CA2252391A1 - Monolithic multilayer piezo actuator and process for its production - Google Patents
Monolithic multilayer piezo actuator and process for its production Download PDFInfo
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- CA2252391A1 CA2252391A1 CA002252391A CA2252391A CA2252391A1 CA 2252391 A1 CA2252391 A1 CA 2252391A1 CA 002252391 A CA002252391 A CA 002252391A CA 2252391 A CA2252391 A CA 2252391A CA 2252391 A1 CA2252391 A1 CA 2252391A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
Abstract
This invention concerns a monolithic piezo actuator with multilayer construction with a high aspect ratio of more than two. The actuator is built of several smaller stacks in a multilayer construction. By sintering them together, a monolithic piezo actuator is obtained which has improved mechanical strength with good piezoelectric properties.
Description
CA 022~2391 1998-10-16 Fl l r r ~ AMENDE~
,' . ~1 ANSLATION
Description Monolithic multilayer piezoelectric actuator and produc-tion process Piezoelectric actuators normally comprise a plurality of piezoelectric elements arranged in a stack.
Each of these elements in turn comprises a piezoceramic layer which is provided on both sides with metallic electrodes. If a voltage is applied to these electrodes, then the piezoceramic layer reacts with a lattice distor-tion which leads to a usable lengthwise expansion alonga major axis. Since this in turn amounts to less than two parts per thousand of the layer thickness along the major axis, a correspo~ingly higher layer thickness of active piezoceramic must be provided in order to achieve a desired absolute lengthwi~e expansion. With increasing layer thickness of the piezoceramic layer within one piezoelectric element, however, the voltage necessary for the response of the piezoelectric element also rises. In order to keep this within manageable limits, the thicknesses of individual piezoelectric elements normally lie between 20 and 200 ~m. A piezoelectric actuator must therefore have an appropriate nll~her of individual elements or layers for a desired lengthwise expansion.
Rnown piezoelectric actuators of multilayer design therefore altogether comprise numerous individual layers. For their production, piezoceramic green films are arranged alternating with electrode material to form a stack and are laminated and sintered together to form a monolithic composite. Such a process is known, for example, from an article by S. Takahashi et al. in Ferroelectrics, 1983, Vol. 90, pages 181 to 190. Larger actuators with larger absolute deflection are obtained, for example, by adhesively bonding a plurality of such stacks. Such a process is disclosed, for example, by US
5 438 232. However, such bonded stacks have too low a stiffness for many applications, in particular if high forces have to be transmitted using the piezoelectric actuator. Sufficiently high stiffnesses are possessed CA 022~239l l998-l0-l6 only by piezoelectric actuators of fully monolithic multilayer design. Only the latter exhibit a sufficiently solid composite of the individual layers in the stack.
In the production of monolithic actuators of multilayer design, however, additional problems occur with increasing height. The plates which are laminated to form a stack and which contain numerous individual actuators must be divided up before sintering. Here, the stacks of the relatively large-area green films are divided up into smaller stacks with the desired actuator area. While low stacks can be stamped in automatic machines, such as is possible, in a simple way, for example in the case of multilayer capacitors, in the case of higher stacks this must be replaced by a multiple sawing process along the separating lines.
In the case of low stacks, the lamination can take place in automatic machines with short cycle times.
Higher stacks must be laminated with increased care, in order in particular to maintain the vertical structural accuracy during lamination. In the process there is always the risk that, as a result of the applied pres-sure, transverse flow processes in the green films will lead to a displacement of individual layers in relation to one another. In the zones with which contact is to be made later, in particular, the accuracy of contact is thereby destroyed.
The organic binders which are used in multilayer technology are primarily matched to the requirements of the green film production and also lamination, and must be removed before sintering by means of complicated binder removal in furnaces with a monitored atmosphere.
However, the diffusion paths for the binder or its decomposition products during the binder removal are multiplied with increasing stack height. In order to prevent destruction of the stack as a result of too high an internal pressure of the decomposing binder, it is necessary to take very elaborate technical measures, much more sophisticated than those in the case of the produc-tion of multilayer capacitors.
- CA 022~239l l998-l0-l6 Because of the many problems to be solved in the production of piezoelectric actuators of multilayer design, known monolithic piezoelectric actuators in the cost-effective technology normal in multilayer capacitors were until now restricted to a maY;mllm height of about
,' . ~1 ANSLATION
Description Monolithic multilayer piezoelectric actuator and produc-tion process Piezoelectric actuators normally comprise a plurality of piezoelectric elements arranged in a stack.
Each of these elements in turn comprises a piezoceramic layer which is provided on both sides with metallic electrodes. If a voltage is applied to these electrodes, then the piezoceramic layer reacts with a lattice distor-tion which leads to a usable lengthwise expansion alonga major axis. Since this in turn amounts to less than two parts per thousand of the layer thickness along the major axis, a correspo~ingly higher layer thickness of active piezoceramic must be provided in order to achieve a desired absolute lengthwi~e expansion. With increasing layer thickness of the piezoceramic layer within one piezoelectric element, however, the voltage necessary for the response of the piezoelectric element also rises. In order to keep this within manageable limits, the thicknesses of individual piezoelectric elements normally lie between 20 and 200 ~m. A piezoelectric actuator must therefore have an appropriate nll~her of individual elements or layers for a desired lengthwise expansion.
Rnown piezoelectric actuators of multilayer design therefore altogether comprise numerous individual layers. For their production, piezoceramic green films are arranged alternating with electrode material to form a stack and are laminated and sintered together to form a monolithic composite. Such a process is known, for example, from an article by S. Takahashi et al. in Ferroelectrics, 1983, Vol. 90, pages 181 to 190. Larger actuators with larger absolute deflection are obtained, for example, by adhesively bonding a plurality of such stacks. Such a process is disclosed, for example, by US
5 438 232. However, such bonded stacks have too low a stiffness for many applications, in particular if high forces have to be transmitted using the piezoelectric actuator. Sufficiently high stiffnesses are possessed CA 022~239l l998-l0-l6 only by piezoelectric actuators of fully monolithic multilayer design. Only the latter exhibit a sufficiently solid composite of the individual layers in the stack.
In the production of monolithic actuators of multilayer design, however, additional problems occur with increasing height. The plates which are laminated to form a stack and which contain numerous individual actuators must be divided up before sintering. Here, the stacks of the relatively large-area green films are divided up into smaller stacks with the desired actuator area. While low stacks can be stamped in automatic machines, such as is possible, in a simple way, for example in the case of multilayer capacitors, in the case of higher stacks this must be replaced by a multiple sawing process along the separating lines.
In the case of low stacks, the lamination can take place in automatic machines with short cycle times.
Higher stacks must be laminated with increased care, in order in particular to maintain the vertical structural accuracy during lamination. In the process there is always the risk that, as a result of the applied pres-sure, transverse flow processes in the green films will lead to a displacement of individual layers in relation to one another. In the zones with which contact is to be made later, in particular, the accuracy of contact is thereby destroyed.
The organic binders which are used in multilayer technology are primarily matched to the requirements of the green film production and also lamination, and must be removed before sintering by means of complicated binder removal in furnaces with a monitored atmosphere.
However, the diffusion paths for the binder or its decomposition products during the binder removal are multiplied with increasing stack height. In order to prevent destruction of the stack as a result of too high an internal pressure of the decomposing binder, it is necessary to take very elaborate technical measures, much more sophisticated than those in the case of the produc-tion of multilayer capacitors.
- CA 022~239l l998-l0-l6 Because of the many problems to be solved in the production of piezoelectric actuators of multilayer design, known monolithic piezoelectric actuators in the cost-effective technology normal in multilayer capacitors were until now restricted to a maY;mllm height of about
2.5 to 5 mm. In addition, for the reasons mentioned, these known piezoelectric actuators only achieve an aspect ratio (height/width) of a mAY;m~lm of about 2.
Higher actuators and actuators with a higher aspect ratio were previously obtained by adhesively bon~;ng together a plurality of smaller stacks, the stiffness of the stack and hence its mechanical loadability being reduced.
It is therefore the object of the present inven-tion to specify a simple and reliable production process for a piezoelectric actuator of monolithic multilayer design which possesses a high aspect ratio of more than 2, which can be produced monolithically in stack heights of more than 5 mm and which possesses optimum piezoelectric properties and a high mechanical composite strength.
This object is achieved according to the inven-tion with a process according to Claim 1. Preferred refinements of the invention emerge from further claims.
The f~ln~A ~ntal idea of the invention is to carry out the lamination in a blank with a limited stack height. Following the separation of the laminates, that is to say the dividing up of the large-area laminated first stacks (= first composites) into smaller second stacks (= second composites) of the desired actuator base area, the binder removal takes place. A plurality of these second composites are then stacked up to a height which is a multiple of the first blank and are sintered under light pressure to make the piezoelectric actuator according to the invention. In this case, piezoelectric actuators according to the invention having an overall height of more than 5 mm and an aspect ratio of more than 2 can be obtained. As a result of the lamination of the first stacks with a relatively low blank size and hence a relatively low stack height, it is possible to maintain - CA 022~2391 1998-10-16 a high vertical accuracy of the internal electrode structures. This i8 particularly important since the electrodes are printed in a structured way onto the green films, 80 that cutouts remain in the electrode layers, the exact positioning of which cutouts in the stack being particularly important for the correct m~king of contact.
This high vertical accuracy within a composite can be maintained in a simple way during the stacking on one another of a plurality of these composites and the subsequent joint sintering. Slight displacements which can occur during the stacking of the composites on one another are of no importance in this case. The dividing up of the first composites of limited stack height can be carried out in a known cost-effective way by cutting, stamping or shearing. The removal of the binder from the optionally separated composites takes place at a low stack height of, for example, up to 2 mm. This means that ;m--m diffusion paths of about 1 mm have to be overcome by the binder or its decomposition products. It is therefore possible to use a conventional process without additional complicated process monitoring for the binder removal.
The production of first composites with electrode structures which are unified in the composite makes it possible in a simple way to produce a piezoelectric actuator having different layer areas by means of the combination of a plurality of composites of different electrode structure. The layer areas may differ in this case in the exact electrode structure, the layer thicknesses of the individual layers or the making of electrical contact. It is thus possible in a simple way to implement mechanically coupled but electrically decoupled actuator and sensor functions alongside one another in the piezoelectric actuator. The production of the end areas, that is to say the top areas and bottom areas of the piezoelectric actuators, is also simplified in this way. These areas comprise relatively large areas of electrically inactive ceramic layers which can be implemented with or wi~hout an electrode structure lying _ CA 022~239l l998-l0-l6 in between.
The piezoelectric actuator according to the invention and its construction process is in this case completely independent of the materials used. Any desired PZT (lead zirconate titanate) ceramic can be used for the actuator. In order to produce the electrode layers, various pastes contA; n; ng metal can be used. A paste contA; n; ng platinum particles, for example, makes sintering possible at the high optimum temperature which is necessary for a good ceramic structure and hence for good piezoelectric properties. For lower sintering temperatures, pastes contAin;ng palladium/silver are also suitable.
- The process is explained in more detail below using an exemplary embodiment and the associated eight figures.
Figure 1 shows a green film printed with electrode material in plan view.
Figure 2 shows a stack of printed green films in sche-matic cross-section.
Figure 3 shows this stack following lamination in a perspective view (= first composite).
Figures 4 to 6 show variously constructed composites which correspond to different areas in the subse~uent piezoelectric actuator. In each case, a section along the diagonal A-B of Figure 3 is shown.
Figure 7 shows the arrangement of various composites in a die and Figure 8 shows a finished piezoelectric actuator pro-vided with electric connections.
1. Production of a piezoelectric actuator The starting materials, mixed as homogeneously as possible, can be produced in accordance with known pro-cesses and be constituted, for example, in accordancewith the mixed oxide process or via chemical routes, for example in accordance with the sol-gel process, the citrate process, the oxalate process or via other - CA 022~2391 1998-10-16 organometallic precursor compounds. Whereas for the mixed oxide process all the cations provided for the ceramic are mixed with one another in the form of their oxides and are then converted into PZT, other production pro-cesses start from mixed solutions of organometalliccompounds of the desired cations. By means of precipita-tion from solution or by means of gradual thickening in the so-called sol-gel process, an extremely homogeneous distribution of the cations in the subsequent solid is achieved. For example, a ceramic powder of the n~in~
compo8ition Pbo97Ndo 02 (ZrO s4Tio 46)~3 i8 obtained.
Following calcining, the product is re-ground and homogenized. It is then mixed with an organic binder and water and a slip is thus produced. Using this, green films are then drawn or cast which, following drying, have a thickness of, for example, 20 to 200 ~m.
Following drying of the green films, these are provided with electrode material, for example printed with a paste which contains particles of a sil-ver/palladium alloy (70/30 mass ratio) in a binder withan overall printable consistency. However, it is also possible to use pastes with particles of other conductive metals, such as platinum for example.
Electrode structures for a plurality of piezoelectric elements can be simultaneously printed onto the base area of a green film in one step. In 80 doing, for the purpose of subsequently m~; ng contact, at least one cutout in the electrode structure is provided for each individual piezoelectric element.
Figure 1 shows a green film, printed with elec-trode material, in plan view. The printing is carried out in accordance with a pattern, which comprises printed areas 1 and unprinted areas 2 remaining free. The section lines SL in this case indicate the subsequent division of the large-area green films into smaller composites having the desired actuator area. Shown in the figure is one green film with a pattern of 3 x 3 smaller composites.
Depending on the desired base area for the subsequent piezoelectric actuator, any other desired pattern and/or CA 022~2391 1998-10-16 another electrode pattern 1, 2 is also conceivable. The quadratic pattern indicated by the section lines in Figure 1 has, for example, an edge length of 14 mm.
For the electrode layer, sufficient electrode material is printed on one side for a coherent electrode layer of about 2 to 3 ~m thickness to result after sintering.
Figure 2: the piezoceramic green films Sl, S2, S3... printed with electrode material are optionally dried and subsequently stacked on one another, an alter-nating arrangement of piezoceramic layers 3 and electrode layers 5 resulting. In the case of the electrode layers, the stacking is likewise carried out alternately such that, above each of the said cutouts 4, which correspond to the unprinted areas 2 of Figure 1, in a first electrode layer there is arranged an area 1, printed with electrode material, in the next adjacent electrode layer.
This is achieved, in the case of an electrode pattern as shown in Figure 1, by means of a 180~ rotation of the film about an axis perpendicular to the film. In Figure 2, the alternating arrangement of the green films 3 printed with electrode material 5 in the stack is indicted schematically. As a result of the alternating arrangement, each second layer coincides in terms of its electrode pattern. In the layers lying in between, which likewise coincide with one another, the cutouts 4 are offset.
In this way, stacks are formed from as many individual layers, laid on one another, that an overall height of typically 2 to 3 mm is not exceeded. In the case of a green film thickness of, for example, 100 ~m, this corresponds to about 30 individual layers.
The loosely stacked individual layers now have placed on them a punch, with which the stack is com-pressed under a uniaxial pressure of about 100 mPa in aquasi-isostatic m~ner. Even at room temperature, but preferably under a slightly elevated temperature and under atmospheric conditions, the flowability of the binder leads to an increase in the ceramic density of 48 CA 022~2391 1998-10-16 to 60 percent of the theoretical ceramic density. At the same time, an internal pressure and volume equalization takes place, for example the cutouts 4 in the electrode pattern being completely filled by ceramic material. In this way, even density and pressure gradients within the stack or the finished composite are equalized during the lamination.
Figure 3 shows a composite produced in this way in a perspective representation. The original cutouts 4 are now completely filled with ceramic material 3. The solid composite made of the laminated individual layers still has sufficient plasticity, so that it can then be divided up in this stage, in accordance with the pattern predefined by the section lines, into the correspon~;ng number of smaller composites having the desired base area. This can take place by means of cutting or stamping in a highly automated process. By using additionally printed-on cutting marks (not shown), the separation of the composite can be observed by means of a video process and monitored using a computer.
In the next step, the laminated stacks (compos-ites) separated in this way are freed of binder. This takes place in a thermal step, a temperature increasing slowly up to about 500~C and an oxygen partial pressure rising in parallel therewith ensuring that the organic binder diffuses out and does not decompose abruptly and, in so doing, destroy the ceramic structure. The condi-tions are therefore set such that only in a later phase of the process does an oxidation of the binder or of its fragments produced by thermal decompositions take place.
The low stack height of the composites of, for example,
Higher actuators and actuators with a higher aspect ratio were previously obtained by adhesively bon~;ng together a plurality of smaller stacks, the stiffness of the stack and hence its mechanical loadability being reduced.
It is therefore the object of the present inven-tion to specify a simple and reliable production process for a piezoelectric actuator of monolithic multilayer design which possesses a high aspect ratio of more than 2, which can be produced monolithically in stack heights of more than 5 mm and which possesses optimum piezoelectric properties and a high mechanical composite strength.
This object is achieved according to the inven-tion with a process according to Claim 1. Preferred refinements of the invention emerge from further claims.
The f~ln~A ~ntal idea of the invention is to carry out the lamination in a blank with a limited stack height. Following the separation of the laminates, that is to say the dividing up of the large-area laminated first stacks (= first composites) into smaller second stacks (= second composites) of the desired actuator base area, the binder removal takes place. A plurality of these second composites are then stacked up to a height which is a multiple of the first blank and are sintered under light pressure to make the piezoelectric actuator according to the invention. In this case, piezoelectric actuators according to the invention having an overall height of more than 5 mm and an aspect ratio of more than 2 can be obtained. As a result of the lamination of the first stacks with a relatively low blank size and hence a relatively low stack height, it is possible to maintain - CA 022~2391 1998-10-16 a high vertical accuracy of the internal electrode structures. This i8 particularly important since the electrodes are printed in a structured way onto the green films, 80 that cutouts remain in the electrode layers, the exact positioning of which cutouts in the stack being particularly important for the correct m~king of contact.
This high vertical accuracy within a composite can be maintained in a simple way during the stacking on one another of a plurality of these composites and the subsequent joint sintering. Slight displacements which can occur during the stacking of the composites on one another are of no importance in this case. The dividing up of the first composites of limited stack height can be carried out in a known cost-effective way by cutting, stamping or shearing. The removal of the binder from the optionally separated composites takes place at a low stack height of, for example, up to 2 mm. This means that ;m--m diffusion paths of about 1 mm have to be overcome by the binder or its decomposition products. It is therefore possible to use a conventional process without additional complicated process monitoring for the binder removal.
The production of first composites with electrode structures which are unified in the composite makes it possible in a simple way to produce a piezoelectric actuator having different layer areas by means of the combination of a plurality of composites of different electrode structure. The layer areas may differ in this case in the exact electrode structure, the layer thicknesses of the individual layers or the making of electrical contact. It is thus possible in a simple way to implement mechanically coupled but electrically decoupled actuator and sensor functions alongside one another in the piezoelectric actuator. The production of the end areas, that is to say the top areas and bottom areas of the piezoelectric actuators, is also simplified in this way. These areas comprise relatively large areas of electrically inactive ceramic layers which can be implemented with or wi~hout an electrode structure lying _ CA 022~239l l998-l0-l6 in between.
The piezoelectric actuator according to the invention and its construction process is in this case completely independent of the materials used. Any desired PZT (lead zirconate titanate) ceramic can be used for the actuator. In order to produce the electrode layers, various pastes contA; n; ng metal can be used. A paste contA; n; ng platinum particles, for example, makes sintering possible at the high optimum temperature which is necessary for a good ceramic structure and hence for good piezoelectric properties. For lower sintering temperatures, pastes contAin;ng palladium/silver are also suitable.
- The process is explained in more detail below using an exemplary embodiment and the associated eight figures.
Figure 1 shows a green film printed with electrode material in plan view.
Figure 2 shows a stack of printed green films in sche-matic cross-section.
Figure 3 shows this stack following lamination in a perspective view (= first composite).
Figures 4 to 6 show variously constructed composites which correspond to different areas in the subse~uent piezoelectric actuator. In each case, a section along the diagonal A-B of Figure 3 is shown.
Figure 7 shows the arrangement of various composites in a die and Figure 8 shows a finished piezoelectric actuator pro-vided with electric connections.
1. Production of a piezoelectric actuator The starting materials, mixed as homogeneously as possible, can be produced in accordance with known pro-cesses and be constituted, for example, in accordancewith the mixed oxide process or via chemical routes, for example in accordance with the sol-gel process, the citrate process, the oxalate process or via other - CA 022~2391 1998-10-16 organometallic precursor compounds. Whereas for the mixed oxide process all the cations provided for the ceramic are mixed with one another in the form of their oxides and are then converted into PZT, other production pro-cesses start from mixed solutions of organometalliccompounds of the desired cations. By means of precipita-tion from solution or by means of gradual thickening in the so-called sol-gel process, an extremely homogeneous distribution of the cations in the subsequent solid is achieved. For example, a ceramic powder of the n~in~
compo8ition Pbo97Ndo 02 (ZrO s4Tio 46)~3 i8 obtained.
Following calcining, the product is re-ground and homogenized. It is then mixed with an organic binder and water and a slip is thus produced. Using this, green films are then drawn or cast which, following drying, have a thickness of, for example, 20 to 200 ~m.
Following drying of the green films, these are provided with electrode material, for example printed with a paste which contains particles of a sil-ver/palladium alloy (70/30 mass ratio) in a binder withan overall printable consistency. However, it is also possible to use pastes with particles of other conductive metals, such as platinum for example.
Electrode structures for a plurality of piezoelectric elements can be simultaneously printed onto the base area of a green film in one step. In 80 doing, for the purpose of subsequently m~; ng contact, at least one cutout in the electrode structure is provided for each individual piezoelectric element.
Figure 1 shows a green film, printed with elec-trode material, in plan view. The printing is carried out in accordance with a pattern, which comprises printed areas 1 and unprinted areas 2 remaining free. The section lines SL in this case indicate the subsequent division of the large-area green films into smaller composites having the desired actuator area. Shown in the figure is one green film with a pattern of 3 x 3 smaller composites.
Depending on the desired base area for the subsequent piezoelectric actuator, any other desired pattern and/or CA 022~2391 1998-10-16 another electrode pattern 1, 2 is also conceivable. The quadratic pattern indicated by the section lines in Figure 1 has, for example, an edge length of 14 mm.
For the electrode layer, sufficient electrode material is printed on one side for a coherent electrode layer of about 2 to 3 ~m thickness to result after sintering.
Figure 2: the piezoceramic green films Sl, S2, S3... printed with electrode material are optionally dried and subsequently stacked on one another, an alter-nating arrangement of piezoceramic layers 3 and electrode layers 5 resulting. In the case of the electrode layers, the stacking is likewise carried out alternately such that, above each of the said cutouts 4, which correspond to the unprinted areas 2 of Figure 1, in a first electrode layer there is arranged an area 1, printed with electrode material, in the next adjacent electrode layer.
This is achieved, in the case of an electrode pattern as shown in Figure 1, by means of a 180~ rotation of the film about an axis perpendicular to the film. In Figure 2, the alternating arrangement of the green films 3 printed with electrode material 5 in the stack is indicted schematically. As a result of the alternating arrangement, each second layer coincides in terms of its electrode pattern. In the layers lying in between, which likewise coincide with one another, the cutouts 4 are offset.
In this way, stacks are formed from as many individual layers, laid on one another, that an overall height of typically 2 to 3 mm is not exceeded. In the case of a green film thickness of, for example, 100 ~m, this corresponds to about 30 individual layers.
The loosely stacked individual layers now have placed on them a punch, with which the stack is com-pressed under a uniaxial pressure of about 100 mPa in aquasi-isostatic m~ner. Even at room temperature, but preferably under a slightly elevated temperature and under atmospheric conditions, the flowability of the binder leads to an increase in the ceramic density of 48 CA 022~2391 1998-10-16 to 60 percent of the theoretical ceramic density. At the same time, an internal pressure and volume equalization takes place, for example the cutouts 4 in the electrode pattern being completely filled by ceramic material. In this way, even density and pressure gradients within the stack or the finished composite are equalized during the lamination.
Figure 3 shows a composite produced in this way in a perspective representation. The original cutouts 4 are now completely filled with ceramic material 3. The solid composite made of the laminated individual layers still has sufficient plasticity, so that it can then be divided up in this stage, in accordance with the pattern predefined by the section lines, into the correspon~;ng number of smaller composites having the desired base area. This can take place by means of cutting or stamping in a highly automated process. By using additionally printed-on cutting marks (not shown), the separation of the composite can be observed by means of a video process and monitored using a computer.
In the next step, the laminated stacks (compos-ites) separated in this way are freed of binder. This takes place in a thermal step, a temperature increasing slowly up to about 500~C and an oxygen partial pressure rising in parallel therewith ensuring that the organic binder diffuses out and does not decompose abruptly and, in so doing, destroy the ceramic structure. The condi-tions are therefore set such that only in a later phase of the process does an oxidation of the binder or of its fragments produced by thermal decompositions take place.
The low stack height of the composites of, for example,
3 mm ensures short diffusion paths for the decomposition products and/or oxidation products of the binder. In the exemplary embodiment, the binder removal is terminated within 24 hours at a temperature rising to 500~C in an atmosphere cont~; n; ng a maY; mllm of 8 percent by volume of oxygen. During the binder removal, no ~;~ensional changes and therefore no warping in the stack is observed. The vertical structural accuracy in the composite is thus CA 022~239l l998-l0-l6 maintained.
The piezoelectric actuator according to the invention can be built up from a plurality of different composites. In the simplest case (for this, see also Figures 4 to 6), the piezoelectric actuator consists of at least one middle part MT, which has the regular, alternating electrode structure already described.
Provided at the upper end of the stack is a top part RT.
The latter comprises a top plate 6, which either contains no active, that is to say electrically connected, elec-trode layer or even no electrode layer. A top plate 6 built up merely from ceramic films can be used for improved force transmission of the piezoelectric actuator. The bottom part FT, whose bottom plate 7 can be constructed like the top plate 6 of the top part RT, also has a correspor~; ng structure.
In order to minimize the use of material, it is in this case possible to vary the pattern for the printed-on electrode layers and to produce a complete piezoelectric actuator, including top part and bottom p~rt and a correspon~;ng number of middle parts, from a single laminated stack. The number of identically or differently constructed middle parts is in this case dependent on the level of the desired deflection of the finished piezoelectric actuator, which in turn determines the height of the piezoelectric actuator.
Figure 7 shows how the top, middle and bottom parts, from which the binder has been removed, are stacked up to the desired height in an accurately-fitting die 9, and are weighted down using a punch 10. The sintering then takes place under a light pressure of 10 to 100 kPa in an oxidizing atmosphere. The press die, which is round for example, corresponds in its diameter to the stamped dimension of the composites stacked on one 3 5 another. Die and punch are preferably reusable and composed of materials which do not enter into any reac-tions with the ceramic during the sintering. Well-suited are, for example, dies made of aluminium oxide or magnesium oxide. The pressure can be produced in a simple - CA 022~239l l998-l0-l6 way using an additional weight placed on the punch. It is also true for the material of this additional weight that it is stable at 1130~C in an oxidizing atmosphere and, for its part, does not have a damaging influence on the S sintering atmosphere.
For the purpose of sintering, also, once more a temperature programme is run until the m~ m sintering temperature is reached. This may take place in an indi-vidual furnace with temperature monitoring or in a con-tinuous furnace with appropriately differently tempera-ture-controlled zones. In the exemplary ~mhodiment, the sintering is completed after about 24 hours at 1130~C.
As a result, a monolithic piezoelectric actuator is obtained which has an optimally pronounced ceramic structure, good piezoelectric properties because of the higher sintering temperature and a high composite strength between the ceramic layers and the electrode layers. Accordingly, the monolithic piezoelectric actuator also possesses a high stiffness, with which the transmission of high forces is possible.
Figure 8 shows a finished piezoelectric actuator to which, for the purpose of ~king electrical contact, contact is made with electrode material in a strip shape at mutually opposite corners. Because of the electrode structure which alternates from individual layer to individual layer, such a contact 13 only reaches each second electrode layer in each case, while the contact 14 fastened to the opposite edge makes contact with the electrode layers lying in between in each case. Elec-trically parallel wiring of the piezoelectric layers(lying between the electrode layers) is thus possible, which allows optimum operation of the piezoelectric actuator.
The aspect ratio, determined from the ratio of the height h to the edge length b, can assume a value of up to 5 in the case of the piezoelectric actuator accord-ing to the invention. In principle, it is also pos~ible to produce still higher and slimmer piezoelectric actuators, but this entails an increased failure rate CA 022~2391 1998-10-16 during sintering. The die is matched in its internal ~;m~n~ions to the stamped ~;m~ncion or the ~;mension of the composites from which the binder has been removed.
However, since during sintering a linear shrinkage in all three spatial axes of about 15 percent is observed, the die is able to support the stack only at the beg;nn;ng during sintering. During the further progress of the sintering process, it is therefore possible for b~n~;ng over of the stack to occur in the case of excessively high or excessively slim piezoelectric actuators.
In the case of the piezoelectric actuator accord-ing to the invention, it should be mentioned as especial-ly advantageous that the vertical structural accuracy of the electrodes in the area of the contact edges is independent of the aspect ratio. Because of tolerances and slight deviations during stamping and stacking, although it is possible in the case of two successive middle parts for slight offsets, characteristic of the process, of the electrode structures to occur, these are of no importance for the reliability of making contact.
The piezoelectric actuator according to the invention can be built up from a plurality of different composites. In the simplest case (for this, see also Figures 4 to 6), the piezoelectric actuator consists of at least one middle part MT, which has the regular, alternating electrode structure already described.
Provided at the upper end of the stack is a top part RT.
The latter comprises a top plate 6, which either contains no active, that is to say electrically connected, elec-trode layer or even no electrode layer. A top plate 6 built up merely from ceramic films can be used for improved force transmission of the piezoelectric actuator. The bottom part FT, whose bottom plate 7 can be constructed like the top plate 6 of the top part RT, also has a correspor~; ng structure.
In order to minimize the use of material, it is in this case possible to vary the pattern for the printed-on electrode layers and to produce a complete piezoelectric actuator, including top part and bottom p~rt and a correspon~;ng number of middle parts, from a single laminated stack. The number of identically or differently constructed middle parts is in this case dependent on the level of the desired deflection of the finished piezoelectric actuator, which in turn determines the height of the piezoelectric actuator.
Figure 7 shows how the top, middle and bottom parts, from which the binder has been removed, are stacked up to the desired height in an accurately-fitting die 9, and are weighted down using a punch 10. The sintering then takes place under a light pressure of 10 to 100 kPa in an oxidizing atmosphere. The press die, which is round for example, corresponds in its diameter to the stamped dimension of the composites stacked on one 3 5 another. Die and punch are preferably reusable and composed of materials which do not enter into any reac-tions with the ceramic during the sintering. Well-suited are, for example, dies made of aluminium oxide or magnesium oxide. The pressure can be produced in a simple - CA 022~239l l998-l0-l6 way using an additional weight placed on the punch. It is also true for the material of this additional weight that it is stable at 1130~C in an oxidizing atmosphere and, for its part, does not have a damaging influence on the S sintering atmosphere.
For the purpose of sintering, also, once more a temperature programme is run until the m~ m sintering temperature is reached. This may take place in an indi-vidual furnace with temperature monitoring or in a con-tinuous furnace with appropriately differently tempera-ture-controlled zones. In the exemplary ~mhodiment, the sintering is completed after about 24 hours at 1130~C.
As a result, a monolithic piezoelectric actuator is obtained which has an optimally pronounced ceramic structure, good piezoelectric properties because of the higher sintering temperature and a high composite strength between the ceramic layers and the electrode layers. Accordingly, the monolithic piezoelectric actuator also possesses a high stiffness, with which the transmission of high forces is possible.
Figure 8 shows a finished piezoelectric actuator to which, for the purpose of ~king electrical contact, contact is made with electrode material in a strip shape at mutually opposite corners. Because of the electrode structure which alternates from individual layer to individual layer, such a contact 13 only reaches each second electrode layer in each case, while the contact 14 fastened to the opposite edge makes contact with the electrode layers lying in between in each case. Elec-trically parallel wiring of the piezoelectric layers(lying between the electrode layers) is thus possible, which allows optimum operation of the piezoelectric actuator.
The aspect ratio, determined from the ratio of the height h to the edge length b, can assume a value of up to 5 in the case of the piezoelectric actuator accord-ing to the invention. In principle, it is also pos~ible to produce still higher and slimmer piezoelectric actuators, but this entails an increased failure rate CA 022~2391 1998-10-16 during sintering. The die is matched in its internal ~;m~n~ions to the stamped ~;m~ncion or the ~;mension of the composites from which the binder has been removed.
However, since during sintering a linear shrinkage in all three spatial axes of about 15 percent is observed, the die is able to support the stack only at the beg;nn;ng during sintering. During the further progress of the sintering process, it is therefore possible for b~n~;ng over of the stack to occur in the case of excessively high or excessively slim piezoelectric actuators.
In the case of the piezoelectric actuator accord-ing to the invention, it should be mentioned as especial-ly advantageous that the vertical structural accuracy of the electrodes in the area of the contact edges is independent of the aspect ratio. Because of tolerances and slight deviations during stamping and stacking, although it is possible in the case of two successive middle parts for slight offsets, characteristic of the process, of the electrode structures to occur, these are of no importance for the reliability of making contact.
Claims (8)
1. Process for producing a piezoelectric actuator of monolithic multilayer design, - in which piezoceramic green films (5) containing a binder and having a thickness of 20 to 200 µm are printed on one side with layers of electrode material (3) - in which the printed piezoceramic green films are layered loosely on one another to form first stacks of a maximum height of 3 mm such that an alternating sequence of piezoceramic green films and electrode material in the layer results - in which the first stacks are laminated to form a first composite, using uniaxial compression - in which the first composite is freed of binder at elevated temperature - in which a plurality of these composites (FT, MT, RT) from which the binder has been removed are stacked on one another to an overall height of more than 5 mm and are sintered under uniaxial pressure, a piezoelectric actuator having the desired number of individual layers being obtained.
