CA2341182A1 - Sealed capacitive pressure sensors - Google Patents

Sealed capacitive pressure sensors

Info

Publication number
CA2341182A1
CA2341182A1 CA002341182A CA2341182A CA2341182A1 CA 2341182 A1 CA2341182 A1 CA 2341182A1 CA 002341182 A CA002341182 A CA 002341182A CA 2341182 A CA2341182 A CA 2341182A CA 2341182 A1 CA2341182 A1 CA 2341182A1
Authority
CA
Canada
Prior art keywords
substrate
base
electrode
external
skirt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002341182A
Other languages
French (fr)
Other versions
CA2341182C (en
Inventor
Yogesh B. Gianchandani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wisconsin Alumni Research Foundation
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2341182A1 publication Critical patent/CA2341182A1/en
Application granted granted Critical
Publication of CA2341182C publication Critical patent/CA2341182C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G01L1/148—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors using semiconductive material, e.g. silicon
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Abstract

A micromachined pressure sensor is formed with a minimum number of masking and processing steps. The structure measures changes in pressure by deflection of structures having capacitive plates external to a sealed cavity so that electrical leads can be readily connected to the plates formed on the structures. The pressure sensor includes a substrate, a base secured to the substrate and a diaphragm secured to the base to define a sealed cavity. A
skirt may extend outwardly from the base above the substrate to form one of the plates of the capacitor with another plate formed on the base. Changes in ambient pressure deflect the skirt toward or away from the electrode on the substrate, changing the effective capacitance between the electrodes.
Electrical connections may be made to the electrode on the skirt and the electrode on the substrate utilizing electrical connectors which are external to the base and thus external to the sealed cavity.
CA002341182A 1998-08-19 1999-08-17 Sealed capacitive pressure sensors Expired - Fee Related CA2341182C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9717098P 1998-08-19 1998-08-19
US60/097,170 1998-08-19
PCT/US1999/018702 WO2000011444A1 (en) 1998-08-19 1999-08-17 Sealed capacitive pressure sensors

Publications (2)

Publication Number Publication Date
CA2341182A1 true CA2341182A1 (en) 2000-03-02
CA2341182C CA2341182C (en) 2005-01-04

Family

ID=22261728

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002341182A Expired - Fee Related CA2341182C (en) 1998-08-19 1999-08-17 Sealed capacitive pressure sensors

Country Status (4)

Country Link
US (2) US6470754B1 (en)
AU (1) AU5489799A (en)
CA (1) CA2341182C (en)
WO (1) WO2000011444A1 (en)

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US8217475B2 (en) * 2008-05-15 2012-07-10 Custom Sensors & Technologies, Inc. Backside controlled MEMS capacitive sensor and interface and method
DE102009000056A1 (en) * 2009-01-07 2010-07-08 Robert Bosch Gmbh Sensor element for capacitive differential pressure detection
US8196475B2 (en) * 2009-03-16 2012-06-12 Kavlico Corporation Cointegrated MEMS sensor and method
US20110023281A1 (en) * 2009-04-30 2011-02-03 Stat Medical Devices, Inc. Pen injection device cap with integral pen needle quick release and/or removal system
US9700681B2 (en) * 2009-05-15 2017-07-11 Stat Medical Devices, Inc. Pen needle with quick release and/or removal system
JP5588243B2 (en) * 2009-07-01 2014-09-10 ブルックス・インストルメント・エルエルシー Monolithic vacuum manometer using electrostatic interference as detection means
US20110060292A1 (en) * 2009-08-14 2011-03-10 Stat Medical Devices, Inc. Pen needle storage device with integral removal and/or installation system
WO2011044387A2 (en) 2009-10-07 2011-04-14 The Board Of Regents Of The University Of Texas System Pressure-sensing medical devices, systems and methods, and methods of forming medical devices
US8528397B2 (en) * 2010-08-18 2013-09-10 International Business Machines Corporation Hermeticity sensor and related method
US10463803B2 (en) 2010-11-12 2019-11-05 Stat Medical Devices, Inc. Pen needle with quick release and/or removal system
US9016133B2 (en) * 2011-01-05 2015-04-28 Nxp, B.V. Pressure sensor with pressure-actuated switch
US8961470B2 (en) 2011-02-17 2015-02-24 Steven Schraga Pen needle with safety shield system
US20130001550A1 (en) * 2011-06-29 2013-01-03 Invensense, Inc. Hermetically sealed mems device with a portion exposed to the environment with vertically integrated electronics
US9078978B2 (en) 2011-12-28 2015-07-14 Stat Medical Devices, Inc. Needle assembly with safety system for a syringe or fluid sampling device and method of making and using the same
US9249008B2 (en) 2012-12-20 2016-02-02 Industrial Technology Research Institute MEMS device with multiple electrodes and fabricating method thereof
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US9285404B2 (en) 2013-08-15 2016-03-15 Freescale Semiconductor, Inc. Test structure and methodology for estimating sensitivity of pressure sensors
US9581511B2 (en) * 2013-10-15 2017-02-28 Meggitt (Orange County), Inc. Microelectromechanical pressure sensors
US10118000B2 (en) 2014-04-21 2018-11-06 Stat Medical Devices, Inc. Pen needle installation and removal safety cover and pen needle assembly utilizing the same
US10155091B2 (en) 2014-07-11 2018-12-18 Stat Medical Devices, Inc. Pen needle tip and method of making and using the same
US9541462B2 (en) * 2014-08-29 2017-01-10 Kionix, Inc. Pressure sensor including deformable pressure vessel(s)
EP3896418B1 (en) * 2018-12-13 2024-04-17 Mitsubishi Electric Corporation Pulling detection device and moving body system comprising same
DE102018222730A1 (en) * 2018-12-21 2020-06-25 Robert Bosch Gmbh Micromechanical component and manufacturing method for a micromechanical component
DE102018222758A1 (en) * 2018-12-21 2020-06-25 Robert Bosch Gmbh MEMS sensor with a membrane and method for producing a MEMS sensor
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Also Published As

Publication number Publication date
US6470754B1 (en) 2002-10-29
AU5489799A (en) 2000-03-14
WO2000011444A1 (en) 2000-03-02
CA2341182C (en) 2005-01-04
US6460234B1 (en) 2002-10-08

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