CA2046253A1 - Integrated circuit package and compact assemblies thereof - Google Patents

Integrated circuit package and compact assemblies thereof

Info

Publication number
CA2046253A1
CA2046253A1 CA2046253A CA2046253A CA2046253A1 CA 2046253 A1 CA2046253 A1 CA 2046253A1 CA 2046253 A CA2046253 A CA 2046253A CA 2046253 A CA2046253 A CA 2046253A CA 2046253 A1 CA2046253 A1 CA 2046253A1
Authority
CA
Canada
Prior art keywords
assemblies
clusters
rectangular structure
integrated circuit
rectangular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2046253A
Other languages
French (fr)
Other versions
CA2046253C (en
Inventor
King Lien Tai
John Thomson, Jr.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Publication of CA2046253A1 publication Critical patent/CA2046253A1/en
Application granted granted Critical
Publication of CA2046253C publication Critical patent/CA2046253C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2225/1035—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the device being entirely enclosed by the support, e.g. high-density interconnect [HDI]
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    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/1064—Electrical connections provided on a side surface of one or more of the containers
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
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    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
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    • H01L2924/161—Cap
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    • H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities

Abstract

An integrated circuit package comprises a thermally conductive plate for receiving an integrated circuit and an open rectangular structure of conductor and insulator for surrounding the sides of the circuit and presenting one or more linear arrays of conductive connectors extending laterally through the rectangular structure.
Preferably the rectangular structure also includes transverse contacts. Advantageously the plate includes extensions beyond the rectangular structure for acting as cooling fins on opposing sides of the rectangular structure. The linear arrays and cooling fins are preferably on different pairs of parallel sides. The integrated circuit package permits the aggregation of packages into assemblies and into clusters of assemblies rich in interconnections. Vertically stacked packages form a rectangular parallelepiped having a plurality of parallel planar cooling fins projecting from two opposing surfaces and another pair of planar surfaces providing rectangular arrays of contacts to the enclosed integrated circuits. In addition, transverse contacts permit electrical interconnection of the stacked packages. Linear clusters can be aggregated as a linear array of such assemblies with their contact surfaces interconnected either directly by an anisotropically conducting plane or indirectly by an intervening transformation plane.
In a preferred linear cluster, successive assemblies are rotated by 90° with respect to the axis of the array. In such clusters each package in the rotated assembly contacts each package in the neighboring assemblies. In low power equipment, elimination of the cooling fins permits even higher levels of interconnection such as rectangular clusters of assemblies.
CA002046253A 1990-09-24 1991-07-04 Integrated circuit package and compact assemblies thereof Expired - Fee Related CA2046253C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/587,308 US5043794A (en) 1990-09-24 1990-09-24 Integrated circuit package and compact assemblies thereof
US587,308 1990-09-24

Publications (2)

Publication Number Publication Date
CA2046253A1 true CA2046253A1 (en) 1992-03-25
CA2046253C CA2046253C (en) 1995-09-05

Family

ID=24349283

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002046253A Expired - Fee Related CA2046253C (en) 1990-09-24 1991-07-04 Integrated circuit package and compact assemblies thereof

Country Status (4)

Country Link
US (1) US5043794A (en)
EP (1) EP0478188A3 (en)
JP (1) JPH0821644B2 (en)
CA (1) CA2046253C (en)

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FR2688630B1 (en) * 1992-03-13 2001-08-10 Thomson Csf METHOD AND DEVICE FOR THREE-DIMENSIONAL INTERCONNECTION OF ELECTRONIC COMPONENT PACKAGES.
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JP2944449B2 (en) * 1995-02-24 1999-09-06 日本電気株式会社 Semiconductor package and manufacturing method thereof
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JPH04234199A (en) 1992-08-21
EP0478188A3 (en) 1992-07-08
CA2046253C (en) 1995-09-05
JPH0821644B2 (en) 1996-03-04
US5043794A (en) 1991-08-27

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