CA2431625A1 - Semiconductor acceleration sensor using doped semiconductor layer as wiring - Google Patents
Semiconductor acceleration sensor using doped semiconductor layer as wiring Download PDFInfo
- Publication number
- CA2431625A1 CA2431625A1 CA002431625A CA2431625A CA2431625A1 CA 2431625 A1 CA2431625 A1 CA 2431625A1 CA 002431625 A CA002431625 A CA 002431625A CA 2431625 A CA2431625 A CA 2431625A CA 2431625 A1 CA2431625 A1 CA 2431625A1
- Authority
- CA
- Canada
- Prior art keywords
- wiring
- acceleration sensor
- beams
- resistor element
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
- G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
- G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape
Abstract
A semiconductor acceleration sensor is provided, which has the capability of preventing a situation that detection accuracy of acceleration deteriorates due to undesirable thermal stress induced when a metal layer wiring is used in the acceleration sensor. This sensor comprises a frame, a weight, at least one pair of beams made of a semiconductor material, via which said weight is supported in the frame, and at least one resistor element formed on each of the beams to thereby detect acceleration according to piezoelectric effect of the resistor element. The sensor also includes a doped semiconductor layer formed in a top surface of each of the beams as a wiring for electrically connecting with the resistor element.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-217359 | 2002-07-26 | ||
JP2002217359 | 2002-07-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2431625A1 true CA2431625A1 (en) | 2004-01-26 |
CA2431625C CA2431625C (en) | 2007-08-14 |
Family
ID=29997283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002431625A Expired - Fee Related CA2431625C (en) | 2002-07-26 | 2003-06-10 | Semiconductor acceleration sensor using doped semiconductor layer as wiring |
Country Status (6)
Country | Link |
---|---|
US (1) | US20040016981A1 (en) |
EP (1) | EP1385010B1 (en) |
KR (1) | KR100580440B1 (en) |
CN (1) | CN1275043C (en) |
CA (1) | CA2431625C (en) |
DE (1) | DE60322479D1 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7461559B2 (en) * | 2005-03-18 | 2008-12-09 | Citizen Holdings Co., Ltd. | Electromechanical transducer and method of fabricating the same |
US20090212665A1 (en) * | 2005-03-24 | 2009-08-27 | Hur Koser | Power harvesting scheme based on piezoelectricity and nonlinear deflections |
AU2006315079B2 (en) * | 2005-11-18 | 2011-03-24 | Ewise Systems Pty Ltd | A method and apparatus for facilitating a secure transaction |
US8026594B2 (en) * | 2005-11-25 | 2011-09-27 | Panasonic Electric Works Co., Ltd. | Sensor device and production method therefor |
WO2007061054A1 (en) * | 2005-11-25 | 2007-05-31 | Matsushita Electric Works, Ltd. | Wafer level package structure and sensor device obtained from such package structure |
EP3257809A1 (en) * | 2005-11-25 | 2017-12-20 | Panasonic Intellectual Property Management Co., Ltd. | Wafer level package structure and production method therefor |
US7674638B2 (en) * | 2005-11-25 | 2010-03-09 | Panasonic Electric Works Co., Ltd. | Sensor device and production method therefor |
CN100399032C (en) * | 2006-05-29 | 2008-07-02 | 东南大学 | Athermal flow speed-direction sensor based on micro mechanical system |
DE102008007345B4 (en) * | 2008-02-04 | 2016-10-06 | Robert Bosch Gmbh | Micromechanical component and method for producing the same |
JP4687736B2 (en) * | 2008-03-25 | 2011-05-25 | 株式会社村田製作所 | Manufacturing method of external force detection device and external force detection device |
JP6166185B2 (en) * | 2014-01-06 | 2017-07-19 | アルプス電気株式会社 | MEMS sensor |
JP6531281B2 (en) * | 2014-01-27 | 2019-06-19 | パナソニックIpマネジメント株式会社 | Acceleration sensor |
US10036765B2 (en) * | 2015-07-10 | 2018-07-31 | Honeywell International Inc. | Reducing hysteresis effects in an accelerometer |
US10350056B2 (en) * | 2016-12-23 | 2019-07-16 | Shifamed Holdings, Llc | Multi-piece accommodating intraocular lenses and methods for making and using same |
JP2019045287A (en) * | 2017-09-01 | 2019-03-22 | セイコーエプソン株式会社 | Physical quantity sensor, electronic apparatus and mobile body |
US10340290B2 (en) * | 2017-09-15 | 2019-07-02 | Globalfoundries Inc. | Stacked SOI semiconductor devices with back bias mechanism |
US10410934B2 (en) * | 2017-12-07 | 2019-09-10 | Micron Technology, Inc. | Apparatuses having an interconnect extending from an upper conductive structure, through a hole in another conductive structure, and to an underlying structure |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0691265B2 (en) * | 1986-08-01 | 1994-11-14 | 株式会社日立製作所 | Semiconductor pressure sensor |
JPS6341080A (en) * | 1986-08-06 | 1988-02-22 | Nissan Motor Co Ltd | Semiconductor acceleration sensor |
JP2586359B2 (en) * | 1990-12-17 | 1997-02-26 | 日本電気株式会社 | Semiconductor acceleration sensor and method of manufacturing the same |
US5408112A (en) * | 1991-06-03 | 1995-04-18 | Nippondenso Co., Ltd. | Semiconductor strain sensor having improved resistance to bonding strain effects |
JP3391841B2 (en) * | 1993-05-26 | 2003-03-31 | 松下電工株式会社 | Semiconductor acceleration sensor |
JPH08145683A (en) * | 1994-11-16 | 1996-06-07 | Nikon Corp | Acceleration/angular acceleration detector |
US5834646A (en) * | 1995-04-12 | 1998-11-10 | Sensonor Asa | Force sensor device |
JPH0945937A (en) * | 1995-07-26 | 1997-02-14 | Matsushita Electric Works Ltd | Fabrication of triaxial acceleration sensor |
EP0899574B1 (en) * | 1997-02-21 | 2004-07-21 | Matsushita Electric Works, Ltd. | Acceleration sensor element and method of its manufacture |
JP2002340713A (en) * | 2001-05-10 | 2002-11-27 | Denso Corp | Semiconductor pressure sensor |
-
2003
- 2003-06-05 US US10/454,675 patent/US20040016981A1/en not_active Abandoned
- 2003-06-10 CA CA002431625A patent/CA2431625C/en not_active Expired - Fee Related
- 2003-06-16 DE DE60322479T patent/DE60322479D1/en not_active Expired - Lifetime
- 2003-06-16 EP EP03013642A patent/EP1385010B1/en not_active Expired - Fee Related
- 2003-06-25 CN CNB031487750A patent/CN1275043C/en not_active Expired - Fee Related
- 2003-07-25 KR KR1020030051372A patent/KR100580440B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20040016981A1 (en) | 2004-01-29 |
KR20040010394A (en) | 2004-01-31 |
CA2431625C (en) | 2007-08-14 |
EP1385010A2 (en) | 2004-01-28 |
KR100580440B1 (en) | 2006-05-15 |
CN1275043C (en) | 2006-09-13 |
DE60322479D1 (en) | 2008-09-11 |
CN1480733A (en) | 2004-03-10 |
EP1385010A3 (en) | 2004-05-12 |
EP1385010B1 (en) | 2008-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |
Effective date: 20140610 |