CA2360351A1 - Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux - Google Patents

Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux Download PDF

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Publication number
CA2360351A1
CA2360351A1 CA002360351A CA2360351A CA2360351A1 CA 2360351 A1 CA2360351 A1 CA 2360351A1 CA 002360351 A CA002360351 A CA 002360351A CA 2360351 A CA2360351 A CA 2360351A CA 2360351 A1 CA2360351 A1 CA 2360351A1
Authority
CA
Canada
Prior art keywords
manufacturing
antenna
smart card
card
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002360351A
Other languages
English (en)
Other versions
CA2360351C (fr
Inventor
Georges Kayanakis
Christophe Mathieu
Sebastien Delenne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASK SA
Original Assignee
Ask S.A.
Georges Kayanakis
Christophe Mathieu
Sebastien Delenne
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ask S.A., Georges Kayanakis, Christophe Mathieu, Sebastien Delenne filed Critical Ask S.A.
Publication of CA2360351A1 publication Critical patent/CA2360351A1/fr
Application granted granted Critical
Publication of CA2360351C publication Critical patent/CA2360351C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Abstract

La présente invention concerne un procédé de fabrication d'une carte à puce sans contact et plus particulièrement un procédé de fabrication d'une carte à puce sans contact dont l'antenne est sur un support en matériau fibreux tel que le papier. Ce procédé comprend une étape de réalisation de l'antenne par sérigraphie sur le support, une étape de collage des contacts de la puce sur le support antenne avec une colle conductrice, une étape de lamination des corps de carte par pressage à chaud sur le support de l'antenne. Des découpes réalisées dans les coins du support de l'antenne avant l'étape de lamination permettent une soudure des corps de carte entre eux. La carte ainsi obtenue permet de visualiser a posteriori les mauvais traitements mécaniques qui lui sont infligés (flexions extrêmes).

Claims (8)

1. Procédé de fabrication d'une carte à puce sans contact avec un support d'antenne en matière fibreuse tel que le papier comprenant les étapes suivantes :
une étape de fabrication de l'antenne consistant à
sérigraphier des spires d'encre polymère conductrice sur un support en matière fibreuse et à faire subir un traitement thermique audit support afin de cuire ladite encre, une étape de collage avec une colle conductrice des plots de contact de la puce sur les plots de contact de l'antenne, et une étape de lamination des corps de carte sur le support de l'antenne consistant à souder de chaque côté dudit support au moins deux feuilles en matière plastique de rigidité différente, constituant les corps de carte, par pressage à chaud.
2. Procédé de fabrication d'une carte à puce selon la revendication 1, dans lequel, durant l'étape de fabrication de l'antenne, les coins du support d'antenne en papier sont découpés afin de permettre la soudure entre les deux corps de carte, ladite carte ainsi obtenue offrant ainsi une zone préférentielle de délamination, permettant de mettre en évidence a posteriori un acte de dégradation volontaire.
3. Procédé de fabrication d'une carte à puce selon la revendication 2, caractérisé en ce que la feuille constituant la couche externe des corps de carte est plus rigide que la feuille constituant la couche interne des corps de carte, ladite couche interne possédant un bas point Vicat.
4. Procédé de fabrication d'une carte à puce selon l'une des revendications précédentes, dans lequel les deux feuilles constituant chacun des corps de carte sont d'épaisseur différente.
5. Procédé de fabrication d'une carte à puce selon la revendication 4, dans lequel la feuille constituant la couche externe est plus épaisse que la feuille constituant la couche interne.
6. Procédé de fabrication d'une carte à puce selon l'une des revendication précédentes, dans lequel durant l'étape de lamination des corps de carte à chaud sur le support de l'antenne, on ajoute une troisième feuille en matière plastique ou une couche de vernis à chaque corps de carte, jouant le rôle de couverture.
7. Procédé de fabrication d'une carte à puce selon l'une des revendications précédentes, dans lequel la matière plastique constituant les corps de carte est le polychlorure de vinyle (PVC), du polyester (PET, PETG), du polycarbonate (PC) ou de l'acrylonitrile-butadiène-styrène (ABS).
8. Procédé de fabrication d'une carte à puce selon l'une des revendications précédentes, dans lequel la colle conductrice permettant de coller les plots de contact de la puce sur les plots de contact de l'antenne est à base d'encre, d'époxy ou de polymères conducteurs.
CA002360351A 1999-11-29 2000-11-28 Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux Expired - Fee Related CA2360351C (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR99/15019 1999-11-29
FR9915019A FR2801708B1 (fr) 1999-11-29 1999-11-29 Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux
PCT/FR2000/003321 WO2001041060A1 (fr) 1999-11-29 2000-11-28 Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux

Publications (2)

Publication Number Publication Date
CA2360351A1 true CA2360351A1 (fr) 2001-06-07
CA2360351C CA2360351C (fr) 2010-01-05

Family

ID=9552672

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002360351A Expired - Fee Related CA2360351C (fr) 1999-11-29 2000-11-28 Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux

Country Status (22)

Country Link
US (1) US6536674B2 (fr)
EP (1) EP1183643B1 (fr)
JP (1) JP4731779B2 (fr)
KR (1) KR100817961B1 (fr)
CN (1) CN1211759C (fr)
AT (1) ATE388453T1 (fr)
AU (1) AU776169B2 (fr)
BR (1) BR0007790A (fr)
CA (1) CA2360351C (fr)
DE (1) DE60038230T2 (fr)
FR (1) FR2801708B1 (fr)
HK (1) HK1044398B (fr)
ID (1) ID29989A (fr)
IL (1) IL144301A (fr)
MX (1) MXPA01007466A (fr)
NO (1) NO20013405L (fr)
PT (1) PT1183643E (fr)
RU (1) RU2251744C2 (fr)
TR (1) TR200102182T1 (fr)
TW (1) TW513672B (fr)
WO (1) WO2001041060A1 (fr)
ZA (1) ZA200105716B (fr)

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Also Published As

Publication number Publication date
CN1211759C (zh) 2005-07-20
US6536674B2 (en) 2003-03-25
US20010006194A1 (en) 2001-07-05
CN1338085A (zh) 2002-02-27
HK1044398B (zh) 2006-02-17
DE60038230D1 (de) 2008-04-17
TW513672B (en) 2002-12-11
WO2001041060A1 (fr) 2001-06-07
HK1044398A1 (en) 2002-10-18
MXPA01007466A (es) 2003-03-12
NO20013405D0 (no) 2001-07-09
JP4731779B2 (ja) 2011-07-27
CA2360351C (fr) 2010-01-05
JP2003515848A (ja) 2003-05-07
KR20010110419A (ko) 2001-12-13
PT1183643E (pt) 2008-06-17
ATE388453T1 (de) 2008-03-15
FR2801708A1 (fr) 2001-06-01
DE60038230T2 (de) 2008-11-13
EP1183643A1 (fr) 2002-03-06
NO20013405L (no) 2001-09-12
BR0007790A (pt) 2002-02-05
IL144301A (en) 2005-12-18
TR200102182T1 (tr) 2002-03-21
FR2801708B1 (fr) 2003-12-26
IL144301A0 (en) 2002-05-23
KR100817961B1 (ko) 2008-03-31
RU2251744C2 (ru) 2005-05-10
EP1183643B1 (fr) 2008-03-05
ZA200105716B (en) 2002-02-21
AU776169B2 (en) 2004-09-02
AU2179301A (en) 2001-06-12
ID29989A (id) 2001-10-25

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