CA2133230A1 - Optical module, method of manufacturing the same, and sleeve - Google Patents

Optical module, method of manufacturing the same, and sleeve

Info

Publication number
CA2133230A1
CA2133230A1 CA002133230A CA2133230A CA2133230A1 CA 2133230 A1 CA2133230 A1 CA 2133230A1 CA 002133230 A CA002133230 A CA 002133230A CA 2133230 A CA2133230 A CA 2133230A CA 2133230 A1 CA2133230 A1 CA 2133230A1
Authority
CA
Canada
Prior art keywords
main body
circuit board
package main
package
sleeve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002133230A
Other languages
French (fr)
Other versions
CA2133230C (en
Inventor
Hiromi Kurashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Hiromi Kurashima
Sumitomo Electric Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hiromi Kurashima, Sumitomo Electric Industries, Ltd. filed Critical Hiromi Kurashima
Publication of CA2133230A1 publication Critical patent/CA2133230A1/en
Application granted granted Critical
Publication of CA2133230C publication Critical patent/CA2133230C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3873—Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
    • G02B6/3874—Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls using tubes, sleeves to align ferrules
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms

Abstract

An optical module comprises a plastic package constituted by a package main body and a cover, sleeves formed integrally with the package main body, a circuit board held in the package main body, light-activated elements fixed at predetermined positions of the circuit board, three projections formed integrally with an inner surface of the package main body and brought into contact with a periphery of the circuit board to position the circuit board, springs formed integrally with an inner surface of the package to press the periphery of the circuit board against the projections. Since the sleeve and the package main body are integrally formed by plastic molding, the number of components is reduced, thereby simplifying the assembling steps.
CA002133230A 1993-09-30 1994-09-29 Optical module, method of manufacturing the same, and sleeve Expired - Fee Related CA2133230C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP245479/1993 1993-09-30
JP24547993 1993-09-30

Publications (2)

Publication Number Publication Date
CA2133230A1 true CA2133230A1 (en) 1995-03-31
CA2133230C CA2133230C (en) 2004-06-29

Family

ID=17134280

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002133230A Expired - Fee Related CA2133230C (en) 1993-09-30 1994-09-29 Optical module, method of manufacturing the same, and sleeve

Country Status (5)

Country Link
US (2) US5475783A (en)
EP (2) EP1146371A3 (en)
KR (1) KR0139132B1 (en)
CA (1) CA2133230C (en)
DE (1) DE69429700T2 (en)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528408A (en) * 1994-10-12 1996-06-18 Methode Electronics, Inc. Small footprint optoelectronic transceiver with laser
US5717533A (en) * 1995-01-13 1998-02-10 Methode Electronics Inc. Removable optoelectronic module
US6220878B1 (en) 1995-10-04 2001-04-24 Methode Electronics, Inc. Optoelectronic module with grounding means
US5598497A (en) * 1995-07-14 1997-01-28 Cogent Light Technologies, Inc. Apparatus for mounting a light source within a system for coupling light into an optic fiber or fiber bundle
DE69723630T2 (en) * 1996-08-26 2004-04-15 Sumitomo Electric Industries, Ltd. Optoelectronic module and method for its production
US6354747B1 (en) 1996-08-26 2002-03-12 Sumitomo Electric Industries, Ltd. Optical module
JPH10123375A (en) * 1996-10-18 1998-05-15 Ando Electric Co Ltd Package for optical module
JP3514609B2 (en) * 1997-05-29 2004-03-31 新光電気工業株式会社 Lead frame for optical semiconductor device and optical semiconductor device
JPH1154770A (en) * 1997-08-01 1999-02-26 Kel Corp Optical connector
DE19738168A1 (en) * 1997-09-01 1999-03-11 Bosch Gmbh Robert Opto-electronic microsystem for carrying out optical and electric functions
SG71172A1 (en) 1997-12-03 2000-03-21 Sumitomo Electric Industries Optical data link
US6239427B1 (en) 1998-01-14 2001-05-29 Sumitomo Electric Industries, Ltd. Optical data link
US6203212B1 (en) * 1998-08-24 2001-03-20 Agilent Technologies, Inc. Optical subassembly for use in fiber optic data transmission and reception
DE19845854C2 (en) * 1998-10-05 2000-11-02 Framatome Connectors Int Optical fiber connector for a mechanically detachable connection between - at least one fiber optic connector pair - at least one fiber optic connector and a circuit board
JP2000193849A (en) * 1998-12-28 2000-07-14 Yazaki Corp Optical connector, sleeve, and manufacture of sleeve
US6213651B1 (en) * 1999-05-26 2001-04-10 E20 Communications, Inc. Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers
US7013088B1 (en) 1999-05-26 2006-03-14 Jds Uniphase Corporation Method and apparatus for parallel optical interconnection of fiber optic transmitters, receivers and transceivers
US6873800B1 (en) 1999-05-26 2005-03-29 Jds Uniphase Corporation Hot pluggable optical transceiver in a small form pluggable package
US6952532B2 (en) 1999-05-27 2005-10-04 Jds Uniphase Corporation Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US7116912B2 (en) * 1999-05-27 2006-10-03 Jds Uniphase Corporation Method and apparatus for pluggable fiber optic modules
US6632030B2 (en) 1999-05-27 2003-10-14 E20 Communications, Inc. Light bending optical block for fiber optic modules
KR100337702B1 (en) * 1999-05-31 2002-05-22 윤종용 Low cost transceiver module for optical communication
US6371665B1 (en) 1999-06-25 2002-04-16 Lucent Technologies Inc. Plastic packaged optoelectronic device
JP3760433B2 (en) * 1999-06-30 2006-03-29 矢崎総業株式会社 Receptacle
DE19946101A1 (en) 1999-09-22 2001-05-03 Infineon Technologies Ag Electro-optical module with a housing
KR100349598B1 (en) * 2000-02-03 2002-08-23 삼성전자 주식회사 Small form factor transceiver module using silicon optical bench
JP3801464B2 (en) * 2000-07-03 2006-07-26 矢崎総業株式会社 Hybrid connector
JP3735011B2 (en) * 2000-07-03 2006-01-11 矢崎総業株式会社 Assembly method of hybrid connector
US6416238B1 (en) 2000-08-07 2002-07-09 Stratos Lightwave, Inc. Modular high density multiple optical transmitter/receiver array
US6799902B2 (en) 2000-12-26 2004-10-05 Emcore Corporation Optoelectronic mounting structure
US6692161B2 (en) * 2001-03-29 2004-02-17 Intel Corporation High frequency emitter and detector packaging scheme for 10GB/S transceiver
EP1248128B1 (en) * 2001-04-03 2007-08-15 Autonetworks Technologies, Ltd. Optical connector, optical element holding structure, and structure of a mount section of an optical connector
US20020154871A1 (en) * 2001-04-19 2002-10-24 Autonetworks Technologies, Ltd. Optical connector, shield casing, optical connector device
TW468795U (en) * 2001-05-30 2001-12-11 Delta Electronics Inc Optical transceiver
DE10130892C1 (en) * 2001-06-27 2003-03-27 Siemens Ag Housings for electrical assemblies
GB0205529D0 (en) * 2002-03-08 2002-04-24 Agilent Technologies Inc Module apparatus
JP2004126015A (en) * 2002-09-30 2004-04-22 Matsushita Electric Works Ltd Photoelectric conversion module and optical receptacle using the same
JP4063278B2 (en) * 2003-04-18 2008-03-19 株式会社村田製作所 Package module and assembly method thereof
US6969203B2 (en) * 2003-04-29 2005-11-29 Agilent Technologies, Inc. Optical fiber receptacle, an optical fiber ferrule and an optical fiber receptacle and ferrule interconnection system
DE10332015A1 (en) * 2003-07-14 2005-03-03 Infineon Technologies Ag Optoelectronic module with transmitter chip and connector for the module to an optical fiber and to a circuit board, and method of making the same
US7685613B2 (en) * 2005-01-18 2010-03-23 Ronald Marc Permut Combination storage extracting and biasing system
JP4523874B2 (en) * 2005-06-01 2010-08-11 ホシデン株式会社 Optical connector
JP4929889B2 (en) * 2006-07-18 2012-05-09 日本電気株式会社 Optical transceiver
US8160451B2 (en) * 2007-02-13 2012-04-17 Finisar Corporation, Inc. Optical network unit transceiver module with arrayed I/O video contacts
JP2009109992A (en) * 2007-10-09 2009-05-21 Sumitomo Electric Ind Ltd Ferrule aligning and supporting sleeve and optical module
WO2012099769A2 (en) * 2011-01-20 2012-07-26 Corning Incorporated Receptacle ferrule assemblies with gradient index lenses and fiber optic connectors using same
CN103792625B (en) * 2012-10-30 2018-04-27 深圳市讯锋科技有限公司 Opto-electronic conversion module
US9772456B2 (en) * 2013-10-07 2017-09-26 Ac Optomechanix Receiving device and method for manufacturing such a receiving device
JP2019184745A (en) * 2018-04-05 2019-10-24 矢崎総業株式会社 Optical connector
JP7111752B2 (en) * 2020-01-21 2022-08-02 矢崎総業株式会社 Board-mounted connector

