CA2104374A1 - Procede d'assemblage en continu de bandes a motifs et micromodule de circuit integre obtenu par ledit procede - Google Patents

Procede d'assemblage en continu de bandes a motifs et micromodule de circuit integre obtenu par ledit procede

Info

Publication number
CA2104374A1
CA2104374A1 CA002104374A CA2104374A CA2104374A1 CA 2104374 A1 CA2104374 A1 CA 2104374A1 CA 002104374 A CA002104374 A CA 002104374A CA 2104374 A CA2104374 A CA 2104374A CA 2104374 A1 CA2104374 A1 CA 2104374A1
Authority
CA
Canada
Prior art keywords
strips
integrated circuit
strip
continuous assembly
patterned strips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002104374A
Other languages
English (en)
Other versions
CA2104374C (fr
Inventor
Jean P. Gloton
Damien Laroche
Joel Turin
Michel Fallah
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Jean P. Gloton
Damien Laroche
Joel Turin
Michel Fallah
Gemplus Card International
Gemplus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9409853&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA2104374(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Jean P. Gloton, Damien Laroche, Joel Turin, Michel Fallah, Gemplus Card International, Gemplus filed Critical Jean P. Gloton
Priority to CA002389603A priority Critical patent/CA2389603A1/fr
Publication of CA2104374A1 publication Critical patent/CA2104374A1/fr
Application granted granted Critical
Publication of CA2104374C publication Critical patent/CA2104374C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • B32B38/1825Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833Positioning, e.g. registration or centering
    • B32B38/1841Positioning, e.g. registration or centering during laying up
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G06K19/041Constructional details
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • G06K19/07747Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07786Antenna details the antenna being of the HF type, such as a dipole
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/14Velocity, e.g. feed speeds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/70Automated, e.g. using a computer or microcomputer
    • B32B2309/72For measuring or regulating, e.g. systems with feedback loops
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00Cards, e.g. identity cards, credit cards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2429/00Carriers for sound or information
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00Labels, badges
    • B32B2519/02RFID tags
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0102Calcium [Ca]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01039Yttrium [Y]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01044Ruthenium [Ru]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01057Lanthanum [La]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01058Cerium [Ce]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01075Rhenium [Re]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01087Francium [Fr]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01094Plutonium [Pu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19042Component type being an inductor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19043Component type being a resistor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/30107Inductance
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702For plural parts or plural areas of single part
    • Y10T156/1712Indefinite or running length work
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702For plural parts or plural areas of single part
    • Y10T156/1712Indefinite or running length work
    • Y10T156/1737Discontinuous, spaced area, and/or patterned pressing

Abstract

2104374 9215118 PCTABS00130 Le procédé consiste à coller par pression une première bande (11) sur une deuxième bande (10) au travers d'une presse à coller (8, 9), en repérant sur chacune des bandes les pas de motifs et en juxtaposant au moment du collage les repères des pas de motifs de chaque bande par extension d'au moins une bande l'une par rapport à l'autre et par échauffement différent de chacune des bandes en regard pour provoquer un déplacement relatif par dilatation des deux bandes l'une par rapport à l'autre. Application: fabrication de "cartes à puces".
CA002104374A 1991-02-19 1992-02-18 Procede d'assemblage en continu de bandes a motifs et micromodule de circuit integre obtenu par ledit procede Expired - Lifetime CA2104374C (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA002389603A CA2389603A1 (fr) 1991-02-19 1992-02-18 Procede d'assemblage en continu de bandes a motifs et micromodule de circuit integre obtenu par ledit procede

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9101934A FR2673041A1 (fr) 1991-02-19 1991-02-19 Procede de fabrication de micromodules de circuit integre et micromodule correspondant.
FR91/01934 1991-02-19
PCT/FR1992/000158 WO1992015118A1 (fr) 1991-02-19 1992-02-18 Procede d'assemblage en continu de bandes a motifs et micromodule de circuit integre obtenu par ledit procede

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CA002389603A Division CA2389603A1 (fr) 1991-02-19 1992-02-18 Procede d'assemblage en continu de bandes a motifs et micromodule de circuit integre obtenu par ledit procede

Publications (2)

Publication Number Publication Date
CA2104374A1 true CA2104374A1 (fr) 1992-08-20
CA2104374C CA2104374C (fr) 2003-07-08

Family

ID=9409853

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002104374A Expired - Lifetime CA2104374C (fr) 1991-02-19 1992-02-18 Procede d'assemblage en continu de bandes a motifs et micromodule de circuit integre obtenu par ledit procede

Country Status (8)

Country Link
US (2) US5470411A (fr)
EP (2) EP0572514B1 (fr)
JP (2) JP2700172B2 (fr)
CA (1) CA2104374C (fr)
DE (1) DE69229168T2 (fr)
ES (1) ES2133318T3 (fr)
FR (1) FR2673041A1 (fr)
WO (1) WO1992015118A1 (fr)

Families Citing this family (117)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4224103A1 (de) * 1992-07-22 1994-01-27 Manfred Dr Ing Michalk Miniaturgehäuse mit elektronischen Bauelementen
US7158031B2 (en) 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
DE4340996C1 (de) * 1993-12-02 1995-03-02 Heraeus Gmbh W C Verfahren und Vorrichtung zur Herstellung eines Folienverbundes
SG66765A1 (en) * 1993-12-02 2001-01-16 Heraeus Gmbh W C Process and apparatus for producing a laminate
FR2724477B1 (fr) 1994-09-13 1997-01-10 Gemplus Card Int Procede de fabrication de cartes sans contact
DE4437721A1 (de) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
DE4442920C2 (de) * 1994-12-02 2001-02-22 Heraeus Gmbh W C Verfahren zur Herstellung eines Folienverbundes
US5558687A (en) * 1994-12-30 1996-09-24 Corning Incorporated Vertical, packed-bed, film evaporator for halide-free, silicon-containing compounds
FR2733553B1 (fr) * 1995-04-25 1997-07-11 Pem Sa Protection Electrolytiq Dispositif de contre-collage pour la solidarisation d'une bande metallique et d'une bande de materiau isolant
FR2734983B1 (fr) * 1995-05-29 1997-07-04 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
DE19521022C2 (de) * 1995-06-13 1997-04-10 Heraeus Gmbh W C Verfahren zur Herstellung eines Schichtverbundes
FR2741191B1 (fr) * 1995-11-14 1998-01-09 Sgs Thomson Microelectronics Procede de fabrication d'un micromodule, notamment pour cartes a puces
DE19543427C2 (de) * 1995-11-21 2003-01-30 Infineon Technologies Ag Chipmodul, insbesondere zum Einbau in eine Chipkarte
US5766389A (en) * 1995-12-29 1998-06-16 Kimberly-Clark Worldwide, Inc. Disposable absorbent article having a registered graphic and process for making
US5818719A (en) * 1995-12-29 1998-10-06 Kimberly-Clark, Worldwide, Inc. Apparatus for controlling the registration of two continuously moving layers of material
DE19632795A1 (de) * 1996-08-15 1998-02-19 Cicorel S A Verfahren und Vorrichtung zum Laminieren von Folienbahnen
JP2786620B2 (ja) * 1996-08-23 1998-08-13 三菱重工業株式会社 段ボールシートの製造装置
JP3520186B2 (ja) * 1996-09-30 2004-04-19 東芝マイクロエレクトロニクス株式会社 フィルムキャリアテープの製造方法、フィルムキャリアテープの製造装置
US5930139A (en) * 1996-11-13 1999-07-27 Kimberly-Clark Worldwide, Inc. Process and apparatus for registration control of material printed at machine product length
US6033502A (en) * 1996-11-13 2000-03-07 Kimberly-Clark Worldwide, Inc. Process and apparatus for registering continuously moving stretchable layers
US6092002A (en) * 1996-11-13 2000-07-18 Kimberly-Clark Worldwide, Inc. Variable tension process and apparatus for continuously moving layers
US5964970A (en) * 1997-10-14 1999-10-12 Kimberly-Clark Worldwide, Inc. Registration process and apparatus for continuously moving elasticized layers having multiple components
US5932039A (en) * 1997-10-14 1999-08-03 Kimberly-Clark Wordwide, Inc. Process and apparatus for registering a continuously moving, treatable layer with another
JP3389053B2 (ja) 1997-05-07 2003-03-24 三菱重工業株式会社 複数層の芯紙を有する段ボールシートの位相制御方法
US6980085B1 (en) 1997-08-18 2005-12-27 Micron Technology, Inc. Wireless communication devices and methods of forming and operating the same
US6339385B1 (en) * 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
DE19739042A1 (de) * 1997-09-05 1999-03-11 Kannegiesser H Gmbh Co Verfahren und Vorrichtung zum Verbinden flexibler Flächengebilde
US6002169A (en) * 1998-06-15 1999-12-14 Lsi Logic Corporation Thermally enhanced tape ball grid array package
FR2780848A1 (fr) * 1998-07-06 2000-01-07 Solaic Sa Antenne a bornes de connexion ajourees pour carte a circuit integre, et carte a circuit integre comprenant une telle antenne
FR2781973B1 (fr) * 1998-07-29 2006-07-07 Solaic Sa Feuille d'antennes comportant des reperes, plaque contenant plusieurs emplacements de corps de carte et incluant une telle feuille d'antennes, et procede de decoupe de cette plaque
US6428641B1 (en) * 1998-08-31 2002-08-06 Amkor Technology, Inc. Method for laminating circuit pattern tape on semiconductor wafer
US6479887B1 (en) 1998-08-31 2002-11-12 Amkor Technology, Inc. Circuit pattern tape for wafer-scale production of chip size semiconductor packages
US6652686B1 (en) 1999-02-08 2003-11-25 Kimberly-Clark Worldwide, Inc. Processes and apparatus for making disposable absorbent articles
DE19920593B4 (de) * 1999-05-05 2006-07-13 Assa Abloy Identification Technology Group Ab Chipträger für ein Chipmodul und Verfahren zur Herstellung des Chipmoduls
FR2796203B1 (fr) * 1999-07-08 2001-08-31 Gemplus Card Int Module electronique sans contact et procede pour son obtention
FR2798002B1 (fr) * 1999-08-26 2001-11-02 Gemplus Card Int Procede de fabrication de micromodules electroniques comprenant une antenne et micromodules obtenus par le procede
CN100355148C (zh) 1999-09-20 2007-12-12 弗拉克托斯股份有限公司 多级天线
JP3644859B2 (ja) * 1999-12-02 2005-05-11 沖電気工業株式会社 半導体装置
ATE302473T1 (de) 2000-01-19 2005-09-15 Fractus Sa Raumfüllende miniaturantenne
US6986820B2 (en) * 2000-01-21 2006-01-17 Kimberly-Clark Worldwide, Inc. Processes and apparatus for making disposable absorbent articles
US6714136B1 (en) * 2000-08-14 2004-03-30 Computime, Ltd. Alarm clock with remote control function
JP2004507096A (ja) * 2000-08-18 2004-03-04 シーメンス アクチエンゲゼルシヤフト 有機電界効果トランジスタ(ofet),該有機電界効果トランジスタの製造方法、前記有機電界効果トランジスタから形成される集積回路、及び該集積回路の使用
JP2004506985A (ja) * 2000-08-18 2004-03-04 シーメンス アクチエンゲゼルシヤフト 封入された有機電子構成素子、その製造方法および使用
DE10044842A1 (de) * 2000-09-11 2002-04-04 Siemens Ag Organischer Gleichrichter, Schaltung, RFID-Tag und Verwendung eines organischen Gleichrichters
US20040026121A1 (en) * 2000-09-22 2004-02-12 Adolf Bernds Electrode and/or conductor track for organic components and production method thereof
DE10116510A1 (de) * 2000-11-27 2002-05-29 Orient Semiconductor Elect Ltd Ultradünnfilm-Kapselung
DE10061299A1 (de) * 2000-12-08 2002-06-27 Siemens Ag Vorrichtung zur Feststellung und/oder Weiterleitung zumindest eines Umwelteinflusses, Herstellungsverfahren und Verwendung dazu
DE10061286C1 (de) * 2000-12-08 2002-04-04 Hollingsworth Gmbh Vorrichtung zum Aufziehen einer Kardiergarnitur
DE10061297C2 (de) 2000-12-08 2003-05-28 Siemens Ag Verfahren zur Sturkturierung eines OFETs
DE10105914C1 (de) * 2001-02-09 2002-10-10 Siemens Ag Organischer Feldeffekt-Transistor mit fotostrukturiertem Gate-Dielektrikum und ein Verfahren zu dessen Erzeugung
US6582887B2 (en) 2001-03-26 2003-06-24 Daniel Luch Electrically conductive patterns, antennas and methods of manufacture
US7564409B2 (en) * 2001-03-26 2009-07-21 Ertek Inc. Antennas and electrical connections of electrical devices
US7452656B2 (en) 2001-03-26 2008-11-18 Ertek Inc. Electrically conductive patterns, antennas and methods of manufacture
JP2005509200A (ja) * 2001-03-26 2005-04-07 シーメンス アクチエンゲゼルシヤフト 少なくとも2つの有機電子構成エレメントを有する装置、および該装置のための製造方法
US7394425B2 (en) * 2001-03-26 2008-07-01 Daniel Luch Electrically conductive patterns, antennas and methods of manufacture
GB0108655D0 (en) * 2001-04-06 2001-05-30 Koninkl Philips Electronics Nv Microwave circuit
DE10120269C1 (de) * 2001-04-25 2002-07-25 Muehlbauer Ag Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders
DE10126859A1 (de) * 2001-06-01 2002-12-12 Siemens Ag Verfahren zur Erzeugung von leitfähigen Strukturen mittels Drucktechnik sowie daraus hergestellte aktive Bauelemente für integrierte Schaltungen
DE10126860C2 (de) * 2001-06-01 2003-05-28 Siemens Ag Organischer Feldeffekt-Transistor, Verfahren zu seiner Herstellung und Verwendung zum Aufbau integrierter Schaltungen
JP4663172B2 (ja) * 2001-07-31 2011-03-30 三洋電機株式会社 半導体装置の製造方法
MXPA04002588A (es) * 2001-09-18 2004-06-18 Nagraid Sa Etiqueta electronica de poco espesor y metodo para la fabricacion de la misma.
DE10151036A1 (de) 2001-10-16 2003-05-08 Siemens Ag Isolator für ein organisches Elektronikbauteil
DE10151440C1 (de) * 2001-10-18 2003-02-06 Siemens Ag Organisches Elektronikbauteil, Verfahren zu seiner Herstellung und seine Verwendung
JP3978019B2 (ja) * 2001-11-19 2007-09-19 矢崎化工株式会社 樹脂被覆鋼管における鋼管と被覆樹脂の分離回収方法、及び分離回収設備
DE10160732A1 (de) * 2001-12-11 2003-06-26 Siemens Ag Organischer Feld-Effekt-Transistor mit verschobener Schwellwertspannung und Verwendung dazu
DE10212639A1 (de) * 2002-03-21 2003-10-16 Siemens Ag Vorrichtung und Verfahren zur Laserstrukturierung von Funktionspolymeren und Verwendungen
DE10212640B4 (de) * 2002-03-21 2004-02-05 Siemens Ag Logische Bauteile aus organischen Feldeffekttransistoren
DE10226370B4 (de) * 2002-06-13 2008-12-11 Polyic Gmbh & Co. Kg Substrat für ein elektronisches Bauteil, Verwendung des Substrates, Verfahren zur Erhöhung der Ladungsträgermobilität und Organischer Feld-Effekt Transistor (OFET)
WO2004017439A2 (fr) * 2002-07-29 2004-02-26 Siemens Aktiengesellschaft Composant electronique comprenant des materiaux fonctionnels majoritairement organiques et procede pour le produire
DE10237084A1 (de) * 2002-08-05 2004-02-19 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines elektrischen Leiterrahmens und Verfahren zum Herstellen eines oberflächenmontierbaren Halbleiterbauelements
ATE395955T1 (de) * 2002-08-08 2008-06-15 Polyic Gmbh & Co Kg Elektronisches gerät
WO2004021256A1 (fr) 2002-08-23 2004-03-11 Siemens Aktiengesellschaft Composant organique procurant une protection contre les surtensions et circuit associe
WO2004042837A2 (fr) * 2002-11-05 2004-05-21 Siemens Aktiengesellschaft Composant electronique organique a structuration haute resolution et procede de production de ce composant
WO2004042868A1 (fr) 2002-11-07 2004-05-21 Fractus, S.A. Boitier de circuit integre incluant une antenne miniature
DE10253154A1 (de) * 2002-11-14 2004-05-27 Siemens Ag Messgerät zur Bestimmung eines Analyten in einer Flüssigkeitsprobe
WO2004047144A2 (fr) * 2002-11-19 2004-06-03 Polyic Gmbh & Co.Kg Composant electronique organique comportant une couche fonctionnelle semiconductrice structuree et procede de fabrication de ce composant
GB2395481B (en) * 2002-11-19 2006-06-28 C Tech Innovation Ltd Control of biocatalysis reactions
US20060035423A1 (en) * 2002-11-19 2006-02-16 Walter Fix Organic electronic component comprising the same organic material for at least two functional layers
DE10300521A1 (de) * 2003-01-09 2004-07-22 Siemens Ag Organoresistiver Speicher
DE10302149A1 (de) * 2003-01-21 2005-08-25 Siemens Ag Verwendung leitfähiger Carbon-black/Graphit-Mischungen für die Herstellung von low-cost Elektronik
WO2004066197A1 (fr) * 2003-01-21 2004-08-05 Siemens Aktiengesellschaft Produit en plastique avec puce a faible cout integree
WO2004066348A2 (fr) * 2003-01-21 2004-08-05 Polyic Gmbh & Co. Kg Composant electronique organique et procede de fabrication de dispositifs electroniques organiques
DE10318688A1 (de) * 2003-04-24 2004-11-25 W. C. Heraeus Gmbh & Co. Kg Verfahren zum Trennen der elektrischen Verbindungsknoten bei IC-Frames und Verfahren zur Herstellung eines elektronischen Bauteils sowie von Frames dafür
DE10330062A1 (de) * 2003-07-03 2005-01-27 Siemens Ag Verfahren und Vorrichtung zur Strukturierung von organischen Schichten
DE10330064B3 (de) * 2003-07-03 2004-12-09 Siemens Ag Logikgatter mit potentialfreier Gate-Elektrode für organische integrierte Schaltungen
DE10338277A1 (de) * 2003-08-20 2005-03-17 Siemens Ag Organischer Kondensator mit spannungsgesteuerter Kapazität
DE10339036A1 (de) 2003-08-25 2005-03-31 Siemens Ag Organisches elektronisches Bauteil mit hochaufgelöster Strukturierung und Herstellungsverfahren dazu
DE10340643B4 (de) * 2003-09-03 2009-04-16 Polyic Gmbh & Co. Kg Druckverfahren zur Herstellung einer Doppelschicht für Polymerelektronik-Schaltungen, sowie dadurch hergestelltes elektronisches Bauelement mit Doppelschicht
DE10340644B4 (de) * 2003-09-03 2010-10-07 Polyic Gmbh & Co. Kg Mechanische Steuerelemente für organische Polymerelektronik
GB0328246D0 (en) * 2003-12-04 2004-06-16 Qinetiq Ltd Improvements relating to electronic circuit packages
US7397067B2 (en) * 2003-12-31 2008-07-08 Intel Corporation Microdisplay packaging system
DE102004002024A1 (de) * 2004-01-14 2005-08-11 Siemens Ag Organischer Transistor mit selbstjustierender Gate-Elektrode und Verfahren zu dessen Herstellung
DE102004025911B4 (de) * 2004-05-27 2008-07-31 Infineon Technologies Ag Kontaktbehaftete Chipkarte, Verfahren zur Herstellung einer solchen
EP1771919A1 (fr) 2004-07-23 2007-04-11 Fractus, S.A. Antenne dans un boitier a interaction electromagnetique reduite avec des elements integres sur la puce
US20150287660A1 (en) 2007-01-05 2015-10-08 Semiconductor Energy Laboratory Co., Ltd. Laminating system, ic sheet, scroll of ic sheet, and method for manufacturing ic chip
US9053401B2 (en) * 2004-07-30 2015-06-09 Semiconductor Energy Laboratory Co., Ltd. Laminating system, IC sheet, scroll of IC sheet, and method for manufacturing IC chip
DE102004040831A1 (de) * 2004-08-23 2006-03-09 Polyic Gmbh & Co. Kg Funketikettfähige Umverpackung
DE102004059465A1 (de) * 2004-12-10 2006-06-14 Polyic Gmbh & Co. Kg Erkennungssystem
DE102004059464A1 (de) * 2004-12-10 2006-06-29 Polyic Gmbh & Co. Kg Elektronikbauteil mit Modulator
DE102004059467A1 (de) * 2004-12-10 2006-07-20 Polyic Gmbh & Co. Kg Gatter aus organischen Feldeffekttransistoren
DE102004063435A1 (de) 2004-12-23 2006-07-27 Polyic Gmbh & Co. Kg Organischer Gleichrichter
DE102005009819A1 (de) 2005-03-01 2006-09-07 Polyic Gmbh & Co. Kg Elektronikbaugruppe
DE102005009820A1 (de) * 2005-03-01 2006-09-07 Polyic Gmbh & Co. Kg Elektronikbaugruppe mit organischen Logik-Schaltelementen
DE102005017655B4 (de) 2005-04-15 2008-12-11 Polyic Gmbh & Co. Kg Mehrschichtiger Verbundkörper mit elektronischer Funktion
DE102005031448A1 (de) 2005-07-04 2007-01-11 Polyic Gmbh & Co. Kg Aktivierbare optische Schicht
DE102005035589A1 (de) 2005-07-29 2007-02-01 Polyic Gmbh & Co. Kg Verfahren zur Herstellung eines elektronischen Bauelements
DE102005044306A1 (de) 2005-09-16 2007-03-22 Polyic Gmbh & Co. Kg Elektronische Schaltung und Verfahren zur Herstellung einer solchen
ATE440346T1 (de) * 2005-11-14 2009-09-15 Tyco Electronics France Sas Smartcard-kírper, smartcard und herstellungsverfahren
US8196829B2 (en) * 2006-06-23 2012-06-12 Fractus, S.A. Chip module, sim card, wireless device and wireless communication method
US8738103B2 (en) 2006-07-18 2014-05-27 Fractus, S.A. Multiple-body-configuration multimedia and smartphone multifunction wireless devices
JP2006344994A (ja) * 2006-08-28 2006-12-21 Oki Electric Ind Co Ltd 半導体装置の製造方法
EP2008813A1 (fr) * 2007-06-29 2008-12-31 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Dispositif de laminage, procédé de laminage et feuille.
JP4702392B2 (ja) * 2008-04-28 2011-06-15 カシオ計算機株式会社 共鳴音発生装置および電子楽器
KR101035054B1 (ko) * 2008-12-24 2011-05-19 전자부품연구원 태그 안테나 및 그 제조방법
DE102011010984B4 (de) * 2011-02-10 2012-12-27 Heraeus Materials Technology Gmbh & Co. Kg Verfahren zum partiellen Laminieren von flexiblen Substraten
RU2508991C1 (ru) * 2012-12-28 2014-03-10 Олег Умарович Айбазов Бесконтактная чип-карта
IT201700035537A1 (it) * 2017-03-31 2018-10-01 Fillshape Srl Procedimento ed apparato per la fabbricazione di buste per contenitori alimentari di tipo doypack e simili.

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3458382A (en) * 1965-10-24 1969-07-29 Schjeldahl Co G T Laminator assembly
CH608314A5 (en) * 1976-04-02 1978-12-29 Ret Sa Rech Economiques Et Tec Process for manufacturing a tape support for mounting integrated electronic components, and tape support obtained by this process
US4295912A (en) * 1978-07-03 1981-10-20 National Semiconductor Corporation Apparatus and process for laminating composite tape
JPS5555556A (en) * 1978-09-29 1980-04-23 Hakutou Kk Device for adhering non-conductivity tape having plating hole to metallic tape blank
US4441205A (en) * 1981-05-18 1984-04-03 Kulicke & Soffa Industries, Inc. Pattern recognition system
JPS607760A (ja) * 1983-06-28 1985-01-16 Toshiba Corp Icカ−ドの製造方法
JPS6095941A (ja) * 1983-10-31 1985-05-29 Toshiba Corp 半導体装置
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
JPS62216523A (ja) * 1986-03-18 1987-09-24 Hitachi Chem Co Ltd 両面プリント配線板の製造法
JPS6339322A (ja) * 1986-08-04 1988-02-19 Meiki Co Ltd ステツプ式連続プレス装置
US5087961A (en) * 1987-01-28 1992-02-11 Lsi Logic Corporation Semiconductor device package
US4800419A (en) * 1987-01-28 1989-01-24 Lsi Logic Corporation Support assembly for integrated circuits
DE3717649A1 (de) * 1987-05-26 1988-12-15 Held Kurt Doppelbandpresse mit erwaerm- oder kuehlbaren teilen und verfahren zu deren herstellung
FR2616995A1 (fr) * 1987-06-22 1988-12-23 Ebauchesfabrik Eta Ag Procede de fabrication de modules electroniques
JPH01210392A (ja) * 1988-02-19 1989-08-23 Asahi Chem Ind Co Ltd Icカード用icモジュール
IT1221258B (it) * 1988-06-22 1990-06-27 Sgs Thomson Microelectronics Contenitore plastico a cavita' per dispositivi semiconduttore
JPH0226797A (ja) * 1988-07-18 1990-01-29 Ibiden Co Ltd Icカード用モジュール及びその製造方法
JPH02150101A (ja) * 1988-12-01 1990-06-08 Seiko Instr Inc 超小型平面パッチアンテナ
JPH0719859B2 (ja) * 1988-12-12 1995-03-06 松下電器産業株式会社 Icカード用モジュールの製造方法
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
JPH034543A (ja) * 1989-05-31 1991-01-10 Ricoh Co Ltd 半導体装置
US5012386A (en) * 1989-10-27 1991-04-30 Motorola, Inc. High performance overmolded electronic package
US5051275A (en) * 1989-11-09 1991-09-24 At&T Bell Laboratories Silicone resin electronic device encapsulant
US5008734A (en) * 1989-12-20 1991-04-16 National Semiconductor Corporation Stadium-stepped package for an integrated circuit with air dielectric
US5115298A (en) * 1990-01-26 1992-05-19 Texas Instruments Incorporated Packaged integrated circuit with encapsulated electronic devices
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
US5048178A (en) * 1990-10-23 1991-09-17 International Business Machines Corp. Alignment--registration tool for fabricating multi-layer electronic packages
US5175397A (en) * 1990-12-24 1992-12-29 Westinghouse Electric Corp. Integrated circuit chip package
US5261157A (en) * 1991-01-22 1993-11-16 Olin Corporation Assembly of electronic packages by vacuum lamination

Also Published As

Publication number Publication date
DE69229168D1 (de) 1999-06-17
FR2673041A1 (fr) 1992-08-21
WO1992015118A1 (fr) 1992-09-03
EP0734063A2 (fr) 1996-09-25
JPH06500204A (ja) 1994-01-06
FR2673041B1 (fr) 1997-02-28
CA2104374C (fr) 2003-07-08
EP0572514A1 (fr) 1993-12-08
JP3238094B2 (ja) 2001-12-10
ES2133318T3 (es) 1999-09-16
JPH1070147A (ja) 1998-03-10
EP0572514B1 (fr) 1999-05-12
US5569879A (en) 1996-10-29
US5470411A (en) 1995-11-28
EP0734063A3 (fr) 1997-01-29
JP2700172B2 (ja) 1998-01-19
DE69229168T2 (de) 1999-10-14

Similar Documents

Publication Publication Date Title
CA2104374A1 (fr) Procede d'assemblage en continu de bandes a motifs et micromodule de circuit integre obtenu par ledit procede
AU4796090A (en) A technique for contraction element marks in a structured document
CA2267142A1 (fr) Procede et dispositif de controle de calage de materiau imprime en continu
DE69901500T2 (de) Sack zum sammeln von menschlichen körperausscheidungen
IL124735A0 (en) Disposable absorbent article having a registered graphic and process for making
DE69603690T2 (de) Verbundfolie, die durch Tiefdruck hergestellt wird
EP0487724A4 (en) Method of manufacturing bright decorative sheet
DE500461T1 (de) Anordnung fuer die detektion des logischen zustandes eines bauteiles, dessen impedanz sich in abhaengigkeit von seinen zustand aendert.
FR2651706B1 (fr) Element de pression pour bridage de pieces a usiner.
NO302505B1 (no) Plate og anvendelse av platen
DE3856007T2 (de) Lichtfilter für die mikroelektronik
JPS5920285U (ja) 照明符号装置
SE8501701L (sv) Forfarande och anordning for att pa en profil pafora ytskikt
MY129485A (en) Photomask, method of generating resist pattern, and method of fabricating master information carrier.
ATE219452T1 (de) Verpackung mit verkeilelement
NO894125D0 (no) Pressestempel med separat pressering.
FR2703490B1 (fr) Procédé de fabrication d'une carte comprenant au moins un élément électronique.
NO903918D0 (no) Spesialrem for bruk i presser med utstrakt nip paa papirmaskiner.
JPS53141380A (en) Manufacture of plastic flooring
FR2665113B1 (fr) Agencement pour le changement rapide d'un outil de presse.
DE59803007D1 (de) Verfahren zum Herstellen eines verbundartigen Informationsträgers
EP0896876A4 (fr) Element fonctionnel dont la surface est pourvue d'un film moleculaire, et son procede de production
DK0847931T3 (da) Film til fremstilling af fleksible emballager forsynet med sikkerhedshologram og fremgangsmåde til fremstilling af filmen
FR2642717B1 (fr) Maitre-cylindre tandem a rapport de pressions variable
FR2610571B1 (fr) Presse a imprimer offset permettant d'imprimer simultanement ou successivement en feuille a feuille ou en bande continue

Legal Events

Date Code Title Description
EEER Examination request
MKEX Expiry