CA2317601C - Combined percussion and trepan laser drilling - Google Patents
Combined percussion and trepan laser drilling Download PDFInfo
- Publication number
- CA2317601C CA2317601C CA002317601A CA2317601A CA2317601C CA 2317601 C CA2317601 C CA 2317601C CA 002317601 A CA002317601 A CA 002317601A CA 2317601 A CA2317601 A CA 2317601A CA 2317601 C CA2317601 C CA 2317601C
- Authority
- CA
- Canada
- Prior art keywords
- hole
- diameter
- laser drilling
- drilling
- trepanning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/001—Turbines
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Chemical And Physical Treatments For Wood And The Like (AREA)
Abstract
A process is provided for laser drilling relatively large and deep holes in superalloy components by percussion laser drilling a central hole through the component to a diameter less than the predetermined diameter, then trepanning laser drilling around the central hole to expand the diameter of the hole to the predetermined diameter.
Description
COMBINED PERCUSSION AND TREPAN LASER DRILLING
This invention relates to the laser drilling of holes in components, more particularly it relates to laser drilling relatively large and deep holes in superalloy components and in particular gas turbine components, such as turbine blades and vanes.
Laser drilling of holes, such as cooling holes, into gas turbine components such as turbine blades and vanes has been known for some time. Laser materials processing involves focusing a high power laser beam onto the surface of a work piece. A portion of the beam is absorbed, the amount depending upon the material type and surface condition. The high intensity (on the order of 10' watts per cm~
produced by absorption of high power (eg. 250 watts) and focusing the beam to 0.004 to 0.008 inch diameter results in heating, melting, and vaporization of the surface material.
Laser drilling is most noted for ability to produce small (e.g. 0.004 inch) diameter holes, holes with high (>10:1) aspect (depth to diameter) ratios, and holes at shallow ( 10°) angles from the surface, aU in the toughest aerospace alloys.
There are two types of laser drilling processes: percussion drilling and trepanning. Percussion laser drilling is typically used for production drilling of cooling holes in blades and nozzle guide vanes. The process involves a stationary beam and one or more pulses to penetrate the thickness of the material. With percussion drilling, the hole diameter is established by the beam diameter and power level.
Trepanning laser drilling involves contour cutting the hole. It involves moving the beam along a circular path to produce a hole having a diameter greater than that produced by a stationary focused beam (i.e. as in percussion drilling). A
high pressure inert or oxidizing gas flows though a nozzle coincident with the laser beam providing mechanical energy needed to remove the laser melted metal. With trepanning, the hole diameter is limited only by the motion system travel.
The percussion drilling and trepanning processes are limited when it comes to drilling relatively large (e.g. of at least 0.030 inches) and deep (e.g. of at least 0.30 inches) holes, especially with regard to drilling holes through Ni and/or Co based superalloys. The percussion method is limited in that the maximum aspect w0 99/36221 PCTNS98/Z3364
This invention relates to the laser drilling of holes in components, more particularly it relates to laser drilling relatively large and deep holes in superalloy components and in particular gas turbine components, such as turbine blades and vanes.
Laser drilling of holes, such as cooling holes, into gas turbine components such as turbine blades and vanes has been known for some time. Laser materials processing involves focusing a high power laser beam onto the surface of a work piece. A portion of the beam is absorbed, the amount depending upon the material type and surface condition. The high intensity (on the order of 10' watts per cm~
produced by absorption of high power (eg. 250 watts) and focusing the beam to 0.004 to 0.008 inch diameter results in heating, melting, and vaporization of the surface material.
Laser drilling is most noted for ability to produce small (e.g. 0.004 inch) diameter holes, holes with high (>10:1) aspect (depth to diameter) ratios, and holes at shallow ( 10°) angles from the surface, aU in the toughest aerospace alloys.
There are two types of laser drilling processes: percussion drilling and trepanning. Percussion laser drilling is typically used for production drilling of cooling holes in blades and nozzle guide vanes. The process involves a stationary beam and one or more pulses to penetrate the thickness of the material. With percussion drilling, the hole diameter is established by the beam diameter and power level.
Trepanning laser drilling involves contour cutting the hole. It involves moving the beam along a circular path to produce a hole having a diameter greater than that produced by a stationary focused beam (i.e. as in percussion drilling). A
high pressure inert or oxidizing gas flows though a nozzle coincident with the laser beam providing mechanical energy needed to remove the laser melted metal. With trepanning, the hole diameter is limited only by the motion system travel.
The percussion drilling and trepanning processes are limited when it comes to drilling relatively large (e.g. of at least 0.030 inches) and deep (e.g. of at least 0.30 inches) holes, especially with regard to drilling holes through Ni and/or Co based superalloys. The percussion method is limited in that the maximum aspect w0 99/36221 PCTNS98/Z3364
2 ratios that can be effectively drilled due to slag buildup blocking the hole is about 10:1 with hole diameters of about 0.030 inches. Further, when large and deep holes are percussion drilled the holes formed are observed to be tapered, i.e.
smaller at the bottom. Trepanning of large and deep holes is also ineffective in that before the hole becomes too deep slag tends to accumulate in the hole and the laser energy becomes absorbed by the substrate interfering with further drilling.
Thus it is an object of the present invention to provide a process for laser drr'lftrtg large and deep holes through superalloy components.
Briefly, a process is provided for laser drilling a hole through a nickel and/or cobalt based superalloy component, said hole having a predetermined diameter of at least about 0.030 inches and a depth to diameter ratio of at least about 10:1, comprising percussion laser drilling a central hole through the superalloy to a diameter less that the predetermined diameter, then trepanning laser drilling a hole around the central hole to expand the diameter of the hole to the predetermined diameter. These steps are repeated as needed during the hole drilling process to complete the formation of a uniform hole.
Laser drilling is generally carried out with a pulsed YAG laser using a CNC
(computer numerical control). The laser typically produces a beam of approximately 0.004 to 0.!~J8 inches diameter wah a.~ average energy of about watts. An optical system is provided which includes a lens for focusing the laser beam onto the surface of the component to be drilled. The component is a N
and/or co based superalloy. Typical superalloys include Mar-M509*, IN-738*, CMSX-4*,1N-792, US20* and X-40*. The components can be gas turbine components, e.g. turbine blades and vanes, and the holes are generally drilled for film cooling purposes. The predetermined diameter being drilled is at least about 0.030 inches with a depth to diameter ratio of at least about 10:1, preferably about 0.03 to 0.10 inches diameter with a depth to diameter ratio of about 20 to 30:1.
Generally the depth of the hole is within the range of about 0.4 to 1.5 inches.
* trade marks WO 99!36221 PCTNS98I23364
smaller at the bottom. Trepanning of large and deep holes is also ineffective in that before the hole becomes too deep slag tends to accumulate in the hole and the laser energy becomes absorbed by the substrate interfering with further drilling.
Thus it is an object of the present invention to provide a process for laser drr'lftrtg large and deep holes through superalloy components.
Briefly, a process is provided for laser drilling a hole through a nickel and/or cobalt based superalloy component, said hole having a predetermined diameter of at least about 0.030 inches and a depth to diameter ratio of at least about 10:1, comprising percussion laser drilling a central hole through the superalloy to a diameter less that the predetermined diameter, then trepanning laser drilling a hole around the central hole to expand the diameter of the hole to the predetermined diameter. These steps are repeated as needed during the hole drilling process to complete the formation of a uniform hole.
Laser drilling is generally carried out with a pulsed YAG laser using a CNC
(computer numerical control). The laser typically produces a beam of approximately 0.004 to 0.!~J8 inches diameter wah a.~ average energy of about watts. An optical system is provided which includes a lens for focusing the laser beam onto the surface of the component to be drilled. The component is a N
and/or co based superalloy. Typical superalloys include Mar-M509*, IN-738*, CMSX-4*,1N-792, US20* and X-40*. The components can be gas turbine components, e.g. turbine blades and vanes, and the holes are generally drilled for film cooling purposes. The predetermined diameter being drilled is at least about 0.030 inches with a depth to diameter ratio of at least about 10:1, preferably about 0.03 to 0.10 inches diameter with a depth to diameter ratio of about 20 to 30:1.
Generally the depth of the hole is within the range of about 0.4 to 1.5 inches.
* trade marks WO 99!36221 PCTNS98I23364
3 The first step of the process involves percussion drilling a central hole through the superaUoy to a diameter less than the desired (predetermined) diameter. The central hole formed by percussion drilling has a diameter up to about 0.020 inches, preferably 0.01 to 0.02 inches. An eight inch focal.
length lens can be used in percussion drilling the central hole. Typically during percussion laser drilling 4 to 8 laser pulsesJsecond are used. This central hole diameter facilitates the removal of slag and allows the subsequent trepanning to be effectively carried out.
After the percussion drilling uepanning laser drilling is carried out to expand the central hole to the predetermined.diameter. Trepanning involves laser drilling a series of small circles with the laser following a circular path to produce a .
hole with the predetermined diameter. A six inch focal length lens can be used during trepanning to produce the trepanning circles. During trepanning typically to 15 laser pulses/second are used.' The relative motion of the laser beam to the component can be carried out by moving the laser beam and/or the component by methods as are common in the art. During trepanning if slag is deposited interfering with drilling then the percussion drilling step is repeated followed by the trepanning step. These two operations are repeated until the predetermined hole diameter is achieved uniformly th~on~h the fiull depth of superalloy material.
During the laser dr:p.:ng process ;!:e r;,a: cf ;he hole is kept clear to allow for slag to exit the central hole during trepanning. Thus no barrier material (eg.
resin) is used abutting the exit of the hole. However, a protective barrier may be desirable to prevent any erosion of the wall of the component opposite to the exit of the hole. A protective barrier material (eg, resin) may be used on the wall of the component opposing the exit of the hole to protect this surface of the component which is in the path of the laser beam from being machined or damaged.
A M34 Convergent Energy* CNC pulsed YAG laser machine was used to produce a 0.045 inch diameter hole through a 0.9 inch thick wall of an industrial turbine vane component comprised of a MAR M509* superalloy.
* trade marks
length lens can be used in percussion drilling the central hole. Typically during percussion laser drilling 4 to 8 laser pulsesJsecond are used. This central hole diameter facilitates the removal of slag and allows the subsequent trepanning to be effectively carried out.
After the percussion drilling uepanning laser drilling is carried out to expand the central hole to the predetermined.diameter. Trepanning involves laser drilling a series of small circles with the laser following a circular path to produce a .
hole with the predetermined diameter. A six inch focal length lens can be used during trepanning to produce the trepanning circles. During trepanning typically to 15 laser pulses/second are used.' The relative motion of the laser beam to the component can be carried out by moving the laser beam and/or the component by methods as are common in the art. During trepanning if slag is deposited interfering with drilling then the percussion drilling step is repeated followed by the trepanning step. These two operations are repeated until the predetermined hole diameter is achieved uniformly th~on~h the fiull depth of superalloy material.
During the laser dr:p.:ng process ;!:e r;,a: cf ;he hole is kept clear to allow for slag to exit the central hole during trepanning. Thus no barrier material (eg.
resin) is used abutting the exit of the hole. However, a protective barrier may be desirable to prevent any erosion of the wall of the component opposite to the exit of the hole. A protective barrier material (eg, resin) may be used on the wall of the component opposing the exit of the hole to protect this surface of the component which is in the path of the laser beam from being machined or damaged.
A M34 Convergent Energy* CNC pulsed YAG laser machine was used to produce a 0.045 inch diameter hole through a 0.9 inch thick wall of an industrial turbine vane component comprised of a MAR M509* superalloy.
* trade marks
4 Using an eight inch focal length lens a 0.015 to 0.020 inch diameter central hole was percussion drilled through the component using a laser pulse rate of pulses/second. Using a six inch focal length lens trepanning laser drilling was carried out with a series of circles drilled about each central hole using a laser pulse rate of 12 pulses/second creating a 0.045 inch diameter hole. As slag built up in the hole during trepanning blocking the central hole the percussion drilling was repeated to clear the central hole followed by trepanning. These steps were repeated until the 0.045 inch diameter hole was achieved through the 0.9 inch depth. The hole was of a uniform diameter, with minimal taper.
Claims
What is claimed:
1. A process of laser drilling a hole through nickel, cobalt or nickel and cobalt based superalloy component said hole having a predetermined diameter of at least about 0.030 inches, a hole depth of at least about 0.4 inches and a depth/diameter ratio of at least about 10:1, comprising:
percussion laser drilling a central hole through the component to a diameter less than the predetermined diameter; then trepanning laser drilling around the central hole to expand the diameter of said hole to the predetermined diameter, and then repeating the above percussion laser drilling and trepanning laser drilling steps to drill said hole.
2. Process of Claim 1 wherein the central hole has a diameter of up to about 0.020 inches.
3. Process of Claim 2 wherein said hole has a depth/diameter ratio of about 20 to 30:1.
4. Process of Claim 3 wherein the predetermined diameter is about 0.30 to 0.10 inches.
5. Process of Claim 3 wherein the depth of the hole is about 0.4 to 1.5 inches.
6. Process of Claim 1 wherein no barrier material is used abutting a rear exit of the hole.
7. Process of Claim 6 wherein a protective barrier material is used on a wall of the component opposing the rear exit of the hole.
8. Process of Claim 6 wherein the component is of a gas turbine component.
9. Process of Claim 7 wherein said hole is a cooling hole.
Process of Claim 1 wherein the precussion laser drilling and the trepanning laser drilling are carried out using a computer numerical control.
11. Process of Claim 10 wherein the percussion drilling is carried out at 4 to 8 pulses/second and the trepanning is carried out at 10 to 15 pulses/second.
1. A process of laser drilling a hole through nickel, cobalt or nickel and cobalt based superalloy component said hole having a predetermined diameter of at least about 0.030 inches, a hole depth of at least about 0.4 inches and a depth/diameter ratio of at least about 10:1, comprising:
percussion laser drilling a central hole through the component to a diameter less than the predetermined diameter; then trepanning laser drilling around the central hole to expand the diameter of said hole to the predetermined diameter, and then repeating the above percussion laser drilling and trepanning laser drilling steps to drill said hole.
2. Process of Claim 1 wherein the central hole has a diameter of up to about 0.020 inches.
3. Process of Claim 2 wherein said hole has a depth/diameter ratio of about 20 to 30:1.
4. Process of Claim 3 wherein the predetermined diameter is about 0.30 to 0.10 inches.
5. Process of Claim 3 wherein the depth of the hole is about 0.4 to 1.5 inches.
6. Process of Claim 1 wherein no barrier material is used abutting a rear exit of the hole.
7. Process of Claim 6 wherein a protective barrier material is used on a wall of the component opposing the rear exit of the hole.
8. Process of Claim 6 wherein the component is of a gas turbine component.
9. Process of Claim 7 wherein said hole is a cooling hole.
Process of Claim 1 wherein the precussion laser drilling and the trepanning laser drilling are carried out using a computer numerical control.
11. Process of Claim 10 wherein the percussion drilling is carried out at 4 to 8 pulses/second and the trepanning is carried out at 10 to 15 pulses/second.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/008,092 US5837964A (en) | 1998-01-16 | 1998-01-16 | Laser drilling holes in components by combined percussion and trepan drilling |
US09/008,092 | 1998-01-16 | ||
PCT/US1998/023364 WO1999036221A1 (en) | 1998-01-16 | 1998-11-03 | Combined percussion and trepan laser drilling |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2317601A1 CA2317601A1 (en) | 1999-07-22 |
CA2317601C true CA2317601C (en) | 2007-01-23 |
Family
ID=21729757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002317601A Expired - Lifetime CA2317601C (en) | 1998-01-16 | 1998-11-03 | Combined percussion and trepan laser drilling |
Country Status (11)
Country | Link |
---|---|
US (1) | US5837964A (en) |
EP (1) | EP1062070B1 (en) |
JP (1) | JP4142252B2 (en) |
KR (1) | KR100552128B1 (en) |
CN (1) | CN1131759C (en) |
AU (1) | AU1376399A (en) |
CA (1) | CA2317601C (en) |
DE (1) | DE69830807T2 (en) |
IL (1) | IL137252A0 (en) |
NO (1) | NO319668B1 (en) |
WO (1) | WO1999036221A1 (en) |
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US6359254B1 (en) * | 1999-09-30 | 2002-03-19 | United Technologies Corporation | Method for producing shaped hole in a structure |
US6362454B1 (en) | 1999-10-01 | 2002-03-26 | Matsushita Electric Industrial Co., Ltd. | Method for drilling circular holes with a laser beam |
US6339208B1 (en) * | 2000-01-19 | 2002-01-15 | General Electric Company | Method of forming cooling holes |
US6501045B1 (en) | 2000-04-06 | 2002-12-31 | Resonetics, Inc. | Method and apparatus for controlling the taper angle of the walls of laser machined features |
AU2001250208A1 (en) | 2000-04-11 | 2001-10-23 | Gsi Lumonics Inc. | A method and system for laser drilling |
US6441341B1 (en) | 2000-06-16 | 2002-08-27 | General Electric Company | Method of forming cooling holes in a ceramic matrix composite turbine components |
US6420677B1 (en) * | 2000-12-20 | 2002-07-16 | Chromalloy Gas Turbine Corporation | Laser machining cooling holes in gas turbine components |
US6864459B2 (en) * | 2001-02-08 | 2005-03-08 | The Regents Of The University Of California | High precision, rapid laser hole drilling |
DE10106809A1 (en) * | 2001-02-14 | 2002-09-19 | Siemens Ag | Method for producing a hole in a body, in particular an injection hole in a fuel injector |
DE10144008A1 (en) * | 2001-09-07 | 2003-03-27 | Siemens Ag | Method and device for producing a hole in a workpiece with laser radiation |
GB2383769B (en) * | 2001-10-06 | 2004-10-13 | Rolls Royce Plc | Method of laser drilling a hole |
GB2381489B (en) | 2001-10-30 | 2004-11-17 | Rolls Royce Plc | Method of forming a shaped hole |
US20040112881A1 (en) * | 2002-04-11 | 2004-06-17 | Bloemeke Stephen Roger | Circle laser trepanning |
CN1323797C (en) * | 2002-07-25 | 2007-07-04 | 松下电器产业株式会社 | Inkjet nozzle and process of laser drilling a hole for use in inkjet nozzles |
US6749285B2 (en) * | 2002-07-25 | 2004-06-15 | Matsushita Electric Industrial Co., Ltd. | Method of milling repeatable exit holes in ink-jet nozzles |
US6734390B1 (en) | 2003-03-24 | 2004-05-11 | Honeywell International, Inc. | Laser cutting holes by trepanning on the fly |
US7754999B2 (en) * | 2003-05-13 | 2010-07-13 | Hewlett-Packard Development Company, L.P. | Laser micromachining and methods of same |
DE102004050047A1 (en) * | 2004-10-14 | 2006-04-27 | Robert Bosch Gmbh | Method and device for producing holes by means of laser |
US7883320B2 (en) * | 2005-01-24 | 2011-02-08 | United Technologies Corporation | Article having diffuser holes and method of making same |
JP2007057008A (en) * | 2005-08-25 | 2007-03-08 | Hitachi Metals Ltd | Method for manufacturing cross-sectionally deformed wire-rod pierced with through-hole |
EP1806203A1 (en) | 2006-01-10 | 2007-07-11 | Siemens Aktiengesellschaft | Method of producing a hole |
JP2007326129A (en) * | 2006-06-08 | 2007-12-20 | Matsushita Electric Ind Co Ltd | Laser-beam machining apparatus and method |
JP5177968B2 (en) * | 2006-07-04 | 2013-04-10 | 日東電工株式会社 | Through-hole forming method and printed circuit board manufacturing method |
FR2909297B1 (en) * | 2006-11-30 | 2010-03-05 | Snecma | METHOD FOR LASER DRILLING OF A PIECE OF COMPOSITE MATERIAL WITH CERAMIC MATRIX, HOLE OBTAINED BY THIS PROCESS, PIECE OF COMPOSITE MATERIAL WITH CERAMIC MATRIX COMPRISING IT, TURBOREACTOR COMPRISING SUCH A PIECE |
US7812282B2 (en) * | 2007-03-15 | 2010-10-12 | Honeywell International Inc. | Methods of forming fan-shaped effusion holes in combustors |
JP4386137B2 (en) * | 2008-02-29 | 2009-12-16 | トヨタ自動車株式会社 | Laser processing apparatus and laser processing method |
EP2384845A1 (en) * | 2010-05-04 | 2011-11-09 | Siemens Aktiengesellschaft | Laser drills without burr formation |
US8624151B2 (en) * | 2011-07-19 | 2014-01-07 | Pratt & Whitney Canada Corp. | Laser drilling methods of shallow-angled holes |
US8631557B2 (en) * | 2011-07-19 | 2014-01-21 | Pratt & Whitney Canada Corp. | Laser drilling methods of shallow-angled holes |
US9434025B2 (en) | 2011-07-19 | 2016-09-06 | Pratt & Whitney Canada Corp. | Laser drilling methods of shallow-angled holes |
US9931712B2 (en) | 2012-01-11 | 2018-04-03 | Pim Snow Leopard Inc. | Laser drilling and trepanning device |
WO2015108991A2 (en) | 2014-01-17 | 2015-07-23 | Imra America, Inc. | Laser-based modification of transparent materials |
US10077903B2 (en) | 2014-10-20 | 2018-09-18 | United Technologies Corporation | Hybrid through holes and angled holes for combustor grommet cooling |
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JP2022548343A (en) | 2019-06-17 | 2022-11-18 | フラウンホーファー-ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン | Method and apparatus for drilling components |
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1998
- 1998-01-16 US US09/008,092 patent/US5837964A/en not_active Expired - Lifetime
- 1998-11-03 CN CN988131137A patent/CN1131759C/en not_active Expired - Lifetime
- 1998-11-03 AU AU13763/99A patent/AU1376399A/en not_active Abandoned
- 1998-11-03 KR KR1020007007703A patent/KR100552128B1/en active IP Right Grant
- 1998-11-03 CA CA002317601A patent/CA2317601C/en not_active Expired - Lifetime
- 1998-11-03 IL IL13725298A patent/IL137252A0/en not_active IP Right Cessation
- 1998-11-03 DE DE69830807T patent/DE69830807T2/en not_active Expired - Fee Related
- 1998-11-03 EP EP98957524A patent/EP1062070B1/en not_active Expired - Lifetime
- 1998-11-03 WO PCT/US1998/023364 patent/WO1999036221A1/en active IP Right Grant
- 1998-11-03 JP JP2000539969A patent/JP4142252B2/en not_active Expired - Lifetime
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DE69830807T2 (en) | 2006-04-27 |
JP2002509033A (en) | 2002-03-26 |
NO319668B1 (en) | 2005-09-05 |
CA2317601A1 (en) | 1999-07-22 |
EP1062070B1 (en) | 2005-07-06 |
EP1062070A4 (en) | 2003-04-09 |
JP4142252B2 (en) | 2008-09-03 |
KR20010034093A (en) | 2001-04-25 |
NO20003656D0 (en) | 2000-07-17 |
NO20003656L (en) | 2000-07-17 |
US5837964A (en) | 1998-11-17 |
DE69830807D1 (en) | 2005-08-11 |
IL137252A0 (en) | 2001-07-24 |
KR100552128B1 (en) | 2006-02-14 |
WO1999036221A1 (en) | 1999-07-22 |
CN1285774A (en) | 2001-02-28 |
EP1062070A1 (en) | 2000-12-27 |
CN1131759C (en) | 2003-12-24 |
AU1376399A (en) | 1999-08-02 |
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