biomaterials have been attached to the circuitry.
An additional step can be added before the _ substrate 11 is released from glass carrier plate 10.
The outline of the thin film electrical component may be cut out with high accuracy using an excimer laser. The ultraviolet wavelength of this laser cuts polyimide rapidly but does not damage glass used to provide the carrier plate 10. In addition, this cutting mechanism generates no mechanical or thermal disruption which could damage biomaterials.
Very thin, flexible substrates are required for biosensors. A biosensor must be small enough to fit into a hypodermic needle or a venous or arterial catheter and withstand some flexing. This type of substrate is not easily handled or held flat, two necessities for cost-effective photolithographic production., Biosensor substrates must also be free of contaminants and be biocompatible. All of these requirements are met by a thin film electrical component in accordance with the present invention. High purity -2i-liquid polymer precursors ara available and relatively inert biologically when cured. GI35S plates are available with very good flatness and can be loaded into =rarious cassette mechanisms =er automatic handling and traps=ers. Also, d means is provided ror releasing the then fLlm StrllCt~~r° withOUt damage t0 010mdterldlS.
- Fle:sibility is a main advantage of the circuitry used to construct the thin film electrical component of the present invention. Curved and three-dimensional thin film structures can be built as a result of the Llexible cha_-dcter of the conductor 1g.
The flexibility of the thin _ilm electrical component ma;~es it easily adaptable to provide a sensor compliable with d surface to be measured cr d connector. By contrast, typical thin film or semiconductor substrates such as silicon, alumind, and silicon dioxide are very brittle in such thin sections.
The small conductor and insulator feature size results in very small overall device size. This is particularly advantageous for portable or implanted devices. It is also useful for high-density connectors such as those that interface directly with integrated circuitry. There is at Least a ten-fold reduction in size compared to standard flex circuitry.
The waterproof nature of this circuit gives it the advantage of being able to operate in many adverse environments not suitable for traditional circuitry.
These include: fresh water, salt water, physiologic saline (body fluid), boiling water, and steam. This_ opens many medical, industrial, and marine applications.
~~~~~4i Polyimide is relative inexpensive compared to silicon and other typical microcircuit foundation materials. This means that one can afford to make the connecting leads on the same substrate as the active circuitry, thereby eliminating wire bonds and connectors. Polyimide has been shown to be biologically inert. Liquid polyamic acid is available in higher purity levels than sheet polyimide.
Many electrical components can be made simply by patterning the metal and insulation layers 22, 24, 26, and 28. These include resistors, capacitors, connectors, antennae. contact pads, electrodes, heaters, inductors, fuses, and thermistors.
In addition, piezoelectric, photoresistive, or magnetic films may be applied yielding sensing elements for force, light, and magnetic fields. The noble metal surface 24 can be electroplated to form electrochemically useful detection electrodes (i.e., platinum, silver/silver-chloride). Active devices (optoelectronic components, transistors. integrated circuits) may be attached to the circuit to achieve amplification, regulation, or other functions.
An area of wide application is implanted medical devices. These could be electrochemical sensors, electrodes, or other physical sensors for strain, temperature, or fluid conductivity. Stimulating electrodes for the cochlea, heart, brain, or spinal column could also be made. The geometries allow such devices to be built to fit inside small size catheters and hypodermic needles.
~03624~
Although the invention has been described in detail with reference to certain preferred embodiments, variations. and modifications exist within the scope and spirit of the invention as described and defined in the following claims.
Claims (8)
1. A thin film electrical component comprising a rigid glass carrier plate, a substrate bonded to the rigid glass carrier plate, the substrate comprising a polymer establishing a bond with the rigid glass carrier plate that is broken upon immersion of the substrate and the rigid glass carrier plate in one of a hot water bath and a warm temperature physiologic saline bath to release the polymer from attachment to the rigid glass carrier plate, and means for providing an electrical circuit, the providing means being bonded to the substrate and undisrupted during release of the substrate from attachment to the rigid glass carrier plate.
2. The compound of claim 1, wherein the means for providing an electrical circuit comprises an adhesive metal layer bonded to the substrate and a noble metal layer bonded to the adhesive metal layer, and further comprising insulating means on the substrate for providing an insulating cover on the means for providing an electrical circuit, the insulating means comprising a polyamic acid precursor solution cured at a heat-cure temperature to provide a polyimide coating, the polyamic acid precursor solution having a heat-cure temperature that is less than a characteristic minimum temperature at which interdiffusion of the noble metal layer and the adhesive metal layer occurs so that substantial interduffusion of the noble metal layer and the adhesive metal layer is avoided during heat curing of the polyamic acid precursor solution.
3. The component of claim 2, wherein the means for providing an electrical circuit further comprises another adhesive metal layer bonded to the noble metal layer to lie between the noble metal layer and the insulating means.
4. A thin film electrical component comprising a polymer substrate, a first adhesive metal layer bonded to the polymer substrate, a noble metal layer bonded to the first adhesive metal layer, a second adhesive metal layer bonded to the noble metal layer, the noble metal layer being sandwiched between the first and second adhesive metal layers, a polymer insulator bonded at least to the first and second adhesive metal layers to cover all exposed surfaces of the first and second adhesive metal layers unbonded to one of the polymer substrate and the noble metal layer, and a rigid glass carrier plate, the polymer substrate being bonded to the rigid glass carrier plate to facilitate handling of the polymer substrate by automatic equipment.
5. The component of any one of claims 2 to 4 wherein the adhesive metal layer or layers is a material selected from the group consisting essentially of titanium and chromium and the noble metal layer is a material selected from the group consisting essentially of gold, platinum and palladium.
6. The component of any one of Claims 1 to 5, wherein the polymer substrate is a PMDA-ODA type polyimide or a BPDA-PPD type polyimide.
7. A method of making a thin film electrical component, the method comprising the steps of providing a rigid glass carrier plate having a flat surface, coating the flat surface with a first polyamic acid precursor solution, and curing the first polyamic acid precursor solution using heat to provide a layer of polyimide film bonded to the flat surface, the polyimide film having a coefficient of thermal expansion that is substantially equivalent to the coefficient of thermal expansion of the rigid glass carrier plate so that creation of internal stresses in the polyimide film during curing is avoided.
8. The method of Claim 7, further comprising the steps of forming means for providing an electrical circuit on the polyimide film, and exposing the rigid glass carrier plate, the polyimide film, and the means for providing an electrical circuit to one of the hot water bath and a room temperature of physiologic saline bath for a period of time sufficient to break the bond connecting the polyimide film to the rigid glass carrier plate so that the polyimide film is released from the rigid glass carrier plate without separating the means for providing an electrical circuit from the polymide film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/479,897 US5108819A (en) | 1990-02-14 | 1990-02-14 | Thin film electrical component |
