CA2091999A1 - Surface mount assembly of devices using adcon interconnections - Google Patents

Surface mount assembly of devices using adcon interconnections

Info

Publication number
CA2091999A1
CA2091999A1 CA2091999A CA2091999A CA2091999A1 CA 2091999 A1 CA2091999 A1 CA 2091999A1 CA 2091999 A CA2091999 A CA 2091999A CA 2091999 A CA2091999 A CA 2091999A CA 2091999 A1 CA2091999 A1 CA 2091999A1
Authority
CA
Canada
Prior art keywords
devices
adcon
pwb
encapsulated
reliability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2091999A
Other languages
French (fr)
Other versions
CA2091999C (en
Inventor
Donald William Dahringer
Alan Michael Lyons
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Donald William Dahringer
Alan Michael Lyons
American Telephone And Telegraph Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Donald William Dahringer, Alan Michael Lyons, American Telephone And Telegraph Company filed Critical Donald William Dahringer
Publication of CA2091999A1 publication Critical patent/CA2091999A1/en
Priority claimed from EP94308064A external-priority patent/EP0711103B1/en
Application granted granted Critical
Publication of CA2091999C publication Critical patent/CA2091999C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Abstract

This invention is an apparatus for and a process of batch assembly of sundry leaded or padded devices, encapsulated and non-encapsulated, onto a printed wiring board (PWB) (4), which exhibits significant improvements in both manufacturability and reliability. A pressure frame assembly apparatus permits an application of uniformly distributed pressures to a variety of leaded packages (2), and padded semiconductor chips (2) during cure of conductive adhesive (AdCons), and leads to the reduction of variations in initial interconnection resistance, and thereby to the enhancement of the reliability of AdCon interconnections, The pressures are applied to the devices by an external application of a fluid under pressure to a flexible, resiliently stretchable mem-brane (14), which conformably envelops outlines of the devices and adjacent areas of the PWB. The external application of pres sure enhances thermal conductivity needed for curing the AdCon, increases the range of processing parameters usable for this
CA002091999A 1991-09-06 1992-08-21 Surface mount assembly of devices using adcon interconnections Expired - Fee Related CA2091999C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US75570491A 1991-09-06 1991-09-06
US775,704 1991-09-06
EP94308064A EP0711103B1 (en) 1991-09-06 1994-11-02 Surface mount assembly of devices using AdCon interconnections

Publications (2)

Publication Number Publication Date
CA2091999A1 true CA2091999A1 (en) 1993-03-07
CA2091999C CA2091999C (en) 1996-06-04

Family

ID=26137370

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002091999A Expired - Fee Related CA2091999C (en) 1991-09-06 1992-08-21 Surface mount assembly of devices using adcon interconnections

Country Status (6)

