CA2155121A1 - Micromachined Relay and Method of Forming the Relay - Google Patents

Micromachined Relay and Method of Forming the Relay

Info

Publication number
CA2155121A1
CA2155121A1 CA2155121A CA2155121A CA2155121A1 CA 2155121 A1 CA2155121 A1 CA 2155121A1 CA 2155121 A CA2155121 A CA 2155121A CA 2155121 A CA2155121 A CA 2155121A CA 2155121 A1 CA2155121 A1 CA 2155121A1
Authority
CA
Canada
Prior art keywords
cavity
substrate
contacts
insulating
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2155121A
Other languages
French (fr)
Other versions
CA2155121C (en
Inventor
Christopher D. James
Henry S. Katzenstein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mindspeed Technologies LLC
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2155121A1 publication Critical patent/CA2155121A1/en
Application granted granted Critical
Publication of CA2155121C publication Critical patent/CA2155121C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/14—Contacts characterised by the manner in which co-operating contacts engage by abutting
    • H01H1/20—Bridging contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0084—Switches making use of microelectromechanical systems [MEMS] with perpendicular movement of the movable contact relative to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H01H2059/0018—Special provisions for avoiding charge trapping, e.g. insulation layer between actuating electrodes being permanently polarised by charge trapping so that actuating or release voltage is altered

Abstract

A bridging member (18) extending across a cavity (16) in a semiconductor substrate (12) (e.g. polycrystalline silicon) has successive layers - a masking layer (20), an electrically conductive layer (22) (e.g. polysilicon) and an insulating layer (24) (eg. SiO2).
A first electrical contact (32) (e.g. gold coated with ruthenium) extends on the insulating layer in a direction perpendicular to the extension of the bridging members across the cavity. A pair of bumps (34) (e.g. gold) are on the insulating layer each between the contact and one of the cavity ends.
Initially the bridging member (18) and then the contact (32) and the bumps (34) are formed on the substrate and then the cavity (16) is etched in the substrate through holes in the bridging member. A
pair of second electrical contacts (44) (e.g. gold coated with ruthenium) are on the surface of an insulating substrate (14) (e.g. pyrex glass) adjacent the substrate. The two substrates are bonded after the contacts are cleaned. The first contact (32) is normally separated from the second contacts (44) because the bumps(34) engage the insulating substrate surface. When a voltage is applied between an electrically conductive layer on the insulating substrate surface and the polysilicon layer, the bridging member (18) is deflected so that the first contact (33) engages the second contacts (44). Electrical leads extend on the surface of the insulating substrate from the second contacts to bonding pads disposed adjacent a second cavity in the semiconductor substrate. The resultant relays on a wafer may be separated by sawing the semiconductor and insulating substrates at the position of the second cavity in each relay to expose the pads for electrical connections.
CA 2155121 1993-02-01 1994-01-31 Micromachined relay and method of forming the relay Expired - Fee Related CA2155121C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/012,055 US5479042A (en) 1993-02-01 1993-02-01 Micromachined relay and method of forming the relay
US08/012,055 1993-02-01
PCT/US1994/001091 WO1994018688A1 (en) 1993-02-01 1994-01-31 Micromachined relay and method of forming the relay

Publications (2)

Publication Number Publication Date
CA2155121A1 true CA2155121A1 (en) 1994-08-18
CA2155121C CA2155121C (en) 2000-10-17

Family

ID=21753163

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 2155121 Expired - Fee Related CA2155121C (en) 1993-02-01 1994-01-31 Micromachined relay and method of forming the relay

Country Status (6)

Country Link
US (3) US5479042A (en)
EP (1) EP0681739B1 (en)
JP (1) JPH08509093A (en)
CA (1) CA2155121C (en)
DE (1) DE69417725T2 (en)
WO (1) WO1994018688A1 (en)

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Also Published As

Publication number Publication date
US5479042A (en) 1995-12-26
DE69417725D1 (en) 1999-05-12
US5620933A (en) 1997-04-15
US5627396A (en) 1997-05-06
DE69417725T2 (en) 1999-10-14
EP0681739A1 (en) 1995-11-15
EP0681739B1 (en) 1999-04-07
CA2155121C (en) 2000-10-17
WO1994018688A1 (en) 1994-08-18
JPH08509093A (en) 1996-09-24

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