| US479,897 | 1990-02-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2036241A1 CA2036241A1 (en) | 1991-08-15 |
| CA2036241C true CA2036241C (en) | 2002-06-04 |
Family
ID=23905890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002036241A Expired - Fee Related CA2036241C (en) | 1990-02-14 | 1991-02-13 | Thin film electrical component |
Country Status (26)
| Country | Link |
|---|---|
| US (2) | US5108819A (en) |
| EP (1) | EP0442674B1 (en) |
| JP (1) | JP3135930B2 (en) |
| KR (1) | KR910016048A (en) |
| CN (2) | CN1033672C (en) |
| AR (1) | AR244911A1 (en) |
| AT (1) | ATE136160T1 (en) |
| AU (1) | AU631297B2 (en) |
| CA (1) | CA2036241C (en) |
| DE (1) | DE69118226T2 (en) |
| DK (1) | DK0442674T3 (en) |
| ES (1) | ES2084766T3 (en) |
| FI (1) | FI910713A (en) |
| GR (1) | GR3019621T3 (en) |
| HU (1) | HUT60066A (en) |
| IE (1) | IE72189B1 (en) |
| IL (1) | IL97182A (en) |
| MX (1) | MX170859B (en) |
| NO (1) | NO910578L (en) |
| NZ (1) | NZ237055A (en) |
| PH (1) | PH27510A (en) |
| PT (1) | PT96724B (en) |
| RU (1) | RU2049365C1 (en) |
| TW (1) | TW222245B (en) |
| YU (1) | YU47389B (en) |
| ZA (1) | ZA91922B (en) |
Families Citing this family (387)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5270090A (en) * | 1987-04-03 | 1993-12-14 | Daikin Industries Ltd. | Semiconductor device coated with a fluorena-containing polyiimide and a process of preparing |
| US5593852A (en) | 1993-12-02 | 1997-01-14 | Heller; Adam | Subcutaneous glucose electrode |
| US5231751A (en) * | 1991-10-29 | 1993-08-03 | International Business Machines Corporation | Process for thin film interconnect |
| DE4204459A1 (en) * | 1992-02-14 | 1993-08-19 | Siemens Nixdorf Inf Syst | Micropack integrated circuit with peripheral testing pads - has separation slits in surface of film carrier on all four sides of IC chip facilitating torsion-free separation |
| US5956501A (en) * | 1997-01-10 | 1999-09-21 | Health Hero Network, Inc. | Disease simulation system and method |
| US5437999A (en) * | 1994-02-22 | 1995-08-01 | Boehringer Mannheim Corporation | Electrochemical sensor |
| US5390671A (en) * | 1994-03-15 | 1995-02-21 | Minimed Inc. | Transcutaneous sensor insertion set |
| US5391250A (en) * | 1994-03-15 | 1995-02-21 | Minimed Inc. | Method of fabricating thin film sensors |
| US5575955A (en) * | 1994-07-22 | 1996-11-19 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Electrically conductive polyimide film containing gold (III) ions, composition, and process of making |
| GB9416002D0 (en) * | 1994-08-08 | 1994-09-28 | Univ Cranfield | Fluid transport device |
| US5632432A (en) * | 1994-12-19 | 1997-05-27 | Ethicon Endo-Surgery, Inc. | Surgical instrument |
| US5568806A (en) * | 1995-02-16 | 1996-10-29 | Minimed Inc. | Transcutaneous sensor insertion set |
| US5586553A (en) * | 1995-02-16 | 1996-12-24 | Minimed Inc. | Transcutaneous sensor insertion set |
| US5786439A (en) | 1996-10-24 | 1998-07-28 | Minimed Inc. | Hydrophilic, swellable coatings for biosensors |
| US5882494A (en) * | 1995-03-27 | 1999-03-16 | Minimed, Inc. | Polyurethane/polyurea compositions containing silicone for biosensor membranes |
| US6329139B1 (en) | 1995-04-25 | 2001-12-11 | Discovery Partners International | Automated sorting system for matrices with memory |
| US5752644A (en) * | 1995-07-11 | 1998-05-19 | United States Surgical Corporation | Disposable loading unit for surgical stapler |
| US6136274A (en) * | 1996-10-07 | 2000-10-24 | Irori | Matrices with memories in automated drug discovery and units therefor |
| US5871842A (en) * | 1996-10-28 | 1999-02-16 | Thomas & Betts International, Inc. | Grafted thermoplastic elastomer barrier layer |
| US5821129A (en) * | 1997-02-12 | 1998-10-13 | Grimes; Craig A. | Magnetochemical sensor and method for remote interrogation |
| US6001067A (en) | 1997-03-04 | 1999-12-14 | Shults; Mark C. | Device and method for determining analyte levels |
| US7899511B2 (en) | 2004-07-13 | 2011-03-01 | Dexcom, Inc. | Low oxygen in vivo analyte sensor |
| US9155496B2 (en) | 1997-03-04 | 2015-10-13 | Dexcom, Inc. | Low oxygen in vivo analyte sensor |
| US8527026B2 (en) | 1997-03-04 | 2013-09-03 | Dexcom, Inc. | Device and method for determining analyte levels |
| US7192450B2 (en) | 2003-05-21 | 2007-03-20 | Dexcom, Inc. | Porous membranes for use with implantable devices |
| US7657297B2 (en) * | 2004-05-03 | 2010-02-02 | Dexcom, Inc. | Implantable analyte sensor |
| US6862465B2 (en) | 1997-03-04 | 2005-03-01 | Dexcom, Inc. | Device and method for determining analyte levels |
| AU6953698A (en) | 1997-04-11 | 1998-11-11 | Alza Corporation | Minimally invasive detecting device |
| US7220550B2 (en) * | 1997-05-14 | 2007-05-22 | Keensense, Inc. | Molecular wire injection sensors |
| US6060327A (en) * | 1997-05-14 | 2000-05-09 | Keensense, Inc. | Molecular wire injection sensors |
| US6699667B2 (en) | 1997-05-14 | 2004-03-02 | Keensense, Inc. | Molecular wire injection sensors |
| US6274293B1 (en) * | 1997-05-30 | 2001-08-14 | Iowa State University Research Foundation | Method of manufacturing flexible metallic photonic band gap structures, and structures resulting therefrom |
| US5888577A (en) * | 1997-06-30 | 1999-03-30 | Procath Corporation | Method for forming an electrophysiology catheter |
| US6259937B1 (en) * | 1997-09-12 | 2001-07-10 | Alfred E. Mann Foundation | Implantable substrate sensor |
| WO1999029364A1 (en) * | 1997-12-11 | 1999-06-17 | Alza Corporation | Device for enhancing transdermal agent flux |
| US6134461A (en) | 1998-03-04 | 2000-10-17 | E. Heller & Company | Electrochemical analyte |
| US6091975A (en) * | 1998-04-01 | 2000-07-18 | Alza Corporation | Minimally invasive detecting device |
| NL1008929C2 (en) | 1998-04-20 | 1999-10-21 | Vhp Ugchelen Bv | Substrate made of paper provided with an integrated circuit. |
| US8346337B2 (en) | 1998-04-30 | 2013-01-01 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
| US8480580B2 (en) | 1998-04-30 | 2013-07-09 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
| US8465425B2 (en) | 1998-04-30 | 2013-06-18 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
| US6175752B1 (en) | 1998-04-30 | 2001-01-16 | Therasense, Inc. | Analyte monitoring device and methods of use |
| US8688188B2 (en) | 1998-04-30 | 2014-04-01 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
| US9066695B2 (en) | 1998-04-30 | 2015-06-30 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
| US6949816B2 (en) | 2003-04-21 | 2005-09-27 | Motorola, Inc. | Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same |
| US8974386B2 (en) | 1998-04-30 | 2015-03-10 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
| US6146558A (en) * | 1998-05-01 | 2000-11-14 | General Electric Company | Structure and method for molding optical disks |
| US6444487B1 (en) * | 1998-07-28 | 2002-09-03 | Rosemount Aerospace Inc. | Flexible silicon strain gage |
| WO2000019887A1 (en) * | 1998-10-08 | 2000-04-13 | Minimed Inc. | Telemetered characteristic monitor system |
| US20060202859A1 (en) * | 1998-10-08 | 2006-09-14 | Mastrototaro John J | Telemetered characteristic monitor system and method of using the same |
| US7766873B2 (en) | 1998-10-29 | 2010-08-03 | Medtronic Minimed, Inc. | Method and apparatus for detecting occlusions in an ambulatory infusion pump |
| US7621893B2 (en) | 1998-10-29 | 2009-11-24 | Medtronic Minimed, Inc. | Methods and apparatuses for detecting occlusions in an ambulatory infusion pump |
| US6424847B1 (en) | 1999-02-25 | 2002-07-23 | Medtronic Minimed, Inc. | Glucose monitor calibration methods |
| US6942695B1 (en) * | 1999-04-05 | 2005-09-13 | Wessley-Jessen Corporation | Biomedical devices with polyimide coating |
| US7806886B2 (en) | 1999-06-03 | 2010-10-05 | Medtronic Minimed, Inc. | Apparatus and method for controlling insulin infusion with state variable feedback |
| US7003336B2 (en) | 2000-02-10 | 2006-02-21 | Medtronic Minimed, Inc. | Analyte sensor method of making the same |
| US6484045B1 (en) | 2000-02-10 | 2002-11-19 | Medtronic Minimed, Inc. | Analyte sensor and method of making the same |
| US20030060765A1 (en) * | 2000-02-16 | 2003-03-27 | Arthur Campbell | Infusion device menu structure and method of using the same |
| US7890295B2 (en) * | 2000-02-23 | 2011-02-15 | Medtronic Minimed, Inc. | Real time self-adjusting calibration algorithm |
| AU6114501A (en) * | 2000-05-03 | 2001-11-12 | Jen Gau Jr | Biological identification system with integrated sensor chip |
| US6340421B1 (en) * | 2000-05-16 | 2002-01-22 | Minimed Inc. | Microelectrogravimetric method for plating a biosensor |
| JP3839224B2 (en) | 2000-06-29 | 2006-11-01 | 株式会社山武 | Integrated sensor element and measurement system using the same |
| US6560471B1 (en) | 2001-01-02 | 2003-05-06 | Therasense, Inc. | Analyte monitoring device and methods of use |
| US6549796B2 (en) | 2001-05-25 | 2003-04-15 | Lifescan, Inc. | Monitoring analyte concentration using minimally invasive devices |
| US20030208113A1 (en) * | 2001-07-18 | 2003-11-06 | Mault James R | Closed loop glycemic index system |
| US6702857B2 (en) | 2001-07-27 | 2004-03-09 | Dexcom, Inc. | Membrane for use with implantable devices |
| US20030032874A1 (en) | 2001-07-27 | 2003-02-13 | Dexcom, Inc. | Sensor head for use with implantable devices |
| US6827702B2 (en) * | 2001-09-07 | 2004-12-07 | Medtronic Minimed, Inc. | Safety limits for closed-loop infusion pump control |
| DE10147954B4 (en) * | 2001-09-28 | 2007-04-19 | Infineon Technologies Ag | CARL for Bioelectronics: Substrate connection via conductive layer |
| JP3948930B2 (en) * | 2001-10-31 | 2007-07-25 | 大日本スクリーン製造株式会社 | Thin film forming apparatus and thin film forming method |
| US9282925B2 (en) | 2002-02-12 | 2016-03-15 | Dexcom, Inc. | Systems and methods for replacing signal artifacts in a glucose sensor data stream |
| US9247901B2 (en) | 2003-08-22 | 2016-02-02 | Dexcom, Inc. | Systems and methods for replacing signal artifacts in a glucose sensor data stream |
| US8010174B2 (en) | 2003-08-22 | 2011-08-30 | Dexcom, Inc. | Systems and methods for replacing signal artifacts in a glucose sensor data stream |
| US7828728B2 (en) | 2003-07-25 | 2010-11-09 | Dexcom, Inc. | Analyte sensor |
| US8260393B2 (en) | 2003-07-25 | 2012-09-04 | Dexcom, Inc. | Systems and methods for replacing signal data artifacts in a glucose sensor data stream |
| US20070227907A1 (en) * | 2006-04-04 | 2007-10-04 | Rajiv Shah | Methods and materials for controlling the electrochemistry of analyte sensors |
| US9492111B2 (en) * | 2002-04-22 | 2016-11-15 | Medtronic Minimed, Inc. | Methods and materials for stabilizing analyte sensors |
| US7153265B2 (en) * | 2002-04-22 | 2006-12-26 | Medtronic Minimed, Inc. | Anti-inflammatory biosensor for reduced biofouling and enhanced sensor performance |
| US7813780B2 (en) | 2005-12-13 | 2010-10-12 | Medtronic Minimed, Inc. | Biosensors and methods for making and using them |
| JP4342771B2 (en) * | 2002-05-15 | 2009-10-14 | リンテック株式会社 | IC tag |
| US7278983B2 (en) * | 2002-07-24 | 2007-10-09 | Medtronic Minimed, Inc. | Physiological monitoring device for controlling a medication infusion device |
| US8512276B2 (en) * | 2002-07-24 | 2013-08-20 | Medtronic Minimed, Inc. | System for providing blood glucose measurements to an infusion device |
| US20040068230A1 (en) * | 2002-07-24 | 2004-04-08 | Medtronic Minimed, Inc. | System for providing blood glucose measurements to an infusion device |
| US8003513B2 (en) * | 2002-09-27 | 2011-08-23 | Medtronic Minimed, Inc. | Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures |
| US20040061232A1 (en) * | 2002-09-27 | 2004-04-01 | Medtronic Minimed, Inc. | Multilayer substrate |
| US6770729B2 (en) * | 2002-09-30 | 2004-08-03 | Medtronic Minimed, Inc. | Polymer compositions containing bioactive agents and methods for their use |
| US20050272989A1 (en) * | 2004-06-04 | 2005-12-08 | Medtronic Minimed, Inc. | Analyte sensors and methods for making and using them |
| US9237865B2 (en) * | 2002-10-18 | 2016-01-19 | Medtronic Minimed, Inc. | Analyte sensors and methods for making and using them |
| US20040074785A1 (en) * | 2002-10-18 | 2004-04-22 | Holker James D. | Analyte sensors and methods for making them |
| US6878643B2 (en) * | 2002-12-18 | 2005-04-12 | The Regents Of The University Of California | Electronic unit integrated into a flexible polymer body |
| US20040122353A1 (en) * | 2002-12-19 | 2004-06-24 | Medtronic Minimed, Inc. | Relay device for transferring information between a sensor system and a fluid delivery system |
| WO2004088728A2 (en) * | 2003-04-02 | 2004-10-14 | Koninklijke Philips Electronics N.V. | Method of manufacturing a flexible electronic device and flexible device |
| US7134999B2 (en) | 2003-04-04 | 2006-11-14 | Dexcom, Inc. | Optimized sensor geometry for an implantable glucose sensor |
| AU2004247026B2 (en) * | 2003-05-16 | 2009-09-24 | Acorda Therapeutics, Inc. | Proteoglycan degrading mutants for treatment of CNS |
| US8282549B2 (en) | 2003-12-09 | 2012-10-09 | Dexcom, Inc. | Signal processing for continuous analyte sensor |
| JP4708342B2 (en) | 2003-07-25 | 2011-06-22 | デックスコム・インコーポレーテッド | Oxygen augmentation membrane system for use in implantable devices |
| US8423113B2 (en) | 2003-07-25 | 2013-04-16 | Dexcom, Inc. | Systems and methods for processing sensor data |
| US7774145B2 (en) | 2003-08-01 | 2010-08-10 | Dexcom, Inc. | Transcutaneous analyte sensor |
| US7925321B2 (en) | 2003-08-01 | 2011-04-12 | Dexcom, Inc. | System and methods for processing analyte sensor data |
| US8060173B2 (en) | 2003-08-01 | 2011-11-15 | Dexcom, Inc. | System and methods for processing analyte sensor data |
| US8761856B2 (en) | 2003-08-01 | 2014-06-24 | Dexcom, Inc. | System and methods for processing analyte sensor data |
| US8886273B2 (en) | 2003-08-01 | 2014-11-11 | Dexcom, Inc. | Analyte sensor |
| US7591801B2 (en) | 2004-02-26 | 2009-09-22 | Dexcom, Inc. | Integrated delivery device for continuous glucose sensor |
| US20190357827A1 (en) | 2003-08-01 | 2019-11-28 | Dexcom, Inc. | Analyte sensor |
| US8369919B2 (en) | 2003-08-01 | 2013-02-05 | Dexcom, Inc. | Systems and methods for processing sensor data |
| US8676287B2 (en) | 2003-08-01 | 2014-03-18 | Dexcom, Inc. | System and methods for processing analyte sensor data |
| US20140121989A1 (en) | 2003-08-22 | 2014-05-01 | Dexcom, Inc. | Systems and methods for processing analyte sensor data |
| US8233959B2 (en) | 2003-08-22 | 2012-07-31 | Dexcom, Inc. | Systems and methods for processing analyte sensor data |
| US7920906B2 (en) | 2005-03-10 | 2011-04-05 | Dexcom, Inc. | System and methods for processing analyte sensor data for sensor calibration |
| US20050090607A1 (en) * | 2003-10-28 | 2005-04-28 | Dexcom, Inc. | Silicone composition for biocompatible membrane |
| US9247900B2 (en) | 2004-07-13 | 2016-02-02 | Dexcom, Inc. | Analyte sensor |
| WO2005051170A2 (en) | 2003-11-19 | 2005-06-09 | Dexcom, Inc. | Integrated receiver for continuous analyte sensor |
| US8364231B2 (en) | 2006-10-04 | 2013-01-29 | Dexcom, Inc. | Analyte sensor |
| US8532730B2 (en) | 2006-10-04 | 2013-09-10 | Dexcom, Inc. | Analyte sensor |
| DE602004029092D1 (en) | 2003-12-05 | 2010-10-21 | Dexcom Inc | CALIBRATION METHODS FOR A CONTINUOUSLY WORKING ANALYTIC SENSOR |
| US8423114B2 (en) | 2006-10-04 | 2013-04-16 | Dexcom, Inc. | Dual electrode system for a continuous analyte sensor |
| US8287453B2 (en) | 2003-12-05 | 2012-10-16 | Dexcom, Inc. | Analyte sensor |
| US11633133B2 (en) | 2003-12-05 | 2023-04-25 | Dexcom, Inc. | Dual electrode system for a continuous analyte sensor |
| US7130234B2 (en) * | 2003-12-12 | 2006-10-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US7768405B2 (en) * | 2003-12-12 | 2010-08-03 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device and manufacturing method thereof |
| US7405665B2 (en) * | 2003-12-19 | 2008-07-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, RFID tag and label-like object |
| US7508305B2 (en) * | 2003-12-26 | 2009-03-24 | Semiconductor Energy Laboratory Co., Ltd. | Packing material, tag, certificate, paper money, and securities |
| EP1713926B1 (en) | 2004-02-06 | 2012-08-01 | Bayer HealthCare, LLC | Oxidizable species as an internal reference for biosensors and method of use |
| US7364592B2 (en) * | 2004-02-12 | 2008-04-29 | Dexcom, Inc. | Biointerface membrane with macro-and micro-architecture |
| US20050187525A1 (en) * | 2004-02-19 | 2005-08-25 | Hilgers Michael E. | Devices and methods for extracting bodily fluid |
| US8808228B2 (en) | 2004-02-26 | 2014-08-19 | Dexcom, Inc. | Integrated medicament delivery device for use with continuous analyte sensor |
| US8277713B2 (en) * | 2004-05-03 | 2012-10-02 | Dexcom, Inc. | Implantable analyte sensor |
| US20050245799A1 (en) * | 2004-05-03 | 2005-11-03 | Dexcom, Inc. | Implantable analyte sensor |
| US8792955B2 (en) | 2004-05-03 | 2014-07-29 | Dexcom, Inc. | Transcutaneous analyte sensor |
| EP2650906A3 (en) | 2004-06-04 | 2015-02-18 | The Board of Trustees of the University of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
| US20070100222A1 (en) * | 2004-06-14 | 2007-05-03 | Metronic Minimed, Inc. | Analyte sensing apparatus for hospital use |
| GB0414487D0 (en) * | 2004-06-29 | 2004-07-28 | Xaar Technology Ltd | Manufacture of electronic devices |
| US7783333B2 (en) | 2004-07-13 | 2010-08-24 | Dexcom, Inc. | Transcutaneous medical device with variable stiffness |
| US20060016700A1 (en) | 2004-07-13 | 2006-01-26 | Dexcom, Inc. | Transcutaneous analyte sensor |
| US7946984B2 (en) | 2004-07-13 | 2011-05-24 | Dexcom, Inc. | Transcutaneous analyte sensor |
| WO2006127694A2 (en) | 2004-07-13 | 2006-11-30 | Dexcom, Inc. | Analyte sensor |
| US8886272B2 (en) | 2004-07-13 | 2014-11-11 | Dexcom, Inc. | Analyte sensor |
| US8452368B2 (en) | 2004-07-13 | 2013-05-28 | Dexcom, Inc. | Transcutaneous analyte sensor |
| US8565848B2 (en) * | 2004-07-13 | 2013-10-22 | Dexcom, Inc. | Transcutaneous analyte sensor |
| US7344500B2 (en) * | 2004-07-27 | 2008-03-18 | Medtronic Minimed, Inc. | Sensing system with auxiliary display |
| US7468033B2 (en) * | 2004-09-08 | 2008-12-23 | Medtronic Minimed, Inc. | Blood contacting sensor |
| TWI372413B (en) * | 2004-09-24 | 2012-09-11 | Semiconductor Energy Lab | Semiconductor device and method for manufacturing the same, and electric appliance |
| US7303543B1 (en) | 2004-12-03 | 2007-12-04 | Medtronic Minimed, Inc. | Medication infusion set |
| US8068913B2 (en) | 2004-12-03 | 2011-11-29 | Second Sight Medical Products, Inc. | Visual prosthesis for improved circadian rhythms and method of improving the circadian rhythms |
| AP2007004056A0 (en) * | 2004-12-16 | 2007-08-31 | Independent Natural Resourcs I | Buoyancy pump power system |
| US7704229B2 (en) | 2005-02-03 | 2010-04-27 | Medtronic Minimed, Inc. | Insertion device |
| US20060293578A1 (en) * | 2005-02-03 | 2006-12-28 | Rennaker Robert L Ii | Brian machine interface device |
| US20060184104A1 (en) * | 2005-02-15 | 2006-08-17 | Medtronic Minimed, Inc. | Needle guard |
| US8133178B2 (en) * | 2006-02-22 | 2012-03-13 | Dexcom, Inc. | Analyte sensor |
| US8744546B2 (en) | 2005-05-05 | 2014-06-03 | Dexcom, Inc. | Cellulosic-based resistance domain for an analyte sensor |
| US8060174B2 (en) | 2005-04-15 | 2011-11-15 | Dexcom, Inc. | Analyte sensing biointerface |
| US20070033074A1 (en) * | 2005-06-03 | 2007-02-08 | Medtronic Minimed, Inc. | Therapy management system |
| US20060272652A1 (en) * | 2005-06-03 | 2006-12-07 | Medtronic Minimed, Inc. | Virtual patient software system for educating and treating individuals with diabetes |
| US20070016449A1 (en) * | 2005-06-29 | 2007-01-18 | Gary Cohen | Flexible glucose analysis using varying time report deltas and configurable glucose target ranges |
| KR101321296B1 (en) | 2005-07-20 | 2013-10-28 | 바이엘 헬스케어 엘엘씨 | Gated amperometry temperature determination |
| US20070066956A1 (en) * | 2005-07-27 | 2007-03-22 | Medtronic Minimed, Inc. | Systems and methods for entering temporary basal rate pattern in an infusion device |
| US20070060869A1 (en) * | 2005-08-16 | 2007-03-15 | Tolle Mike C V | Controller device for an infusion pump |
| US20070093786A1 (en) * | 2005-08-16 | 2007-04-26 | Medtronic Minimed, Inc. | Watch controller for a medical device |
| US20090227855A1 (en) | 2005-08-16 | 2009-09-10 | Medtronic Minimed, Inc. | Controller device for an infusion pump |
| US20070060870A1 (en) * | 2005-08-16 | 2007-03-15 | Tolle Mike Charles V | Controller device for an infusion pump |
| US7737581B2 (en) | 2005-08-16 | 2010-06-15 | Medtronic Minimed, Inc. | Method and apparatus for predicting end of battery life |
| US7713240B2 (en) | 2005-09-13 | 2010-05-11 | Medtronic Minimed, Inc. | Modular external infusion device |
| US9072476B2 (en) | 2005-09-23 | 2015-07-07 | Medtronic Minimed, Inc. | Flexible sensor apparatus |
| US7725148B2 (en) * | 2005-09-23 | 2010-05-25 | Medtronic Minimed, Inc. | Sensor with layered electrodes |
| JP5671205B2 (en) | 2005-09-30 | 2015-02-18 | バイエル・ヘルスケア・エルエルシー | Gated voltammetry |
| CN101583309B (en) * | 2005-10-07 | 2012-07-04 | 神经连结科技公司 | Modular multichannel microelectrode array and methods of making same |
| US7877866B1 (en) | 2005-10-26 | 2011-02-01 | Second Sight Medical Products, Inc. | Flexible circuit electrode array and method of manufacturing the same |
| WO2007058975A2 (en) * | 2005-11-10 | 2007-05-24 | Second Sight Medical Products, Inc. | Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same |
| US7759167B2 (en) * | 2005-11-23 | 2010-07-20 | Imec | Method for embedding dies |
| US7867176B2 (en) * | 2005-12-27 | 2011-01-11 | Cordis Corporation | Variable stiffness guidewire |
| US7774038B2 (en) * | 2005-12-30 | 2010-08-10 | Medtronic Minimed, Inc. | Real-time self-calibrating sensor system and method |
| US8114268B2 (en) * | 2005-12-30 | 2012-02-14 | Medtronic Minimed, Inc. | Method and system for remedying sensor malfunctions detected by electrochemical impedance spectroscopy |
| US20070169533A1 (en) * | 2005-12-30 | 2007-07-26 | Medtronic Minimed, Inc. | Methods and systems for detecting the hydration of sensors |
| US8114269B2 (en) | 2005-12-30 | 2012-02-14 | Medtronic Minimed, Inc. | System and method for determining the point of hydration and proper time to apply potential to a glucose sensor |
| US20070173712A1 (en) * | 2005-12-30 | 2007-07-26 | Medtronic Minimed, Inc. | Method of and system for stabilization of sensors |
| US7985330B2 (en) | 2005-12-30 | 2011-07-26 | Medtronic Minimed, Inc. | Method and system for detecting age, hydration, and functional states of sensors using electrochemical impedance spectroscopy |
| US9757061B2 (en) | 2006-01-17 | 2017-09-12 | Dexcom, Inc. | Low oxygen in vivo analyte sensor |
| US7785317B2 (en) | 2006-03-29 | 2010-08-31 | Codman & Shurtleff, Inc. | Joined metal tubing and method of manufacture |
| US20070255125A1 (en) * | 2006-04-28 | 2007-11-01 | Moberg Sheldon B | Monitor devices for networked fluid infusion systems |
| US20070253380A1 (en) * | 2006-04-28 | 2007-11-01 | James Jollota | Data translation device with nonvolatile memory for a networked medical device system |
| US20070254593A1 (en) * | 2006-04-28 | 2007-11-01 | Medtronic Minimed, Inc. | Wireless data communication for a medical device network that supports a plurality of data communication modes |
| US8073008B2 (en) * | 2006-04-28 | 2011-12-06 | Medtronic Minimed, Inc. | Subnetwork synchronization and variable transmit synchronization techniques for a wireless medical device network |
| US20070255126A1 (en) * | 2006-04-28 | 2007-11-01 | Moberg Sheldon B | Data communication in networked fluid infusion systems |
| US8690938B2 (en) * | 2006-05-26 | 2014-04-08 | DePuy Synthes Products, LLC | Occlusion device combination of stent and mesh with diamond-shaped porosity |
| US8118859B2 (en) * | 2006-05-26 | 2012-02-21 | Codman & Shurtleff, Inc. | Occlusion device combination of stent and mesh having offset parallelogram porosity |
| US9185810B2 (en) | 2006-06-06 | 2015-11-10 | Second Sight Medical Products, Inc. | Molded polymer comprising silicone and at least one metal trace and a process of manufacturing the same |
| US7750076B2 (en) | 2006-06-07 | 2010-07-06 | Second Sight Medical Products, Inc. | Polymer comprising silicone and at least one metal trace |
| US7749608B2 (en) | 2006-06-06 | 2010-07-06 | Second Sight Medical Products, Inc. | Molded polymer comprising silicone and at least one metal trace |
| US7670353B2 (en) * | 2006-06-12 | 2010-03-02 | Codman & Shurtleff, Inc. | Modified headpiece for hydraulic coil deployment system |
| US7766935B2 (en) | 2006-06-12 | 2010-08-03 | Codman & Shurtleff, Inc. | Modified headpiece for hydraulic coil deployment system |
| US8585732B2 (en) * | 2006-06-14 | 2013-11-19 | DePuy Synthes Products, LLC | Retrieval device with sidewall grippers |
| WO2007149465A2 (en) * | 2006-06-19 | 2007-12-27 | Second Sight Medical Products, Inc. | Electrode with increased stability and method of manufacturing the same |
| US7831287B2 (en) | 2006-10-04 | 2010-11-09 | Dexcom, Inc. | Dual electrode system for a continuous analyte sensor |
| ES2825036T3 (en) | 2006-10-24 | 2021-05-14 | Ascensia Diabetes Care Holdings Ag | Transient decay amperometry |
| US20080139910A1 (en) * | 2006-12-06 | 2008-06-12 | Metronic Minimed, Inc. | Analyte sensor and method of using the same |
| US10154804B2 (en) * | 2007-01-31 | 2018-12-18 | Medtronic Minimed, Inc. | Model predictive method and system for controlling and supervising insulin infusion |
| US8731673B2 (en) | 2007-02-26 | 2014-05-20 | Sapiens Steering Brain Stimulation B.V. | Neural interface system |
| JP5279731B2 (en) * | 2007-03-02 | 2013-09-04 | レイセオン カンパニー | Manufacturing method of electric circuit on ultra-thin plastic film |
| US20080269714A1 (en) | 2007-04-25 | 2008-10-30 | Medtronic Minimed, Inc. | Closed loop/semi-closed loop therapy modification system |
| US20080300572A1 (en) * | 2007-06-01 | 2008-12-04 | Medtronic Minimed, Inc. | Wireless monitor for a personal medical device system |
| WO2008154312A1 (en) | 2007-06-08 | 2008-12-18 | Dexcom, Inc. | Integrated medicament delivery device for use with continuous analyte sensor |
| US9452258B2 (en) | 2007-10-09 | 2016-09-27 | Dexcom, Inc. | Integrated insulin delivery system with continuous glucose sensor |
| US8565894B2 (en) * | 2007-10-17 | 2013-10-22 | Neuronexus Technologies, Inc. | Three-dimensional system of electrode leads |
| WO2009052425A1 (en) * | 2007-10-17 | 2009-04-23 | Neuronexus Technologies | Implantable device including a resorbable carrier |
| US8224417B2 (en) * | 2007-10-17 | 2012-07-17 | Neuronexus Technologies, Inc. | Guide tube for an implantable device system |
| US8417312B2 (en) | 2007-10-25 | 2013-04-09 | Dexcom, Inc. | Systems and methods for processing sensor data |
| US20090112626A1 (en) * | 2007-10-30 | 2009-04-30 | Cary Talbot | Remote wireless monitoring, processing, and communication of patient data |
| US7783442B2 (en) * | 2007-10-31 | 2010-08-24 | Medtronic Minimed, Inc. | System and methods for calibrating physiological characteristic sensors |
| WO2009076302A1 (en) | 2007-12-10 | 2009-06-18 | Bayer Healthcare Llc | Control markers for auto-detection of control solution and methods of use |
| US8313467B2 (en) | 2007-12-27 | 2012-11-20 | Medtronic Minimed, Inc. | Reservoir pressure equalization systems and methods |
| US7743492B2 (en) * | 2008-02-08 | 2010-06-29 | Carestream Health, Inc. | Method for forming cast flexible substrate and resultant substrate and electronic device |
| US8498720B2 (en) | 2008-02-29 | 2013-07-30 | Neuronexus Technologies, Inc. | Implantable electrode and method of making the same |
| US20090242399A1 (en) * | 2008-03-25 | 2009-10-01 | Dexcom, Inc. | Analyte sensor |
| US8583204B2 (en) | 2008-03-28 | 2013-11-12 | Dexcom, Inc. | Polymer membranes for continuous analyte sensors |
| US11730407B2 (en) | 2008-03-28 | 2023-08-22 | Dexcom, Inc. | Polymer membranes for continuous analyte sensors |
| US8682408B2 (en) | 2008-03-28 | 2014-03-25 | Dexcom, Inc. | Polymer membranes for continuous analyte sensors |
| US9295786B2 (en) | 2008-05-28 | 2016-03-29 | Medtronic Minimed, Inc. | Needle protective device for subcutaneous sensors |
| EP2326944B1 (en) | 2008-09-19 | 2020-08-19 | Dexcom, Inc. | Particle-containing membrane and particulate electrode for analyte sensors |
| EP2349440B1 (en) | 2008-10-07 | 2019-08-21 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
| US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| US8372726B2 (en) * | 2008-10-07 | 2013-02-12 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| US8208973B2 (en) * | 2008-11-05 | 2012-06-26 | Medtronic Minimed, Inc. | System and method for variable beacon timing with wireless devices |
| US20100161346A1 (en) * | 2008-12-24 | 2010-06-24 | Kristen Getschmann | Systems and Methods for Providing Bolus Dosage Recommendations |
| US20100160740A1 (en) * | 2008-12-24 | 2010-06-24 | Gary Cohen | Use of Patterns in a Therapy Management System |
| US9330237B2 (en) * | 2008-12-24 | 2016-05-03 | Medtronic Minimed, Inc. | Pattern recognition and filtering in a therapy management system |
| US8696917B2 (en) * | 2009-02-09 | 2014-04-15 | Edwards Lifesciences Corporation | Analyte sensor and fabrication methods |
| US9446194B2 (en) | 2009-03-27 | 2016-09-20 | Dexcom, Inc. | Methods and systems for promoting glucose management |
| JP2010251745A (en) * | 2009-04-10 | 2010-11-04 | Asml Netherlands Bv | Immersion lithography device and device manufacturing method |
| US20110006880A1 (en) * | 2009-07-09 | 2011-01-13 | Medtronic Minimed, Inc. | Fingerprint-linked control of a portable medical device |
| US20110009813A1 (en) * | 2009-07-09 | 2011-01-13 | Medtronic Minimed, Inc. | Panning a display of a portable medical device |
| US8344847B2 (en) | 2009-07-09 | 2013-01-01 | Medtronic Minimed, Inc. | Coordination of control commands in a medical device system having at least one therapy delivery device and at least one wireless controller device |
| US8487758B2 (en) * | 2009-09-02 | 2013-07-16 | Medtronic Minimed, Inc. | Medical device having an intelligent alerting scheme, and related operating methods |
| US20110218756A1 (en) * | 2009-10-01 | 2011-09-08 | Mc10, Inc. | Methods and apparatus for conformal sensing of force and/or acceleration at a person's head |
| WO2011041727A1 (en) | 2009-10-01 | 2011-04-07 | Mc10, Inc. | Protective cases with integrated electronics |
| WO2011046665A1 (en) * | 2009-10-16 | 2011-04-21 | Neuronexus Technologies | Neural interface system |
| US8386042B2 (en) * | 2009-11-03 | 2013-02-26 | Medtronic Minimed, Inc. | Omnidirectional accelerometer device and medical device incorporating same |
| WO2011084450A1 (en) | 2009-12-16 | 2011-07-14 | The Board Of Trustees Of The University Of Illinois | Electrophysiology in-vivo using conformal electronics |
| US9936574B2 (en) | 2009-12-16 | 2018-04-03 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
| US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
| US8660628B2 (en) * | 2009-12-21 | 2014-02-25 | Medtronic Minimed, Inc. | Analyte sensors comprising blended membrane compositions and methods for making and using them |
| US8574201B2 (en) | 2009-12-22 | 2013-11-05 | Medtronic Minimed, Inc. | Syringe piston with check valve seal |
| US8755269B2 (en) * | 2009-12-23 | 2014-06-17 | Medtronic Minimed, Inc. | Ranking and switching of wireless channels in a body area network of medical devices |
| US20110152970A1 (en) * | 2009-12-23 | 2011-06-23 | Medtronic Minimed, Inc. | Location-based ranking and switching of wireless channels in a body area network of medical devices |
| KR101125567B1 (en) * | 2009-12-24 | 2012-03-22 | 삼성모바일디스플레이주식회사 | Polymer substrate and method of manufacturing the same and display device including the polymer substrate and method of manufacturing the display device |
| NO20093601A1 (en) | 2009-12-29 | 2011-06-30 | Idex Asa | surface Sensor |
| KR101724273B1 (en) | 2010-03-17 | 2017-04-07 | 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 | implantable biomedical devices on bioresorbable substrates |
| DE102010016779A1 (en) * | 2010-05-04 | 2011-11-10 | Cicor Management AG | Method for producing a flexible circuit arrangement |
| US9155861B2 (en) | 2010-09-20 | 2015-10-13 | Neuronexus Technologies, Inc. | Neural drug delivery system with fluidic threads |
| US8603032B2 (en) | 2010-10-15 | 2013-12-10 | Medtronic Minimed, Inc. | Medical device with membrane keypad sealing element, and related manufacturing method |
| US8562565B2 (en) | 2010-10-15 | 2013-10-22 | Medtronic Minimed, Inc. | Battery shock absorber for a portable medical device |
| US8603033B2 (en) | 2010-10-15 | 2013-12-10 | Medtronic Minimed, Inc. | Medical device and related assembly having an offset element for a piezoelectric speaker |
| US8474332B2 (en) | 2010-10-20 | 2013-07-02 | Medtronic Minimed, Inc. | Sensor assembly and medical device incorporating same |
| US8495918B2 (en) | 2010-10-20 | 2013-07-30 | Medtronic Minimed, Inc. | Sensor assembly and medical device incorporating same |
| US8479595B2 (en) | 2010-10-20 | 2013-07-09 | Medtronic Minimed, Inc. | Sensor assembly and medical device incorporating same |
| US8197444B1 (en) | 2010-12-22 | 2012-06-12 | Medtronic Minimed, Inc. | Monitoring the seating status of a fluid reservoir in a fluid infusion device |
| US8690855B2 (en) | 2010-12-22 | 2014-04-08 | Medtronic Minimed, Inc. | Fluid reservoir seating procedure for a fluid infusion device |
| US8469942B2 (en) | 2010-12-22 | 2013-06-25 | Medtronic Minimed, Inc. | Occlusion detection for a fluid infusion device |
| US8628510B2 (en) | 2010-12-22 | 2014-01-14 | Medtronic Minimed, Inc. | Monitoring the operating health of a force sensor in a fluid infusion device |
| EP2477467B1 (en) | 2011-01-14 | 2017-07-26 | Second Sight Medical Products, Inc. | Method of manufacturing a flexible circuit electrode array |
| US9283318B2 (en) | 2011-02-22 | 2016-03-15 | Medtronic Minimed, Inc. | Flanged sealing element and needle guide pin assembly for a fluid infusion device having a needled fluid reservoir |
| US20120211946A1 (en) | 2011-02-22 | 2012-08-23 | Medtronic Minimed, Inc. | Sealing element for a hollow needle of a fluid infusion device |
| US9463309B2 (en) | 2011-02-22 | 2016-10-11 | Medtronic Minimed, Inc. | Sealing assembly and structure for a fluid infusion device having a needled fluid reservoir |
| US9393399B2 (en) | 2011-02-22 | 2016-07-19 | Medtronic Minimed, Inc. | Sealing assembly for a fluid reservoir of a fluid infusion device |
| US8614596B2 (en) | 2011-02-28 | 2013-12-24 | Medtronic Minimed, Inc. | Systems and methods for initializing a voltage bus and medical devices incorporating same |
| US9101305B2 (en) | 2011-03-09 | 2015-08-11 | Medtronic Minimed, Inc. | Glucose sensor product and related manufacturing and packaging methods |
| US9018893B2 (en) | 2011-03-18 | 2015-04-28 | Medtronic Minimed, Inc. | Power control techniques for an electronic device |
| US8564447B2 (en) | 2011-03-18 | 2013-10-22 | Medtronic Minimed, Inc. | Battery life indication techniques for an electronic device |
| DK3575796T3 (en) | 2011-04-15 | 2021-01-18 | Dexcom Inc | ADVANCED ANALYZE SENSOR CALIBRATION AND ERROR DETECTION |
| WO2012158709A1 (en) | 2011-05-16 | 2012-11-22 | The Board Of Trustees Of The University Of Illinois | Thermally managed led arrays assembled by printing |
| JP2014523633A (en) | 2011-05-27 | 2014-09-11 | エムシー１０ インコーポレイテッド | Electronic, optical and / or mechanical devices and systems and methods of manufacturing these devices and systems |
| US8934965B2 (en) | 2011-06-03 | 2015-01-13 | The Board Of Trustees Of The University Of Illinois | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
| US9579040B2 (en) * | 2011-09-01 | 2017-02-28 | Mc10, Inc. | Electronics for detection of a condition of tissue |
| KR101772490B1 (en) | 2011-09-28 | 2017-08-30 | 삼성전자주식회사 | Printed circuit board assembly |
| EP2786644B1 (en) | 2011-12-01 | 2019-04-10 | The Board of Trustees of the University of Illionis | Transient devices designed to undergo programmable transformations |
| US9610401B2 (en) | 2012-01-13 | 2017-04-04 | Medtronic Minimed, Inc. | Infusion set component with modular fluid channel element |
| CN104271346B (en) | 2012-02-28 | 2017-10-13 | 康宁股份有限公司 | Glassware with low-friction coating |
| US10737973B2 (en) | 2012-02-28 | 2020-08-11 | Corning Incorporated | Pharmaceutical glass coating for achieving particle reduction |
| US11497681B2 (en) | 2012-02-28 | 2022-11-15 | Corning Incorporated | Glass articles with low-friction coatings |
| US8603027B2 (en) | 2012-03-20 | 2013-12-10 | Medtronic Minimed, Inc. | Occlusion detection using pulse-width modulation and medical device incorporating same |
| US8603026B2 (en) | 2012-03-20 | 2013-12-10 | Medtronic Minimed, Inc. | Dynamic pulse-width modulation motor control and medical device incorporating same |
| US8523803B1 (en) | 2012-03-20 | 2013-09-03 | Medtronic Minimed, Inc. | Motor health monitoring and medical device incorporating same |
| JP2015521303A (en) | 2012-03-30 | 2015-07-27 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシ | An electronic device that can be attached to the surface and can be attached to an accessory |
| US10273048B2 (en) | 2012-06-07 | 2019-04-30 | Corning Incorporated | Delamination resistant glass containers with heat-tolerant coatings |
| US20130338629A1 (en) | 2012-06-07 | 2013-12-19 | Medtronic Minimed, Inc. | Diabetes therapy management system for recommending basal pattern adjustments |
| US9333292B2 (en) | 2012-06-26 | 2016-05-10 | Medtronic Minimed, Inc. | Mechanically actuated fluid infusion device |
| US9034442B2 (en) | 2012-11-30 | 2015-05-19 | Corning Incorporated | Strengthened borosilicate glass containers with improved damage tolerance |
| US8999446B2 (en) * | 2012-07-09 | 2015-04-07 | Stmicroelectronics Pte Ltd. | Methods for adjusting adhesion strength during sensor processing |
| US8808269B2 (en) | 2012-08-21 | 2014-08-19 | Medtronic Minimed, Inc. | Reservoir plunger position monitoring and medical device incorporating same |
| US9849239B2 (en) | 2012-08-30 | 2017-12-26 | Medtronic Minimed, Inc. | Generation and application of an insulin limit for a closed-loop operating mode of an insulin infusion system |
| US9878096B2 (en) | 2012-08-30 | 2018-01-30 | Medtronic Minimed, Inc. | Generation of target glucose values for a closed-loop operating mode of an insulin infusion system |
| US10496797B2 (en) | 2012-08-30 | 2019-12-03 | Medtronic Minimed, Inc. | Blood glucose validation for a closed-loop operating mode of an insulin infusion system |
| US9364609B2 (en) | 2012-08-30 | 2016-06-14 | Medtronic Minimed, Inc. | Insulin on board compensation for a closed-loop insulin infusion system |
| US9623179B2 (en) | 2012-08-30 | 2017-04-18 | Medtronic Minimed, Inc. | Safeguarding techniques for a closed-loop insulin infusion system |
| US9662445B2 (en) | 2012-08-30 | 2017-05-30 | Medtronic Minimed, Inc. | Regulating entry into a closed-loop operating mode of an insulin infusion system |
| US10130767B2 (en) | 2012-08-30 | 2018-11-20 | Medtronic Minimed, Inc. | Sensor model supervisor for a closed-loop insulin infusion system |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| US8870818B2 (en) | 2012-11-15 | 2014-10-28 | Medtronic Minimed, Inc. | Systems and methods for alignment and detection of a consumable component |
| RU2520568C1 (en) * | 2012-11-23 | 2014-06-27 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "МИЭТ" (МИЭТ) | Method of manufacturing flexible microprinted board |
| RU2539583C2 (en) * | 2012-11-27 | 2015-01-20 | Открытое акционерное общество "Московский радиозавод "Темп" | Manufacturing method of two-sided flexible printed board |
| US10117806B2 (en) | 2012-11-30 | 2018-11-06 | Corning Incorporated | Strengthened glass containers resistant to delamination and damage |
| US9522223B2 (en) | 2013-01-18 | 2016-12-20 | Medtronic Minimed, Inc. | Systems for fluid reservoir retention |
| US9107994B2 (en) | 2013-01-18 | 2015-08-18 | Medtronic Minimed, Inc. | Systems for fluid reservoir retention |
| US9033924B2 (en) | 2013-01-18 | 2015-05-19 | Medtronic Minimed, Inc. | Systems for fluid reservoir retention |
| US9308321B2 (en) | 2013-02-18 | 2016-04-12 | Medtronic Minimed, Inc. | Infusion device having gear assembly initialization |
| US10224258B2 (en) * | 2013-03-22 | 2019-03-05 | Applied Materials, Inc. | Method of curing thermoplastics with microwave energy |
