CA2175087A1 - Coplanar Waveguide Mounted Flip Chip - Google Patents
Coplanar Waveguide Mounted Flip ChipInfo
- Publication number
- CA2175087A1 CA2175087A1 CA2175087A CA2175087A CA2175087A1 CA 2175087 A1 CA2175087 A1 CA 2175087A1 CA 2175087 A CA2175087 A CA 2175087A CA 2175087 A CA2175087 A CA 2175087A CA 2175087 A1 CA2175087 A1 CA 2175087A1
- Authority
- CA
- Canada
- Prior art keywords
- connection region
- coplanar waveguide
- waveguide
- fet chip
- signal conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/60—Amplifiers in which coupling networks have distributed constants, e.g. with waveguide resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/60—Amplifiers in which coupling networks have distributed constants, e.g. with waveguide resonators
- H03F3/602—Combinations of several amplifiers
- H03F3/604—Combinations of several amplifiers using FET's
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6644—Packaging aspects of high-frequency amplifiers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/372—Noise reduction and elimination in amplifier
Abstract
A radio-frequency power amplifier (22) includes a multiple-FET chip (26) that is flip mounted on a connection region (32) of a substrate (30). An input impedance-matching network (62, 64) is also mounted on the substrate. The network includes a coplanar waveguide (24) having an elongate waveguide signal conductor (48b, 48c) for each gate terminal (70) on the FET chip (26) with a distal end (48d, 48c) spaced from the connection region (32) and a proximal end (48g, 48h) in the connection region. A capacitor (54, 56) couples each of the input signal conductor distal ends (48d, 48c) to an adjacent ground conductor (36, 38). The signal conductors (48b, 48c) and capacitors (54, 56) provide a selected impedance at a selected frequency. An output coplanar waveguide (28) includes, for each drain terminal (72) an output signal conductor (88) having an end (82a) in the connection region (32) that is electrically connected to the flip mounted FET chip (26). This waveguide (28) also has a length selected to provide desired impedance matching and may also have other means of impedance matching.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31392794A | 1994-09-26 | 1994-09-26 | |
US08/313/927 | 1994-09-26 | ||
US08/478,375 | 1995-06-07 | ||
US08/478,375 US5528203A (en) | 1994-09-26 | 1995-06-07 | Coplanar waveguide-mounted flip chip |
PCT/US1995/012301 WO1996010292A1 (en) | 1994-09-26 | 1995-09-25 | Coplanar waveguide-mounted flip chip |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2175087A1 true CA2175087A1 (en) | 1996-04-04 |
CA2175087C CA2175087C (en) | 1999-07-20 |
Family
ID=26979127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002175087A Expired - Fee Related CA2175087C (en) | 1994-09-26 | 1995-09-25 | Coplanar waveguide mounted flip chip |
Country Status (9)
Country | Link |
---|---|
US (2) | US5528203A (en) |
EP (1) | EP0730793A4 (en) |
JP (1) | JP3134086B2 (en) |
KR (1) | KR100227540B1 (en) |
CN (1) | CN1062394C (en) |
AU (1) | AU681050B2 (en) |
BR (1) | BR9506378A (en) |
CA (1) | CA2175087C (en) |
WO (1) | WO1996010292A1 (en) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5752182A (en) * | 1994-05-09 | 1998-05-12 | Matsushita Electric Industrial Co., Ltd. | Hybrid IC |
US6265937B1 (en) | 1994-09-26 | 2001-07-24 | Endgate Corporation | Push-pull amplifier with dual coplanar transmission line |
US5623231A (en) * | 1994-09-26 | 1997-04-22 | Endgate Corporation | Push-pull power amplifier |
US5978666A (en) * | 1994-09-26 | 1999-11-02 | Endgate Corporation | Slotline-mounted flip chip structures |
US5942957A (en) * | 1994-09-26 | 1999-08-24 | Endgate Corporation | Flip-mounted impedance |
US6094114A (en) * | 1994-09-26 | 2000-07-25 | Endgate Corporation | Slotline-to-slotline mounted flip chip |
US5528203A (en) * | 1994-09-26 | 1996-06-18 | Endgate Corporation | Coplanar waveguide-mounted flip chip |
US5983089A (en) * | 1994-09-26 | 1999-11-09 | Endgate Corporation | Slotline-mounted flip chip |
US6023209A (en) * | 1996-07-05 | 2000-02-08 | Endgate Corporation | Coplanar microwave circuit having suppression of undesired modes |
US5821815A (en) * | 1996-09-25 | 1998-10-13 | Endgate Corporation | Miniature active conversion between slotline and coplanar waveguide |
JP3147061B2 (en) * | 1997-11-19 | 2001-03-19 | 日本電気株式会社 | Substrate type non-reciprocal element and integrated circuit using the same |
JP3496752B2 (en) * | 1998-02-19 | 2004-02-16 | シャープ株式会社 | Microwave / millimeter wave equipment |
US6064253A (en) * | 1998-04-20 | 2000-05-16 | Endgate Corporation | Multiple stage self-biasing RF transistor circuit |
CN1299524A (en) * | 1998-04-24 | 2001-06-13 | 恩德威夫公司 | Coplanar microwave circuit having suppression of undesired mode |
US5990757A (en) * | 1998-06-05 | 1999-11-23 | Raytheon Company | Gallium arsenide monolithic microwave integrated circuits employing thermally bumped devices |
US6259337B1 (en) * | 1999-08-19 | 2001-07-10 | Raytheon Company | High efficiency flip-chip monolithic microwave integrated circuit power amplifier |
US6507110B1 (en) | 2000-03-08 | 2003-01-14 | Teledyne Technologies Incorporated | Microwave device and method for making same |
DE10037385A1 (en) * | 2000-08-01 | 2002-02-14 | Bosch Gmbh Robert | Device with a capacitor |
KR100394377B1 (en) * | 2000-09-07 | 2003-08-14 | 이진구 | manufacturing method of bump for flip chip |
US6437669B1 (en) | 2000-09-29 | 2002-08-20 | Applied Micro Circuits Corporation | Microwave to millimeter wave frequency substrate interface |
US6724261B2 (en) * | 2000-12-13 | 2004-04-20 | Aria Microwave Systems, Inc. | Active radio frequency cavity amplifier |
US6882239B2 (en) * | 2001-05-08 | 2005-04-19 | Formfactor, Inc. | Electromagnetically coupled interconnect system |
US6469383B1 (en) | 2001-09-17 | 2002-10-22 | Applied Micro Circuits Corporation | Flip-chip transition interface structure |
US6514783B1 (en) | 2001-09-17 | 2003-02-04 | Applied Micro Circuits Corporation | Method for determining a layout for a flip-chip transition interface structure |
US6639322B1 (en) | 2001-09-17 | 2003-10-28 | Applied Micro Circuits Corporation | Flip-chip transition interface structure |
CN1564940A (en) * | 2002-04-19 | 2005-01-12 | 韦弗拜克公司 | Sample detection based on low-frequency spectral components |
US6933603B2 (en) * | 2002-07-11 | 2005-08-23 | Teledyne Technologies Incorporated | Multi-substrate layer semiconductor packages and method for making same |
US7466157B2 (en) * | 2004-02-05 | 2008-12-16 | Formfactor, Inc. | Contactless interfacing of test signals with a device under test |
US7813145B2 (en) * | 2004-06-30 | 2010-10-12 | Endwave Corporation | Circuit structure with multifunction circuit cover |
US7656236B2 (en) | 2007-05-15 | 2010-02-02 | Teledyne Wireless, Llc | Noise canceling technique for frequency synthesizer |
US8983242B2 (en) * | 2008-01-31 | 2015-03-17 | Alcatel Lucent | Plasmonic device for modulation and amplification of plasmonic signals |
US8344750B2 (en) * | 2008-03-25 | 2013-01-01 | Alcatel Lucent | Surface-plasmon detector based on a field-effect transistor |
US8179045B2 (en) | 2008-04-22 | 2012-05-15 | Teledyne Wireless, Llc | Slow wave structure having offset projections comprised of a metal-dielectric composite stack |
US8416024B2 (en) * | 2011-04-19 | 2013-04-09 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Impedance matching arrangement for amplifier having split shunt capacitor and amplifier including the same |
US20120280755A1 (en) * | 2011-05-04 | 2012-11-08 | Triquint Semiconductor, Inc. | Flip-chip power amplifier and impedance matching network |
GB2495493A (en) * | 2011-10-10 | 2013-04-17 | Nujira Ltd | A low-impedance supply feed network for an envelope-tracking RF power amplifier |
US9903090B2 (en) | 2012-01-18 | 2018-02-27 | Harnischfeger Technologies, Inc. | System and method for vibration monitoring of a mining machine |
US9202660B2 (en) | 2013-03-13 | 2015-12-01 | Teledyne Wireless, Llc | Asymmetrical slow wave structures to eliminate backward wave oscillations in wideband traveling wave tubes |
US10693236B2 (en) | 2016-02-03 | 2020-06-23 | Waymo Llc | Iris matched PCB to waveguide transition |
JP2021078054A (en) * | 2019-11-12 | 2021-05-20 | 富士通株式会社 | Semiconductor device |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3517278A (en) * | 1967-10-02 | 1970-06-23 | Teledyne Inc | Flip chip structure |
US3622385A (en) * | 1968-07-19 | 1971-11-23 | Hughes Aircraft Co | Method of providing flip-chip devices with solderable connections |
US4135168A (en) * | 1978-02-02 | 1979-01-16 | Microwave Semiconductor Corporation | Reverse channel GaAsFET oscillator |
FR2489624B1 (en) * | 1980-09-02 | 1985-06-14 | Thomson Csf | MONOLITHIC AMPLIFIER COMPRISING A POWER DIVISION AND RECOMBINATION SYSTEM COMPRISING SEVERAL TRANSISTORS |
US4376287A (en) * | 1980-10-29 | 1983-03-08 | Rca Corporation | Microwave power circuit with an active device mounted on a heat dissipating substrate |
IT1137600B (en) * | 1981-07-08 | 1986-09-10 | Cise Spa | DIELECTRIC CAVITY PLANAR OSCILLATOR OPERATING AT MICROWAVE FREQUENCY |
FR2515448B1 (en) * | 1981-10-23 | 1986-08-14 | Thomson Csf | BROADBAND MICROPHONE DEVICE FOR GENERATING PEER HARMONICS OF AN INCIDENT SIGNAL AND SYSTEM COMPRISING SUCH A DEVICE |
FR2524712B1 (en) * | 1982-03-31 | 1985-06-07 | Radiotechnique Compelec | MICROWAVE CIRCUIT WITH INTEGRATED CAPACITOR AND APPLICATION TO A SUPPLY CIRCUIT |
US4739519A (en) * | 1985-10-31 | 1988-04-19 | Narda Western Operations | Coplanar microwave balun, multiplexer and mixer assemblies |
JP2522649B2 (en) * | 1986-08-14 | 1996-08-07 | 日本電信電話株式会社 | Ultra high speed integrated circuit |
JP2597645B2 (en) * | 1988-04-18 | 1997-04-09 | 日本電信電話株式会社 | High frequency power distribution / combination circuit |
US5206986A (en) * | 1989-08-11 | 1993-05-04 | Fujitsu Limited | Method of producing an electronic circuit package |
US5115245A (en) * | 1990-09-04 | 1992-05-19 | Hughes Aircraft Company | Single substrate microwave radar transceiver including flip-chip integrated circuits |
US5138436A (en) * | 1990-11-16 | 1992-08-11 | Ball Corporation | Interconnect package having means for waveguide transmission of rf signals |
US5087896A (en) * | 1991-01-16 | 1992-02-11 | Hughes Aircraft Company | Flip-chip MMIC oscillator assembly with off-chip coplanar waveguide resonant inductor |
US5105171A (en) * | 1991-04-29 | 1992-04-14 | Hughes Aircraft Company | Coplanar waveguide directional coupler and flip-clip microwave monolithic integrated circuit assembly incorporating the coupler |
US5132641A (en) * | 1991-05-01 | 1992-07-21 | Fujitsu Limited | Apparatus and method for dividing/combining microwave power from an odd number of transistor chips |
JP2605502B2 (en) * | 1991-05-14 | 1997-04-30 | 三菱電機株式会社 | package |
US5194833A (en) * | 1991-11-15 | 1993-03-16 | Motorola, Inc. | Airbridge compensated microwave conductors |
DE69422968T2 (en) * | 1993-12-22 | 2000-06-29 | Murata Manufacturing Co | Mounting arrangement for electronic component |
US5528203A (en) * | 1994-09-26 | 1996-06-18 | Endgate Corporation | Coplanar waveguide-mounted flip chip |
US5550518A (en) * | 1995-06-12 | 1996-08-27 | Endgate Corporation | Miniature active conversion between microstrip and coplanar wave guide |
-
1995
- 1995-06-07 US US08/478,375 patent/US5528203A/en not_active Expired - Lifetime
- 1995-09-25 EP EP95933953A patent/EP0730793A4/en not_active Withdrawn
- 1995-09-25 KR KR1019960702766A patent/KR100227540B1/en not_active IP Right Cessation
- 1995-09-25 AU AU36423/95A patent/AU681050B2/en not_active Ceased
- 1995-09-25 CN CN95190932A patent/CN1062394C/en not_active Expired - Fee Related
- 1995-09-25 JP JP08511972A patent/JP3134086B2/en not_active Expired - Fee Related
- 1995-09-25 CA CA002175087A patent/CA2175087C/en not_active Expired - Fee Related
- 1995-09-25 WO PCT/US1995/012301 patent/WO1996010292A1/en not_active Application Discontinuation
- 1995-09-25 BR BR9506378A patent/BR9506378A/en not_active Application Discontinuation
-
1996
- 1996-06-12 US US08/662,693 patent/US5668512A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
AU681050B2 (en) | 1997-08-14 |
JP3134086B2 (en) | 2001-02-13 |
EP0730793A1 (en) | 1996-09-11 |
US5528203A (en) | 1996-06-18 |
AU3642395A (en) | 1996-04-19 |
CN1062394C (en) | 2001-02-21 |
WO1996010292A1 (en) | 1996-04-04 |
EP0730793A4 (en) | 2000-02-23 |
CN1135811A (en) | 1996-11-13 |
CA2175087C (en) | 1999-07-20 |
KR100227540B1 (en) | 1999-11-01 |
JPH09500780A (en) | 1997-01-21 |
US5668512A (en) | 1997-09-16 |
KR960706224A (en) | 1996-11-08 |
BR9506378A (en) | 1997-09-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |