CA2135241A1 - Cavity and Bump Interconnection Structure for Electronic Packages - Google Patents

Cavity and Bump Interconnection Structure for Electronic Packages

Info

Publication number
CA2135241A1
CA2135241A1 CA2135241A CA2135241A CA2135241A1 CA 2135241 A1 CA2135241 A1 CA 2135241A1 CA 2135241 A CA2135241 A CA 2135241A CA 2135241 A CA2135241 A CA 2135241A CA 2135241 A1 CA2135241 A1 CA 2135241A1
Authority
CA
Canada
Prior art keywords
printed wiring
wiring board
holes
interconnection structure
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2135241A
Other languages
French (fr)
Other versions
CA2135241C (en
Inventor
Mohi Sobhani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of CA2135241A1 publication Critical patent/CA2135241A1/en
Application granted granted Critical
Publication of CA2135241C publication Critical patent/CA2135241C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Electronic interconnection of two printed wiring structures. Two printed wiring boards (11, 16) or a flexprint circuit (20) and a printed wiring board (11) are interconnected by creating a plated hole pattern (12) on a surface (12) of the printed wiring board (11), and wherein holes (13) of the pattern (12) have a concave cross section. The holes (13) of the plated hole pattern (12) are mated with corresponding bumps (17) or dimples (17) disposed on the second printed wiring board (16) or the flexprint circuit (20). The holes (13) formed in the first printed wiring board (11) are disposed a predetermined depth below a surface (18) of the printed wiring board (11), typically to a depth of between 0.007 inches and 0.020 inches below the surface. The plurality of plated holes (13) are formed by electroless plating or electroplating of the holes (13). The present interconnection structure (10) provides for reliable and self aligning interconnection of the two printed wiring boards (11, 16) or the flexprint circuit (20) and printed wiring board (11).
CA002135241A 1993-12-17 1994-11-07 Cavity and bump interconnection structure for electronic packages Expired - Fee Related CA2135241C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16834293A 1993-12-17 1993-12-17
US08/168,342 1993-12-17

Publications (2)

Publication Number Publication Date
CA2135241A1 true CA2135241A1 (en) 1995-06-18
CA2135241C CA2135241C (en) 1998-08-04

Family

ID=22611130

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002135241A Expired - Fee Related CA2135241C (en) 1993-12-17 1994-11-07 Cavity and bump interconnection structure for electronic packages

Country Status (6)

Country Link
US (1) US5525065A (en)
EP (1) EP0658960A3 (en)
JP (1) JP2825772B2 (en)
KR (1) KR950023254A (en)
CA (1) CA2135241C (en)
IL (1) IL111951A (en)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit
US5620329A (en) * 1996-06-17 1997-04-15 General Motors Corporation Self-aligning electrical connective arrangement
SE516011C2 (en) * 1996-12-19 2001-11-05 Ericsson Telefon Ab L M Tightly packed electrical connectors
US6246548B1 (en) 1997-03-24 2001-06-12 Maxtor Corporation Mechanically formed standoffs in a circuit interconnect
US6114221A (en) * 1998-03-16 2000-09-05 International Business Machines Corporation Method and apparatus for interconnecting multiple circuit chips
US6172414B1 (en) 1998-04-28 2001-01-09 Trw Inc. Apparatus and method for snap-on thermo-compression bonding
SG75841A1 (en) 1998-05-02 2000-10-24 Eriston Invest Pte Ltd Flip chip assembly with via interconnection
US6406939B1 (en) 1998-05-02 2002-06-18 Charles W. C. Lin Flip chip assembly with via interconnection
TW522536B (en) 1998-12-17 2003-03-01 Wen-Chiang Lin Bumpless flip chip assembly with strips-in-via and plating
SG82591A1 (en) 1998-12-17 2001-08-21 Eriston Technologies Pte Ltd Bumpless flip chip assembly with solder via
SG82590A1 (en) 1998-12-17 2001-08-21 Eriston Technologies Pte Ltd Bumpless flip chip assembly with strips and via-fill
US6316737B1 (en) * 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
US6402970B1 (en) 2000-08-22 2002-06-11 Charles W. C. Lin Method of making a support circuit for a semiconductor chip assembly
US6350633B1 (en) 2000-08-22 2002-02-26 Charles W. C. Lin Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint
US6562657B1 (en) 2000-08-22 2003-05-13 Charles W. C. Lin Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint
US6660626B1 (en) 2000-08-22 2003-12-09 Charles W. C. Lin Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint
US6403460B1 (en) 2000-08-22 2002-06-11 Charles W. C. Lin Method of making a semiconductor chip assembly
US6436734B1 (en) 2000-08-22 2002-08-20 Charles W. C. Lin Method of making a support circuit for a semiconductor chip assembly
US6562709B1 (en) 2000-08-22 2003-05-13 Charles W. C. Lin Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint
US6551861B1 (en) 2000-08-22 2003-04-22 Charles W. C. Lin Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive
US6350632B1 (en) 2000-09-20 2002-02-26 Charles W. C. Lin Semiconductor chip assembly with ball bond connection joint
US6511865B1 (en) 2000-09-20 2003-01-28 Charles W. C. Lin Method for forming a ball bond connection joint on a conductive trace and conductive pad in a semiconductor chip assembly
US6350386B1 (en) 2000-09-20 2002-02-26 Charles W. C. Lin Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly
US6544813B1 (en) 2000-10-02 2003-04-08 Charles W. C. Lin Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
US6448108B1 (en) 2000-10-02 2002-09-10 Charles W. C. Lin Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
US7319265B1 (en) 2000-10-13 2008-01-15 Bridge Semiconductor Corporation Semiconductor chip assembly with precision-formed metal pillar
US7190080B1 (en) 2000-10-13 2007-03-13 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal pillar
US6492252B1 (en) 2000-10-13 2002-12-10 Bridge Semiconductor Corporation Method of connecting a bumped conductive trace to a semiconductor chip
US6872591B1 (en) 2000-10-13 2005-03-29 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a conductive trace and a substrate
US6740576B1 (en) 2000-10-13 2004-05-25 Bridge Semiconductor Corporation Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly
US7094676B1 (en) 2000-10-13 2006-08-22 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal pillar
US7264991B1 (en) 2000-10-13 2007-09-04 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using conductive adhesive
US6537851B1 (en) 2000-10-13 2003-03-25 Bridge Semiconductor Corporation Method of connecting a bumped compliant conductive trace to a semiconductor chip
US7132741B1 (en) 2000-10-13 2006-11-07 Bridge Semiconductor Corporation Semiconductor chip assembly with carved bumped terminal
US7075186B1 (en) 2000-10-13 2006-07-11 Bridge Semiconductor Corporation Semiconductor chip assembly with interlocked contact terminal
US6949408B1 (en) 2000-10-13 2005-09-27 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
US7262082B1 (en) 2000-10-13 2007-08-28 Bridge Semiconductor Corporation Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture
US7071089B1 (en) 2000-10-13 2006-07-04 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a carved bumped terminal
US6876072B1 (en) 2000-10-13 2005-04-05 Bridge Semiconductor Corporation Semiconductor chip assembly with chip in substrate cavity
US6908788B1 (en) 2000-10-13 2005-06-21 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using a metal base
US7009297B1 (en) 2000-10-13 2006-03-07 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal particle
US6667229B1 (en) 2000-10-13 2003-12-23 Bridge Semiconductor Corporation Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip
US7414319B2 (en) * 2000-10-13 2008-08-19 Bridge Semiconductor Corporation Semiconductor chip assembly with metal containment wall and solder terminal
US6440835B1 (en) 2000-10-13 2002-08-27 Charles W. C. Lin Method of connecting a conductive trace to a semiconductor chip
US6576539B1 (en) 2000-10-13 2003-06-10 Charles W.C. Lin Semiconductor chip assembly with interlocked conductive trace
US6984576B1 (en) 2000-10-13 2006-01-10 Bridge Semiconductor Corporation Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip
US7129113B1 (en) 2000-10-13 2006-10-31 Bridge Semiconductor Corporation Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture
US6548393B1 (en) 2000-10-13 2003-04-15 Charles W. C. Lin Semiconductor chip assembly with hardened connection joint
US6699780B1 (en) 2000-10-13 2004-03-02 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching
US6673710B1 (en) 2000-10-13 2004-01-06 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip
US7129575B1 (en) 2000-10-13 2006-10-31 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped metal pillar
US6576493B1 (en) 2000-10-13 2003-06-10 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
US6444489B1 (en) 2000-12-15 2002-09-03 Charles W. C. Lin Semiconductor chip assembly with bumped molded substrate
US6653170B1 (en) 2001-02-06 2003-11-25 Charles W. C. Lin Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit
US6674647B2 (en) * 2002-01-07 2004-01-06 International Business Machines Corporation Low or no-force bump flattening structure and method
DE10304906A1 (en) * 2003-02-06 2004-09-16 Siemens Ag SMT-compatible component and circuit board as well as SMT processes
WO2004077525A2 (en) * 2003-02-25 2004-09-10 Tessera, Inc. Ball grid array with bumps
DE10324450A1 (en) * 2003-05-28 2005-01-05 Infineon Technologies Ag Contacting device for electronic circuit units and manufacturing method
US7993983B1 (en) 2003-11-17 2011-08-09 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with chip and encapsulant grinding
US7538415B1 (en) 2003-11-20 2009-05-26 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped terminal, filler and insulative base
US7425759B1 (en) 2003-11-20 2008-09-16 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped terminal and filler
US7404252B2 (en) * 2004-10-18 2008-07-29 International Business Machines Corporation Method for fastening two coplanar edges without a weld
US7750483B1 (en) 2004-11-10 2010-07-06 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal
US7268421B1 (en) 2004-11-10 2007-09-11 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond
US7446419B1 (en) 2004-11-10 2008-11-04 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar of stacked metal balls
US7811863B1 (en) 2006-10-26 2010-10-12 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment
US7494843B1 (en) 2006-12-26 2009-02-24 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding
US7785113B2 (en) 2006-10-27 2010-08-31 Asahi Denka Kenkyusho Co., Ltd. Electrical connection structure
KR101022912B1 (en) * 2008-11-28 2011-03-17 삼성전기주식회사 A printed circuit board comprising a metal bump and a method of manufacturing the same
TWI395279B (en) * 2009-12-30 2013-05-01 Ind Tech Res Inst Micro-bump structure
WO2012049087A2 (en) * 2010-10-13 2012-04-19 Abb Research Ltd Semiconductor module and method of manufacturing a semiconductor module
US9832887B2 (en) * 2013-08-07 2017-11-28 Invensas Corporation Micro mechanical anchor for 3D architecture
US10008797B2 (en) 2015-07-10 2018-06-26 Te Connectivity Corporation Flexible printed circuit connector and connector assembly including the same
US11495560B2 (en) * 2015-08-10 2022-11-08 X Display Company Technology Limited Chiplets with connection posts
US10468363B2 (en) * 2015-08-10 2019-11-05 X-Celeprint Limited Chiplets with connection posts
US10750614B2 (en) * 2017-06-12 2020-08-18 Invensas Corporation Deformable electrical contacts with conformable target pads
CN107741676A (en) * 2017-10-19 2018-02-27 武汉华星光电半导体显示技术有限公司 One kind coupling crimp type terminal structure and display device
WO2021184188A1 (en) * 2020-03-17 2021-09-23 元锦生物科技股份有限公司 Detachable joint structure

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3465435A (en) * 1967-05-08 1969-09-09 Ibm Method of forming an interconnecting multilayer circuitry
DE2947811C2 (en) * 1979-11-28 1983-06-16 Leopold Kostal GmbH & Co KG, 5880 Lüdenscheid Contact body
US4813129A (en) * 1987-06-19 1989-03-21 Hewlett-Packard Company Interconnect structure for PC boards and integrated circuits
US4940181A (en) * 1989-04-06 1990-07-10 Motorola, Inc. Pad grid array for receiving a solder bumped chip carrier
US5164336A (en) * 1989-09-11 1992-11-17 Nippon Steel Corporation Method of connecting tab tape to semiconductor chip, and bump sheet and bumped tape used in the method
US5121299A (en) * 1989-12-29 1992-06-09 International Business Machines Corporation Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein
US5071363A (en) * 1990-04-18 1991-12-10 Minnesota Mining And Manufacturing Company Miniature multiple conductor electrical connector
US5197184A (en) * 1990-09-11 1993-03-30 Hughes Aircraft Company Method of forming three-dimensional circuitry
JPH04142095A (en) * 1990-10-02 1992-05-15 Sharp Corp Connecting structure for member
JPH0467379U (en) * 1990-10-23 1992-06-15
US5147208A (en) * 1991-06-28 1992-09-15 Rogers Corporation Flexible printed circuit with raised contacts
JPH07105420B2 (en) * 1991-08-26 1995-11-13 ヒューズ・エアクラフト・カンパニー Electrical connection with molded contacts
EP0529577B1 (en) * 1991-08-26 1996-10-09 Hughes Aircraft Company Electrical test probe having shaped contacts
JPH05267811A (en) * 1992-03-17 1993-10-15 Fujitsu Denso Ltd Manufacture of printed circuit board connecting structure and connecting land
US5213511A (en) * 1992-03-27 1993-05-25 Hughes Aircraft Company Dimple interconnect for flat cables and printed wiring boards
US5245135A (en) * 1992-04-20 1993-09-14 Hughes Aircraft Company Stackable high density interconnection mechanism (SHIM)
US5342207A (en) * 1992-12-14 1994-08-30 Hughes Aircraft Company Electrical interconnection method and apparatus utilizing raised connecting means
US5288235A (en) * 1992-12-14 1994-02-22 Hughes Aircraft Company Electrical interconnects having a supported bulge configuration
US5326412A (en) * 1992-12-22 1994-07-05 Hughes Aircraft Company Method for electrodepositing corrosion barrier on isolated circuitry
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit

Also Published As

Publication number Publication date
IL111951A0 (en) 1995-03-15
EP0658960A3 (en) 1997-01-29
EP0658960A2 (en) 1995-06-21
IL111951A (en) 1998-02-22
US5525065A (en) 1996-06-11
JPH07263830A (en) 1995-10-13
KR950023254A (en) 1995-07-28
JP2825772B2 (en) 1998-11-18
CA2135241C (en) 1998-08-04

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