US5406209A
(en)
*
|
1993-02-04 |
1995-04-11 |
Northern Telecom Limited |
Methods and apparatus for testing circuit boards
|
US5631572A
(en)
*
|
1993-09-17 |
1997-05-20 |
Teradyne, Inc. |
Printed circuit board tester using magnetic induction
|
DE4402230C1
(en)
*
|
1994-01-26 |
1995-01-19 |
Gfp Ges Fuer Prueftechnik Mbh |
Method for testing whether terminal pins (posts) of an integrated circuit are electrically conductively soldered into a printed circuit and circuit arrangement for carrying out the method
|
JP3368451B2
(en)
*
|
1995-03-17 |
2003-01-20 |
富士通株式会社 |
Circuit board manufacturing method and circuit inspection device
|
US5517110A
(en)
*
|
1995-04-06 |
1996-05-14 |
Yentec Inc. |
Contactless test method and system for testing printed circuit boards
|
SG45512A1
(en)
*
|
1995-10-30 |
1998-01-16 |
Matsushita Electric Ind Co Ltd |
Electromagnetic radiation measuring apparatus
|
DE19541307C2
(en)
*
|
1995-11-06 |
2001-09-27 |
Atg Test Systems Gmbh |
Method for testing electrical conductor arrangements and device for carrying out the method
|
CA2162347C
(en)
*
|
1995-11-07 |
2001-01-09 |
Gary Gunthorpe |
Method and apparatus for high-speed scanning of electromagnetic field levels
|
US5714888A
(en)
*
|
1995-12-26 |
1998-02-03 |
Motorola, Inc. |
Method and apparatus for testing electronic circuitry in a manufacturing environment
|
US5818246A
(en)
*
|
1996-05-07 |
1998-10-06 |
Zhong; George Guozhen |
Automatic multi-probe PWB tester
|
US5821759A
(en)
*
|
1997-02-27 |
1998-10-13 |
International Business Machines Corporation |
Method and apparatus for detecting shorts in a multi-layer electronic package
|
US6154043A
(en)
*
|
1997-05-07 |
2000-11-28 |
Advanced Micro Devices, Inc. |
Method and apparatus for identifying the position of a selected semiconductor die relative to other dice formed from the same semiconductor wafer
|
US6118279A
(en)
|
1997-07-30 |
2000-09-12 |
Candescent Technologies Corporation |
Magnetic detection of short circuit defects in plate structure
|
US6107806A
(en)
|
1997-07-30 |
2000-08-22 |
Candescent Technologies Corporation |
Device for magnetically sensing current in plate structure
|
US6201403B1
(en)
*
|
1997-09-22 |
2001-03-13 |
Nortel Networks Limited |
Integrated circuit package shielding characterization method and apparatus
|
DE19742055C2
(en)
*
|
1997-09-24 |
2000-02-24 |
Ita Ingb Testaufgaben Gmbh |
Device for testing circuit boards
|
US6331782B1
(en)
|
1998-03-23 |
2001-12-18 |
Conexant Systems, Inc. |
Method and apparatus for wireless testing of integrated circuits
|
IL124961A
(en)
*
|
1998-06-16 |
2006-10-05 |
Orbotech Ltd |
Contactless test method and system
|
DE19837169A1
(en)
*
|
1998-08-17 |
2000-02-24 |
Reinhold Wein |
Method for testing printed and unprinted circuit board assemblies aligning a focused, high-frequency electromagnetic transmission beam to irradiate a component to be tested and produce a spectral measuring signal.
