CA2441124A1 - Electronic module with fluid dissociation electrodes and methods - Google Patents
Electronic module with fluid dissociation electrodes and methods Download PDFInfo
- Publication number
- CA2441124A1 CA2441124A1 CA002441124A CA2441124A CA2441124A1 CA 2441124 A1 CA2441124 A1 CA 2441124A1 CA 002441124 A CA002441124 A CA 002441124A CA 2441124 A CA2441124 A CA 2441124A CA 2441124 A1 CA2441124 A1 CA 2441124A1
- Authority
- CA
- Canada
- Prior art keywords
- cooling fluid
- electronic module
- cooling
- condenser
- evaporator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Abstract
An electronic module includes a cooling substrate, an electronic device mounted thereon, and a plurality of cooling fluid dissociation electrodes carried by the cooling substrate for dissociating cooling fluid to control a pressure thereof. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber.
Claims (44)
1. An electronic module comprising:
a cooling substrate and an electronic device mounted thereon;
said cooling substrate having an evaporator chamber adjacent said electronic device, at least one condenser chamber, and at least one cooling fluid passageway connecting said evaporator chamber in fluid communication with said at least one condenser chamber; and a plurality of cooling fluid dissociation electrodes carried by said cooling substrate for dissociating cooling fluid to control a pressure thereof.
a cooling substrate and an electronic device mounted thereon;
said cooling substrate having an evaporator chamber adjacent said electronic device, at least one condenser chamber, and at least one cooling fluid passageway connecting said evaporator chamber in fluid communication with said at least one condenser chamber; and a plurality of cooling fluid dissociation electrodes carried by said cooling substrate for dissociating cooling fluid to control a pressure thereof.
2. The electronic module of Claim 1 wherein said plurality of cooling fluid dissociation electrodes allow cooling fluid dissociation during manufacture of the electronic module.
3. The electronic module of Claim 1 wherein said electronic device drives said plurality of cooling fluid dissociation electrodes.
4. The electronic module of Claim 3 wherein said electronic device senses a temperature thereof and drives said plurality of cooling fluid dissociation electrodes responsive to the sensed temperature.
5. The electronic module of Claim 1 wherein each of said cooling fluid dissociation electrodes comprises metal.
6. The electronic module of Claim 5 wherein the metal is resistant to corrosion from the cooling fluid.
7. The electronic module of Claim 6 wherein the metal comprises at least one of gold and nickel.
8. The electronic module of Claim 1 further comprising a heat sink adjacent said cooling substrate; and wherein said plurality of cooling fluid dissociation electrodes comprise an evaporator thermal transfer body connected in thermal communication between said evaporator chamber and said electronic device and at least one condenser thermal transfer body connected in thermal communication between said at least one condenser chamber and said heat sink.
9. The electronic module of Claim 8 wherein said evaporator thermal transfer body and said at least one condenser thermal transfer body each have a higher thermal conductivity than adjacent cooling substrate portions.
10. The electronic module of Claim 8 wherein said evaporator thermal transfer body and said at least one condenser thermal transfer body each have a thermal conductivity greater than about 100 Watts per meter-degree Celsius.
11. The electronic module of Claim 8 wherein said evaporator thermal transfer body, said at least one condenser thermal transfer body, and said at least one cooling fluid passageway cause fluid flow during operation of the electronic module without a pump.
12. The electronic module of Claim 8 wherein said evaporator thermal transfer body comprises a wicking portion exposed within said evaporator chamber for facilitating cooling fluid flow by capillary action.
13. The electronic module of Claim 8 wherein said at least one condenser thermal transfer body comprises at least one wicking portion exposed within said at least one condenser chamber for facilitating cooling fluid flow by capillary action.
14. The electronic module of Claim 8 wherein said cooling substrate further comprises projections extending inwardly into said at least one cooling fluid passageway for facilitating cooling fluid flow by capillary action.
15. The electronic module of Claim 8 wherein said cooling substrate further comprises projections extending inwardly into said evaporator chamber and said at least one condenser chamber for facilitating cooling fluid flow by capillary action.
