CA2135027A1 - Semiconductor Stack - Google Patents

Semiconductor Stack

Info

Publication number
CA2135027A1
CA2135027A1 CA2135027A CA2135027A CA2135027A1 CA 2135027 A1 CA2135027 A1 CA 2135027A1 CA 2135027 A CA2135027 A CA 2135027A CA 2135027 A CA2135027 A CA 2135027A CA 2135027 A1 CA2135027 A1 CA 2135027A1
Authority
CA
Canada
Prior art keywords
conductors
switching element
terminals
base member
semiconductor assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2135027A
Other languages
French (fr)
Other versions
CA2135027C (en
Inventor
Toshiki Tatuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17575881&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA2135027(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Individual filed Critical Individual
Publication of CA2135027A1 publication Critical patent/CA2135027A1/en
Application granted granted Critical
Publication of CA2135027C publication Critical patent/CA2135027C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Abstract

A semiconductor stack including a base member and a semiconductor assembly member provided on the base member.
The semiconductor assembly member includes a switching element having a first, a second and a third terminal, mounted on a surface of the base member such that the first, second and third terminals of the switching element are led to a same plane, and a batch laminated conductor positioned on the first, second and third terminals of the switching element, composed of superimposition of a first, a second and a third conductor and insulators for insulating between adjacent two of the conductors. The semiconductor assembly member also includes a first, a second and a third connecting device for connecting the first, second and third conductors and the first, second and third terminals of the switching element, respectively. The first, second and third connecting devices thrust through the batch laminated conductor in a state in which the first, second and third connecting devices are electrically connected to the first, second and third conductors and are insulated from the second and third conductors, the first and third conductors and the first and second conductors, respectively.
CA002135027A 1993-11-05 1994-11-03 Semiconductor stack Expired - Lifetime CA2135027C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5276894A JP2531928B2 (en) 1993-11-05 1993-11-05 Semiconductor stack
JPP05-276894 1993-11-05

Publications (2)

Publication Number Publication Date
CA2135027A1 true CA2135027A1 (en) 1995-05-06
CA2135027C CA2135027C (en) 1998-09-22

Family

ID=17575881

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002135027A Expired - Lifetime CA2135027C (en) 1993-11-05 1994-11-03 Semiconductor stack

Country Status (9)

Country Link
US (1) US5637918A (en)
EP (1) EP0652630B1 (en)
JP (1) JP2531928B2 (en)
KR (1) KR0149064B1 (en)
CN (1) CN1039073C (en)
CA (1) CA2135027C (en)
DE (1) DE69427629T2 (en)
FI (1) FI945204A (en)
TW (1) TW332898B (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3424532B2 (en) * 1997-11-25 2003-07-07 株式会社日立製作所 Power converter
JP2004513596A (en) * 2000-11-03 2004-04-30 エス　エム　シー　エレクトリカル　プロダクツ　インコーポレーテッド Micro drive
SE525572C2 (en) * 2002-12-23 2005-03-15 Danaher Motion Stockholm Ab Inverter type motor drive
US7364945B2 (en) 2005-03-31 2008-04-29 Stats Chippac Ltd. Method of mounting an integrated circuit package in an encapsulant cavity
WO2006118720A2 (en) * 2005-03-31 2006-11-09 Stats Chippac Ltd. Semiconductor assembly including chip scale package and second substrate and having exposed substrate surfaces on upper and lower sides
US7354800B2 (en) 2005-04-29 2008-04-08 Stats Chippac Ltd. Method of fabricating a stacked integrated circuit package system
US7394148B2 (en) 2005-06-20 2008-07-01 Stats Chippac Ltd. Module having stacked chip scale semiconductor packages
US7456088B2 (en) 2006-01-04 2008-11-25 Stats Chippac Ltd. Integrated circuit package system including stacked die
US7768125B2 (en) 2006-01-04 2010-08-03 Stats Chippac Ltd. Multi-chip package system
US7750482B2 (en) 2006-02-09 2010-07-06 Stats Chippac Ltd. Integrated circuit package system including zero fillet resin
FI120068B (en) 2006-04-20 2009-06-15 Abb Oy Electrical connection and electrical component
EP2034602A1 (en) * 2006-06-23 2009-03-11 Mitsubishi Electric Corporation Power converter
JP5132175B2 (en) * 2007-03-28 2013-01-30 三菱電機株式会社 Power converter
US7791884B2 (en) * 2008-11-10 2010-09-07 Rockwell Automation Technologies, Inc. Motor drive with heat pipe air cooling
DE202010004699U1 (en) * 2010-04-08 2010-07-22 Danfoss Silicon Power Gmbh power converter
US20130043071A1 (en) * 2011-08-17 2013-02-21 General Electric Company Thermal energy management component and system incorporating the same
US8634193B2 (en) 2011-12-05 2014-01-21 Rockwell Automation Technologies, Inc. Device and method using induction to improve natural convection cooling
JP6067536B2 (en) * 2013-10-24 2017-01-25 東芝三菱電機産業システム株式会社 Power converter
DE102016110847B4 (en) 2016-06-14 2022-02-17 Auto-Kabel Management Gmbh In-line switch and method of making an in-line switch

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3648121A (en) * 1967-09-06 1972-03-07 Tokyo Shibaura Electric Co A laminated semiconductor structure
JPS62178538U (en) * 1986-05-02 1987-11-12
DE3900512A1 (en) * 1989-01-10 1990-07-19 Tucker Gmbh Bostik Semiconductor component for a switched-mode power supply
DE3937045A1 (en) * 1989-11-07 1991-05-08 Abb Ixys Semiconductor Gmbh PERFORMANCE SEMICONDUCTOR MODULE
JPH03216776A (en) * 1990-01-22 1991-09-24 Mitsubishi Electric Corp Integrated circuit device and microprocessor consisting of this circuit device
JPH0555793A (en) * 1991-08-29 1993-03-05 Matsushita Electric Ind Co Ltd Component mounting device
JPH0715969B2 (en) * 1991-09-30 1995-02-22 インターナショナル・ビジネス・マシーンズ・コーポレイション Multi-chip integrated circuit package and system thereof
EP0695494B1 (en) * 1993-04-23 2001-02-14 Irvine Sensors Corporation Electronic module comprising a stack of ic chips

Also Published As

Publication number Publication date
DE69427629D1 (en) 2001-08-09
JPH07131981A (en) 1995-05-19
CN1108825A (en) 1995-09-20
DE69427629T2 (en) 2001-10-18
EP0652630A3 (en) 1997-01-22
CN1039073C (en) 1998-07-08
KR0149064B1 (en) 1998-12-01
JP2531928B2 (en) 1996-09-04
FI945204A (en) 1995-05-06
EP0652630A2 (en) 1995-05-10
EP0652630B1 (en) 2001-07-04
TW332898B (en) 1998-06-01
US5637918A (en) 1997-06-10
FI945204A0 (en) 1994-11-04
CA2135027C (en) 1998-09-22

Similar Documents

Publication Publication Date Title
CA2135027A1 (en) Semiconductor Stack
TW238431B (en)
TW360916B (en) Semiconductor device and fabrication process thereof
GR3029271T3 (en) Terminals for side by side mounting.
CA2325148A1 (en) Bus bar heat sink
EP0110285A3 (en) Interconnection of integrated circuits
EP0731525A3 (en) Three-wire-line vertical interconnect structure for multilevel substrates
JPH02180056A (en) Multifunctional grounding surface
ATE241211T1 (en) ELECTRICAL FUSE ELEMENT
JPS6450443A (en) Semiconductor device
IN190218B (en)
EP0330372A3 (en) Hybrid ic with heat sink
AU4101600A (en) An electrical coil module, an electrical coil comprising such modules, an actuation mechanism including such a coil and circuit breaker comprising such an actuation mechanism
KR940020539A (en) Low inductance semiconductor package
WO2003032390A3 (en) Device with power semiconductor components for controlling the power of high currents and use of said device
AU671713B2 (en) Connection Structure For At Least One Electrical Device
CA2402050A1 (en) Electrical connector
CA2168312A1 (en) Assembly Structure of Self-Turn-Off Switching Device and Snubber Circuit Therefor
GB1429078A (en) Component wafer for an electrical circuit packaging structure
DE60029903D1 (en) Wiring device for protection circuit
CA2132856A1 (en) Electrical connector
WO1998045908A3 (en) Electrical distributor with a common conductor
EP0355965A3 (en) A method of achieving selective inhibition and control of adhesion in thick-film conductors
IT1257372B (en) MODULAR TERMINAL BOARD, IN PARTICULAR FOR HOUSEHOLD APPLIANCES, AND WIRING SYSTEM INCLUDING SUCH TERMINAL BOARD.
CA2332209A1 (en) Wire bond pad and method therefor

Legal Events

Date Code Title Description
EEER Examination request
MKEX Expiry

Effective date: 20141103