|
JP3189801B2
(en)
*
|
1998-08-28 |
2001-07-16 |
日本電気株式会社 |
Semiconductor evaluation device, magnetic field detector used therefor, manufacturing method thereof, and storage medium storing semiconductor evaluation program
|
US6300785B1
(en)
|
1998-10-20 |
2001-10-09 |
International Business Machines Corporation |
Contact-less probe of semiconductor wafers
|
FR2792076B1
(en)
*
|
1999-04-06 |
2001-05-04 |
Thomson Plasma |
DEVICE FOR TESTING AN ELECTRODE NETWORK AND RELATED METHOD
|
JP2003500655A
(en)
*
|
1999-05-21 |
2003-01-07 |
コネクサント システムズ インコーポレイテッド |
Integrated circuit wireless inspection apparatus and inspection method
|
JP2001272430A
(en)
*
|
2000-03-24 |
2001-10-05 |
Oht Inc |
Apparatus and method for inspection
|
US6759850B2
(en)
*
|
2001-03-28 |
2004-07-06 |
Orbotech Ltd. |
System and method for non-contact electrical testing employing a CAM derived reference
|
JP2003035738A
(en)
|
2001-07-19 |
2003-02-07 |
Omron Corp |
Method and apparatus for checking component mounting substrate
|
US6734681B2
(en)
|
2001-08-10 |
2004-05-11 |
James Sabey |
Apparatus and methods for testing circuit boards
|
US6865503B2
(en)
*
|
2002-12-24 |
2005-03-08 |
Conexant Systems, Inc. |
Method and apparatus for telemetered probing of integrated circuit operation
|
US7220990B2
(en)
|
2003-08-25 |
2007-05-22 |
Tau-Metrix, Inc. |
Technique for evaluating a fabrication of a die and wafer
|
US7102363B2
(en)
*
|
2003-11-21 |
2006-09-05 |
Neocera, Inc. |
Method and system for non-contact measurement of microwave capacitance of miniature structures of integrated circuits
|
DE10358794B4
(en)
*
|
2003-12-12 |
2012-10-04 |
Eurocopter Deutschland Gmbh |
Near-field measurement method for printed circuit boards
|
WO2005081000A1
(en)
*
|
2004-02-23 |
2005-09-01 |
Asetronics Ag |
Method and apparatus for inspecting a printed circuit board assembly
|
US7250757B1
(en)
*
|
2004-09-16 |
2007-07-31 |
Radiation Monitoring Devices, Inc. |
Apparatus and method for circuit analysis using magnetic and electromagnetic stimulation of the circuit for dual magnetic field imaging
|
US7622931B2
(en)
*
|
2005-10-03 |
2009-11-24 |
University Of Utah Research Foundation |
Non-contact reflectometry system and method
|
KR100799161B1
(en)
*
|
2006-07-20 |
2008-01-29 |
마이크로 인스펙션 주식회사 |
Non-contact type single side probe and inspection apparatus and method for open/short test of pattern electrodes used thereof
|
US7496466B2
(en)
*
|
2007-01-19 |
2009-02-24 |
Huntron, Inc. |
System for fault determinations for high frequency electronic circuits
|
JP2009002788A
(en)
*
|
2007-06-21 |
2009-01-08 |
Panasonic Corp |
Electromagnetic wave measuring method and electromagnetic wave measuring device
|
US8069490B2
(en)
*
|
2007-10-16 |
2011-11-29 |
Oracle America, Inc. |
Detecting counterfeit electronic components using EMI telemetric fingerprints
|
FI122041B
(en)
*
|
2008-09-18 |
2011-07-29 |
Jot Automation Oy |
Test Adapter Configuration
|
US8643539B2
(en)
*
|
2008-11-19 |
2014-02-04 |
Nokomis, Inc. |
Advance manufacturing monitoring and diagnostic tool
|
US8136982B2
(en)
*
|
2009-03-16 |
2012-03-20 |
International Business Machines Corporation |
Thermal profiling to validate electronic device authenticity
|
US8242793B2
(en)
*
|
2009-03-17 |
2012-08-14 |
International Business Machines Corporation |
Electromagnetic profiling to validate electronic device authenticity
|
US8760185B2
(en)
*
|
2009-12-22 |
2014-06-24 |
Anthony J. Suto |
Low capacitance probe for testing circuit assembly
|
US8310256B2
(en)
*
|
2009-12-22 |
2012-11-13 |
Teradyne, Inc. |
Capacitive opens testing in low signal environments
|
US9205270B2
(en)
|
2010-06-28 |
2015-12-08 |
Nokomis, Inc |
Method and apparatus for the diagnosis and prognosis of active implants in or attached to biological hosts or systems
|
US8825823B2
(en)
|
2011-01-06 |
2014-09-02 |
Nokomis, Inc |
System and method for physically detecting, identifying, diagnosing and geolocating electronic devices connectable to a network
|
US10475754B2
(en)
*
|
2011-03-02 |
2019-11-12 |
Nokomis, Inc. |
System and method for physically detecting counterfeit electronics
|
US9059189B2
(en)
|
2011-03-02 |
2015-06-16 |
Nokomis, Inc |
Integrated circuit with electromagnetic energy anomaly detection and processing
|
FR2974634B1
(en)
*
|
2011-04-27 |
2014-01-17 |
Thales Sa |
METHOD FOR CONTROLLING THE OPERATION OF AN ELECTRONIC COMPONENT, ELECTRONIC DEVICE AND ELECTRONIC COMPUTER FOR CORRESPONDING INBOARDS
|
JP2013051379A
(en)
*
|
2011-08-31 |
2013-03-14 |
Panasonic Corp |
High-frequency module and inspection method of high-frequency module
|
US8896320B2
(en)
|
2011-08-31 |
2014-11-25 |
Infineon Technologies Ag |
Measuring device and a method for measuring a chip-to-chip-carrier connection
|
US8933722B2
(en)
*
|
2011-08-31 |
2015-01-13 |
Infineon Technologies Ag |
Measuring device and a method for measuring a chip-to-chip-carrier connection
|
US9285463B1
(en)
|
2011-12-12 |
2016-03-15 |
Nokomis, Inc. |
Method and apparatus for battle damage assessment of electric or electronic devices and systems
|
US9851386B2
(en)
|
2012-03-02 |
2017-12-26 |
Nokomis, Inc. |
Method and apparatus for detection and identification of counterfeit and substandard electronics
|
US9658314B2
(en)
|
2012-03-02 |
2017-05-23 |
Nokomis, Inc. |
System and method for geo-locating and detecting source of electromagnetic emissions
|
JP6171264B2
(en)
*
|
2012-03-30 |
2017-08-02 |
株式会社デンソー |
Imaging device
|
US9625509B1
(en)
|
2013-03-06 |
2017-04-18 |
Nokomis, Inc. |
Automated sensor system for RF shielding characterization
|
US9599576B1
(en)
|
2013-03-06 |
2017-03-21 |
Nokomis, Inc. |
Acoustic—RF multi-sensor material characterization system
|
US9500690B2
(en)
*
|
2013-11-07 |
2016-11-22 |
Lenovo Enterprise Solutions (Singapore) Pte. Ltd. |
Radio frequency and microwave imaging with a two-dimensional sensor array
|
WO2015089346A1
(en)
|
2013-12-13 |
2015-06-18 |
Battelle Memorial Institute |
Electronic component classification
|
US9772363B2
(en)
|
2014-02-26 |
2017-09-26 |
Nokomis, Inc. |
Automated analysis of RF effects on electronic devices through the use of device unintended emissions
|
EP2930523B1
(en)
*
|
2014-04-10 |
2016-11-16 |
D-Con Ab |
Contactless conductive interconnect testing
|
US9642014B2
(en)
|
2014-06-09 |
2017-05-02 |
Nokomis, Inc. |
Non-contact electromagnetic illuminated detection of part anomalies for cyber physical security
|
US10395032B2
(en)
|
2014-10-03 |
2019-08-27 |
Nokomis, Inc. |
Detection of malicious software, firmware, IP cores and circuitry via unintended emissions
|
US10448864B1
(en)
|
2017-02-24 |
2019-10-22 |
Nokomis, Inc. |
Apparatus and method to identify and measure gas concentrations
|
US10895592B2
(en)
*
|
2017-03-24 |
2021-01-19 |
Rosemount Aerospace Inc. |
Probe heater remaining useful life determination
|
US11060992B2
(en)
|
2017-03-24 |
2021-07-13 |
Rosemount Aerospace Inc. |
Probe heater remaining useful life determination
|
US10914777B2
(en)
|
2017-03-24 |
2021-02-09 |
Rosemount Aerospace Inc. |
Probe heater remaining useful life determination
|
US10789550B2
(en)
|
2017-04-13 |
2020-09-29 |
Battelle Memorial Institute |
System and method for generating test vectors
|
US11489847B1
(en)
|
2018-02-14 |
2022-11-01 |
Nokomis, Inc. |
System and method for physically detecting, identifying, and diagnosing medical electronic devices connectable to a network
|
US10962580B2
(en)
|
2018-12-14 |
2021-03-30 |
Rosemount Aerospace Inc. |
Electric arc detection for probe heater PHM and prediction of remaining useful life
|
US11061080B2
(en)
|
2018-12-14 |
2021-07-13 |
Rosemount Aerospace Inc. |
Real time operational leakage current measurement for probe heater PHM and prediction of remaining useful life
|
US10685226B1
(en)
*
|
2019-03-05 |
2020-06-16 |
Oracle International Corporation |
Detecting counterfeit components in utility system electronics based on EMI fingerprints
|
US11639954B2
(en)
|
2019-05-29 |
2023-05-02 |
Rosemount Aerospace Inc. |
Differential leakage current measurement for heater health monitoring
|
US11472562B2
(en)
|
2019-06-14 |
2022-10-18 |
Rosemount Aerospace Inc. |
Health monitoring of an electrical heater of an air data probe
|
CN112415358A
(en)
*
|
2019-08-22 |
2021-02-26 |
上海为彪汽配制造有限公司 |
Fault tracing method, storage medium, electronic device and system
|
US11930563B2
(en)
|
2019-09-16 |
2024-03-12 |
Rosemount Aerospace Inc. |
Monitoring and extending heater life through power supply polarity switching
|
EP4034895A4
(en)
*
|
2019-09-23 |
2023-10-18 |
Palitronica Inc. |
A method and apparatus for detection of counterfeit parts, compromised or tampered components or devices, tampered systems such as local communication networks, and for secure identification of components
|
US11293995B2
(en)
|
2020-03-23 |
2022-04-05 |
Rosemount Aerospace Inc. |
Differential leakage current measurement for heater health monitoring
|
US11630140B2
(en)
|
2020-04-22 |
2023-04-18 |
Rosemount Aerospace Inc. |
Prognostic health monitoring for heater
|
CN113777464A
(en)
*
|
2020-06-10 |
2021-12-10 |
深南电路股份有限公司 |
Circuit board function testing device, system and method
|
US11768225B2
(en)
|
2021-06-29 |
2023-09-26 |
International Business Machines Corporation |
Removable contactless probe
|