CA2396566A1 - Conditioning of through holes and glass - Google Patents

Conditioning of through holes and glass Download PDF

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Publication number
CA2396566A1
CA2396566A1 CA002396566A CA2396566A CA2396566A1 CA 2396566 A1 CA2396566 A1 CA 2396566A1 CA 002396566 A CA002396566 A CA 002396566A CA 2396566 A CA2396566 A CA 2396566A CA 2396566 A1 CA2396566 A1 CA 2396566A1
Authority
CA
Canada
Prior art keywords
composition
conditioning
agent
holes
anionic dispersing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002396566A
Other languages
French (fr)
Other versions
CA2396566C (en
Inventor
Michael V. Carano
Frank Polakovic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2396566A1 publication Critical patent/CA2396566A1/en
Application granted granted Critical
Publication of CA2396566C publication Critical patent/CA2396566C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating

Abstract

A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and conditioned surface. The clean and conditioned surface is coated with conductive carbon particles (usually graphite) to provide a carbon-coated surface. The carbon-coated surface is electro plated and then soldered using hot solder. Those surfaces that have been soldered and also treated with the composition of the invention exhibit fewer blow hole problems. The composition of the invention comprises carbonates, binders, and resins, and combinations thereof, that improve the adhesion and coverage of a coating containing graphite to a surface defined by a through hole bore or other substrate. ("Through holes" as used herein refe rs both to through holes and to vias).

Claims (12)

1. A conditioning composition for improving the adhesion and coverage of a conductive coating to a surface comprising a through hole bore, said conditioning composition comprising a conditioning agent and a further ingredient selected from a pH buffer, a binding agent, anionic dispersing agent, and combinations thereof.
2. The composition of claim 1, wherein said further ingredient is a carbonate-bicarbonate buffer.
3. The composition of claim 2, wherein said carbonate-bicarbonate buffer comprises potassium canons.
4. The composition of claim 1, wherein said composition further comprises a surfactant.
5. The composition of claim 1, wherein said conditioning agent is an anionic dispersing agent.
6. The composition of claim 5, wherein said anionic dispersing agent is an acrylic latex having a molecular weight of less than about 1000.
7. The composition of claim 1, wherein said conditioning agent is a binding agent.
8. The composition of claim 7, wherein said binding agent is carboxymethylcellulose.
9. A method for providing a soldered surface that is substantially free of blow-holes, comprising the steps of:

(a) contacting a surface with a conditioning composition to provide a conditioned surface, said conditioning composition comprising a conditioning agent and at least one of a buffer, a anionic dispersing agent and a binder;
(b) contacting said conditioned surface with a conductive carbon coating to provide a carbon coated surface;
(c) electroplating said carbon coated surface to provide an electroplated surface; and (d) soldering said electroplated surface to provide a soldered surface that is substantially free of blow-holes.
10. The composition of claim 9, wherein said conditioning composition comprises an anionic dispersing agent.
11. The composition of claim 9, wherein said conditioning agent comprises a binder.
12. The composition of claim 11, wherein said conditioning composition comprises sodium carboxymethylcellulose.
CA2396566A 2000-01-06 2000-11-16 Conditioning of through holes and glass Expired - Lifetime CA2396566C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/478,587 US6375731B1 (en) 2000-01-06 2000-01-06 Conditioning of through holes and glass
US09/478,587 2000-01-06
PCT/US2000/042189 WO2001050821A2 (en) 2000-01-06 2000-11-16 Conditioning of through holes and glass

Publications (2)

Publication Number Publication Date
CA2396566A1 true CA2396566A1 (en) 2001-07-12
CA2396566C CA2396566C (en) 2010-03-23

Family

ID=23900523

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2396566A Expired - Lifetime CA2396566C (en) 2000-01-06 2000-11-16 Conditioning of through holes and glass

Country Status (11)

Country Link
US (2) US6375731B1 (en)
EP (1) EP1257694B1 (en)
JP (1) JP5005867B2 (en)
KR (1) KR100744328B1 (en)
CN (1) CN1214134C (en)
AT (1) ATE462290T1 (en)
AU (1) AU4506701A (en)
CA (1) CA2396566C (en)
DE (1) DE60044067D1 (en)
TW (1) TWI280272B (en)
WO (1) WO2001050821A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6375731B1 (en) 2000-01-06 2002-04-23 Electrochemicals Inc. Conditioning of through holes and glass
US20020134684A1 (en) * 2000-10-25 2002-09-26 Shipley Company, L.L.C. Seed layer processes
US7211204B2 (en) 2003-12-12 2007-05-01 Electrochemicals, Inc. Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA)
US7858146B2 (en) 2007-06-29 2010-12-28 Rohm And Haas Electronic Materials Llc Method of electrolessly depositing metal on the walls of through-holes
TW201035513A (en) * 2009-03-25 2010-10-01 Wah Hong Ind Corp Method for manufacturing heat dissipation interface device and product thereof
US8955580B2 (en) 2009-08-14 2015-02-17 Wah Hong Industrial Corp. Use of a graphite heat-dissipation device including a plating metal layer
CN103303020B (en) * 2013-05-08 2014-11-19 福建农林大学 Konjak gulcomannan printing thin film and preparation method thereof
JPWO2015114984A1 (en) * 2014-01-31 2017-03-23 住友電気工業株式会社 Conductive resin molded body, structure, porous aluminum body, method for producing porous aluminum body, current collector, electrode, non-aqueous electric double layer capacitor and lithium ion capacitor
KR20200102535A (en) * 2016-04-22 2020-08-31 한국과학기술연구원 Two-Dimensional Metal Carbide, Nitride, and Carbonitride Films and Composites for EMI Shielding
US10986738B2 (en) * 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process
US10677856B2 (en) 2018-08-17 2020-06-09 International Business Machines Corporation Facilitating reliable circuit board press-fit connector assembly fabrication
CN116941027A (en) 2021-02-08 2023-10-24 麦克德米德乐思公司 Method and wet chemistry for diffusion barrier formation

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
US3556883A (en) 1967-07-21 1971-01-19 Mitsubishi Edogawa Kagaku Kk Method for chemically polishing copper or copper alloy
US4724005A (en) * 1985-11-29 1988-02-09 Olin Hunt Specialty Products Inc. Liquid carbon black dispersion
US4969979A (en) * 1989-05-08 1990-11-13 International Business Machines Corporation Direct electroplating of through holes
WO1992019092A1 (en) * 1991-04-22 1992-10-29 Atotech Deutschland Gmbh Method for selectively coating non-conductors with carbon particles and use of copper containing solutions therein
US5139642A (en) 1991-05-01 1992-08-18 Olin Corporation Process for preparing a nonconductive substrate for electroplating
TW222313B (en) * 1993-01-29 1994-04-11 Mekku Kk Electroplating method
US5389270A (en) 1993-05-17 1995-02-14 Electrochemicals, Inc. Composition and process for preparing a non-conductive substrate for electroplating
US5690805A (en) 1993-05-17 1997-11-25 Electrochemicals Inc. Direct metallization process
US5476580A (en) * 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating
US5725807A (en) 1993-05-17 1998-03-10 Electrochemicals Inc. Carbon containing composition for electroplating
JPH07268682A (en) * 1994-03-28 1995-10-17 Mec Kk Method for electroplating surface of electric nonconductor
US5585427A (en) 1994-11-07 1996-12-17 Ppg Industries, Inc. Pigment dispersing additive for coating compositions
US5626736A (en) * 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
US5800739A (en) * 1996-04-11 1998-09-01 Shipley Company, L.L.C. Stabilized dispersions of graphite particles
US6375731B1 (en) 2000-01-06 2002-04-23 Electrochemicals Inc. Conditioning of through holes and glass

Also Published As

Publication number Publication date
US6691912B2 (en) 2004-02-17
JP2003519285A (en) 2003-06-17
KR20020079771A (en) 2002-10-19
WO2001050821A3 (en) 2002-02-21
EP1257694B1 (en) 2010-03-24
EP1257694A2 (en) 2002-11-20
US20020139686A1 (en) 2002-10-03
US6375731B1 (en) 2002-04-23
CN1214134C (en) 2005-08-10
CN1437661A (en) 2003-08-20
ATE462290T1 (en) 2010-04-15
DE60044067D1 (en) 2010-05-06
JP5005867B2 (en) 2012-08-22
TWI280272B (en) 2007-05-01
CA2396566C (en) 2010-03-23
EP1257694A4 (en) 2005-03-09
WO2001050821A2 (en) 2001-07-12
KR100744328B1 (en) 2007-07-30
AU4506701A (en) 2001-07-16

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Effective date: 20201116