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4134641A (en) * 1977-05-17 1979-01-16 International Telephone & Telegraph Corp. Self centering connector design
US4539476A (en) * 1980-11-28 1985-09-03 Tokyo Shibaura Denki Kabushiki Kaisha Module for a fiber optic link
EP0053483B1 (en) * 1980-11-28 1985-10-02 Kabushiki Kaisha Toshiba Method for manufacturing a module for a fiber optic link
JPS5893017A (en) * 1981-11-30 1983-06-02 Dai Ichi Seiko Co Ltd Optical connector
US4547039A (en) * 1982-04-16 1985-10-15 Amp Incorporated Housing mountable on printed circuit board to interconnect fiber optic connectors
JPS60237410A (en) * 1984-05-11 1985-11-26 Nec Corp Construction of connecting sleeve for optical connector
US5222170A (en) * 1987-04-03 1993-06-22 Bt&D Technologies Ltd. Optical fiber device fabrication
US4840451A (en) * 1987-12-08 1989-06-20 Molex Incorporated Shielded fiber optic connector assembly
JPH01169416A (en) * 1987-12-25 1989-07-04 Hitachi Ltd Optical transmission module
JP2640766B2 (en) * 1988-11-04 1997-08-13 大成建設株式会社 Method and apparatus for detecting relative angle in two-dimensional measurement by laser displacement meter
US4979787A (en) * 1990-01-12 1990-12-25 Pco, Inc. Optical-electronic interface module
US5117476A (en) * 1990-01-19 1992-05-26 Amp Incorporated Optical transceiver package with insertable subassembly
KR100195850B1 (en) * 1990-03-13 1999-06-15 구라우치 노리타카 Optical module and process of producing the same
US5071219A (en) * 1990-11-09 1991-12-10 General Motors Corporation Fiber optic connection system and method
FR2694419B1 (en) * 1992-07-29 1994-09-02 Cit Alcatel Method of coupling an optical fiber to a component on a common substrate.
CA2103611A1 (en) * 1992-08-11 1994-02-12 Hiromi Kurashima Optical module with improved grounding of an optical element
DE69408344T2 (en) * 1993-02-24 1998-05-20 Sumitomo Wiring Systems Optical connector

Also Published As

Publication number Publication date
EP0646816A2 (en) 1995-04-05
EP0646816B1 (en) 2002-01-23
EP1146371A2 (en) 2001-10-17
KR0139132B1 (en) 1998-07-01
US5633971A (en) 1997-05-27
CA2133230C (en) 2004-06-29
DE69429700D1 (en) 2002-03-14
US5475783A (en) 1995-12-12
KR950010414A (en) 1995-04-28
DE69429700T2 (en) 2002-09-12
EP0646816A3 (en) 1996-02-07
EP1146371A3 (en) 2002-01-09

Similar Documents

Publication Publication Date Title
CA2133230A1 (en) Optical module, method of manufacturing the same, and sleeve
CA2062415A1 (en) Molded optical package utilizing leadframe technology
KR860005233A (en) Glass integrated optical element and manufacturing method
AU8625291A (en) Leadframe for molded plastic electronic packages
AU5128690A (en) Adaptive predistortion circuit with a memory
DE69417300D1 (en) Composite circuit board, semiconductor power module with this composite circuit board and manufacturing method therefor
NL194814B (en) Integrated semiconductor circuit with an identification circuit in a common semiconductor body.
AU2676295A (en) Foldable cup with a prefolded convex base
EP1013472A4 (en) Card mounted with circuit chip and circuit chip module
EP0661307A3 (en) Transparent resin and plastic lens.
CA2014821A1 (en) Semiconductor integrated circuit device
AU8428291A (en) Can with push-on cover
AU4384889A (en) An associative hierarchical deinterleaver
EP0235925A3 (en) Surface-mountable package for encapsulated tap-automated-bonded integrated circuit modules
USD382516S (en) Side-by-side stroller for two children
AU2056495A (en) Method and apparatus for contact lens mold filling and assembly
AU2819889A (en) Wind motor module made by assembling a parabolic-flow turbinebetween a base and a dome
SG50911A1 (en) Vertical polysilicon diode compatible with cmos/ bicmos integrated circuit processes
DE69121175T2 (en) Flip-flop circuit with a CMOS hysteresis inverter
CA2165376A1 (en) Piezoelectric Type Acceleration Sensor with Metallic Case and Resin Package
EP0633610A3 (en) Opto-electronic integrated circuit and method of manufacturing the same.
AU7174091A (en) Plastic injection mould with serial numbering
AU2507997A (en) Electronic card for electromagnectic data exchange and a process for manufacturing such a card
USD396449S (en) Circuit board module
GB2251529A (en) Outer case for a telephone

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed