CA2147318C - Tape carrier for increasing the number of terminals between the tape carrier and a substrate - Google Patents

Tape carrier for increasing the number of terminals between the tape carrier and a substrate

Info

Publication number
CA2147318C
CA2147318C CA002147318A CA2147318A CA2147318C CA 2147318 C CA2147318 C CA 2147318C CA 002147318 A CA002147318 A CA 002147318A CA 2147318 A CA2147318 A CA 2147318A CA 2147318 C CA2147318 C CA 2147318C
Authority
CA
Canada
Prior art keywords
film
tape carrier
lead
opening
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002147318A
Other languages
French (fr)
Other versions
CA2147318A1 (en
Inventor
Takayuki Suyama
Shinichi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of CA2147318A1 publication Critical patent/CA2147318A1/en
Application granted granted Critical
Publication of CA2147318C publication Critical patent/CA2147318C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Abstract

A tape carrier for increasing the number of terminals between a tape carrier and a substrate includes a film, a lead, a terminal and a connection. The film has first and second surfaces and includes first and second regions. The first region of the film is covered with a device when the device is received by the first surface of the film. The film has an opening between the first and second regions. The lead is provided on the first surface of the film and extends above the opening of the film. The lead is coupled to the device at the opening of the film when the device is received by the first surface of the film. The terminal is provided on the second surface in the first region of the film. The connection connects the lead to the terminal. The lead and the device are connected together by thermocompression bonding with a thermode inserted into the opening of the film.

Description

TAPE CARRIER FOR INCREASING THE NUMBER OF TERMINALS
BETWEEN THE TAPE CARRIER AND A SUBSTRATE
The present invention relates to a tape carrier used in tape automated bonding (TAB), and more particularly to a tape carrier for increasing the number of the terminals for connection to a substrate.
A conventional tape carrier is described in Rao R.
Tummala and Eugene J. Rymaszewski, "Microelectronics Packaging Handbook", pp. 409-424.
Referring to Figure 6-39 on page 411 of this reference, the conventional tape carrier has a central opening for receiving a thermode that thermocompression bonds inner leads of the tape carrier and terminals of a chip. Referring to Figure 6-41 on page 412 of the above reference, outer leads of the tape carrier are connected to a substrate.
In this structure, the central opening prevents the tape carrier from increasing the number of terminals (i.e., the outer leads) between the tape carrier and the substrate because terminals cannot be provided in the central portion of the tape carrier.
Referring to Figure 6-49 on page 422 of the above reference, another conventional tape carrier known as an area TAB has terminals in the central portion thereof.
However, these terminals do not increase the number of terminals between the tape carrier and the substrate because they connect the chip to the tap carrier.
In view of the above problems of the conventional tape carriers, an object of the present invention is to provide a tape carrier which has terminals in a region covered by a semiconductor device. The terminals connect the tape carrier to a substrate.
Another object of the present invention is to allow the aforementioned tape carrier to be bonded by thermocompression bonding with a thermode.

Another object of the present invention is to shorten the total wiring length within the tape carrier.
Yet another object of the present invention is to suppress power supply noise generated from the tape carrier by reducing the inductance of a power supply and the ground.
A tape carrier according to the present invention comprises a film, a f first lead, a f first terminal and a f first connection.
The film has first and second surfaces and includes first and second regions. The first region of the film is covered with a device when the device is received by the first surface of the film. The film has an opening between the first and second regions.
The first lead is provided on the first surface of the film and extends above the opening of the film. The ffirst lead is coupled to the device at the opening of the film when the device is received by the first surface of the f film.
The first terminal is provided on the second surface in the first region of the film. The first connection connects the first lead to the first terminal.
The first leads and the device are preferably connected together by thermocompression bonding with a thermode inserted into the opening of the film.
The number of terminals of the aforementioned tape carrier is increased due to the first terminals provided in the first region of the film in which terminals cannot be provided in conventional tape carriers.
Other objects, features and advantages of the present invention will become more apparent when the following description is read in conjunction with the accompanying drawings, wherein:
Figure 1 shows a tape carrier according to a ffirst embodiment of the present invention.
Figure 2 is a sectional view of the tape carrier according to the first embodiment of the present invention.
Figures 3(a) and 3(b) show the dimensions of respective parts of the tape carrier according to the first embodiment of the invention.
Figure 4 is a sectional view of the tape carrier according to the first embodiment of the present invention when a device is mounted thereon.
Figures 5(a) - 5(d) show a process for manufac-turing the tape carrier according to the first embodiment of the present invention.
Figures 6(a) and 6(b) show a process for mounting a device on the tape carrier according to the first embodi-ment of the present invention.
Figure 7 is an enlarged plan view of inner leads of a tape carrier according to a second embodiment of the present invention.
Figure 8 shows a tape carrier according to a third embodiment of the present invention.
In these drawings, the same reference numerals depict the same parts, respectively.
Referring to Figure 1, a tape carrier 100 according to the first embodiment of the present invention is shown in an enlarged scale because the actual structures provided in the tape carrier 1o0 are too minute to illus trate. The dimensions of the structures in the tape carrier 100 are described below.
The tape carrier 100 is formed on a base film 1.
On the base film 1, a plurality of tape carriers 100 are arranged longitudinally of the base film 1. The tape carriers are moved by winding the base film 1 with a sprocket. The teeth of the sprocket fit into sprocket holes 2 of the base film 1 in a conventional manner.
A plurality (e.g., four) narrow openings 3 are formed in the tape carrier 100 and are arranged in a rectangular shape. The openings 3 are formed at positions where terminals (e.g., pads or bumps) of a device (e.g., a semiconductor chip) are located when the device is mounted on the tape carrier 100. The openings 3 receive a thermode to bond the terminals of the device and leads 4 of the tape carrier loo.
The openings 3 divide the base film 1 into a peripheral region 19 and a center region 20. The center region 20 is covered with the device when the device is mounted on the tape carrier 100. The bridges 21 between adjacent ones of the openings 3 connect the center region 20 to the peri-pheral region 19.
Outer wiring lines 7 are provided in the peri-pheral region 19 of the base film 1.
First ends of the outer wiring lines 7 are connected to respective through-holes 5. The through-holes 5 connect the outer wiring lines 7 to terminals on the back surface of the tape carrier 1o0. Detailed structures of the through-holes 5 are described below.
The outer wiring lines 7 extend toward the center region 20, and a second end of each outer wiring line 7 is integrally connected at an edge of an opening 3 to a first end of a respective lead 4 which bridges the opening 3 (see Figure 3(b)). The second end of the lead 4 is attached to the center region 20 of the base film 1.
Inner wiring lines 12 are provided in the center region 20 of the base film 1.
First ends of the inner wiring lines 12 are connected to respective through-holes 6. The through-holes 6 connect the inner wiring lines 12 to terminals on the back surface of the tape carrier 100. Detailed structures of the through-holes 6 are described below.
The inner wiring lines 12 extend toward the peripheral portion 19, and a second end of each inner wiring line 12 is integrally connected at an edge of an opening 3 to a first end of a respective lead 4 which bridges the opening 3. The second end of the lead 4 is attached to the peripheral region 19 of the base film 1.
Next, the structures of the through-holes 5 and 6 are described.
Referring to Figure 2, the through-holes 5 penetrate the base film 1 and connect the outer wiring lines 7 to terminals (e. g., pads or bumps) 10 on the back surface of the tape carrier 100. Similarly, the through-holes 6 connect the inner wiring lines 12 to terminals (e. g., pads or bumpers) 11. Terminals 10 and 11 connect the tape carrier 100 to a substrate.
The openings 3 penetrate the tape carrier 100, exposing the leads 4. A thermode is thus able to reach the leads 4 from the back side of the tape carrier 1 through the openings 3.
Next, the materials preferably used for the respective portions of the tape carrier 100 are described.
The base film 1 is preferably made of polyimide-type materials, glass epoxy or polyester. Among those materials, polyimide-type materials are especially suitable when chemical etching is performed in a manufacturing process (described below) of the tape carrier 100, because of their corrosion-resistance.
The leads 4, the outer wiring lines 7 and the inner wiring lines 12 are preferably made of copper, and their surfaces are preferably gold-plated.
The terminals 10 and 11 are preferably spheres of solder. Alternatively, they may be copper or silver spheres that are solder-plated.
Next, the dimensions of the respective portions of the tape carrier 100 are described.
Referring to Figure 3(a), in this embodiment, the tape carrier 100 preferably has a side length L1 of 38.1 mm.
The openings 3 preferably have a side length L2 of about 17 mm and a width L3 of about 0.8 mm.
The terminals 10 and 11 are arranged in a grid like form having a pitch of 1.27 mm. The diameter of the terminals 10 and 11 is about 0.3 mm. The through-holes 5 and 6 preferably have a smaller diameter than that of the terminals l0 and 11.
Referring to Figure 3(b), the leads 4 preferably have a width L5 of 30 Vim. A width L6 of the outer wiring lines 7 and a width L7 of the inner wiring lines 12 are each preferably 40 ~,m.
If the terminals provided on the center line of the tape carrier 100 are assumed to be a first row, the terminals of the first to sixth rows are arranged in the center region 20 of the base film 1. The number of terminals in the center region 20 is 11 x 11 - 121. A
terminal is not provided for the seventh to ninth rows because of the openings 3. The terminals of the 10th to 16th rows are arranged in the peripheral region 19 of the base film 1. The number of terminals in the peripheral region 19 is (31 x 31) - (17 x 17) - 672. Thus, the total number of terminals provided on the tape carrier 100 is 12l + 672 = 793.
Next is described the configuration of the tape carrier 100 when a semiconductor device is mounted thereon.
Referring to Figure 4, a device 8 (e.g., a semiconductor chip) is mounted on the center region 20 of the base film 1. Terminals 22 (e.g., gold bumps) are provided on the bottom face of the device 8. The terminals 22 and the leads 4 are connected together at the openings 3 by thermocompression bonding. The device 8 is encapsulated in a resin 9 . The base film 1 is mounted on a substrate 101. The terminals 10 and 11 of the tape carrier 100 are connec-ted to the terminals 102 of the substrate 101.
Two paths connect the device 8 to the substrate 101. The first path includes the terminals 10, the outer wiring lines 7, the leads 4 and the terminals 22. The second path includes the terminals 11, the inner wiring lines 12, the leads 4 and the terminals 22.
Next is described a process for manufacturing the tape carrier 100.
Referring to Figure 5(a), in the first step, the openings 3, holes 14 and holes 15 are formed in the base film 1 by punching by use of metal dies or the like. Chemi cal etching can also be used instead of punching. The holes 14 and 15 are provided for forming the through-holes 5 and 6, respectively.
Referring to Figure 5(b), in the second step, copper foil 13 is bonded to the base film 1.
Referring to Figure 5(c), in the third step, the copper foil 13 is etched to form the outer wiring lines 7, leads 4 and inner wiring lines 12. In this operation, the back surface of the tape carrier 100 is also coated with a resist to prevent the copper foil 13 from being etched with an etching liquid coming through the openings 3, holes 14 and 15.
Referring to Figure 5(d), in the fourth step, the inner walls of the holes 14 and 15 are plated to form the through-holes 5 and 6. Alternatively, the through-holes 5 and 6 may be formed by charging the holes 14 and 15 with solder. The terminals 10 and 11 are provided under the through-holes 5 and 6, respectively.
Next is described the process for mounting a device 8 on the tape carrier 100.
Referring to Figure 6(a), in the first step, a bonding stage 23 positions the device 8 so that the terminals 22 of the device 8 are opposite the corresponding leads 4 at the openings 3.
After the positioning of the device 8, a U-shaped thermode 16 is inserted into the openings 3. The thermode 16 projects toward the device 8, and bonds the inner leads 4 to the terminals 22 by thermocompression bonding. Since the thermode 16 directly contacts inner leads 4 through the openings 3, this bonding operation can be performed easily.
In addition, since an insulating film 8' is formed on the surface of the device 8, the bonding does not create short circuiting between the device 8 and the inner wiring lines 12. If necessary, an insulating treatment may be performed in advance on the wiring lines 12.
Referring to Figure 6(b), in the second step, the device 8 is encapsulated in resin 9, which is supplied from a dispenser 17. Next, a modification of the first embodi ment will be described.
In this embodiment, a power supply and the ground (not illustrated) are preferably connected to the wiring lines 12 to reduce power supply noise. By connecting the power supply and the ground to the inner wiring lines 12, connection lengths between the power supply and the device 8 and also between the ground and the device 8 are shortened. As a result, the inductance of the connection is reduced and, therefore, the power supply noise is reduced.
The structure provided in the center region 20 of the base film 1 are not limited to the wiring lines 12. Any structure may be provided so long as it does not affect the operation of the device 8.
The shape of the openings 3 is not limited to a narrow rectangular shape. Similarly, the arrangement of the openings 3 is not limited to a rectangular shape. The and arrangement of the openings 3 should be selectively deter-mined in accordance with the arrangement of the terminals 22 of the device 8.
The advantages of the first embodiment are described below.
First, according to the first embodiment of the present invention, the center region 20 of the base film 1, as well as the peripheral region 19, can accommodate the terminals 11 for connection between the tape carrier 100 and the substrate 101. This arrangement results in an increased number of terminals between the tape carrier 100 and the substrate 101. This advantage is due to the narrow openings 3 for receiving the U-shaped thermode 16.
Second, the total wiring length within the tape carrier 100 is shortened because the inner wiring lines 12 are generally shorter than the outer wiring lines 7. Simul _g_ taneously, the tape carrier 100 can be downsized because the total number of terminals 10 in the peripheral region 19 is reduced.
Next is described an exemplary comparison of the conventional tape carrier and the tape carrier according to the first embodiment in view of the number of terminals and sizes of the carriers.
The conventional tape carrier is nearly equal to the first embodiment in the number of terminals if it accom modates the 10th to 17th rows of terminals in the peripheral region 19. Specifically, the number of terminals of this tape carrier is 800 (_ (33 x 33) - (17 x 17)). This is nearly equal to the number of terminals of the first embodi-ment (e. g., 793).
The outer diameter and the maximum wiring length of this conventional tape carrier are 40.64 mm and about 33 mm, respectively. In contrast, the outer diameter and the maximum wiring length are preferably 38.1 mm and about 30 mm, respectively, in the first embodiment. That is, the outer diameter and the maximum wiring length have been shortened by 2 mm and 3 mm, respectively.
A third advantage of the first embodiment is the reduction of the power supply noise. This advantage is due to the power supply and the ground being collectively connected to the inner wiring lines 12, to reduce their inductance.
Fourthly, the first embodiment allows the leads 4 and the device 8 to be easily connected together. The leads 4 and the device 8 are connected by thermocompression bonding. The thermocompression bonding requires a smaller number of steps and requires less time for the connecting operation than that of other connecting methods such as solder reflowing. Further, by replacing the conventional thermode with a U-shaped thermode 16, a conventional manu-facturing apparatus can also be used.
Next, a second embodiment of the present invention is described in which the leads 4 are modified. The struc-tures of the other parts of the second embodiment are the same as those in the first embodiment.
Referring to Figure 7, in the second embodiment, the leads 4 extend to the openings 3 but do not bridge the openings. Thus, the ends of the leads 4 hang freely above the openings 3.
In the second embodiment, since the leads 4 have free ends, the leads 4 flexibly follow the thermocompression bonding operation. Therefore, the thermocompression bonding operation can be performed more easily than in the first embodiment.
Next, a third embodiment of the present invention is described in which a structure is provided on the center region 20 of the base film 1. Specifically, a wiring plane 18 is provided on the center region 20 instead of the inner wiring lines 12. The structures of the other parts of the third embodiment are the same as those in the first embodi-ment.
Referring to Figure 8, the wiring plane 18 is provided on the center region 20 and is connected to the terminals il on the back surface of the tape carrier 100 through the through-holes 6. The wiring plane 18 is connected to a power supply or the ground via the terminals 11 (shown in Figure 2).
In this embodiment, the power supply noise is further reduced because the inductance of a line connecting a power source or the ground and the device 8 is reduced to that of the wiring plane 18. In addition, the wiring plane 18 acts as a shield against external electromagnetic waves.
The invention may be embodied in other specific forms without departing from the spirit or essential charac teristics thereof. For example, there are no limitations on the structures provided on the center region 20 of the base film 1. Further, the features of the respective embodiments may be combined. For example, the inner wiring lines 12 and the wiring plane 18 may both be provided on the center region 20.
The present embodiments are therefore, to be con sidered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description and a11 changes which come within the meanings and range of equi-valency of the claims are therefore intended to the embraced therein.

Claims (20)

1. A tape carrier for receiving a device, comprising:
a film having first and second surfaces and including first and second regions, said first region of said film being covered with said device when said device is received by said first surface of said film, said film having an opening between said first and second regions of said film;
a first lead provided on said first surface of said film, said first lead extending above said opening of said film, said first lead being coupled to said device at said opening of said film when said device is received by said first surface of said film;
a first terminal provided on said second surface in said first region of said film; and, a first connection between said first lead and said first terminal.
2. A tape carrier according to claim 1, further comprising:
a second lead provided on said first surface of said film, said second lead extending above said opening of said film, said second lead being coupled to said device at said opening of said film when said device is received by said first surface of said film;
a second terminal provided on said second surface in said second region of said film; and, a second connection between said second lead and said second terminal.
3. A tape carrier according to claim 1, wherein said first connection comprises a first wiring provided on said first surface in said first region of said film and a first through-hole in said film connecting said first wiring to said first terminal.
4. A tape carrier according to claim 2, wherein said second connection comprises a second wiring provided on said first surface in said second region of said film and a second through-hole in said film connecting said second wiring to said second terminal.
5. A tape carrier according to claim 1, wherein said first lead bridges said opening.
6. A tape carrier according to claim 1, wherein a first end of said first lead includes a free end positioned partially over said opening.
7. A tape carrier according to claim 1, wherein said tape carrier has a plurality of said first terminals, and said plurality of said first terminals are arranged in a grid.
8. A tape carrier according to claim 2, wherein said tape carrier has a plurality of said first terminals and a plurality of said second terminals, and said plurality of said first terminals and said plurality of said second terminals are arranged in a grid.
9. A tape carrier according to claim 1, said tape carrier being adapted for connection to one of a power supply and a ground, wherein said first terminal is for connection to said one of said power supply and said ground.
10. A tape carrier according to claim 3, wherein said first wiring comprises a wiring plate.
11. A tape carrier according to claim 1, wherein said tape carrier has a plurality of said openings and said plurality of said openings are arranged in a rectangular shape.
12. A tape carrier according to claim 11, wherein said first region of said film is surrounded by said plurality of said openings.
13. A process for manufacturing a tape carrier, comprising the steps of:
(a) forming an opening and a hole in a film, said film having a first surface;
(b) attaching a first surface of a foil to said first surface of said film;
(c) applying a resist over said foil, said resist being applied to said first surface of said foil through said opening and said hole of said film;
(d) etching said foil to form a lead extending above said opening of said film and a wiring connected to said lead; and, (e) applying a conductive material into said hole of said film to form a through-hole connected to said wiring.
14. A tape carrier prepared by a process comprising the steps of:
(a) forming an opening and a hole in a film, said film having a first surface;
(b) attaching a first surface of a foil to said first surface of said film;
(c) applying a resist over said foil, said resist being applied to said first surface of said foil through said opening and said hole of said film;
(d) etching said foil to form a lead extending above said opening of said film and a wiring connected to said lead; and, (e) applying a conductive material into said hole of said film to form a through-hole connected to said wiring.
15. A process for mounting a device on a tape carrier, said tape carrier comprising:
a film having first and second surfaces and including first and second regions, said first region of said film being covered with said device when said device is mounted on film, said film having an opening between said first and second regions of said film;
a first lead provided on said first surface of said film, said first lead extending above said opening of said film, said first lead being coupled to said device at said opening of said film when said device is mounted on said first surface of said film;
a first terminal provided on said second surface in said first region of said film; and a first connection between said first lead and said first terminal;
said process comprising the steps of:
(a) locating said device over said first surface of said film so that a second terminal on said device is opposite said first lead; and, (b) thermocompression bonding said first lead of said tape carrier and said second terminal of said device by inserting a thermode into said opening of said film from said second surface of said film.
16. A tape carrier according to claim 1, further comprising a resin for encapsulating said device.
17. A structure for mounting a device on a substrate, comprising:
a film having first and second surfaces and including first and second regions, said first region of said film being covered with said device when said device is mounted on said first surface of said film, said film having an opening between said first and second regions;
a first lead provided on said first surface of said film, said first lead extending above said opening of said film, said first lead being coupled to said device at said opening of said film;
a first terminal connected to said substrate, said first terminal being provided on a second surface in said first region of said film; and, a first connection between said first lead and said first terminal.
18. A tape carrier according to claim 17, further comprising:
a second lead provided on said first surface of said film, said second lead extending above said opening of said film, said second lead being coupled to said device at said opening of said film when said device is received by said first surface of said film;
a second terminal provided on said second surface in said second region of said film; and, a second connection between said second lead and said second terminal.
19. A tape carrier according to claim 18, wherein said first connection comprises a first wiring provided on said first surface in said first region of said film and a first through-hole in said film connecting said first wiring to said first terminal.
20. A tape carrier according to claim 19, wherein said second connection comprises a second wiring provided on said first surface in said second region of said film and a second through-hole in said film connecting said second wiring to said second terminal.
CA002147318A 1994-05-31 1995-04-19 Tape carrier for increasing the number of terminals between the tape carrier and a substrate Expired - Fee Related CA2147318C (en)

Applications Claiming Priority (2)

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JP118224/1994 1994-05-31
JP6118224A JP2647001B2 (en) 1994-05-31 1994-05-31 Tape carrier, mounting structure of semiconductor device, and method of manufacturing the same

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CA2147318A1 CA2147318A1 (en) 1995-12-01
CA2147318C true CA2147318C (en) 1999-07-13

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EP (1) EP0703615A1 (en)
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US5731630A (en) 1998-03-24
EP0703615A1 (en) 1996-03-27
CA2147318A1 (en) 1995-12-01
JPH07326644A (en) 1995-12-12
JP2647001B2 (en) 1997-08-27

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