2. Process according to Claim 1, - in which piezoceramic green films of n times the desired base area are provided and printed and - in which the laminated first composite, before the binder removal, is divided up by cutting or stamping into n composites of the desired base area.
3. Process according to Claim 1 or 2, in which the stacking on one another and sintering under pressure takes place in a die (9).
4. Process according to one of Claims 1 to 3, in which the piezoceramic green films comprise PZT, and in which the sintering takes place in an oxidizing atmosphere.
5. Process according to one of Claims 1 to 4, in which the sintering takes place under constant pressure of 10 to 100 kPa.
6. Process according to one of Claims 1 to 5, in which the piezoelectric actuator is built up from different composites which comprise at least a top part (KT), a middle part (MT) and a bottom part (FT).
7. Process according to one of Claims 1 to 6, in which the piezoelectric actuator is built up from a plurality of composites having an electrode structure which is intrinsically uniform but different from composite to composite.
8. Process according to one of Claims 1 to 7, - in which electrode layers made of a paste containing silver and palladium are applied to the green films - in which the sintering is carried out in an oxidizing atmosphere at a maximum temperature of 1130°C.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19615694.7 | 1996-04-19 | ||
| DE19615694A DE19615694C1 (en) | 1996-04-19 | 1996-04-19 | Piezo-actuator based on monolithic multi-layer structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2252391A1 true CA2252391A1 (en) | 1997-10-30 |
Family
ID=7791879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002252391A Abandoned CA2252391A1 (en) | 1996-04-19 | 1997-04-03 | Monolithic multilayer piezo actuator and process for its production |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6260248B1 (en) |
| EP (1) | EP0894340B1 (en) |
| JP (1) | JP3150708B2 (en) |
| KR (1) | KR20000010526A (en) |
| AT (1) | ATE211856T1 (en) |
| CA (1) | CA2252391A1 (en) |
| DE (2) | DE19615694C1 (en) |
| TW (1) | TW354431B (en) |
| WO (1) | WO1997040536A1 (en) |
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| DE19860001C2 (en) * | 1998-12-23 | 2001-10-04 | Epcos Ag | Piezoelectric component, method for its production and use of such a component |
| DE19913902B4 (en) * | 1999-03-26 | 2004-12-09 | Siemens Ag | Method for detecting a crack in a piezoelectric component and arrangement for detecting the crack |
| ATE356441T1 (en) * | 1999-06-29 | 2007-03-15 | Siemens Ag | PIEZO ACTOR WITH AN ELECTRICALLY CONDUCTIVE MULTI-LAYER FILM |
| WO2001045138A2 (en) * | 1999-12-16 | 2001-06-21 | Epcos Ag | Piezoelectric component |
| DE10025998A1 (en) * | 2000-05-25 | 2001-12-06 | Bosch Gmbh Robert | Piezo actuator |
| US7248444B1 (en) * | 2000-07-21 | 2007-07-24 | Lauer Mark A | Electromagnetic heads, flexures, gimbals and actuators formed on and from a wafer substrate |
| US7117239B1 (en) | 2000-07-28 | 2006-10-03 | Axeda Corporation | Reporting the state of an apparatus to a remote computer |
| DE10041338A1 (en) * | 2000-08-23 | 2002-03-14 | Epcos Ag | Manufacture of large-volume ceramic multilayer component by forming holes in green body, removing and sintering |
| DE10046657A1 (en) * | 2000-09-20 | 2002-04-04 | Bosch Gmbh Robert | Manufacture of piezoelectric element e.g. for vehicle fuel injection system actuator, by forming block with neutral regions, and separating after sintering |
| US8108543B2 (en) | 2000-09-22 | 2012-01-31 | Axeda Corporation | Retrieving data from a server |
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| US7468112B2 (en) | 2001-04-18 | 2008-12-23 | Denso Corporation | Method of producing a ceramic laminate |
| JP2003205511A (en) * | 2001-11-07 | 2003-07-22 | Denso Corp | Method for manufacturing ceramic laminate |
| US7254601B2 (en) | 2001-12-20 | 2007-08-07 | Questra Corporation | Method and apparatus for managing intelligent assets in a distributed environment |
| JP2003212666A (en) * | 2002-01-28 | 2003-07-30 | Sanyo Electric Co Ltd | Apparatus and process for manufacturing ceramic laminated body |
| JP3884669B2 (en) * | 2002-04-05 | 2007-02-21 | 株式会社デンソー | Method for manufacturing ceramic laminate |
| US7178149B2 (en) | 2002-04-17 | 2007-02-13 | Axeda Corporation | XML scripting of soap commands |
| EP1537611A1 (en) * | 2002-09-11 | 2005-06-08 | Siemens Aktiengesellschaft | Ceramic element comprising a homogeneous ceramic layer, and method for the production of said ceramic element |
| US7966418B2 (en) | 2003-02-21 | 2011-06-21 | Axeda Corporation | Establishing a virtual tunnel between two computer programs |
| DE102004031596A1 (en) * | 2004-06-30 | 2006-02-09 | Robert Bosch Gmbh | piezo actuator |
| US7174792B2 (en) * | 2004-08-09 | 2007-02-13 | Xinetics, Inc. | Multi-axis transducer |
| DE102005033463B3 (en) * | 2005-07-18 | 2007-02-01 | Siemens Ag | piezo actuator |
| DE102005038891B4 (en) * | 2005-08-17 | 2009-01-15 | Siemens Ag | Actuator device, in particular for an injection device |
| DE102005051289B3 (en) * | 2005-10-26 | 2007-05-16 | Siemens Ag | Piezoelectric actuator and method for producing the same |
| DE102006026642A1 (en) * | 2006-06-08 | 2007-12-13 | Robert Bosch Gmbh | System for operating a piezoelectric element |
| US8370479B2 (en) | 2006-10-03 | 2013-02-05 | Axeda Acquisition Corporation | System and method for dynamically grouping devices based on present device conditions |
| US8065397B2 (en) | 2006-12-26 | 2011-11-22 | Axeda Acquisition Corporation | Managing configurations of distributed devices |
| DE102007005341A1 (en) * | 2007-02-02 | 2008-08-07 | Epcos Ag | Multi-layer component and method for producing a multilayer component |
| DE102007016316A1 (en) * | 2007-04-04 | 2008-10-09 | Siemens Ag | Method and system for separating a plurality of ceramic devices from a device block |
| US8478861B2 (en) | 2007-07-06 | 2013-07-02 | Axeda Acquisition Corp. | Managing distributed devices with limited connectivity |
| DE102008062021A1 (en) | 2008-08-18 | 2010-03-04 | Epcos Ag | Piezo actuator in multilayer construction |
| DE102011079658A1 (en) * | 2011-07-22 | 2013-01-24 | Robert Bosch Gmbh | Process for producing a ceramic multilayer component and ceramic multilayer component |
| TWI501435B (en) * | 2012-01-19 | 2015-09-21 | Betacera Inc | Method for fabricating piezoelectric composite material and piezoelectric power generating device |
| RU2540440C1 (en) * | 2013-08-01 | 2015-02-10 | Открытое акционерное общество "Научно-исследовательский институт "Элпа" с опытным производством" | Manufacturing method of monolithic multilayer piezoceramic elements-columns |
| KR101686193B1 (en) | 2013-12-30 | 2016-12-15 | 주식회사 엠플러스 | Apparatus and method for piezoelectric actuator, and piezoelectric using the same |
| RU2572292C1 (en) * | 2014-11-10 | 2016-01-10 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Тверской государственный университет" | Method of making multilayer piezoceramic elements |
| DE102015210797B4 (en) * | 2015-06-12 | 2019-03-28 | Continental Automotive Gmbh | Method for producing a piezoelectric layer stack |
| CN111682102A (en) * | 2020-05-29 | 2020-09-18 | 深圳振华富电子有限公司 | Preparation method of piezoelectric driver stack |
| CN111682103A (en) * | 2020-05-29 | 2020-09-18 | 深圳振华富电子有限公司 | Preparation method of piezoelectric driver stack with electrode plates |
| CN113904585B (en) * | 2021-08-27 | 2022-10-14 | 成都汇通西电电子有限公司 | Array actuator structure and preparation method thereof |
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| MY105668A (en) * | 1989-04-07 | 1994-11-30 | Mitsui Petrochemical Ind | Laminated ceramic device and method of manufacturing the same. |
| US5126618A (en) * | 1990-03-06 | 1992-06-30 | Brother Kogyo Kabushiki Kaisha | Longitudinal-effect type laminar piezoelectric/electrostrictive driver, and printing actuator using the driver |
| US5089739A (en) * | 1990-03-19 | 1992-02-18 | Brother Kogyo Kabushiki Kaisha | Laminate type piezoelectric actuator element |
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| DE4201937C2 (en) * | 1991-01-25 | 1997-05-22 | Murata Manufacturing Co | Piezoelectric laminated actuator |
| JPH04264784A (en) | 1991-02-20 | 1992-09-21 | Nec Corp | Electrostrictive effect element and manufacture thereof |
| JP2976262B2 (en) * | 1992-09-25 | 1999-11-10 | 株式会社村田製作所 | Electronic component manufacturing method |
| JPH06334236A (en) * | 1993-05-20 | 1994-12-02 | Fujitsu Ltd | Manufacture of multilayer piezoelectric/electrostrictive actuator |
| JP2581436B2 (en) * | 1993-12-29 | 1997-02-12 | 日本電気株式会社 | Manufacturing method of ceramic multilayer wiring board |
-
1996
- 1996-04-19 DE DE19615694A patent/DE19615694C1/en not_active Expired - Lifetime
-
1997
- 1997-04-03 US US09/171,474 patent/US6260248B1/en not_active Expired - Lifetime
- 1997-04-03 DE DE59706121T patent/DE59706121D1/en not_active Expired - Fee Related
- 1997-04-03 AT AT97920584T patent/ATE211856T1/en not_active IP Right Cessation
- 1997-04-03 JP JP53756597A patent/JP3150708B2/en not_active Expired - Fee Related
- 1997-04-03 CA CA002252391A patent/CA2252391A1/en not_active Abandoned
- 1997-04-03 EP EP97920584A patent/EP0894340B1/en not_active Expired - Lifetime
- 1997-04-03 KR KR1019980708361A patent/KR20000010526A/en not_active Application Discontinuation
- 1997-04-03 WO PCT/DE1997/000687 patent/WO1997040536A1/en not_active Application Discontinuation
- 1997-04-12 TW TW086104710A patent/TW354431B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| US6260248B1 (en) | 2001-07-17 |
| DE19615694C1 (en) | 1997-07-03 |
| ATE211856T1 (en) | 2002-01-15 |
| TW354431B (en) | 1999-03-11 |
| JP2000500925A (en) | 2000-01-25 |
| KR20000010526A (en) | 2000-02-15 |
| WO1997040536A1 (en) | 1997-10-30 |
| EP0894340B1 (en) | 2002-01-09 |
| JP3150708B2 (en) | 2001-03-26 |
| DE59706121D1 (en) | 2002-02-28 |
| EP0894340A1 (en) | 1999-02-03 |
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