CA2336413A1 - Integrated image read/write head and image processor with the head - Google Patents

Integrated image read/write head and image processor with the head Download PDF

Info

Publication number
CA2336413A1
CA2336413A1 CA002336413A CA2336413A CA2336413A1 CA 2336413 A1 CA2336413 A1 CA 2336413A1 CA 002336413 A CA002336413 A CA 002336413A CA 2336413 A CA2336413 A CA 2336413A CA 2336413 A1 CA2336413 A1 CA 2336413A1
Authority
CA
Canada
Prior art keywords
head
substrate
write head
image read
integrated image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002336413A
Other languages
French (fr)
Other versions
CA2336413C (en
Inventor
Hisayoshi Fujimoto
Hiroaki Onishi
Toshihiko Takakura
Norihiro Imamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co., Ltd.
Hisayoshi Fujimoto
Hiroaki Onishi
Toshihiko Takakura
Norihiro Imamura
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP19733298A external-priority patent/JP3798910B2/en
Priority claimed from JP20180998A external-priority patent/JP3798911B2/en
Priority claimed from JP20943498A external-priority patent/JP3798912B2/en
Application filed by Rohm Co., Ltd., Hisayoshi Fujimoto, Hiroaki Onishi, Toshihiko Takakura, Norihiro Imamura filed Critical Rohm Co., Ltd.
Publication of CA2336413A1 publication Critical patent/CA2336413A1/en
Application granted granted Critical
Publication of CA2336413C publication Critical patent/CA2336413C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024—Details of scanning heads ; Means for illuminating the original
    • H04N1/02418—Details of scanning heads ; Means for illuminating the original for picture information pick up and reproduction
    • H04N1/02427—Details of scanning heads ; Means for illuminating the original for picture information pick up and reproduction in different planes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024—Details of scanning heads ; Means for illuminating the original
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024—Details of scanning heads ; Means for illuminating the original
    • H04N1/02418—Details of scanning heads ; Means for illuminating the original for picture information pick up and reproduction
    • H04N1/02463—Details of scanning heads ; Means for illuminating the original for picture information pick up and reproduction using heads mounted on the same support or substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/04—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa
    • H04N1/12—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using the sheet-feed movement or the medium-advance or the drum-rotation movement as the slow scanning component, e.g. arrangements for the main-scanning
    • H04N1/121—Feeding arrangements
    • H04N1/1215—Feeding using one or more cylindrical platens or rollers in the immediate vicinity of the main scanning line

Abstract

An integrated image read/write head (A) comprises a long rectangular substrate (4) having a first side edge (4c) and a second side edge (4d) in the direction of width and carrying a plurality of photodetector elements (2), and driver ICs (80) are arranged in rows on its one side (4a). A long case (1) is attached to house the photodetector elements (2) and driver ICs (80) on the side (4a) of the substrate (4) in such a manner that the first edge (4c) of the side of the substrate (4) is exposed along a predetermined width. A source of light (3) is also arranged on the side (4a) and housed in the case (1). A plurality of heating elements (8) are mounted on the exposed part of the side (4a) of the substrate (4).
CA002336413A 1998-07-13 1999-07-12 Integrated image read/write head and image processor with the head Expired - Fee Related CA2336413C (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP10/197332 1998-07-13
JP19733298A JP3798910B2 (en) 1998-07-13 1998-07-13 Image read / write integrated head and image processing apparatus having the same
JP10/201809 1998-07-16
JP20180998A JP3798911B2 (en) 1998-07-16 1998-07-16 Image read / write integrated head
JP20943498A JP3798912B2 (en) 1998-07-24 1998-07-24 Image read / write integrated head and image processing apparatus having the same
JP10/209434 1998-07-24
PCT/JP1999/003770 WO2000003537A1 (en) 1998-07-13 1999-07-12 Integrated image read/write head and image processor with the head

Publications (2)

Publication Number Publication Date
CA2336413A1 true CA2336413A1 (en) 2000-01-20
CA2336413C CA2336413C (en) 2004-10-05

Family

ID=27327365

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002336413A Expired - Fee Related CA2336413C (en) 1998-07-13 1999-07-12 Integrated image read/write head and image processor with the head

Country Status (8)

Country Link
US (1) US6864999B1 (en)
EP (1) EP1119184B1 (en)
KR (1) KR100388678B1 (en)
CN (1) CN1170418C (en)
CA (1) CA2336413C (en)
DE (1) DE69940699D1 (en)
TW (1) TW425811B (en)
WO (1) WO2000003537A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69936314T2 (en) * 1998-11-09 2008-02-21 Rohm Co. Ltd., Kyoto INTEGRATED PICTURE READING / WRITING HEAD, IMAGE PROCESSOR ALREADY EQUIPPED, PICTURE READING HEAD AND PRINT HEAD
US7821684B2 (en) * 2002-04-23 2010-10-26 Chen-Hsiang Shih Circuit module integrating a light driver and an optical
JP2004193773A (en) * 2002-12-09 2004-07-08 Rohm Co Ltd Image read apparatus and unit used for the same
US7663777B2 (en) * 2005-05-06 2010-02-16 Lexmark International, Inc. Default settings customization system
US7881652B2 (en) * 2005-06-30 2011-02-01 Lexmark International, Inc. Modular printer and scanner ADF duplexer feedpath including second tray
KR20100095666A (en) * 2009-02-12 2010-09-01 서울반도체 주식회사 Light emitting diode chip for high voltage operation and light emitting diode package having the same
US9247095B2 (en) * 2012-12-19 2016-01-26 Canon Components, Inc. Image sensor unit, image reading apparatus, and image forming apparatus

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3269826D1 (en) * 1981-08-17 1986-04-17 Xerox Corp Imaging device
JPS6336648A (en) * 1986-07-31 1988-02-17 Ricoh Co Ltd Input/output device
JPH04282952A (en) * 1991-03-12 1992-10-08 Hitachi Ltd Facsimile equipment, recording read element and drive ic
JPH0583470A (en) * 1991-09-25 1993-04-02 Rohm Co Ltd Image sensor
JP2868673B2 (en) * 1992-08-17 1999-03-10 三菱電機株式会社 I / O device
JP3003416B2 (en) * 1992-08-28 2000-01-31 ブラザー工業株式会社 Image reading / recording device
US6014231A (en) * 1992-09-09 2000-01-11 Rohm Co., Ltd. Image sensor
JPH06113069A (en) * 1992-09-30 1994-04-22 Mita Ind Co Ltd Digital image forming device
JP2968662B2 (en) 1993-05-07 1999-10-25 ローム株式会社 Reading / printing head
KR0182048B1 (en) * 1995-10-12 1999-04-15 김광호 Closed image sensor and its manufacturing method
WO1997023991A1 (en) * 1995-12-26 1997-07-03 Rohm Co., Ltd. Contact-type image sensor
JPH09284470A (en) * 1996-04-15 1997-10-31 Rohm Co Ltd Picture reading/writing head
JPH1051587A (en) * 1996-07-30 1998-02-20 Rohm Co Ltd Image read-write head
CN1147122C (en) * 1996-07-30 2004-04-21 罗姆股份有限公司 Picture readin/writing head and integrated circuit used for same
JP3167111B2 (en) * 1997-04-25 2001-05-21 キヤノン株式会社 Image reading device
FR2782779B1 (en) * 1998-05-15 2002-06-07 Rohm Co Ltd IMAGE READING DEVICE AND LIGHTING DEVICE USED THEREFOR
TW417380B (en) * 1998-05-29 2001-01-01 Rohm Co Ltd Unified pick-up head for image reading and writing and the image processor comprising the same

Also Published As

Publication number Publication date
CN1309864A (en) 2001-08-22
DE69940699D1 (en) 2009-05-20
EP1119184B1 (en) 2009-04-08
EP1119184A4 (en) 2002-03-06
CN1170418C (en) 2004-10-06
TW425811B (en) 2001-03-11
KR20010053461A (en) 2001-06-25
WO2000003537A1 (en) 2000-01-20
US6864999B1 (en) 2005-03-08
CA2336413C (en) 2004-10-05
KR100388678B1 (en) 2003-06-25
EP1119184A1 (en) 2001-07-25

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