16. An electronic module comprising:
a cooling substrate and an electronic device mounted thereon;
a heat sink adjacent said cooling substrate;
said cooling substrate having an evaporator chamber adjacent said electronic device, at least one condenser chamber adjacent said heat sink, and at least one cooling fluid passageway connecting said evaporator chamber in fluid communication with said at least one condenser chamber; and a plurality of cooling fluid dissociation electrodes carried by said cooling substrate for dissociating cooling fluid to control a pressure thereof, at least one of said plurality of fluid dissociation electrodes comprising an evaporator thermal transfer body connected in thermal communication between said evaporator chamber and said electronic device.
a cooling substrate and an electronic device mounted thereon;
a heat sink adjacent said cooling substrate;
said cooling substrate having an evaporator chamber adjacent said electronic device, at least one condenser chamber adjacent said heat sink, and at least one cooling fluid passageway connecting said evaporator chamber in fluid communication with said at least one condenser chamber; and a plurality of cooling fluid dissociation electrodes carried by said cooling substrate for dissociating cooling fluid to control a pressure thereof, at least one of said plurality of fluid dissociation electrodes comprising an evaporator thermal transfer body connected in thermal communication between said evaporator chamber and said electronic device.
17. The electronic module of Claim 16 wherein said plurality of cooling fluid dissociation electrodes. allow cooling fluid dissociation during manufacture of the electronic module.
18. The electronic module of Claim 16 wherein said electronic device drives said plurality of cooling fluid dissociation electrodes.
19. The electronic module of Claim 18 wherein said electronic device senses a temperature thereof and drives said plurality of cooling fluid dissociation electrodes responsive to the sensed temperature.
20. The electronic module of Claim 16 wherein each of said cooling fluid dissociation electrodes comprises metal.
21. The electronic module of Claim 20 wherein the metal is resistant to corrosion from the cooling fluid.
22. The electronic module of Claim 21 wherein the metal comprises at least one of gold and nickel.
23. The electronic module of Claim 16 wherein said evaporator thermal transfer body comprises a wicking portion exposed within said evaporator chamber for facilitating cooling fluid flow by capillary action.
24. The electronic module of Claim 16 wherein said evaporator thermal transfer body has a higher thermal conductivity than adjacent cooling substrate portions.
25. The electronic module of Claim 16 wherein said evaporator thermal transfer body has a thermal conductivity greater than about 100 Watts per meter-degree Celsius.
26. An electronic module comprising:
a cooling substrate and an electronic device mounted thereon;
a heat sink adjacent said cooling substrate;
said cooling substrate having an evaporator chamber adjacent said electronic device, at least one condenser chamber adjacent said heat sink, and at least one cooling fluid passageway connecting said evaporator chamber in fluid communication with said at least one condenser chamber; and a plurality of cooling fluid dissociation electrodes carried by said cooling substrate for dissociating cooling fluid to control a pressure thereof, at least one of said plurality of cooling fluid dissociation electrodes comprising a condenser thermal transfer body connected in thermal communication between said at least one condenser chamber and said heat sink.
a cooling substrate and an electronic device mounted thereon;
a heat sink adjacent said cooling substrate;
said cooling substrate having an evaporator chamber adjacent said electronic device, at least one condenser chamber adjacent said heat sink, and at least one cooling fluid passageway connecting said evaporator chamber in fluid communication with said at least one condenser chamber; and a plurality of cooling fluid dissociation electrodes carried by said cooling substrate for dissociating cooling fluid to control a pressure thereof, at least one of said plurality of cooling fluid dissociation electrodes comprising a condenser thermal transfer body connected in thermal communication between said at least one condenser chamber and said heat sink.
27. The electronic module of Claim 26 wherein said plurality of cooling fluid dissociation electrodes allow cooling fluid dissociation during manufacture of the electronic module.
28. The electronic module of Claim 26 wherein said electronic device drives said plurality of cooling fluid dissociation electrodes.
29. The electronic module of Claim 28 wherein said electronic device senses a temperature thereof and drives said plurality of cooling fluid dissociation electrodes responsive to the sensed temperature.
30. The electronic module of Claim 26 wherein each of said cooling fluid dissociation electrodes comprises metal.
31. The electronic module of Claim 30 wherein the metal is resistant to corrosion from the cooling fluid.
32. The electronic module of Claim 31 wherein the metal comprises at least one of gold and nickel.
33. The electronic module of Claim 26 wherein said condenser thermal transfer body comprises at least one wicking portion exposed within said at least one condenser chamber for facilitating cooling fluid flow by capillary action.
34. The electronic module of Claim 26 wherein said condenser thermal transfer body has a higher thermal conductivity than adjacent cooling substrate portions.
35. The electronic module of Claim 26 wherein said condenser thermal transfer body has a thermal conductivity greater than about 100 Watts per meter-degree Celsius.
36. A method for controlling cooling fluid pressure in an electronic module comprising a cooling substrate having an evaporator chamber, at least one condenser chamber, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber and an electronic device carried by the cooling substrate adjacent the at lest one condenser chamber, the method comprising:
driving a plurality of cooling fluid dissociation electrodes carried by the cooling substrate for dissociating cooling fluid to control a pressure thereof.
driving a plurality of cooling fluid dissociation electrodes carried by the cooling substrate for dissociating cooling fluid to control a pressure thereof.
37. The method of Claim 36 wherein driving comprises driving the plurality of cooling fluid dissociation electrodes using the electronic device.
38. The method of Claim 37 wherein driving comprises sensing a temperature of the electronic device and driving the plurality of cooling fluid dissociation electrodes responsive to the sensed temperature.
39. The method of Claim 36 wherein each of the cooling fluid dissociation electrodes comprises metal.
40. The method of Claim 39 wherein the metal is resistant to corrosion from the cooling fluid.
41. The method of Claim 36 wherein the metal comprises at least one of gold and nickel.
42. The method of Claim 36 further comprising connecting a heat sink to the cooling substrate adjacent the at least one condenser chamber.
43. The method of Claim 42 wherein at least one of the plurality of cooling fluid dissociation electrodes comprises a condenser thermal transfer body in thermal communication between the at least one condenser chamber and the heat sink.
44. The method of Claim 42 wherein at least one of the plurality of cooling fluid dissociation electrodes comprises an evaporator thermal transfer body in thermal communication between the evaporator chamber and the electronic device.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/811,815 US6418019B1 (en) | 2001-03-19 | 2001-03-19 | Electronic module including a cooling substrate with fluid dissociation electrodes and related methods |
| US09/811,815 | 2001-03-19 | ||
| PCT/US2002/007312 WO2002076164A2 (en) | 2001-03-19 | 2002-03-12 | Electronic module with fluid dissociation electrodes and methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2441124A1 true CA2441124A1 (en) | 2002-09-26 |
| CA2441124C CA2441124C (en) | 2011-10-04 |
Family
ID=25207668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2441124A Expired - Lifetime CA2441124C (en) | 2001-03-19 | 2002-03-12 | Electronic module with fluid dissociation electrodes and methods |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6418019B1 (en) |
| EP (1) | EP1378154B1 (en) |
| JP (1) | JP3899034B2 (en) |
| KR (1) | KR100553172B1 (en) |
| CN (1) | CN1253063C (en) |
| AU (1) | AU2002306686B2 (en) |
| CA (1) | CA2441124C (en) |
| NO (1) | NO20034070L (en) |
| WO (1) | WO2002076164A2 (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110076A (en) * | 2001-10-01 | 2003-04-11 | Fujitsu Ltd | Heat spreader and heat sink |
| US20040011509A1 (en) * | 2002-05-15 | 2004-01-22 | Wing Ming Siu | Vapor augmented heatsink with multi-wick structure |
| US6639798B1 (en) * | 2002-06-24 | 2003-10-28 | Delphi Technologies, Inc. | Automotive electronics heat exchanger |
| JP2004037039A (en) * | 2002-07-05 | 2004-02-05 | Sony Corp | Cooling device, electronic equipment device and display device, and cooling device manufacturing method |
| US7108056B1 (en) * | 2002-10-18 | 2006-09-19 | Atec Advanced Thermal And Environmental Concepts | Slit-type restrictor for controlling flow delivery to electrohydrodynamic thin film evaporator |
| JP3896961B2 (en) * | 2002-12-12 | 2007-03-22 | ソニー株式会社 | Heat transport device and method of manufacturing heat transport device |
| US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
| DE102006011333A1 (en) * | 2006-03-09 | 2007-09-13 | Behr Industry Gmbh & Co. Kg | Device for cooling, in particular electronic components |
| WO2008109804A1 (en) * | 2007-03-08 | 2008-09-12 | Convergence Technologies Limited | Vapor-augmented heat spreader device |
| KR100891520B1 (en) * | 2007-05-15 | 2009-04-06 | 주식회사 하이닉스반도체 | Printed circuit board having thermal circulation medium and method for fabricating the same |
| CN102423653A (en) * | 2007-09-14 | 2012-04-25 | 株式会社爱德万测试 | Advanced heat control interface |
| US8195118B2 (en) | 2008-07-15 | 2012-06-05 | Linear Signal, Inc. | Apparatus, system, and method for integrated phase shifting and amplitude control of phased array signals |
| KR200451800Y1 (en) * | 2008-09-25 | 2011-01-12 | 홍순열 | Turbulent flow preventing device of hot runner valve gate device using electromagnet |
| US8872719B2 (en) | 2009-11-09 | 2014-10-28 | Linear Signal, Inc. | Apparatus, system, and method for integrated modular phased array tile configuration |
| US20130056178A1 (en) * | 2010-05-19 | 2013-03-07 | Nec Corporation | Ebullient cooling device |
| US9360514B2 (en) * | 2012-04-05 | 2016-06-07 | Board Of Regents, The University Of Texas System | Thermal reliability testing systems with thermal cycling and multidimensional heat transfer |
| CN108603989A (en) | 2016-02-26 | 2018-09-28 | 华为技术有限公司 | Optical assembly encapsulating structure, optical assembly, optical module and relevant apparatus and system |
| CN109310175B (en) | 2016-04-18 | 2021-09-10 | 史赛克公司 | Personal protection system including a hood with a transparent face shield and control buttons on the face shield |
| US10622282B2 (en) * | 2017-07-28 | 2020-04-14 | Qualcomm Incorporated | Systems and methods for cooling an electronic device |
| EP3454370B1 (en) * | 2017-09-11 | 2020-09-09 | Nokia Technologies Oy | Package, and method of manufacturing a package comprising an enclosure and an integrated circuit |
| US20190191589A1 (en) * | 2017-12-15 | 2019-06-20 | Google Llc | Three-Dimensional Electronic Structure with Integrated Phase-Change Cooling |
| DE102020103028A1 (en) * | 2019-03-06 | 2020-09-10 | GM Global Technology Operations LLC | COMPOSITE ARRANGEMENTS FOR THERMAL COOLING OF ELECTRONIC COMPONENTS |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU883643A2 (en) * | 1979-03-19 | 1981-11-23 | Институт Прикладной Физики Ан Мсср | Heat pipe with electrohydrodynamic generator |
| US4220195A (en) * | 1979-05-24 | 1980-09-02 | The United States Of America As Represented By The Secretary Of The Navy | Ion drag pumped heat pipe |
| US4519447A (en) | 1980-08-04 | 1985-05-28 | Fine Particle Technology Corporation | Substrate cooling |
| US4833567A (en) | 1986-05-30 | 1989-05-23 | Digital Equipment Corporation | Integral heat pipe module |
| US5199165A (en) * | 1991-12-13 | 1993-04-06 | Hewlett-Packard Company | Heat pipe-electrical interconnect integration method for chip modules |
| US5216580A (en) | 1992-01-14 | 1993-06-01 | Sun Microsystems, Inc. | Optimized integral heat pipe and electronic circuit module arrangement |
| US5308920A (en) * | 1992-07-31 | 1994-05-03 | Itoh Research & Development Laboratory Co., Ltd. | Heat radiating device |
| US6056044A (en) * | 1996-01-29 | 2000-05-02 | Sandia Corporation | Heat pipe with improved wick structures |
| KR100253899B1 (en) * | 1996-04-15 | 2000-04-15 | 다니구찌 이찌로오 | Hydro-evaporation type cooling device by electrolytic reaction |
| TW346566B (en) * | 1996-08-29 | 1998-12-01 | Showa Aluminiun Co Ltd | Radiator for portable electronic apparatus |
-
2001
- 2001-03-19 US US09/811,815 patent/US6418019B1/en not_active Expired - Lifetime
-
2002
- 2002-03-12 JP JP2002573498A patent/JP3899034B2/en not_active Expired - Fee Related
- 2002-03-12 WO PCT/US2002/007312 patent/WO2002076164A2/en active IP Right Grant
- 2002-03-12 KR KR1020037012176A patent/KR100553172B1/en active IP Right Grant
- 2002-03-12 CN CNB028069595A patent/CN1253063C/en not_active Expired - Fee Related
- 2002-03-12 EP EP02753609A patent/EP1378154B1/en not_active Expired - Lifetime
- 2002-03-12 AU AU2002306686A patent/AU2002306686B2/en not_active Ceased
- 2002-03-12 CA CA2441124A patent/CA2441124C/en not_active Expired - Lifetime
-
2003
- 2003-09-15 NO NO20034070A patent/NO20034070L/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030087646A (en) | 2003-11-14 |
| US6418019B1 (en) | 2002-07-09 |
| EP1378154B1 (en) | 2011-09-21 |
| AU2002306686B2 (en) | 2004-05-20 |
| CN1253063C (en) | 2006-04-19 |
| EP1378154A4 (en) | 2009-05-06 |
| KR100553172B1 (en) | 2006-02-21 |
| CA2441124C (en) | 2011-10-04 |
| WO2002076164A2 (en) | 2002-09-26 |
| JP3899034B2 (en) | 2007-03-28 |
| WO2002076164A3 (en) | 2002-11-14 |
| CN1498522A (en) | 2004-05-19 |
| NO20034070L (en) | 2003-11-19 |
| EP1378154A2 (en) | 2004-01-07 |
| JP2004523919A (en) | 2004-08-05 |
| NO20034070D0 (en) | 2003-09-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKEX | Expiry |
Effective date: 20220314 |