CA2352095A1 - Thermally conductive composite material - Google Patents

Thermally conductive composite material Download PDF

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Publication number
CA2352095A1
CA2352095A1 CA002352095A CA2352095A CA2352095A1 CA 2352095 A1 CA2352095 A1 CA 2352095A1 CA 002352095 A CA002352095 A CA 002352095A CA 2352095 A CA2352095 A CA 2352095A CA 2352095 A1 CA2352095 A1 CA 2352095A1
Authority
CA
Canada
Prior art keywords
thermally conductive
composition
composite material
percent
volume
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002352095A
Other languages
French (fr)
Other versions
CA2352095C (en
Inventor
Kevin A. Mccullough
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ticona Polymers Inc
Original Assignee
Cool Options, Inc.
Kevin A. Mccullough
Ticona Polymers, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cool Options, Inc., Kevin A. Mccullough, Ticona Polymers, Inc. filed Critical Cool Options, Inc.
Publication of CA2352095A1 publication Critical patent/CA2352095A1/en
Application granted granted Critical
Publication of CA2352095C publication Critical patent/CA2352095C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A conductive molding composition (100), with a thermal conductivity above 22 W/m°K, is provided. The thermally conductive composition (100) includes a polymer base matrix (12) of, by volume, between 30 and 60 percent.
A first thermally conductive filler (116), by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture (100) is a second thermally conductive filler (114), by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.
CA002352095A 1999-01-29 1999-10-14 Thermally conductive composite material Expired - Fee Related CA2352095C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/239,913 US6048919A (en) 1999-01-29 1999-01-29 Thermally conductive composite material
US09/239,913 1999-01-29
PCT/US1999/023950 WO2000044823A1 (en) 1999-01-29 1999-10-14 Thermally conductive composite material

Publications (2)

Publication Number Publication Date
CA2352095A1 true CA2352095A1 (en) 2000-08-03
CA2352095C CA2352095C (en) 2006-01-10

Family

ID=22904281

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002352095A Expired - Fee Related CA2352095C (en) 1999-01-29 1999-10-14 Thermally conductive composite material

Country Status (16)

Country Link
US (2) US6048919A (en)
EP (1) EP1151033B1 (en)
JP (1) JP4087068B2 (en)
KR (1) KR100450831B1 (en)
CN (1) CN1150258C (en)
AT (1) ATE259392T1 (en)
AU (1) AU752158B2 (en)
BR (1) BR9917095B1 (en)
CA (1) CA2352095C (en)
DE (1) DE69914807T2 (en)
ES (1) ES2213395T3 (en)
HK (1) HK1043141B (en)
MX (1) MXPA01007656A (en)
PT (1) PT1151033E (en)
TW (1) TWI285656B (en)
WO (1) WO2000044823A1 (en)

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US6251978B1 (en) 2001-06-26
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WO2000044823A1 (en) 2000-08-03
ATE259392T1 (en) 2004-02-15
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KR100450831B1 (en) 2004-10-01
BR9917095B1 (en) 2009-12-01
CN1150258C (en) 2004-05-19
DE69914807D1 (en) 2004-03-18
EP1151033A1 (en) 2001-11-07
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HK1043141A1 (en) 2002-09-06
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EP1151033A4 (en) 2002-10-30
CA2352095C (en) 2006-01-10
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KR20010099969A (en) 2001-11-09
EP1151033B1 (en) 2004-02-11

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