CA2092636C - Bulk metal chip resistor - Google Patents
Bulk metal chip resistorInfo
- Publication number
- CA2092636C CA2092636C CA002092636A CA2092636A CA2092636C CA 2092636 C CA2092636 C CA 2092636C CA 002092636 A CA002092636 A CA 002092636A CA 2092636 A CA2092636 A CA 2092636A CA 2092636 C CA2092636 C CA 2092636C
- Authority
- CA
- Canada
- Prior art keywords
- resistor
- terminals
- resistor body
- central portion
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 title abstract description 24
- 239000002184 metal Substances 0.000 title abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 238000007747 plating Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 8
- 238000010276 construction Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 5
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 3
- 230000000284 resting effect Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 15
- 238000000576 coating method Methods 0.000 abstract description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
Abstract
A bulk metal chip resistor includes an elongated resistor element having terminals at its opposite ends. The terminals are formed by coating the opposite ends of the resistor element with a conductive material. Insulative material may be molded around the center portion of the resistor to provide structural support, and the ends of the resistor can be bent downwardly so as to cause the central portion to be raised when the resistor is mounted on a circuit board. A modified form of the invention includes wrapping the resistance element around the ends of a rectangular substrate so that the substrate provides structural support. Another modified form includes placing four terminals at the four corners of the resistor element.
Description
Title: BULR METAL CHIP RESISTOR
BACKGROUND OF THE INVENTION
The present invention relates to a bulk metal chip resistor, and particularly to a bulk metal chip resistor that can be surface mounted on a circuit board.
Bulk metal resistors have been known in the prior art, and an example of such a resistor is shown in United States Patent 4,467,311. The resistor in that patent includes a flat metal plate having a plurality of slots extending inwardly from its lateral edges. A
pair of electrical leads are welded or otherwise operatively secured to the opposite ends of the plate.
In prior art axial lead resistors such as shown in Patent 4,467,311, the bulk metal resistance element or plate is generally formed from a material having a low temperature coefficient of resistance (TCR) often in the range of 25 ppm/ C. The axial leads welded to the resistor are usually formed of copper or other highly conductive metals having a very high TCR which is generally above 150 ppm/ C.
The axial leads of prior art resistors influence both the overall resistance value and the overall TCR
of the resistor. The leads affect the overall TCR of the resistor in direct proportion to the ratio of the resistance value of the leads to the resistance value of the resistance element. In lower value resistors (for example 1 ohm or less) the resistance value of the long axial leads is high compared to the resistance value of the low value resistance element.
As a result, in these lower value resistors, the leads significantly raise the overall TCR of the resistor above the lower TCR of the resistance element.
BACKGROUND OF THE INVENTION
The present invention relates to a bulk metal chip resistor, and particularly to a bulk metal chip resistor that can be surface mounted on a circuit board.
Bulk metal resistors have been known in the prior art, and an example of such a resistor is shown in United States Patent 4,467,311. The resistor in that patent includes a flat metal plate having a plurality of slots extending inwardly from its lateral edges. A
pair of electrical leads are welded or otherwise operatively secured to the opposite ends of the plate.
In prior art axial lead resistors such as shown in Patent 4,467,311, the bulk metal resistance element or plate is generally formed from a material having a low temperature coefficient of resistance (TCR) often in the range of 25 ppm/ C. The axial leads welded to the resistor are usually formed of copper or other highly conductive metals having a very high TCR which is generally above 150 ppm/ C.
The axial leads of prior art resistors influence both the overall resistance value and the overall TCR
of the resistor. The leads affect the overall TCR of the resistor in direct proportion to the ratio of the resistance value of the leads to the resistance value of the resistance element. In lower value resistors (for example 1 ohm or less) the resistance value of the long axial leads is high compared to the resistance value of the low value resistance element.
As a result, in these lower value resistors, the leads significantly raise the overall TCR of the resistor above the lower TCR of the resistance element.
- 2 - ~ 0 92636 -Another disadvantage of prior art axial lead resistors is in the manner in which heat is dissipated through the leads of the resistor to the board on which the resistor is mounted. The length of the leads retards the conducticn of heat thereby causing the resistor to have a lower than desired wattage rating for any given size.
BRIEF DESCRIPTION OF THE INVENTION
Therefore, a primary object of the present invention is the provision of an improved bulk metal resistor.
A further object of the present invention is the provision of an improved bulk metal resistor which eliminates the need for axially extending terminals at the opposite ends thereof.
A further object of the present invention is the provision of an improved bulk metal resistor which utilizes terminals having a negligible effect upon the TCR of the completed resistor (with resistance element plus leads), and which cause the resulting entire resistor to have a TCR closely approximating the TCR
of the resistance element.