| US8920381B2 (en) | 2013-04-12 | 2014-12-30 | Medtronic Minimed, Inc. | Infusion set with improved bore configuration |
| US9433731B2 (en) | 2013-07-19 | 2016-09-06 | Medtronic Minimed, Inc. | Detecting unintentional motor motion and infusion device incorporating same |
| US9402949B2 (en) | 2013-08-13 | 2016-08-02 | Medtronic Minimed, Inc. | Detecting conditions associated with medical device operations using matched filters |
| US9880528B2 (en) | 2013-08-21 | 2018-01-30 | Medtronic Minimed, Inc. | Medical devices and related updating methods and systems |
| US9889257B2 (en) | 2013-08-21 | 2018-02-13 | Medtronic Minimed, Inc. | Systems and methods for updating medical devices |
| US9259528B2 (en) | 2013-08-22 | 2016-02-16 | Medtronic Minimed, Inc. | Fluid infusion device with safety coupling |
| US9750877B2 (en) | 2013-12-11 | 2017-09-05 | Medtronic Minimed, Inc. | Predicted time to assess and/or control a glycemic state |
| US9750878B2 (en) | 2013-12-11 | 2017-09-05 | Medtronic Minimed, Inc. | Closed-loop control of glucose according to a predicted blood glucose trajectory |
| US10105488B2 (en) | 2013-12-12 | 2018-10-23 | Medtronic Minimed, Inc. | Predictive infusion device operations and related methods and systems |
| US9849240B2 (en) | 2013-12-12 | 2017-12-26 | Medtronic Minimed, Inc. | Data modification for predictive operations and devices incorporating same |
| US9694132B2 (en) | 2013-12-19 | 2017-07-04 | Medtronic Minimed, Inc. | Insertion device for insertion set |
| US9399096B2 (en) | 2014-02-06 | 2016-07-26 | Medtronic Minimed, Inc. | Automatic closed-loop control adjustments and infusion systems incorporating same |
| US9861748B2 (en) | 2014-02-06 | 2018-01-09 | Medtronic Minimed, Inc. | User-configurable closed-loop notifications and infusion systems incorporating same |
| US10034976B2 (en) | 2014-03-24 | 2018-07-31 | Medtronic Minimed, Inc. | Fluid infusion patch pump device with automatic fluid system priming feature |
| US10001450B2 (en) | 2014-04-18 | 2018-06-19 | Medtronic Minimed, Inc. | Nonlinear mapping technique for a physiological characteristic sensor |
| US10232113B2 (en) | 2014-04-24 | 2019-03-19 | Medtronic Minimed, Inc. | Infusion devices and related methods and systems for regulating insulin on board |
| US9681828B2 (en) | 2014-05-01 | 2017-06-20 | Medtronic Minimed, Inc. | Physiological characteristic sensors and methods for forming such sensors |
| US10275572B2 (en) | 2014-05-01 | 2019-04-30 | Medtronic Minimed, Inc. | Detecting blockage of a reservoir cavity during a seating operation of a fluid infusion device |
| RU2556697C1 (en) * | 2014-05-15 | 2015-07-20 | Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "МИЭТ" (МИЭТ) | Method of making flexible micro-printed circuit boards |
| US10582618B2 (en) * | 2014-05-16 | 2020-03-03 | The Regents Of The University Of California | Fabrication of flexible electronic devices |
| US10152049B2 (en) | 2014-05-19 | 2018-12-11 | Medtronic Minimed, Inc. | Glucose sensor health monitoring and related methods and systems |
| US10007765B2 (en) | 2014-05-19 | 2018-06-26 | Medtronic Minimed, Inc. | Adaptive signal processing for infusion devices and related methods and systems |
| US10274349B2 (en) | 2014-05-19 | 2019-04-30 | Medtronic Minimed, Inc. | Calibration factor adjustments for infusion devices and related methods and systems |
| US10899659B2 (en) | 2014-09-05 | 2021-01-26 | Corning Incorporated | Glass articles and methods for improving the reliability of glass articles |
| US9839753B2 (en) | 2014-09-26 | 2017-12-12 | Medtronic Minimed, Inc. | Systems for managing reservoir chamber pressure |
| US9833563B2 (en) | 2014-09-26 | 2017-12-05 | Medtronic Minimed, Inc. | Systems for managing reservoir chamber pressure |
| US10279126B2 (en) | 2014-10-07 | 2019-05-07 | Medtronic Minimed, Inc. | Fluid conduit assembly with gas trapping filter in the fluid flow path |
| US9833564B2 (en) | 2014-11-25 | 2017-12-05 | Medtronic Minimed, Inc. | Fluid conduit assembly with air venting features |
| US10195341B2 (en) | 2014-11-26 | 2019-02-05 | Medtronic Minimed, Inc. | Systems and methods for fluid infusion device with automatic reservoir fill |
| US9987420B2 (en) | 2014-11-26 | 2018-06-05 | Medtronic Minimed, Inc. | Systems and methods for fluid infusion device with automatic reservoir fill |
| WO2016085867A1 (en) | 2014-11-26 | 2016-06-02 | Corning Incorporated | Methods for producing strengthened and durable glass containers |
| US9943645B2 (en) | 2014-12-04 | 2018-04-17 | Medtronic Minimed, Inc. | Methods for operating mode transitions and related infusion devices and systems |
| US9636453B2 (en) | 2014-12-04 | 2017-05-02 | Medtronic Minimed, Inc. | Advance diagnosis of infusion device operating mode viability |
| US9937292B2 (en) | 2014-12-09 | 2018-04-10 | Medtronic Minimed, Inc. | Systems for filling a fluid infusion device reservoir |
| US10307535B2 (en) | 2014-12-19 | 2019-06-04 | Medtronic Minimed, Inc. | Infusion devices and related methods and systems for preemptive alerting |
| US10265031B2 (en) | 2014-12-19 | 2019-04-23 | Medtronic Minimed, Inc. | Infusion devices and related methods and systems for automatic alert clearing |
| US10307528B2 (en) | 2015-03-09 | 2019-06-04 | Medtronic Minimed, Inc. | Extensible infusion devices and related methods |
| US10449298B2 (en) | 2015-03-26 | 2019-10-22 | Medtronic Minimed, Inc. | Fluid injection devices and related methods |
| US10137243B2 (en) | 2015-05-26 | 2018-11-27 | Medtronic Minimed, Inc. | Infusion devices with distributed motor control and related operating methods |
| US9999721B2 (en) | 2015-05-26 | 2018-06-19 | Medtronic Minimed, Inc. | Error handling in infusion devices with distributed motor control and related operating methods |
| US10575767B2 (en) | 2015-05-29 | 2020-03-03 | Medtronic Minimed, Inc. | Method for monitoring an analyte, analyte sensor and analyte monitoring apparatus |
| EP3304130B1 (en) | 2015-06-01 | 2021-10-06 | The Board of Trustees of the University of Illinois | Alternative approach to uv sensing |
| CN107851208B (en) | 2015-06-01 | 2021-09-10 | 伊利诺伊大学评议会 | Miniaturized electronic system with wireless power supply and near field communication capability |
| US9879668B2 (en) | 2015-06-22 | 2018-01-30 | Medtronic Minimed, Inc. | Occlusion detection techniques for a fluid infusion device having a rotary pump mechanism and an optical sensor |
| US9993594B2 (en) | 2015-06-22 | 2018-06-12 | Medtronic Minimed, Inc. | Occlusion detection techniques for a fluid infusion device having a rotary pump mechanism and rotor position sensors |
| US9987425B2 (en) | 2015-06-22 | 2018-06-05 | Medtronic Minimed, Inc. | Occlusion detection techniques for a fluid infusion device having a rotary pump mechanism and sensor contact elements |
| US10010668B2 (en) | 2015-06-22 | 2018-07-03 | Medtronic Minimed, Inc. | Occlusion detection techniques for a fluid infusion device having a rotary pump mechanism and a force sensor |
| US9878095B2 (en) | 2015-06-22 | 2018-01-30 | Medtronic Minimed, Inc. | Occlusion detection techniques for a fluid infusion device having a rotary pump mechanism and multiple sensor contact elements |
| US10201657B2 (en) | 2015-08-21 | 2019-02-12 | Medtronic Minimed, Inc. | Methods for providing sensor site rotation feedback and related infusion devices and systems |
| US10478557B2 (en) | 2015-08-21 | 2019-11-19 | Medtronic Minimed, Inc. | Personalized parameter modeling methods and related devices and systems |
| US10664569B2 (en) | 2015-08-21 | 2020-05-26 | Medtronic Minimed, Inc. | Data analytics and generation of recommendations for controlling glycemic outcomes associated with tracked events |
| US10293108B2 (en) | 2015-08-21 | 2019-05-21 | Medtronic Minimed, Inc. | Infusion devices and related patient ratio adjustment methods |
| US10463297B2 (en) | 2015-08-21 | 2019-11-05 | Medtronic Minimed, Inc. | Personalized event detection methods and related devices and systems |
| US10117992B2 (en) | 2015-09-29 | 2018-11-06 | Medtronic Minimed, Inc. | Infusion devices and related rescue detection methods |
| EP3150564B1 (en) | 2015-09-30 | 2018-12-05 | Corning Incorporated | Halogenated polyimide siloxane chemical compositions and glass articles with halogenated polylmide siloxane low-friction coatings |
| US11501867B2 (en) | 2015-10-19 | 2022-11-15 | Medtronic Minimed, Inc. | Medical devices and related event pattern presentation methods |
| US11666702B2 (en) | 2015-10-19 | 2023-06-06 | Medtronic Minimed, Inc. | Medical devices and related event pattern treatment recommendation methods |
| US10146911B2 (en) | 2015-10-23 | 2018-12-04 | Medtronic Minimed, Inc. | Medical devices and related methods and systems for data transfer |
| WO2017075435A1 (en) | 2015-10-30 | 2017-05-04 | Corning Incorporated | Glass articles with mixed polymer and metal oxide coatings |
| US10037722B2 (en) | 2015-11-03 | 2018-07-31 | Medtronic Minimed, Inc. | Detecting breakage in a display element |
| US10925543B2 (en) | 2015-11-11 | 2021-02-23 | The Board Of Trustees Of The University Of Illinois | Bioresorbable silicon electronics for transient implants |
| US10449306B2 (en) | 2015-11-25 | 2019-10-22 | Medtronics Minimed, Inc. | Systems for fluid delivery with wicking membrane |
| US10589038B2 (en) | 2016-04-27 | 2020-03-17 | Medtronic Minimed, Inc. | Set connector systems for venting a fluid reservoir |
| RU2636575C1 (en) * | 2016-07-01 | 2017-11-24 | Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский университет "Московский институт электронной техники" (МИЭТ) | Method of manufacturing of plastic radioelectronic nodes and interconnections |
| US11097051B2 (en) | 2016-11-04 | 2021-08-24 | Medtronic Minimed, Inc. | Methods and apparatus for detecting and reacting to insufficient hypoglycemia response |
| US10238030B2 (en) | 2016-12-06 | 2019-03-26 | Medtronic Minimed, Inc. | Wireless medical device with a complementary split ring resonator arrangement for suppression of electromagnetic interference |
| US10272201B2 (en) | 2016-12-22 | 2019-04-30 | Medtronic Minimed, Inc. | Insertion site monitoring methods and related infusion devices and systems |
| US10532165B2 (en) | 2017-01-30 | 2020-01-14 | Medtronic Minimed, Inc. | Fluid reservoir and systems for filling a fluid reservoir of a fluid infusion device |
| US10500135B2 (en) | 2017-01-30 | 2019-12-10 | Medtronic Minimed, Inc. | Fluid reservoir and systems for filling a fluid reservoir of a fluid infusion device |
| US10363365B2 (en) | 2017-02-07 | 2019-07-30 | Medtronic Minimed, Inc. | Infusion devices and related consumable calibration methods |
| US10552580B2 (en) | 2017-02-07 | 2020-02-04 | Medtronic Minimed, Inc. | Infusion system consumables and related calibration methods |
| US11207463B2 (en) | 2017-02-21 | 2021-12-28 | Medtronic Minimed, Inc. | Apparatuses, systems, and methods for identifying an infusate in a reservoir of an infusion device |
| US10646649B2 (en) | 2017-02-21 | 2020-05-12 | Medtronic Minimed, Inc. | Infusion devices and fluid identification apparatuses and methods |
| EP3415086A3 (en) | 2017-06-15 | 2019-04-03 | Analog Devices, Inc. | Sensor module for vital sign monitoring device |
| US11331022B2 (en) | 2017-10-24 | 2022-05-17 | Dexcom, Inc. | Pre-connected analyte sensors |
| US20190120785A1 (en) | 2017-10-24 | 2019-04-25 | Dexcom, Inc. | Pre-connected analyte sensors |
| US11953388B2 (en) | 2018-05-16 | 2024-04-09 | Alleima Tube Ab | Metallic tube structure with a sensor arrangement |
| CN109002233A (en) * | 2018-07-10 | 2018-12-14 | 汕头超声显示器技术有限公司 | A kind of touch screen of PI substrate or the manufacturing method of display |
| US10847400B2 (en) | 2018-12-28 | 2020-11-24 | Applied Materials, Inc. | Adhesive-less substrate bonding to carrier plate |
| DE102021106203A1 (en) * | 2021-03-15 | 2022-09-15 | Grohe Ag | Device for fixing a sanitary component to a wall |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1094517B (en) * | 1978-04-28 | 1985-08-02 | Componenti Elettronici Sgs Ate | PROCEDURE FOR THE MANUFACTURE OF A FILIFORM RESISTIVE ELEMENT FOR INTEGRATED CIRCUIT |
| DE3024030A1 (en) * | 1980-06-26 | 1982-01-14 | Siemens AG, 1000 Berlin und 8000 München | RC-Network film circuits - made using a polyimide film support coated on both sides with a poly:fluoroethylene-propylene! polymer |
| JPS6041461A (en) * | 1983-08-17 | 1985-03-05 | Sono Harumitsu | Preparation of paste made from starch of devil's-tongue |
| US4697335A (en) * | 1986-03-31 | 1987-10-06 | Hy-Meg Corporation | Method of manufacturing a film-type electronic device |
| US4743568A (en) * | 1987-07-24 | 1988-05-10 | Motorola Inc. | Multilevel interconnect transfer process |
| AU5094890A (en) * | 1989-01-25 | 1990-09-05 | Polylithics, Inc. | Extended integration semiconductor structure and method of making the same |
-
1990
- 1990-02-14 US US07/479,897 patent/US5108819A/en not_active Expired - Lifetime
-
1991
- 1991-02-07 ZA ZA91922A patent/ZA91922B/en unknown
- 1991-02-07 IL IL97182A patent/IL97182A/en not_active IP Right Cessation
- 1991-02-08 PT PT96724A patent/PT96724B/en not_active IP Right Cessation
- 1991-02-08 PH PH41966A patent/PH27510A/en unknown
- 1991-02-08 NZ NZ237055A patent/NZ237055A/en unknown
- 1991-02-11 AT AT91301057T patent/ATE136160T1/en not_active IP Right Cessation
- 1991-02-11 AR AR91319029A patent/AR244911A1/en active
- 1991-02-11 DE DE69118226T patent/DE69118226T2/en not_active Expired - Fee Related
- 1991-02-11 CN CN91101035A patent/CN1033672C/en not_active Expired - Fee Related
- 1991-02-11 EP EP91301057A patent/EP0442674B1/en not_active Expired - Lifetime
- 1991-02-11 DK DK91301057.5T patent/DK0442674T3/en active
- 1991-02-11 MX MX024475A patent/MX170859B/en unknown
- 1991-02-11 ES ES91301057T patent/ES2084766T3/en not_active Expired - Lifetime
- 1991-02-12 KR KR1019910002304A patent/KR910016048A/en active IP Right Grant
- 1991-02-12 RU SU914894779A patent/RU2049365C1/en active
- 1991-02-12 AU AU70993/91A patent/AU631297B2/en not_active Ceased
- 1991-02-13 JP JP03042474A patent/JP3135930B2/en not_active Expired - Fee Related
- 1991-02-13 NO NO91910578A patent/NO910578L/en unknown
- 1991-02-13 IE IE48991A patent/IE72189B1/en not_active IP Right Cessation
- 1991-02-13 YU YU26191A patent/YU47389B/en unknown
- 1991-02-13 CA CA002036241A patent/CA2036241C/en not_active Expired - Fee Related
- 1991-02-13 FI FI910713A patent/FI910713A/en unknown
- 1991-02-13 HU HU91483A patent/HUT60066A/en unknown
- 1991-03-28 TW TW080102415A patent/TW222245B/zh active
-
1992
- 1992-01-22 US US07/823,798 patent/US5403700A/en not_active Expired - Lifetime
-
1994
- 1994-02-09 CN CN94101876A patent/CN1099191A/en not_active Withdrawn
-
1996
- 1996-04-10 GR GR960401018T patent/GR3019621T3/en unknown
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2036241C (en) | Thin film electrical component | |
| EP1949437B2 (en) | Implantable microelectronic device and method of manufacture | |
| EP0836229A2 (en) | Method and structure for integration of passive components on flexible film layers | |
| US20070037315A1 (en) | Silicone Metalization | |
| EP0190820A2 (en) | Zirconium thin-film metal conductor systems | |
| JPH07286987A (en) | Assembly method of thin-film sensor | |
| CA1213077A (en) | Structure and process for lift-off wafer processing | |
| JP4083350B2 (en) | Manufacturing method of membrane ring with bumps | |
| GB2457096A (en) | Strain gauge having support structure formed integrally with flexible substrate and method of manufacture thereof | |
| JPS6392102A (en) | Manufacture of flexible micro circuit | |
| JPS60149181A (en) | Manufacture of superconductive multiplayer wiring | |
| JPS61187346A (en) | Semiconductor device | |
| FI113806B (en) | Moisture detection elements and method for making them | |
| CN112470554B (en) | Method for manufacturing device connector and device connector | |
| JP2003273147A (en) | Semiconductor device and manufacturing method thereof | |
| JPH02306184A (en) | Magnetic sensor and manufacture thereof | |
| JPS62265750A (en) | Hybrid integrated circuit device | |
| GB2323966A (en) | Laminated photosensitive dielectric for semiconductor device | |
| JPS62143283A (en) | Manufacture of magnetic bubble memory element | |
| JPS62179136A (en) | Semiconductor device and manufacture thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |