CA2104374A1 - Procede d'assemblage en continu de bandes a motifs et micromodule de circuit integre obtenu par ledit procede - Google Patents
Procede d'assemblage en continu de bandes a motifs et micromodule de circuit integre obtenu par ledit procedeInfo
- Publication number
- CA2104374A1 CA2104374A1 CA002104374A CA2104374A CA2104374A1 CA 2104374 A1 CA2104374 A1 CA 2104374A1 CA 002104374 A CA002104374 A CA 002104374A CA 2104374 A CA2104374 A CA 2104374A CA 2104374 A1 CA2104374 A1 CA 2104374A1
- Authority
- CA
- Canada
- Prior art keywords
- strips
- integrated circuit
- strip
- continuous assembly
- patterned strips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01082—Lead [Pb]
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- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H01L2924/01—Chemical elements
- H01L2924/01094—Plutonium [Pu]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H—ELECTRICITY
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1712—Indefinite or running length work
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1712—Indefinite or running length work
- Y10T156/1737—Discontinuous, spaced area, and/or patterned pressing
Abstract
2104374 9215118 PCTABS00130 Le procédé consiste à coller par pression une première bande (11) sur une deuxième bande (10) au travers d'une presse à coller (8, 9), en repérant sur chacune des bandes les pas de motifs et en juxtaposant au moment du collage les repères des pas de motifs de chaque bande par extension d'au moins une bande l'une par rapport à l'autre et par échauffement différent de chacune des bandes en regard pour provoquer un déplacement relatif par dilatation des deux bandes l'une par rapport à l'autre. Application: fabrication de "cartes à puces".
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002389603A CA2389603A1 (fr) | 1991-02-19 | 1992-02-18 | Procede d'assemblage en continu de bandes a motifs et micromodule de circuit integre obtenu par ledit procede |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9101934A FR2673041A1 (fr) | 1991-02-19 | 1991-02-19 | Procede de fabrication de micromodules de circuit integre et micromodule correspondant. |
FR91/01934 | 1991-02-19 | ||
PCT/FR1992/000158 WO1992015118A1 (fr) | 1991-02-19 | 1992-02-18 | Procede d'assemblage en continu de bandes a motifs et micromodule de circuit integre obtenu par ledit procede |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002389603A Division CA2389603A1 (fr) | 1991-02-19 | 1992-02-18 | Procede d'assemblage en continu de bandes a motifs et micromodule de circuit integre obtenu par ledit procede |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2104374A1 true CA2104374A1 (fr) | 1992-08-20 |
CA2104374C CA2104374C (fr) | 2003-07-08 |
Family
ID=9409853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002104374A Expired - Lifetime CA2104374C (fr) | 1991-02-19 | 1992-02-18 | Procede d'assemblage en continu de bandes a motifs et micromodule de circuit integre obtenu par ledit procede |
Country Status (8)
Country | Link |
---|---|
US (2) | US5470411A (fr) |
EP (2) | EP0572514B1 (fr) |
JP (2) | JP2700172B2 (fr) |
CA (1) | CA2104374C (fr) |
DE (1) | DE69229168T2 (fr) |
ES (1) | ES2133318T3 (fr) |
FR (1) | FR2673041A1 (fr) |
WO (1) | WO1992015118A1 (fr) |
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-
1991
- 1991-02-19 FR FR9101934A patent/FR2673041A1/fr active Granted
-
1992
- 1992-02-18 CA CA002104374A patent/CA2104374C/fr not_active Expired - Lifetime
- 1992-02-18 EP EP92906568A patent/EP0572514B1/fr not_active Expired - Lifetime
- 1992-02-18 DE DE69229168T patent/DE69229168T2/de not_active Expired - Lifetime
- 1992-02-18 EP EP96106073A patent/EP0734063A3/fr not_active Ceased
- 1992-02-18 ES ES92906568T patent/ES2133318T3/es not_active Expired - Lifetime
- 1992-02-18 WO PCT/FR1992/000158 patent/WO1992015118A1/fr active IP Right Grant
- 1992-02-18 US US08/107,710 patent/US5470411A/en not_active Expired - Lifetime
- 1992-02-18 JP JP4506021A patent/JP2700172B2/ja not_active Expired - Fee Related
-
1995
- 1995-03-30 US US08/413,379 patent/US5569879A/en not_active Expired - Lifetime
-
1997
- 1997-04-16 JP JP11443997A patent/JP3238094B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69229168D1 (de) | 1999-06-17 |
FR2673041A1 (fr) | 1992-08-21 |
WO1992015118A1 (fr) | 1992-09-03 |
EP0734063A2 (fr) | 1996-09-25 |
JPH06500204A (ja) | 1994-01-06 |
FR2673041B1 (fr) | 1997-02-28 |
CA2104374C (fr) | 2003-07-08 |
EP0572514A1 (fr) | 1993-12-08 |
JP3238094B2 (ja) | 2001-12-10 |
ES2133318T3 (es) | 1999-09-16 |
JPH1070147A (ja) | 1998-03-10 |
EP0572514B1 (fr) | 1999-05-12 |
US5569879A (en) | 1996-10-29 |
US5470411A (en) | 1995-11-28 |
EP0734063A3 (fr) | 1997-01-29 |
JP2700172B2 (ja) | 1998-01-19 |
DE69229168T2 (de) | 1999-10-14 |
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EEER | Examination request | ||
MKEX | Expiry |