A further object of the present invention is the provision of an improved bulk metal resistor which is made from one contiguous piece of resistance metal.
A further object of the present invention is the provision of an improved bulk metal res~istor which reduces the cost of material in the resistor by eliminating the separate terminals.
A further object of the present invention is the provision of an improved bulk metal resistor which reduces the cost of labor in production by reducing the number of parts to be assembled.
~ 3 - 20 9 2 6 3 6 ' A further object of the present invention is the provision of a bu~k metal resistor which increases the heat dissipation capabilities of the resistor by having the resistance material itself closely adjacent the board on which it is mounted and in good heat conducting contact therewith so as to provide a very good heat sink.
A further object of the present invention is the provision of an improved bulk metal resistor wherein the size and design of the part will lend itself to being surface mounted on a mounting board.
A further object of the present invention is the provision of a bulk metal chip resistor which is easily solderable on a surface mount board.
A further object of the present invention is the provision of an improved bulk metal chip resistor which is simple to manufacture, efficient in use, and durable in construction.
SUMMARY OF THE INVENTION
The present invention utilizes a resistance element comprised of an elongated rectangular plate of resistance material. A preferred material for this purpose is a product manufactured by Carpenter Technology Corporation under the trademark "Evanohm".
This product is designated "Evanohm Alloy R" and is comprised of 75% nickel, 20% chromium, 2.5% aluminum, and 2.5~ copper. This material has a TCR of approximately 25 ppm/ C. The first step in the construction of the resistor is to coat the rectangular resistance element with a nickel undercoat and a tin-lead overcoat by placing the plate in a barrel plater so that the plating material covers the - 4 - 20 9~636 entire surface of the part. This process makes the plating operation more economical than in prior methods. The coating is then removed from the central portion of the rectangular plate so as to leave two plated terminal elements at the opposite ends of the resistance plate. One way to remove the plating from the center of the resistance element is to use a laser beam to cut grooves into the edges of the central portion of the resistance plate, so as to cause the resistance plate to have the desired resistance value.
The laser will burn away the plating at the central portion of the resistor so as to prevent the plating on the two opposite ends from being in electrical contact with one another except through the "~vanohm"
resistor element.
It is also possible to remove the plating by using a wire brush to brush the flat central surface of the resistance element so as to remove the conductive plating at the center of the resistance element. Also, the cutting of the grooves into the side edges of the resistance element can be accom-plished by other means such as stamping, cutting with a diamond wheel, machining, or etching.
The central portion of the resistance element optionally can be coated with an insulative dielectric material which provides structure and support to the element, but it is not essential that such an insulative material be used unless the-~foil is too thin.
In the preferred form of the resistor, the ends of the resistance element are bent downwardly so as to cause the central portion of the resistance element to be supported above the board on which the device is mounted.
- s - ~o g~636 A modified form of the invention contemplates wrapping the ends of the plated resistance element-around the ends of a substrate and crimping them in place so that the substrate will provide structural support for the resistance element. Then the conductive plating is removed from the center of the resistance element, and an insulative material is coated over the exposed center of the resistance element.
Another modified form of the invention contemplates using the flat resistance element with the metal coating terminals on the ends of the resistance element, but without bending the resistance element as in the above described preferred embodiment. Instead, the resistance element remains in a single plane. This is the most simple form of Applicants' invention.
A further modified form of the invention contemplates placing separate termi n~l S at each of the four corners of the resistance element, with each of the four terminals being separate from one another.
This permits the use of a four lead bulk chip resistor.
BRIEF DESCRIPTION OF THE FIGURES OF THE DRAWINGS
Figure 1 is a perspective view of the preferred embodiment of the present invention.
Figure 2 is a top plan view of the resistance element used in the first step of the manufacturing process.
Figure 3 is a plan view of the resistance element of Figure 2 after a coating of conductive material has been placed thereon.
- 6 - ~Q Q 2 ~ 3 6 Figure 4 is a sectional view taken along line 4-4 of Figure 3.
Figure 5 is a plan view of the resistance element shown in Figure 3, but showing the central portion of the conductive coating removed to expose the original resistor element.
Figure 6 is a sectional view taXen along line 6-6 of Figure 5.
Figure 7 is a top plan view of the resistance element after the grooves have been cut in the resistance element and after the ends of the resistance element have been bent downwardly.
Figure 8 is a sectional view taken along line 8-8 of Figure 7.
Figure 9 is a top plan view of the resistor after the insulative coating has been placed thereon.
Figure 10 is a sectional view taken along line 10-10 of Figure 9.
Figure 11 is a perspective view of a modified form of the present invention.
Figure 12 is a sectional view taken along line 12-12 of Figure 11.
Figure 13 is a top plan view of a modified form of the present invention.
Figure 14 is a sectional view taken along line 14-14 of Figure 13.
Figure 15 is a top plan view of a modified form of the present invention.
Figure 16 is a sectional view taken along line 16-16 of Figure 15.
Figure 17 is a sectional view taken along line 17-17 of Figure 15.
_ 7 _ ~ n 9 ~ 6 3 6 DETAILED DESCRIPTION OF PREFERRED EMBODIMENT
Referring to the drawings, the numeral 10 generally designates a bulk metal chip resistor which is the preferred embodiment of the present invention.
Resistor 10 includes a resistance body 12 (Figure 2) which is rectangular in shape and which includes opposite side edges 20, 22, a first end 24, and a second end 26. On the ends of resistor 10 are a pair of conductive terminals 14, 16 which comprise a coating of electrically conductive material which has been coated over the ends 24, 26 of resistance body 12. An insulative material 18 is molded around the center portion of the resistance body 12.
The steps in the construction of resistor 10 are shown in Figures 2-10. Initially the resistance body 12 is formed into the rectangular shape shown in Figure 2. The resistance body 12 is manufactured from a resistance material such as the "Evanohm Alloy R"
material described above. This resistance material usually has a thickness of from 1 mill to 7 or 8 mills, depending upon the resulting resistance which is desired for the completed resistor. If the material is 3 mills or greater, it gënerally has sufficient rigidity to be self-supporting, but a resistance material less than 3 mills may require additional support from a substrate as shown in later embodiments below. For example, a resistor manufactured by this process could be -formed into a resistance element 3 mills thick and having dimensions of .250 inches by .100 inches. Slots can be cut in the sides of such a resistance element to increase its original resistance value of approximately .04 ohms to a resulting resistance of as high as 2.6 ohms. Lower 20 ~636 values could be obtained by using thicker resistance material. The preferred thickness would be approximately 6 mills because this would provide more than adequate strength and still produce a resistance range of from .02 ohms to 1.4 ~hms in the .250 inch by .100 inch size. Different chip resistor sizes would have different value ranges.
The second step in the manufacture of the resistor is the coating of the resistance element 12 with a conductive coating 28 (Figs. 3 and 4). This conductive coating preferably is a two-coat process utilizing a nickel undercoat and a tin-lead overcoat.
The plating covers the entire surface of the part and is accomplished by placing the resistance elements 12 in a barrel plater. This makes the plating operation very economical and simple. The thickness of the resulting coating 28 is substantially less than the thickness of the resistance element 12, resembling a coat of conductive paint.
Figures 5 and 6 show the next step in the manufacturing process. The coating material 28 is removed from the exposed central portion 34 of the resistor, leaving two terminals 14, 16 at the opposite ends of the resistance element. The exposed portion 34 may be produced by wire brushing the resistance element, or it can also be produced by using laser beams to cut grooves or slots into the edges of the resistance element 12. This cutting s~ep is shown in Figures 7 and 8. A plurality of grooves or slots 36 are alternatively cut into the opposite edges of the central portion 34 of the resistance element 12 so as to increase the resistance of the resistance element 12 to the desired value. Also, the ends of the 9 2nq2~36 resistance element 12 are bent downwardly as can be seen in Figure 8 so as to enable the terminals 14, 16 to engage and directly contact the contact pads on a circuit board such as circuit board 37 shown in Figure 1. The slots 36 are cut in the central portion 34 of the resistor so as to achieve the desired resistance value. These slots 36 can be cut by laser beems, or they can be cut by stamping, cutting with a diamond wheel, machining, or etching.
The final step of construction involves the molding of a dielectric insulation material 18 around the central portion 34 of the resistor as shown in Figures 9 and 10 so as to protect the resistance element 12 from the outside elements.
Several unique advantages are obtained by the bulk metal chip resistor 10 described above. Since the resistor is made from one contiguous piece of metal, and since the terminals 14, 16 comprise plated conductive material coated over the ends of the resistance element 12, the heat generated by I2R
losses is quickly conducted from the center of the resistor to the terminals where it is dissipated to the Printed Circuit Board 37. This allows the part to have a higher wattage rating for its size than would be obtainable with an axial lead resistor such as shown in U.S. Patent 4,467,311.
The terminals 14, 16 are short and wide which allows this design to be used for surface mounting.
The coating of the part with insulative material 18 helps maintain its mechanical integrity and the terminals 14, 16 are slightly bent to make certain that the part will solder easily to a flat PC Board.
~ ~2636 The TCR of the resistance element 20 is approximately 25 ppm/ C, whereas the TCR of the conductive plating material 28 is substantially higher, on the order of 1500 to 2000 ppm/ C. However, because the terminals 14/ 16 are very thinly coated with the conductive material 28, the distance through which the current must pass comprises only the thickness of the coating material 14, 16, and is relatively small compared to the overall length of the resistance element 20. As a result of these dimensions, the resulting TCR of the entire resistor 10 is very close to the TCR of the resistance material 20. That is, the electrical conductive material of terminals 14, 16 has a negligible effect upon the overall resulting TCR-of the resistor. This makes it possible to make a low value resistor (for example 1 ohm or less) having a much lower TCR than comparably sized resistors manufactured with axially extending leads such as shown in U.S. Patent 4,467,311.
Referring to Figures 11 and 12, a modified form 38 of the resistor is shown. Resistor 38 utilizes a substrate 40 of alumina or other ceramic or plastic material. A rectangular resistor element 42 includes U-shaped ends 44, 46 which are wrapped around and crimped over the ends of the substrate 40 so as to attach the resistance element 42 to the substrate 40.
The conductive leads 48, 50 are plated conductive material coated onto resistance element 42 in the manner described previously for the device shown in Figures 1-10. Resistance element 42 can be solid as shown in the drawings, or can be cut with slots to achieve the desired resistance value in the same manner as described for the embodiment of Figures 1-- 11 - 2~ q ~6 3 6 10. An insulative material 52 is coated over the central portion of resistance element 42 so as to protect it from the elements.
Referring to Figures 13 and 14, the simplest form of Applicants' invention s shown and is deslgnated by the numeral 54. Resistor 54 is similar in construction to the resistor shown in Figures 1-10, with the exception that it does not include an insulative protective cover over the central portion of the resistor, and the ends of the resistor are not bent downwardly as is the case with resistor 10 shown in Figures 1-10. Resistor 54 includes a rectangular resistor element 56 having conductive terminals 58, 60 formed at the opposite ends thereof. Slots 62 are cut into the edges of resistance element 56 so as to achieve the desired resistance value for the resistor 54.
The resistor of the present invention can also be constructed to have four terminals rather than two.
Such a modified form of Applicants' invention is shown in Figures 15-17 and is designated by the numeral 64.
Resistor 64 includes a resistance element 66 similar to that shown in the prior resistors of Figures 1-14.
Grooves or slots 76 are cut in the edges of resistance element 66. The four corners of the resistance element 66 are provided with a first terminal 68, a second terminal 70, a third terminal 72, and a fourth terminal 74. These terminals are formed of conductive material in the same manner as the resistors shown in Figures 1-14. However, the terminals 68, 70, 72, 74 are separated from one another by brushing away or otherwise removing the conductive plating material therebetween so that each of the four terminals is - 12 _ 2R ~63~
free from electrical connection with one another. An alternative construction (not shown) could be made by using a laser to cut an axially extending slot in the appropriate ends of resistance element 66 for the purpose of separating terminals 68, 72 and terminals 70, 74. An example of a use of a four terminal resistor would be to utilize terminals 68, 70 as current leads connected to a source of current, and to utilize terminals 72, 74 as voltage leads for measuring voltage across the resistor.
All of the foregoing modified forms of the invention make possible the production of a completed low value resistor which has a TCR closely approximating the temperature coefficient of the resistor element. The terminals at the ends of the resistors have a negligible effect on the overall TCR
of the resulting resistor. While the termin~ls are described as having been made by the preferred method of tumbling in a barrel plater, other methods of coating could be utilized such as printing or other methods. Thus, it can be seen that the device accomplishes at least all of its stated objectives.
BRIEF DESCRIPTION OF THE INVENTION
Therefore, a primary object of the present invention is the provision of an improved bulk metal resistor.
A further object of the present invention is the provision of an improved bulk metal resistor which eliminates the need for axially extending terminals at the opposite ends thereof.
A further object of the present invention is the provision of an improved bulk metal resistor which utilizes terminals having a negligible effect upon the TCR of the completed resistor (with resistance element plus leads), and which cause the resulting entire resistor to have a TCR closely approximating the TCR
of the resistance element.
A further object of the present invention is the provision of an improved bulk metal resistor which is made from one contiguous piece of resistance metal.
A further object of the present invention is the provision of an improved bulk metal res~istor which reduces the cost of material in the resistor by eliminating the separate terminals.
A further object of the present invention is the provision of an improved bulk metal resistor which reduces the cost of labor in production by reducing the number of parts to be assembled.
~ 3 - 20 9 2 6 3 6 ' A further object of the present invention is the provision of a bu~k metal resistor which increases the heat dissipation capabilities of the resistor by having the resistance material itself closely adjacent the board on which it is mounted and in good heat conducting contact therewith so as to provide a very good heat sink.
A further object of the present invention is the provision of an improved bulk metal resistor wherein the size and design of the part will lend itself to being surface mounted on a mounting board.
A further object of the present invention is the provision of a bulk metal chip resistor which is easily solderable on a surface mount board.
A further object of the present invention is the provision of an improved bulk metal chip resistor which is simple to manufacture, efficient in use, and durable in construction.
SUMMARY OF THE INVENTION
The present invention utilizes a resistance element comprised of an elongated rectangular plate of resistance material. A preferred material for this purpose is a product manufactured by Carpenter Technology Corporation under the trademark "Evanohm".
This product is designated "Evanohm Alloy R" and is comprised of 75% nickel, 20% chromium, 2.5% aluminum, and 2.5~ copper. This material has a TCR of approximately 25 ppm/ C. The first step in the construction of the resistor is to coat the rectangular resistance element with a nickel undercoat and a tin-lead overcoat by placing the plate in a barrel plater so that the plating material covers the - 4 - 20 9~636 entire surface of the part. This process makes the plating operation more economical than in prior methods. The coating is then removed from the central portion of the rectangular plate so as to leave two plated terminal elements at the opposite ends of the resistance plate. One way to remove the plating from the center of the resistance element is to use a laser beam to cut grooves into the edges of the central portion of the resistance plate, so as to cause the resistance plate to have the desired resistance value.
The laser will burn away the plating at the central portion of the resistor so as to prevent the plating on the two opposite ends from being in electrical contact with one another except through the "~vanohm"
resistor element.
It is also possible to remove the plating by using a wire brush to brush the flat central surface of the resistance element so as to remove the conductive plating at the center of the resistance element. Also, the cutting of the grooves into the side edges of the resistance element can be accom-plished by other means such as stamping, cutting with a diamond wheel, machining, or etching.
The central portion of the resistance element optionally can be coated with an insulative dielectric material which provides structure and support to the element, but it is not essential that such an insulative material be used unless the-~foil is too thin.
In the preferred form of the resistor, the ends of the resistance element are bent downwardly so as to cause the central portion of the resistance element to be supported above the board on which the device is mounted.
- s - ~o g~636 A modified form of the invention contemplates wrapping the ends of the plated resistance element-around the ends of a substrate and crimping them in place so that the substrate will provide structural support for the resistance element. Then the conductive plating is removed from the center of the resistance element, and an insulative material is coated over the exposed center of the resistance element.
Another modified form of the invention contemplates using the flat resistance element with the metal coating terminals on the ends of the resistance element, but without bending the resistance element as in the above described preferred embodiment. Instead, the resistance element remains in a single plane. This is the most simple form of Applicants' invention.
A further modified form of the invention contemplates placing separate termi n~l S at each of the four corners of the resistance element, with each of the four terminals being separate from one another.
This permits the use of a four lead bulk chip resistor.
BRIEF DESCRIPTION OF THE FIGURES OF THE DRAWINGS
Figure 1 is a perspective view of the preferred embodiment of the present invention.
Figure 2 is a top plan view of the resistance element used in the first step of the manufacturing process.
Figure 3 is a plan view of the resistance element of Figure 2 after a coating of conductive material has been placed thereon.
- 6 - ~Q Q 2 ~ 3 6 Figure 4 is a sectional view taken along line 4-4 of Figure 3.
Figure 5 is a plan view of the resistance element shown in Figure 3, but showing the central portion of the conductive coating removed to expose the original resistor element.
Figure 6 is a sectional view taXen along line 6-6 of Figure 5.
Figure 7 is a top plan view of the resistance element after the grooves have been cut in the resistance element and after the ends of the resistance element have been bent downwardly.
Figure 8 is a sectional view taken along line 8-8 of Figure 7.
Figure 9 is a top plan view of the resistor after the insulative coating has been placed thereon.
Figure 10 is a sectional view taken along line 10-10 of Figure 9.
Figure 11 is a perspective view of a modified form of the present invention.
Figure 12 is a sectional view taken along line 12-12 of Figure 11.
Figure 13 is a top plan view of a modified form of the present invention.
Figure 14 is a sectional view taken along line 14-14 of Figure 13.
Figure 15 is a top plan view of a modified form of the present invention.
Figure 16 is a sectional view taken along line 16-16 of Figure 15.
Figure 17 is a sectional view taken along line 17-17 of Figure 15.
_ 7 _ ~ n 9 ~ 6 3 6 DETAILED DESCRIPTION OF PREFERRED EMBODIMENT
Referring to the drawings, the numeral 10 generally designates a bulk metal chip resistor which is the preferred embodiment of the present invention.
Resistor 10 includes a resistance body 12 (Figure 2) which is rectangular in shape and which includes opposite side edges 20, 22, a first end 24, and a second end 26. On the ends of resistor 10 are a pair of conductive terminals 14, 16 which comprise a coating of electrically conductive material which has been coated over the ends 24, 26 of resistance body 12. An insulative material 18 is molded around the center portion of the resistance body 12.
The steps in the construction of resistor 10 are shown in Figures 2-10. Initially the resistance body 12 is formed into the rectangular shape shown in Figure 2. The resistance body 12 is manufactured from a resistance material such as the "Evanohm Alloy R"
material described above. This resistance material usually has a thickness of from 1 mill to 7 or 8 mills, depending upon the resulting resistance which is desired for the completed resistor. If the material is 3 mills or greater, it gënerally has sufficient rigidity to be self-supporting, but a resistance material less than 3 mills may require additional support from a substrate as shown in later embodiments below. For example, a resistor manufactured by this process could be -formed into a resistance element 3 mills thick and having dimensions of .250 inches by .100 inches. Slots can be cut in the sides of such a resistance element to increase its original resistance value of approximately .04 ohms to a resulting resistance of as high as 2.6 ohms. Lower 20 ~636 values could be obtained by using thicker resistance material. The preferred thickness would be approximately 6 mills because this would provide more than adequate strength and still produce a resistance range of from .02 ohms to 1.4 ~hms in the .250 inch by .100 inch size. Different chip resistor sizes would have different value ranges.
The second step in the manufacture of the resistor is the coating of the resistance element 12 with a conductive coating 28 (Figs. 3 and 4). This conductive coating preferably is a two-coat process utilizing a nickel undercoat and a tin-lead overcoat.
The plating covers the entire surface of the part and is accomplished by placing the resistance elements 12 in a barrel plater. This makes the plating operation very economical and simple. The thickness of the resulting coating 28 is substantially less than the thickness of the resistance element 12, resembling a coat of conductive paint.
Figures 5 and 6 show the next step in the manufacturing process. The coating material 28 is removed from the exposed central portion 34 of the resistor, leaving two terminals 14, 16 at the opposite ends of the resistance element. The exposed portion 34 may be produced by wire brushing the resistance element, or it can also be produced by using laser beams to cut grooves or slots into the edges of the resistance element 12. This cutting s~ep is shown in Figures 7 and 8. A plurality of grooves or slots 36 are alternatively cut into the opposite edges of the central portion 34 of the resistance element 12 so as to increase the resistance of the resistance element 12 to the desired value. Also, the ends of the 9 2nq2~36 resistance element 12 are bent downwardly as can be seen in Figure 8 so as to enable the terminals 14, 16 to engage and directly contact the contact pads on a circuit board such as circuit board 37 shown in Figure 1. The slots 36 are cut in the central portion 34 of the resistor so as to achieve the desired resistance value. These slots 36 can be cut by laser beems, or they can be cut by stamping, cutting with a diamond wheel, machining, or etching.
The final step of construction involves the molding of a dielectric insulation material 18 around the central portion 34 of the resistor as shown in Figures 9 and 10 so as to protect the resistance element 12 from the outside elements.
Several unique advantages are obtained by the bulk metal chip resistor 10 described above. Since the resistor is made from one contiguous piece of metal, and since the terminals 14, 16 comprise plated conductive material coated over the ends of the resistance element 12, the heat generated by I2R
losses is quickly conducted from the center of the resistor to the terminals where it is dissipated to the Printed Circuit Board 37. This allows the part to have a higher wattage rating for its size than would be obtainable with an axial lead resistor such as shown in U.S. Patent 4,467,311.
The terminals 14, 16 are short and wide which allows this design to be used for surface mounting.
The coating of the part with insulative material 18 helps maintain its mechanical integrity and the terminals 14, 16 are slightly bent to make certain that the part will solder easily to a flat PC Board.
~ ~2636 The TCR of the resistance element 20 is approximately 25 ppm/ C, whereas the TCR of the conductive plating material 28 is substantially higher, on the order of 1500 to 2000 ppm/ C. However, because the terminals 14/ 16 are very thinly coated with the conductive material 28, the distance through which the current must pass comprises only the thickness of the coating material 14, 16, and is relatively small compared to the overall length of the resistance element 20. As a result of these dimensions, the resulting TCR of the entire resistor 10 is very close to the TCR of the resistance material 20. That is, the electrical conductive material of terminals 14, 16 has a negligible effect upon the overall resulting TCR-of the resistor. This makes it possible to make a low value resistor (for example 1 ohm or less) having a much lower TCR than comparably sized resistors manufactured with axially extending leads such as shown in U.S. Patent 4,467,311.
Referring to Figures 11 and 12, a modified form 38 of the resistor is shown. Resistor 38 utilizes a substrate 40 of alumina or other ceramic or plastic material. A rectangular resistor element 42 includes U-shaped ends 44, 46 which are wrapped around and crimped over the ends of the substrate 40 so as to attach the resistance element 42 to the substrate 40.
The conductive leads 48, 50 are plated conductive material coated onto resistance element 42 in the manner described previously for the device shown in Figures 1-10. Resistance element 42 can be solid as shown in the drawings, or can be cut with slots to achieve the desired resistance value in the same manner as described for the embodiment of Figures 1-- 11 - 2~ q ~6 3 6 10. An insulative material 52 is coated over the central portion of resistance element 42 so as to protect it from the elements.
Referring to Figures 13 and 14, the simplest form of Applicants' invention s shown and is deslgnated by the numeral 54. Resistor 54 is similar in construction to the resistor shown in Figures 1-10, with the exception that it does not include an insulative protective cover over the central portion of the resistor, and the ends of the resistor are not bent downwardly as is the case with resistor 10 shown in Figures 1-10. Resistor 54 includes a rectangular resistor element 56 having conductive terminals 58, 60 formed at the opposite ends thereof. Slots 62 are cut into the edges of resistance element 56 so as to achieve the desired resistance value for the resistor 54.
The resistor of the present invention can also be constructed to have four terminals rather than two.
Such a modified form of Applicants' invention is shown in Figures 15-17 and is designated by the numeral 64.
Resistor 64 includes a resistance element 66 similar to that shown in the prior resistors of Figures 1-14.
Grooves or slots 76 are cut in the edges of resistance element 66. The four corners of the resistance element 66 are provided with a first terminal 68, a second terminal 70, a third terminal 72, and a fourth terminal 74. These terminals are formed of conductive material in the same manner as the resistors shown in Figures 1-14. However, the terminals 68, 70, 72, 74 are separated from one another by brushing away or otherwise removing the conductive plating material therebetween so that each of the four terminals is - 12 _ 2R ~63~
free from electrical connection with one another. An alternative construction (not shown) could be made by using a laser to cut an axially extending slot in the appropriate ends of resistance element 66 for the purpose of separating terminals 68, 72 and terminals 70, 74. An example of a use of a four terminal resistor would be to utilize terminals 68, 70 as current leads connected to a source of current, and to utilize terminals 72, 74 as voltage leads for measuring voltage across the resistor.
All of the foregoing modified forms of the invention make possible the production of a completed low value resistor which has a TCR closely approximating the temperature coefficient of the resistor element. The terminals at the ends of the resistors have a negligible effect on the overall TCR
of the resulting resistor. While the termin~ls are described as having been made by the preferred method of tumbling in a barrel plater, other methods of coating could be utilized such as printing or other methods. Thus, it can be seen that the device accomplishes at least all of its stated objectives.
Claims (13)
1. A resistor comprising:
an elongated resistor body having first and second opposite ends and a central portion therebetween, said resistor body being of unitary construction and being comprised of a resistance material shaped to produce a predetermined resistance value between said first and second opposite ends;
first and second terminals in electrical contact with said first and second ends respectively of said resistor body, said first and second terminals being formed of an electrically conductive material having an electrical conductivity higher than said resistance material of said resistance body, said first and second terminals being free from electrical contact with one another so that said resistor body forms the only electrical connection between said first and second terminals;
said first and second terminals each comprising a layer of said electrically conductive material on said first and second opposite ends of said resistor body.
an elongated resistor body having first and second opposite ends and a central portion therebetween, said resistor body being of unitary construction and being comprised of a resistance material shaped to produce a predetermined resistance value between said first and second opposite ends;
first and second terminals in electrical contact with said first and second ends respectively of said resistor body, said first and second terminals being formed of an electrically conductive material having an electrical conductivity higher than said resistance material of said resistance body, said first and second terminals being free from electrical contact with one another so that said resistor body forms the only electrical connection between said first and second terminals;
said first and second terminals each comprising a layer of said electrically conductive material on said first and second opposite ends of said resistor body.
2. A resistor according to claim 1 wherein the temperature coefficient of resistance of said resistance material of said resistor body is substantially less than the TCR of said conductive material of said first and second terminals, the terminals have lower ohms per square than the resistor body, and the combined TCR resistor body and said first and second terminals closely approximates said TCR of said resistor body.
3. A resistor according to claim 1 wherein said first and second opposite ends of said resistor body are bent with respect to said central portion so that said first and second terminals, when resting on a horizontal support surface, will cause said central portion to be supported in spaced relation above said supporting surface.
4. A resistor according to claim 1 and further comprising a dielectric substrate, said resistor body being supported on and operatively attached to said substrate whereby said substrate provides structural support to said resistor body.
5. A resistor according to claim 4 wherein said resistor body comprises a rectangular plate and said substrate is in a rectangular shape having a top surface, a bottom surface and opposite ends, said central portion of said resistor body being supported on said top surface of said substrate and said first and second ends of said resistor body wrapping around said opposite ends of said substrate and engaging said bottom surface of said substrate.
6. A resistor according to claim 1 wherein said resistor body has an upper surface and a lower surface spaced apart a first thickenss therebetween, said layers of said conductive material forming said first and second terminals having a layer thickness substantially less than said first thickness.
7. A resistor according to claim 6 wherein said first thickness is less than .010 inches.
8. A resistor according to claim 1 wherein said central portion of said resistor body is rectangular in shape, having a top rectangular surface, a bottom rectangular surface, and opposite rectangular side edges extending between said first and second opposite ends of said resistor body, at least one cut being made completely through said central portion from said top rectangular surface to said bottom rectangular surface, said one cut extending inwardly from one of said side edges of said central portion.
9. A resistor according to claim 8 wherein said cut is formed by using a laser to cut through said central portion of said resistor body.
10. A resistor according to claim 8 wherein said cut is formed by one of the methods selected from the group consisting essentially of stamping, cutting with a diamond wheel, machining, and etching.
11. A resistor according to claim 1 wherein said layers of electrically conductive material are placed on said first and second ends of said resistor body by plating.
12. A resistor according to claim 1 and further comprising third and fourth terminals in electrical contact with said first and second ends of said resistor body, said first, second, third, and fourth terminals being free from electrical contact with one another so that said resistor body forms the only electrical connection therebetween, said third and fourth terminals each comprising a layer of said electrically conductive material on said first and second opposite ends of said resistor body.
13. A resistor according to claim 12 wherein said resistor body is rectangular in shape and includes four corners, said first, second, third, and fourth terminals each being located adjacent one of said four corners.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/860,403 | 1992-03-30 | ||
| US07/860,403 US5287083A (en) | 1992-03-30 | 1992-03-30 | Bulk metal chip resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2092636A1 CA2092636A1 (en) | 1993-10-01 |
| CA2092636C true CA2092636C (en) | 1997-06-10 |
Family
ID=25333161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002092636A Expired - Lifetime CA2092636C (en) | 1992-03-30 | 1993-03-12 | Bulk metal chip resistor |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5287083A (en) |
| JP (1) | JPH0738321B2 (en) |
| CA (1) | CA2092636C (en) |
| DE (1) | DE4310288B4 (en) |
| FR (1) | FR2690003B1 (en) |
| GB (1) | GB2265761B (en) |
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-
1992
- 1992-03-30 US US07/860,403 patent/US5287083A/en not_active Expired - Lifetime
-
1993
- 1993-03-09 GB GB9304814A patent/GB2265761B/en not_active Expired - Lifetime
- 1993-03-12 CA CA002092636A patent/CA2092636C/en not_active Expired - Lifetime
- 1993-03-23 JP JP5087939A patent/JPH0738321B2/en not_active Expired - Lifetime
- 1993-03-29 FR FR9303621A patent/FR2690003B1/en not_active Expired - Lifetime
- 1993-03-30 DE DE4310288A patent/DE4310288B4/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0620802A (en) | 1994-01-28 |
| JPH0738321B2 (en) | 1995-04-26 |
| GB9304814D0 (en) | 1993-04-28 |
| US5287083A (en) | 1994-02-15 |
| DE4310288B4 (en) | 2005-11-10 |
| GB2265761B (en) | 1996-07-17 |
| FR2690003A1 (en) | 1993-10-15 |
| FR2690003B1 (en) | 1997-12-19 |
| GB2265761A (en) | 1993-10-06 |
| DE4310288A1 (en) | 1993-10-07 |
| CA2092636A1 (en) | 1993-10-01 |
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