Country Link
US (1) US5365656A (en)
EP (1) EP0556351B1 (en)
JP (1) JP2840697B2 (en)
CA (1) CA2091999C (en)
DE (1) DE69203089T2 (en)
WO (1) WO1993005634A1 (en)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0711103B1 (en) * 1991-09-06 2000-03-08 AT&T Corp. Surface mount assembly of devices using AdCon interconnections
US5579573A (en) * 1994-10-11 1996-12-03 Ford Motor Company Method for fabricating an undercoated chip electrically interconnected to a substrate
JPH08193188A (en) * 1995-01-18 1996-07-30 Mitsui Mining & Smelting Co Ltd Adhesive for copper foil and copper foil backed therewith
US5605547A (en) * 1995-03-27 1997-02-25 Micron Technology, Inc. Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor
US5564181A (en) * 1995-04-18 1996-10-15 Draper Laboratory, Inc. Method of fabricating a laminated substrate assembly chips-first multichip module
US5632434A (en) * 1995-06-29 1997-05-27 Regents Of The University Of California Pressure activated diaphragm bonder
US5653019A (en) * 1995-08-31 1997-08-05 Regents Of The University Of California Repairable chip bonding/interconnect process
TW388748B (en) * 1996-06-28 2000-05-01 Sintokogio Ltd Apparatus for setting a gap between glass substrates
JPH11291600A (en) * 1998-04-13 1999-10-26 Riso Kagaku Corp Reduced pressure printer
WO1999063794A1 (en) * 1998-06-02 1999-12-09 Siemens Audiologische Technik Gmbh A method of mounting a semiconductor die on a printed circuit board
US6449837B1 (en) 1999-10-29 2002-09-17 Tca, Inc. Method for attaching electronic devices to metallized glass printed circuit
AU3409702A (en) * 2000-10-24 2002-05-06 Nanopierce Technologies Inc Method and materials for printing particle-enhanced electrical contacts
AU2003269917A1 (en) * 2002-07-24 2004-02-09 Eggs In The Pipeline, Llc. Attachable modular electronic systems
JP4099761B2 (en) * 2003-01-30 2008-06-11 太陽誘電株式会社 Composition for electronic material, electronic article, and method of using composition for electronic material
US7814676B2 (en) 2008-01-18 2010-10-19 Rockwell Collins, Inc. Alignment system and method thereof
US8691043B2 (en) 2005-08-30 2014-04-08 Rockwell Collins, Inc. Substrate lamination system and method
US8118075B2 (en) 2008-01-18 2012-02-21 Rockwell Collins, Inc. System and method for disassembling laminated substrates
US8137498B2 (en) 2005-08-30 2012-03-20 Rockwell Collins Inc. System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure
US8603288B2 (en) 2008-01-18 2013-12-10 Rockwell Collins, Inc. Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination
US8936057B2 (en) 2005-08-30 2015-01-20 Rockwell Collins, Inc. Substrate lamination system and method
US9939526B2 (en) 2007-09-06 2018-04-10 Rockwell Collins, Inc. Display system and method using weather radar sensing
US9733349B1 (en) 2007-09-06 2017-08-15 Rockwell Collins, Inc. System for and method of radar data processing for low visibility landing applications
JP5431364B2 (en) 2008-01-18 2014-03-05 ロックウェル・コリンズ・インコーポレーテッド Substrate stacking system and method
US8411235B1 (en) 2010-03-16 2013-04-02 Rockwell Collins, Inc. Displays for three-dimensional imaging
US8419496B1 (en) 2010-03-18 2013-04-16 Rockwell Collins, Inc. Display panel alignment system
US8486535B1 (en) 2010-05-24 2013-07-16 Rockwell Collins, Inc. Systems and methods for adherable and removable thin flexible glass
JP5709435B2 (en) * 2010-08-23 2015-04-30 キヤノン株式会社 Imaging module and camera
US8647727B1 (en) 2012-06-29 2014-02-11 Rockwell Colllins, Inc. Optical assembly with adhesive layers configured for diffusion
US9262932B1 (en) 2013-04-05 2016-02-16 Rockwell Collins, Inc. Extended runway centerline systems and methods
US9981460B1 (en) 2014-05-06 2018-05-29 Rockwell Collins, Inc. Systems and methods for substrate lamination
US10928510B1 (en) 2014-09-10 2021-02-23 Rockwell Collins, Inc. System for and method of image processing for low visibility landing applications
US9824995B2 (en) * 2014-09-29 2017-11-21 Nxp Usa, Inc. Flexible circuit leads in packaging for radio frequency devices
US10705201B1 (en) 2015-08-31 2020-07-07 Rockwell Collins, Inc. Radar beam sharpening system and method
US10228460B1 (en) 2016-05-26 2019-03-12 Rockwell Collins, Inc. Weather radar enabled low visibility operation system and method
US10353068B1 (en) 2016-07-28 2019-07-16 Rockwell Collins, Inc. Weather radar enabled offshore operation system and method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2960147A (en) * 1958-04-15 1960-11-15 Us Rubber Co Heat sealing device
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
DE3342279C1 (en) * 1983-11-23 1985-06-05 ANT Nachrichtentechnik GmbH, 7150 Backnang Soldering method and device for carrying out the method
US4868637A (en) * 1985-11-26 1989-09-19 Clements James R Electronic device including uniaxial conductive adhesive and method of making same
US4667401A (en) * 1985-11-26 1987-05-26 Clements James R Method of making an electronic device using an uniaxial conductive adhesive
US5108532A (en) * 1988-02-02 1992-04-28 Northrop Corporation Method and apparatus for shaping, forming, consolidating and co-consolidating thermoplastic or thermosetting composite products
DE3839396A1 (en) * 1988-11-22 1990-05-23 Nixdorf Computer Ag Method and device for soldering electrical components lying on a printed circuit board to the printed circuit board

Also Published As

Publication number Publication date
EP0556351B1 (en) 1995-06-21
JPH06501821A (en) 1994-02-24
DE69203089D1 (en) 1995-07-27
DE69203089T2 (en) 1996-02-01
US5365656A (en) 1994-11-22
WO1993005634A1 (en) 1993-03-18
EP0556351A1 (en) 1993-08-25
CA2091999C (en) 1996-06-04
JP2840697B2 (en) 1998-12-24

Similar Documents

Publication Publication Date Title
CA2091999A1 (en) Surface mount assembly of devices using adcon interconnections
US6197665B1 (en) Lamination machine and method to laminate a coverlay to a microelectronic package
CA2108868A1 (en) Printed circuit board with electric elements mounted thereon
CA2192076A1 (en) IC Card and IC Module
EP0263277A3 (en) A flexible electrical connection and method of making same
EP0926939A3 (en) Electronic circuit apparatus and method for assembling the same
TW370694B (en) Semiconductor device
EP1067598A4 (en) Method of packaging semiconductor device using anisotropic conductive adhesive
ATE179833T1 (en) METHOD FOR FLEXIBLE ASSEMBLY OF A PIEZOELECTRIC COMPONENT
EP0683517A3 (en) Semiconductor device having semiconductor chip bonded to circuit board through bumps and process of mounting thereof.
EP0711103B1 (en) Surface mount assembly of devices using AdCon interconnections
US5605547A (en) Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor
GB2285883B (en) Lead frame for semiconductor devices
EP0407585A4 (en) Semiconductor device sealed with resin and a method of producing the same
EP0997944A3 (en) Printed circuit board with integrated circuit devices mounted on both sides thereof
JPH0455334B2 (en)
CA2134575A1 (en) Surface Mount Assembly of Devices Using AdCon Interconnections
EP0376620A3 (en) Method for processing plastic packaged electronic devices
GB2208569B (en) Method for connecting leadless chip packages and articles
MY112620A (en) No fixture method to cure die attach for bonding ic dies to substrates
MY120098A (en) Method and pellet for encapsulating lead frames and device for manufacturing pellets
GB9420191D0 (en) Electronic circuit packaging
MY129172A (en) Epoxy mold compound and method
KR960016658A (en) External lead bonding method and device
JPS54137971A (en) Resin-sealed type semiconductor device

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed