CA2241402A1 - Heat dissipator including coolant passage and method of fabricating the same - Google Patents

Heat dissipator including coolant passage and method of fabricating the same

Info

Publication number
CA2241402A1
CA2241402A1 CA002241402A CA2241402A CA2241402A1 CA 2241402 A1 CA2241402 A1 CA 2241402A1 CA 002241402 A CA002241402 A CA 002241402A CA 2241402 A CA2241402 A CA 2241402A CA 2241402 A1 CA2241402 A1 CA 2241402A1
Authority
CA
Canada
Prior art keywords
same
fabricating
heat dissipator
coolant passage
including coolant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002241402A
Other languages
French (fr)
Other versions
CA2241402C (en
Inventor
Yoshiyuki Yamamoto
Takahiro Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of CA2241402A1 publication Critical patent/CA2241402A1/en
Application granted granted Critical
Publication of CA2241402C publication Critical patent/CA2241402C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipator includes a heat-conductive substrate, a lid and a heat-conductive cover layer, and a coolant groove for passing coolant is formed on a major surface of the substrate. The lid is positioned on the coolant groove to seal the same, and the cover layer covers the major surface of substrate and the lid.
CA002241402A 1997-08-28 1998-06-23 Heat dissipator including coolant passage and method of fabricating the same Expired - Fee Related CA2241402C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP23220097A JP4048579B2 (en) 1997-08-28 1997-08-28 Heat dissipating body including refrigerant flow path and manufacturing method thereof
JP9-232200 1997-08-28

Publications (2)

Publication Number Publication Date
CA2241402A1 true CA2241402A1 (en) 1999-02-28
CA2241402C CA2241402C (en) 2003-12-02

Family

ID=16935564

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002241402A Expired - Fee Related CA2241402C (en) 1997-08-28 1998-06-23 Heat dissipator including coolant passage and method of fabricating the same

Country Status (5)

Country Link
US (1) US6129145A (en)
EP (1) EP0902470B1 (en)
JP (1) JP4048579B2 (en)
CA (1) CA2241402C (en)
DE (1) DE69826798T2 (en)

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US6606251B1 (en) 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US20030183368A1 (en) * 2002-04-02 2003-10-02 Paradis Leo Richard Diamond heat sink
US6881039B2 (en) 2002-09-23 2005-04-19 Cooligy, Inc. Micro-fabricated electrokinetic pump
US20040076408A1 (en) * 2002-10-22 2004-04-22 Cooligy Inc. Method and apparatus for removeably coupling a heat rejection device with a heat producing device
US6994151B2 (en) * 2002-10-22 2006-02-07 Cooligy, Inc. Vapor escape microchannel heat exchanger
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US6986382B2 (en) * 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US6988535B2 (en) * 2002-11-01 2006-01-24 Cooligy, Inc. Channeled flat plate fin heat exchange system, device and method
US7227257B2 (en) 2002-12-09 2007-06-05 Intel Corporation Cooling micro-channels
JP2005013905A (en) * 2003-06-27 2005-01-20 Sumitomo Electric Ind Ltd Microchip for chemical reaction and method for producing the same
US7021369B2 (en) * 2003-07-23 2006-04-04 Cooligy, Inc. Hermetic closed loop fluid system
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7353859B2 (en) * 2004-11-24 2008-04-08 General Electric Company Heat sink with microchannel cooling for power devices
US7327024B2 (en) * 2004-11-24 2008-02-05 General Electric Company Power module, and phase leg assembly
US20070131659A1 (en) * 2005-12-09 2007-06-14 Durocher Kevin M Method of making an electronic device cooling system
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
US7550841B2 (en) * 2006-03-23 2009-06-23 Intel Corporation Methods of forming a diamond micro-channel structure and resulting devices
WO2007120530A2 (en) 2006-03-30 2007-10-25 Cooligy, Inc. Integrated liquid to air conduction module
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
US8030754B2 (en) * 2007-01-31 2011-10-04 Hewlett-Packard Development Company, L.P. Chip cooling channels formed in wafer bonding gap
TW200912621A (en) 2007-08-07 2009-03-16 Cooligy Inc Method and apparatus for providing a supplemental cooling to server racks
US7738249B2 (en) 2007-10-25 2010-06-15 Endicott Interconnect Technologies, Inc. Circuitized substrate with internal cooling structure and electrical assembly utilizing same
DE102007051797B3 (en) * 2007-10-26 2009-06-04 Jenoptik Laserdiode Gmbh Corrosion resistant microchannel heat sink
US20090225514A1 (en) 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
WO2010017321A1 (en) 2008-08-05 2010-02-11 Cooligy Inc. Bonded metal and ceramic plates for thermal management of optical and electronic devices
US20100078155A1 (en) * 2008-09-30 2010-04-01 Third Millennium Engineering Thin Cavity Fluidic Heat Exchanger
JP4775428B2 (en) * 2008-11-20 2011-09-21 日本軽金属株式会社 Manufacturing method of heat plate
JP4775431B2 (en) * 2008-12-09 2011-09-21 日本軽金属株式会社 Manufacturing method of heat plate
US8839519B2 (en) * 2009-11-16 2014-09-23 Raytheon Company Method of making cold chassis for electronic modules
JP5463224B2 (en) 2010-07-09 2014-04-09 日本発條株式会社 Manufacturing method of plate with flow path, plate with flow path, temperature control plate, cold plate, and shower plate
WO2012014516A1 (en) * 2010-07-30 2012-02-02 Ｎｋワークス株式会社 Led light-emitting device
GB201107736D0 (en) * 2011-05-10 2011-06-22 Element Six Holdings N V Composite diamond assemblies
US9194189B2 (en) 2011-09-19 2015-11-24 Baker Hughes Incorporated Methods of forming a cutting element for an earth-boring tool, a related cutting element, and an earth-boring tool including such a cutting element
JP5534067B1 (en) * 2013-03-06 2014-06-25 日本電気株式会社 Electronic component and electronic component cooling method
US9480149B2 (en) 2013-12-10 2016-10-25 Brocade Communications Systems, Inc. Printed circuit board with fluid flow channels
US9220183B1 (en) 2014-07-16 2015-12-22 International Business Machines Corporation Devices employing semiconductor die having hydrophobic coatings, and related cooling methods
US11417584B2 (en) * 2017-09-25 2022-08-16 Sony Semiconductor Solutions Corporation Semiconductor device
CN109068538A (en) * 2018-08-23 2018-12-21 西安交通大学 A kind of liquid cooling heat radiator structure and preparation method thereof based on diamond microchannel
CN111843247A (en) * 2020-06-28 2020-10-30 西安中科微精光子制造科技有限公司 Method for forming channels in diamond and diamond product

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US3731992A (en) * 1972-04-06 1973-05-08 States Of Air Force Spiral grooved liquid cooled laser mirror
DE2418841C3 (en) * 1974-04-19 1979-04-26 Messerschmitt-Boelkow-Blohm Gmbh, 8000 Muenchen Heat exchangers, in particular regeneratively cooled combustion chambers for liquid rocket engines and processes for their manufacture
US4185369A (en) * 1978-03-22 1980-01-29 General Electric Company Method of manufacture of cooled turbine or compressor buckets
JPH0684852B2 (en) * 1986-01-20 1994-10-26 株式会社東芝 Cryogenic refrigerator
JPH07112030B2 (en) * 1986-11-04 1995-11-29 株式会社フジクラ Micro heat pipe manufacturing method
CH675019A5 (en) * 1987-08-04 1990-08-15 Sulzer Ag
CA2050091C (en) * 1990-10-03 1999-06-15 Richard C. Eden Electronic circuit and method with thermal management
FR2715502B1 (en) * 1994-01-26 1996-04-05 Commissariat Energie Atomique Structure having cavities and method for producing such a structure.
US5509046A (en) * 1994-09-06 1996-04-16 Regents Of The University Of California Cooled window for X-rays or charged particles
JP3528376B2 (en) * 1994-11-30 2004-05-17 住友電気工業株式会社 Substrate manufacturing method
JP3528375B2 (en) * 1994-11-30 2004-05-17 住友電気工業株式会社 Substrate and heat dissipation substrate using the same, semiconductor device, element mounting device
KR100264431B1 (en) * 1994-11-30 2000-08-16 오카야마 노리오 Window material and method for preparing thereof
EP0715352B1 (en) * 1994-11-30 2003-07-30 Sumitomo Electric Industries, Ltd. Substrate, semiconductor device, element-mounted device
DE19514548C1 (en) * 1995-04-20 1996-10-02 Daimler Benz Ag Method of manufacturing a micro cooler
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DE19514542C2 (en) * 1995-04-20 1997-07-31 Daimler Benz Ag Composite structure and process for its manufacture

Also Published As

Publication number Publication date
JP4048579B2 (en) 2008-02-20
JPH1174614A (en) 1999-03-16
DE69826798T2 (en) 2005-03-10
US6129145A (en) 2000-10-10
DE69826798D1 (en) 2004-11-11
CA2241402C (en) 2003-12-02
EP0902470B1 (en) 2004-10-06
EP0902470A3 (en) 1999-08-18
EP0902470A2 (en) 1999-03-17

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Legal Events

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