CA2088821A1 - Cooling structure for integrated circuit - Google Patents

Cooling structure for integrated circuit

Info

Publication number
CA2088821A1
CA2088821A1 CA2088821A CA2088821A CA2088821A1 CA 2088821 A1 CA2088821 A1 CA 2088821A1 CA 2088821 A CA2088821 A CA 2088821A CA 2088821 A CA2088821 A CA 2088821A CA 2088821 A1 CA2088821 A1 CA 2088821A1
Authority
CA
Canada
Prior art keywords
integrated circuit
liquid coolant
block
radiating surface
heat radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2088821A
Other languages
French (fr)
Other versions
CA2088821C (en
Inventor
Hironobu Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4054449A external-priority patent/JP2901408B2/en
Application filed by NEC Corp filed Critical NEC Corp
Publication of CA2088821A1 publication Critical patent/CA2088821A1/en
Application granted granted Critical
Publication of CA2088821C publication Critical patent/CA2088821C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/908—Fluid jets

Abstract

Disclosed is a cooling structure in which an integrated circuit is cooled by circulating liquid coolant in the vicinity of the integrated circuit, the structure having a minimum heat resistance between the integrated circuit and the coolant. The structure includes a cooling block having an inlet port and an outlet port for liquid coolant in an upper portion thereof.
The block has an opening portion on a side opposed to a heat radiating surface of the integrated circuit and an interior for accumulating the liquid coolant. The opening portion of the block is fixedly secured to the heat radiating surface of the integrated circuit. A nozzle mounted on the inlet port of the cooling block jets the liquid coolant to the heat radiating surface of the integrated circuit.
CA002088821A 1992-02-05 1993-02-04 Cooling structure for integrated circuit Expired - Fee Related CA2088821C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4054449A JP2901408B2 (en) 1991-05-30 1992-02-05 Integrated circuit cooling mechanism
JP54449/1992 1992-02-05

Publications (2)

Publication Number Publication Date
CA2088821A1 true CA2088821A1 (en) 1993-08-06
CA2088821C CA2088821C (en) 1999-09-07

Family

ID=12971012

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002088821A Expired - Fee Related CA2088821C (en) 1992-02-05 1993-02-04 Cooling structure for integrated circuit

Country Status (2)

Country Link
US (1) US5436501A (en)
CA (1) CA2088821C (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5780928A (en) * 1994-03-07 1998-07-14 Lsi Logic Corporation Electronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devices
US5831824A (en) * 1996-01-31 1998-11-03 Motorola, Inc. Apparatus for spray-cooling multiple electronic modules
US5675473A (en) * 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US5718117A (en) * 1996-04-10 1998-02-17 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5687577A (en) * 1996-04-10 1997-11-18 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5731542A (en) * 1996-05-23 1998-03-24 Motorola, Inc. Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate
US5907473A (en) * 1997-04-04 1999-05-25 Raytheon Company Environmentally isolated enclosure for electronic components
IT1293021B1 (en) * 1997-07-10 1999-02-11 Sme Elettronica Spa SEMICONDUCTOR POWER MODULE.
JPH11135973A (en) * 1997-10-31 1999-05-21 Nec Corp Cooling device
TW494314B (en) * 1999-12-22 2002-07-11 Cfph Llc Systems and methods for providing a trading interface
JP3857060B2 (en) * 2001-02-09 2006-12-13 株式会社東芝 Heating element cooling device
US7032392B2 (en) * 2001-12-19 2006-04-25 Intel Corporation Method and apparatus for cooling an integrated circuit package using a cooling fluid
EP1331665B1 (en) * 2002-01-26 2009-10-14 Danfoss Silicon Power GmbH Cooling apparatus
US7084495B2 (en) * 2003-10-16 2006-08-01 Intel Corporation Electroosmotic pumps using porous frits for cooling integrated circuit stacks
US7187550B1 (en) * 2005-09-14 2007-03-06 Sun Microsystems, Inc. Gasketed field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components
US7511957B2 (en) * 2006-05-25 2009-03-31 International Business Machines Corporation Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled
US7999375B2 (en) * 2006-10-11 2011-08-16 Formfactor, Inc. Electronic device with integrated micromechanical contacts and cooling system
US7834448B2 (en) * 2007-09-05 2010-11-16 Delphi Technologies, Inc. Fluid cooled semiconductor power module having double-sided cooling
US8490419B2 (en) * 2009-08-20 2013-07-23 United States Thermoelectric Consortium Interlocked jets cooling method and apparatus
JP5782741B2 (en) 2010-07-15 2015-09-24 富士通株式会社 Electronics
JP2013247354A (en) * 2012-05-23 2013-12-09 Samsung Electro-Mechanics Co Ltd Heat dissipation system for power module
EP3188230B1 (en) * 2015-12-30 2020-09-02 IMEC vzw Liquid cooling of electronic devices
US20230301020A1 (en) * 2022-03-18 2023-09-21 Baidu Usa Llc Chip to server packaging design for immersion systems

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138692A (en) * 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4573067A (en) * 1981-03-02 1986-02-25 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits
JPS61102883A (en) * 1984-10-25 1986-05-21 Asahi Optical Co Ltd Power supply circuit of recording pat for electronic camera
US4649990A (en) * 1985-05-06 1987-03-17 Hitachi, Ltd. Heat-conducting cooling module
JPH0797617B2 (en) * 1986-05-23 1995-10-18 株式会社日立製作所 Refrigerant leakage prevention device
US4734820A (en) * 1987-04-16 1988-03-29 Ncr Corporation Cryogenic packaging scheme
US4805420A (en) * 1987-06-22 1989-02-21 Ncr Corporation Cryogenic vessel for cooling electronic components
JPH065700B2 (en) * 1987-07-22 1994-01-19 株式会社日立製作所 Cooling device for electronic circuit devices
JP2786193B2 (en) * 1987-10-26 1998-08-13 株式会社日立製作所 Semiconductor cooling device
EP0341950B1 (en) * 1988-05-09 1994-09-14 Nec Corporation Flat cooling structure of integrated circuit
JPH0732222B2 (en) * 1988-10-06 1995-04-10 日本電気株式会社 Integrated circuit cooling structure
JPH0636421B2 (en) * 1988-09-21 1994-05-11 株式会社日立製作所 Semiconductor module and electronic computer using the same
JP2681288B2 (en) * 1988-11-02 1997-11-26 富士通株式会社 Superconducting device package
US4884169A (en) * 1989-01-23 1989-11-28 Technology Enterprises Company Bubble generation in condensation wells for cooling high density integrated circuit chips
JP2811884B2 (en) * 1990-03-20 1998-10-15 日本電気株式会社 Integrated circuit cooling device
US5166863A (en) * 1991-07-15 1992-11-24 Amdahl Corporation Liquid-cooled assembly of heat-generating devices and method for assembling and disassembling

Also Published As

Publication number Publication date
US5436501A (en) 1995-07-25
CA2088821C (en) 1999-09-07

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed