CA2178465A1 - Procede et dispositif de brasage a la vague integrant une operation de fluxage par voie seche - Google Patents
Procede et dispositif de brasage a la vague integrant une operation de fluxage par voie secheInfo
- Publication number
- CA2178465A1 CA2178465A1 CA002178465A CA2178465A CA2178465A1 CA 2178465 A1 CA2178465 A1 CA 2178465A1 CA 002178465 A CA002178465 A CA 002178465A CA 2178465 A CA2178465 A CA 2178465A CA 2178465 A1 CA2178465 A1 CA 2178465A1
- Authority
- CA
- Canada
- Prior art keywords
- gas
- circuit
- wave
- process including
- species
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Abstract
L'invention concerne un procédé de brasage à la vague d'un circuit à l'aide d'un alliage de soudure, au cours duquel, on met en contact le cir-cuit avec au moins une vague de soudure liquide, obtenue par pompage d'un bain liquide de l'alliage de soudure, contenu dans un bac, au travers d'une buse, caractérisé en ce que, au préalable, chacune des faces du circuit a été, à une pression voisine de la pression atmosphérique, amenée en regard de la sortie de gaz d'au moins un appareil de formation d'espèces gazeuses excitées ou instables dans lequel on fait passer un mélange gazeux initial comprenant un gaz inerte et/ou un gaz réducteur et/ou un gaz oxydant, pour obtenir en sortie de gaz de l'appa-reil, un mélange gazeux primaire comprenant des espèces excitées ou instables et substantiellement dépourvu d'espèces électriquement chargées.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9506818 | 1995-06-09 | ||
FR9506818A FR2735053B1 (fr) | 1995-06-09 | 1995-06-09 | Procede et dispositif de brasage a la vague integrant une operation de fluxage par voie seche |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2178465A1 true CA2178465A1 (fr) | 1996-12-10 |
CA2178465C CA2178465C (fr) | 2002-10-29 |
Family
ID=9479786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002178465A Expired - Fee Related CA2178465C (fr) | 1995-06-09 | 1996-06-06 | Procede et dispositif de brasage a la vague integrant une operation de fluxage par voie seche |
Country Status (18)
Country | Link |
---|---|
US (1) | US5722581A (fr) |
EP (1) | EP0747160B1 (fr) |
JP (1) | JP3313972B2 (fr) |
KR (1) | KR100321354B1 (fr) |
CN (1) | CN1095316C (fr) |
AR (1) | AR002312A1 (fr) |
AU (1) | AU712613B2 (fr) |
BR (1) | BR9602725A (fr) |
CA (1) | CA2178465C (fr) |
DE (1) | DE69603418T2 (fr) |
DK (1) | DK0747160T3 (fr) |
ES (1) | ES2136376T3 (fr) |
FR (1) | FR2735053B1 (fr) |
GR (1) | GR3031181T3 (fr) |
HK (1) | HK1013039A1 (fr) |
MX (1) | MX9601752A (fr) |
TW (1) | TW307092B (fr) |
ZA (1) | ZA964623B (fr) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3521587B2 (ja) * | 1995-02-07 | 2004-04-19 | セイコーエプソン株式会社 | 基板周縁の不要物除去方法及び装置並びにそれを用いた塗布方法 |
DE19749185A1 (de) * | 1997-11-07 | 1999-05-12 | Messer Griesheim Gmbh | Mit einer Gasversorgung verbindbare Gasverteilung |
DE19749187A1 (de) * | 1997-11-07 | 1999-05-12 | Messer Griesheim Gmbh | Lötvorrichtung |
FR2778190B1 (fr) * | 1998-05-04 | 2000-06-02 | Air Liquide | Procede et appareil de traitement de surfaces metalliques par voie seche |
DE19825423A1 (de) * | 1998-06-06 | 1999-12-09 | Alcatel Sa | Vorrichtung zur Herstellung eines optischen Kabels |
US6315189B1 (en) * | 1998-10-13 | 2001-11-13 | Texas Instruments Incorporated | Semiconductor package lead plating method and apparatus |
US6354481B1 (en) * | 1999-02-18 | 2002-03-12 | Speedline Technologies, Inc. | Compact reflow and cleaning apparatus |
US6468833B2 (en) | 2000-03-31 | 2002-10-22 | American Air Liquide, Inc. | Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods |
JP2002080950A (ja) * | 2000-09-07 | 2002-03-22 | Senju Metal Ind Co Ltd | ドロスから酸化物を分離する方法および噴流はんだ槽 |
DE50115393D1 (de) * | 2000-10-06 | 2010-04-29 | Pac Tech Gmbh | Verfahren zum flussmittelfreien aufbringen eines lötmittels auf ein substrat oder einen chip |
US6776330B2 (en) | 2001-09-10 | 2004-08-17 | Air Products And Chemicals, Inc. | Hydrogen fluxless soldering by electron attachment |
JP4409134B2 (ja) * | 2001-10-09 | 2010-02-03 | パナソニック株式会社 | 実装システム |
US20080011332A1 (en) * | 2002-04-26 | 2008-01-17 | Accretech Usa, Inc. | Method and apparatus for cleaning a wafer substrate |
US20080017316A1 (en) * | 2002-04-26 | 2008-01-24 | Accretech Usa, Inc. | Clean ignition system for wafer substrate processing |
US20080190558A1 (en) * | 2002-04-26 | 2008-08-14 | Accretech Usa, Inc. | Wafer processing apparatus and method |
US6936546B2 (en) * | 2002-04-26 | 2005-08-30 | Accretech Usa, Inc. | Apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates |
US7897029B2 (en) * | 2008-03-04 | 2011-03-01 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment |
US7079370B2 (en) | 2003-04-28 | 2006-07-18 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation |
US7387738B2 (en) * | 2003-04-28 | 2008-06-17 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment for wafer bumping applications |
US8361340B2 (en) | 2003-04-28 | 2013-01-29 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment |
CA2465195C (fr) * | 2003-04-28 | 2012-06-19 | Air Products And Chemicals, Inc. | Dispositif d'electrode pour eliminer les oxydes de surface par fixation d'electrons |
US7434719B2 (en) * | 2005-12-09 | 2008-10-14 | Air Products And Chemicals, Inc. | Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment |
DE102006024192A1 (de) * | 2006-05-23 | 2007-11-29 | Linde Ag | Vorrichtung und Verfahren zum Wellenlöten |
DE102006027027A1 (de) | 2006-06-08 | 2007-12-13 | Centrotherm Thermal Solutions Gmbh + Co.Kg | Lötverfahren |
US8567658B2 (en) * | 2009-07-20 | 2013-10-29 | Ontos Equipment Systems, Inc. | Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bonds |
US8454850B2 (en) * | 2009-09-02 | 2013-06-04 | Air Products And Chemicals, Inc. | Method for the removal of surface oxides by electron attachment |
SG192011A1 (en) * | 2011-01-17 | 2013-08-30 | Orthodyne Electronics Corp | Systems and methods for processing ribbon and wire in ultrasonic bonding systems |
US9006975B2 (en) | 2011-02-09 | 2015-04-14 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment |
US9053894B2 (en) | 2011-02-09 | 2015-06-09 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment |
JP2014157858A (ja) * | 2013-02-14 | 2014-08-28 | Fuji Electric Co Ltd | 半導体装置の製造方法 |
KR102124042B1 (ko) * | 2013-02-18 | 2020-06-18 | 삼성디스플레이 주식회사 | 기상 증착 장치, 이를 이용한 증착 방법 및 유기 발광 표시 장치 제조 방법 |
CN104425289B (zh) * | 2013-09-11 | 2017-12-15 | 先进科技新加坡有限公司 | 利用激发的混合气体的晶粒安装装置和方法 |
US10438804B2 (en) | 2014-11-12 | 2019-10-08 | Ontos Equipment Systems | Simultaneous hydrophilization of photoresist and metal surface preparation: methods, systems, and products |
KR20190058228A (ko) | 2017-11-20 | 2019-05-29 | (주)케이티엔에프 | 웨이브 솔더링 공정에서 피씨비(pcb)의 과열을 방지할 수 있는 웨이브 지그 및 이를 이용한 웨이브 솔더링 방법 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4273859A (en) * | 1979-12-31 | 1981-06-16 | Honeywell Information Systems Inc. | Method of forming solder bump terminals on semiconductor elements |
US5090609A (en) * | 1989-04-28 | 1992-02-25 | Hitachi, Ltd. | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals |
DE4032328A1 (de) * | 1989-11-06 | 1991-09-19 | Wls Karl Heinz Grasmann Weichl | Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern |
US5255840A (en) * | 1989-12-26 | 1993-10-26 | Praxair Technology, Inc. | Fluxless solder coating and joining |
FR2683114A1 (fr) * | 1991-10-28 | 1993-04-30 | Brizais Jacqueline | Installation pour le traitement de cartes de circuit imprime par un flux. |
FR2692730B1 (fr) * | 1992-06-19 | 1994-08-19 | Air Liquide | Dispositif de formation de molécules gazeuses excitées ou instables et utilisations d'un tel dispositif. |
FR2713528B1 (fr) * | 1993-12-15 | 1996-01-12 | Air Liquide | Procédé et dispositif de fluxage par voie sèche de surfaces métalliques avant brasage ou étamage. |
US5525204A (en) * | 1994-09-29 | 1996-06-11 | Motorola, Inc. | Method for fabricating a printed circuit for DCA semiconductor chips |
-
1995
- 1995-06-09 FR FR9506818A patent/FR2735053B1/fr not_active Expired - Fee Related
-
1996
- 1996-04-29 TW TW085105072A patent/TW307092B/zh active
- 1996-05-09 MX MX9601752A patent/MX9601752A/es not_active IP Right Cessation
- 1996-05-22 KR KR1019960017398A patent/KR100321354B1/ko not_active IP Right Cessation
- 1996-05-31 DE DE69603418T patent/DE69603418T2/de not_active Expired - Fee Related
- 1996-05-31 DK DK96401173T patent/DK0747160T3/da active
- 1996-05-31 ES ES96401173T patent/ES2136376T3/es not_active Expired - Lifetime
- 1996-05-31 EP EP96401173A patent/EP0747160B1/fr not_active Expired - Lifetime
- 1996-06-04 ZA ZA964623A patent/ZA964623B/xx unknown
- 1996-06-05 AR ARP960102917A patent/AR002312A1/es unknown
- 1996-06-06 CA CA002178465A patent/CA2178465C/fr not_active Expired - Fee Related
- 1996-06-07 CN CN96108133A patent/CN1095316C/zh not_active Expired - Fee Related
- 1996-06-07 JP JP14586196A patent/JP3313972B2/ja not_active Expired - Fee Related
- 1996-06-07 US US08/655,206 patent/US5722581A/en not_active Expired - Fee Related
- 1996-06-07 AU AU55833/96A patent/AU712613B2/en not_active Ceased
- 1996-06-10 BR BR9602725A patent/BR9602725A/pt not_active IP Right Cessation
-
1998
- 1998-12-21 HK HK98114140A patent/HK1013039A1/xx not_active IP Right Cessation
-
1999
- 1999-09-08 GR GR990402275T patent/GR3031181T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
KR100321354B1 (ko) | 2002-07-06 |
DE69603418D1 (de) | 1999-09-02 |
DK0747160T3 (da) | 1999-12-13 |
GR3031181T3 (en) | 1999-12-31 |
FR2735053B1 (fr) | 1997-07-25 |
HK1013039A1 (en) | 1999-08-13 |
DE69603418T2 (de) | 2000-02-03 |
US5722581A (en) | 1998-03-03 |
CA2178465C (fr) | 2002-10-29 |
EP0747160A2 (fr) | 1996-12-11 |
EP0747160B1 (fr) | 1999-07-28 |
EP0747160A3 (fr) | 1997-02-12 |
AU712613B2 (en) | 1999-11-11 |
CN1095316C (zh) | 2002-11-27 |
JPH09122904A (ja) | 1997-05-13 |
JP3313972B2 (ja) | 2002-08-12 |
ES2136376T3 (es) | 1999-11-16 |
CN1143892A (zh) | 1997-02-26 |
MX9601752A (es) | 1998-04-30 |
TW307092B (fr) | 1997-06-01 |
AU5583396A (en) | 1996-12-19 |
KR970003390A (ko) | 1997-01-28 |
FR2735053A1 (fr) | 1996-12-13 |
BR9602725A (pt) | 1998-09-08 |
ZA964623B (en) | 1996-12-12 |
AR002312A1 (es) | 1998-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |