CA2232894A1 - Ibm pc compatible multi-chip module - Google Patents

Ibm pc compatible multi-chip module

Info

Publication number
CA2232894A1
CA2232894A1 CA2232894A CA2232894A CA2232894A1 CA 2232894 A1 CA2232894 A1 CA 2232894A1 CA 2232894 A CA2232894 A CA 2232894A CA 2232894 A CA2232894 A CA 2232894A CA 2232894 A1 CA2232894 A1 CA 2232894A1
Authority
CA
Canada
Prior art keywords
chip module
ibm
interface
chip
compatible multi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2232894A
Other languages
French (fr)
Other versions
CA2232894C (en
Inventor
David L. Feldman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Z Microsystems Inc
Original Assignee
Zf Microsystems, Inc.
David L. Feldman
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zf Microsystems, Inc., David L. Feldman filed Critical Zf Microsystems, Inc.
Publication of CA2232894A1 publication Critical patent/CA2232894A1/en
Application granted granted Critical
Publication of CA2232894C publication Critical patent/CA2232894C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • G06F15/76—Architectures of general purpose stored program computers
    • G06F15/78—Architectures of general purpose stored program computers comprising a single central processing unit
    • G06F15/7807—System on chip, i.e. computer system on a single chip; System in package, i.e. computer system on one or more chips in a single package
    • G06F15/7814—Specially adapted for real time processing, e.g. comprising hardware timers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

A multi-chip module (10) and a chip set that comprises a plurality of the multi-chip modules. The multi-chip module (10) includes a plurality of functional circuits (40, 42, 36, 32, 34, 44, 28, 50, 48, 20, 26, 46, 30) provided on a substrate, the circuits (40, 42, 36, 32, 34, 44, 28, 50, 48, 20, 26, 46, 30) defining a plurality of signal inputs and outputs. The functional circuits (40, 42, 36, 32, 34, 44, 28, 50, 48, 20, 26, 46, 30) of one embodiment of the module include a CPU (20), serial interfaces (32, 34), a parallel interface (36), a hard drive interface (42), a floppy disk interface (40), a keyboard interface (28), and flash memory (44).
CA002232894A 1995-11-29 1996-11-27 Ibm pc compatible multi-chip module Expired - Fee Related CA2232894C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/564,688 1995-11-29
US08/564,688 US5742844A (en) 1995-11-29 1995-11-29 IBM PC compatible multi-chip module
PCT/US1996/019064 WO1997020273A1 (en) 1995-11-29 1996-11-27 Ibm pc compatible multi-chip module

Publications (2)

Publication Number Publication Date
CA2232894A1 true CA2232894A1 (en) 1997-06-05
CA2232894C CA2232894C (en) 2000-02-01

Family

ID=24255479

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002232894A Expired - Fee Related CA2232894C (en) 1995-11-29 1996-11-27 Ibm pc compatible multi-chip module

Country Status (9)

Country Link
US (3) US5742844A (en)
EP (1) EP0864127A4 (en)
JP (1) JPH11508713A (en)
AU (1) AU1125697A (en)
CA (1) CA2232894C (en)
CH (1) CH690527A5 (en)
DE (1) DE29623495U1 (en)
GB (1) GB2322462B (en)
WO (1) WO1997020273A1 (en)

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* Cited by examiner, † Cited by third party
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US5742844A (en) * 1995-11-29 1998-04-21 Zf Microsystems, Inc. IBM PC compatible multi-chip module
DE19649258C2 (en) * 1996-11-28 2002-11-14 Lucent Tech Network Sys Gmbh Bus system and method for data transmission
US6721817B1 (en) * 1997-01-21 2004-04-13 Dell Usa, L.P. Original equipment manufacturer identification for configurable electronic hardware
KR19990024489A (en) 1997-09-03 1999-04-06 윤종용 Power pin on hard disk drive
US5909587A (en) * 1997-10-24 1999-06-01 Advanced Micro Devices, Inc. Multi-chip superscalar microprocessor module
US6154789A (en) * 1998-06-15 2000-11-28 Compaq Computer Corporation Peripheral controller comprising first messaging unit for communication with first OS driver and second messaging unit for communication with second OS driver for mass-storage peripheral
DE19912441A1 (en) * 1999-03-19 2000-09-21 Elfo Ag Sachseln Sachseln Multi-chip module
US6571347B1 (en) * 1999-05-24 2003-05-27 Winbond Electronics Corporation Apparatus and method for intelligent computer initiation program recovery
TW462025B (en) * 1999-06-23 2001-11-01 Micro Star Int Co Ltd BIOS virus protection method
WO2001024014A1 (en) * 1999-09-27 2001-04-05 Zf Micro Devices, Inc. Embedded computer system and method with flash memory interface
US7231513B1 (en) * 1999-12-17 2007-06-12 Intel Corporation Dynamically linked basic input/output system
US6738879B2 (en) * 2000-05-22 2004-05-18 Seagate Technology Llc Advanced technology attachment compatible disc drive write protection scheme
US6784372B1 (en) * 2000-05-26 2004-08-31 Albert T. Yuen Orthogonal electrical connection using a ball edge array
US6757838B1 (en) * 2000-10-13 2004-06-29 Hewlett-Packard Development Company, L.P. Hardware independent implementation of computer system BIOS recovery
US7266731B2 (en) * 2001-11-13 2007-09-04 Sun Microsystems, Inc. Method and apparatus for managing remote software code update
KR100429265B1 (en) * 2001-11-14 2004-04-29 엘지전자 주식회사 Common communication interface by programable logic divice
US7209252B2 (en) * 2002-01-15 2007-04-24 Lexmark International, Inc. Memory module, printer assembly, and method for storing printer code
AU2003231960B2 (en) * 2002-02-25 2008-08-21 Scott Laboratories, Inc. Fail-safe module integral with a sedation and analgesia system and method
US6934873B2 (en) * 2002-02-28 2005-08-23 Dell Products L.P. Automatic BIOS recovery in a multi-node computer system
TW571240B (en) * 2002-07-10 2004-01-11 Akom Technology Inc Display method for debugging code of BISO
JP3960169B2 (en) * 2002-08-30 2007-08-15 富士通株式会社 Information processing apparatus and recovery method therefor
TWI221959B (en) * 2002-10-25 2004-10-11 Via Tech Inc Method and computer system using a debug system to boot up
TW584800B (en) * 2002-10-25 2004-04-21 Via Tech Inc Method, computer and peripheral/expansion bus bridge for booting up with debug system
US20050057907A1 (en) * 2003-09-12 2005-03-17 Hewlett-Packard Development Company, L.P. Circuit board assembly
US20050081090A1 (en) * 2003-09-29 2005-04-14 Giga-Byte Technology Co., Ltd. Method for automatically and safely recovering BIOS memory circuit in memory device including double BIOS memory circuits
US7345891B2 (en) * 2003-10-07 2008-03-18 Hewlett-Packard Development Company, L.P. Circuit board assembly
US7061126B2 (en) * 2003-10-07 2006-06-13 Hewlett-Packard Development Company, L.P. Circuit board assembly
US7056144B2 (en) 2004-02-19 2006-06-06 Hewlett-Packard Development Company, L.P. Offset compensation system
CN100530146C (en) * 2004-08-26 2009-08-19 鸿富锦精密工业（深圳）有限公司 BIOS on-line rewriting method
CN100369224C (en) * 2005-05-08 2008-02-13 薛萍 Chip with built-in software and hardware system and making method thereof
TW200723125A (en) * 2005-12-05 2007-06-16 A Data Technology Co Ltd Memory card module
US9214431B1 (en) * 2006-05-25 2015-12-15 Qualcomm Incorporated On-chip/off-chip magnetic shielding loop
US7742310B2 (en) * 2006-09-29 2010-06-22 Hewlett-Packard Development Company, L.P. Sequencer
US7397666B2 (en) * 2006-10-25 2008-07-08 Hewlett-Packard Development Company, L.P. Wedge lock
CN103164353A (en) * 2011-12-12 2013-06-19 鸿富锦精密工业（深圳）有限公司 Recognition circuit
CN102970027B (en) * 2012-11-27 2015-05-13 杭州电子科技大学 Level switch and serial port transceiver circuit
TWI750109B (en) 2014-11-12 2021-12-21 香港商阿里巴巴集團服務有限公司 Hard disk power consumption, hard disk power consumption management service control method and device
SE539724C2 (en) * 2016-05-13 2017-11-07 Oniteo Ab Method and system for fail-safe booting
CN106339238B (en) * 2016-08-26 2020-03-24 卢军 Serial port multi-mode automatic multiplexing chip fast programming system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4763188A (en) * 1986-08-08 1988-08-09 Thomas Johnson Packaging system for multiple semiconductor devices
DE19513275A1 (en) * 1994-06-27 1996-01-11 Hewlett Packard Co Probe adaptor for connecting integrated circuit components to electronic test-measurement appts.
US5659680A (en) * 1995-06-30 1997-08-19 Micro Processor Systems, Inc. PC compatible modular based diagnostic system
US5742844A (en) * 1995-11-29 1998-04-21 Zf Microsystems, Inc. IBM PC compatible multi-chip module
US5793943A (en) * 1996-07-29 1998-08-11 Micron Electronics, Inc. System for a primary BIOS ROM recovery in a dual BIOS ROM computer system

Also Published As

Publication number Publication date
AU1125697A (en) 1997-06-19
GB2322462B (en) 1999-09-22
EP0864127A4 (en) 1999-01-27
US6038663A (en) 2000-03-14
GB2322462A (en) 1998-08-26
DE29623495U1 (en) 1998-08-20
CH690527A5 (en) 2000-09-29
CA2232894C (en) 2000-02-01
GB9811497D0 (en) 1998-07-29
EP0864127A1 (en) 1998-09-16
WO1997020273A1 (en) 1997-06-05
US6101593A (en) 2000-08-08
JPH11508713A (en) 1999-07-27
US5742844A (en) 1998-04-21

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