CA2447204A1 - Error correction scheme for memory - Google Patents

Error correction scheme for memory Download PDF

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Publication number
CA2447204A1
CA2447204A1 CA002447204A CA2447204A CA2447204A1 CA 2447204 A1 CA2447204 A1 CA 2447204A1 CA 002447204 A CA002447204 A CA 002447204A CA 2447204 A CA2447204 A CA 2447204A CA 2447204 A1 CA2447204 A1 CA 2447204A1
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Prior art keywords
parity
circuit
global
column
word
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CA002447204A
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French (fr)
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CA2447204C (en
Inventor
Richard C. Foss
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Mosaid Technologies Inc
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MEMORY MANAGEMENT SERVICES Ltd
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Publication of CA2447204A1 publication Critical patent/CA2447204A1/en
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Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03MCODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M13/00Coding, decoding or code conversion, for error detection or error correction; Coding theory basic assumptions; Coding bounds; Error probability evaluation methods; Channel models; Simulation or testing of codes
    • H03M13/29Coding, decoding or code conversion, for error detection or error correction; Coding theory basic assumptions; Coding bounds; Error probability evaluation methods; Channel models; Simulation or testing of codes combining two or more codes or code structures, e.g. product codes, generalised product codes, concatenated codes, inner and outer codes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/07Responding to the occurrence of a fault, e.g. fault tolerance
    • G06F11/08Error detection or correction by redundancy in data representation, e.g. by using checking codes
    • G06F11/10Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's
    • G06F11/1008Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's in individual solid state devices
    • G06F11/1044Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's in individual solid state devices with specific ECC/EDC distribution
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03MCODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M13/00Coding, decoding or code conversion, for error detection or error correction; Coding theory basic assumptions; Coding bounds; Error probability evaluation methods; Channel models; Simulation or testing of codes
    • H03M13/03Error detection or forward error correction by redundancy in data representation, i.e. code words containing more digits than the source words
    • H03M13/05Error detection or forward error correction by redundancy in data representation, i.e. code words containing more digits than the source words using block codes, i.e. a predetermined number of check bits joined to a predetermined number of information bits
    • H03M13/09Error detection only, e.g. using cyclic redundancy check [CRC] codes or single parity bit
    • H03M13/095Error detection codes other than CRC and single parity bit codes

Abstract

An embedded DRAM ECC architecture for purging data errors is disclosed. The embedded DRAM ECC architecture is based upon a two-dimensional linear parity scheme, and includes a plurality of memory blocks and a parity block. Each memory block includes additional columns for storing row parity bits, and the parity block stores column parity bits. A row parity circuit coupled in parallel to an existing local databus of each memory checks the parity of the local databus bits against a row parity bit during a refresh or read operation in order to identify parity failure for the word.
Identification of the incorrect bit of the word is achieved by iteratively transferring the data of the local databus of each memory block onto an existing global databus, and checking the parity across the global databus with a column parity circuit. When global databus parity failure is detected, all bits of the global databus are inverted to purge the incorrect bit from the memory block via the local databus. A method for initializing the memory upon power up in order to prepare the memory for writing data, and methods and circuits for generating the corresponding row and column parity bits during a write operation are also disclosed.

Claims (54)

1. An error detection system for a memory comprising:
a memory block for storing a data word and a corresponding row parity bit; and a row parity circuit for receiving the data word and the corresponding row parity bit from the memory block in response to a memory block access operation, the row parity circuit comparing parity of the data word against the corresponding row parity bit for generating an active local parity fail flag in response to parity failure.
2. The error detection system of claim 1, further including a local data I/O
circuit for coupling the data word between the memory block and global datalines, and for coupling the corresponding row parity bit between the memory block and the row parity circuit.
3. The error detection system of claim 2, wherein the row parity circuit includes a serial parity chain for receiving the data word from the local data I/O
circuit and for providing a parity output corresponding to parity of the local data, and a sense circuit for receiving the parity output and the corresponding row parity bit, for providing the active local parity fail flag if the logic state of the parity output and the logic state of the local row parity bit mismatch.
4. The error detection system of claim 3, wherein the serial parity chain includes an even parity line driven to a first logic level at one end thereof, and an odd parity line driven to a second logic level at one end thereof, the parity output being provided from the other end of the even parity line, and each parity circuit includes cross-over transistors for coupling the parity output to one of the first and second logic levels.
5. The error detection system of claim 4, wherein the sense circuit includes a cross-coupled latch for receiving and latching the parity output, and a comparator circuit for comparing the latched parity output to the local row parity bit.
6. The error detection system of claim 5, wherein the sense circuit includes switching means for coupling the latched parity output to the memory block during a write operation.
7. The error detection system of claim 3, wherein the serial parity chain is segmented into at least two serially connected sub-parity circuits.
8. The error detection system of claim 1, wherein the memory block includes one of redundant rows and columns, and corresponding redundancy circuits.
9. The error detection system of claim 2, further including a parity block for storing a column parity word, each bit of the column parity word representing column parity for a corresponding bit position of the data word, a column parity circuit coupled to the local data I/O circuit and the parity block for receiving the data word and the column parity word and for comparing column parity of each bit position of the data word to a corresponding bit of the column parity word in response to the active local parity fail flag, the column parity circuit inverting data of each bit position of the data word that fails column parity.
10. The error detection system of claim 9, wherein the memory block ,the row parity circuit, the parity block and the column parity circuit are integrated in an embedded DRAM.
11. The error detection system of claim 9, wherein the parity block has a configuration identical to that of the memory block, and a parity block data I/O circuit for coupling the word of column parity bits between the parity block and the column parity circuit.
12. The error detection system of claim 10, wherein the column parity circuit includes a multiplexor circuit coupled between the local data I/O circuit and the global datelines for receiving the bits of the data word and for iteratively providing each bit of the data word to the global datelines, a parity block multiplexor circuit coupled to the parity block data I/O
circuit for receiving the bits of the column parity word and for providing one bit of the column parity word in each iteration, a parity evaluator circuit coupled to the global datelines for receiving the one bit of the column parity word, the parity evaluator circuit comparing parity of the global datelines to the one column parity bit in each iteration and generating an active global parity fail flag in response to column parity failure, and a global dateline inverting circuit for receiving and then inverting data of the global datelines in response to the active global parity fail flag.
13. The error detection system of claim 12, wherein the multiplexor circuit and the parity block multiplexor circuit each include a counter for controlling operation thereof.
14. The error detection system of claim 12, wherein the parity evaluator circuit includes a serial parity chain coupled to the global datelines for providing a parity output corresponding to parity of the global datelines, and a sense circuit for receiving the parity output and the one bit of the column parity word, for providing the active local parity fail flag if the logic state of the parity output and the logic state of the one bit of the column parity word mismatch.
15. The error detection system of claim 12, wherein the global dateline inverting circuit includes a flip-flop having an input coupled to one global dateline, an output coupled to a complementary global dateline of the one global dateline, a complementary output coupled to the global dateline, and a clock input for receiving the active global parity fail flag.
16. The error detection system of claim 2, further including a column parity check circuit for selectively inverting bits of the column parity word on the global datalines in a write operation for writing a new word to an address of the data word stored in the memory block, the column parity check circuit including, a parity comparison circuit for storing the data word and the new word and for comparing each bit position of the stored data word to each corresponding bit position of the stored new word, the parity comparison circuit providing a mismatch flag signal for each bit position having mismatching logic states, and a parity inverting circuit coupled to the global datalines and for receiving the mismatch flag signals, the parity inverting circuit inverting the logic state of the global datalines in response to the corresponding received mismatch flag signals.
17. The error detection system of claim 1, wherein the memory is a DRAM and the memory block access operation includes a refresh operation.
18. The error detection system of claim 1, wherein the memory is one or an SRAM
and an FeRAM, and the memory block access operation includes a data purge operation.
19. A method of detecting and purging bit errors in a memory, comprising:
a) executing a read operation to read a data word and corresponding row parity bit from a memory block of the memory;
b) comparing row parity of the data word against the corresponding row parity bit and generating a row parity fail flag in response to row parity failure;
c) comparing column parity of each bit of the data word against a corresponding bit of a column parity word stored in a parity block of the memory, in response to the row parity fail flag; and, d) inverting bits of the data word that fail column parity.
20. The method of claim 19, wherein the step of executing includes suppressing the data word from global I/O circuits.
21. The method of claim 19, wherein the step of executing includes providing the data word and the corresponding row parity bit to a local databus.
22. The method of claim 21, wherein the step of comparing row parity includes executing a row parity check of the local databus against the corresponding row parity bit.
23. The method of claim 21, wherein the step of comparing column parity includes iteratively multiplexing bits of the data word from the local databus to a corresponding global dataline in response to row failure.
24. The method of claim 23, wherein the step of comparing column parity includes executing a column parity check of the global datalines against a corresponding column parity bit in each iteration.
25. The method of claim 24, wherein the step of comparing column parity includes inverting the data bits of the global datalines if column parity failure is detected in each iteration.
26. The method of claim 19, wherein the background read operation includes a refresh operation.
27. The method of claim 19, wherein the background read operation includes a data purge operation.
28. The method of claim 25, wherein the step of inverting includes inverting the data bit of a local databus line coupled to one of the global data lines for purging the bit error of the data word stored in the memory block.
29. The method of claim 23, wherein the step of iteratively multiplexing includes selectively activating column access transistors for coupling a different local databus line to the corresponding global dateline in each iteration.
30. The method of claim 29, wherein the step of selectively activating includes incrementing a counter to address and activate a different column access transistor in each iteration.
31. The method of claim 30, further including maintaining activation of the column access transistor corresponding to the memory block having row parity failure.
32. An error detection and purging system for a memory comprising:
a plurality of memory blocks for storing data words and corresponding row parity bits, one of the memory blocks being a parity block for providing a column parity word;
a local data I/O circuit coupled to each memory block for transferring the data words to global datelines;
a row parity circuit coupled to the local data I/O circuit of each memory block for receiving the data words and the corresponding row parity bits in a memory block access operation, and for comparing parity of the data words against the corresponding row parity bits for generating a corresponding active local parity fail flag in response to row parity failure; and, a column parity circuit coupled to all the local data I/O circuits, the global datelines, and the parity block for receiving the data words and the column parity word, the column parity circuit iteratively transferring a bit from each of the data words to a different global dateline for comparing parity of the global datelines to a corresponding bit of the column parity word, the column parity circuit inverting data of the global datelines in response to column parity failure in each iteration.
33. The error detection and purging system of claim 32, wherein each row parity circuit includes a serial parity chain for receiving the data word from the local data I/O
circuit and for providing a parity output corresponding to parity of the data word, and a sense circuit for receiving the parity output and the corresponding row parity bit, for providing the active local parity fail flag if the parity output and the corresponding row parity bit mismatch.
34. The error detection and purging system of claim 33, wherein the serial parity chain includes an even parity line driven to a first logic level at one end thereof, and an odd parity line driven to a second logic level at one end thereof, the parity output being provided from the other end of the even parity line, and each parity circuit includes cross-over transistors for coupling the parity output to one of the first and second logic levels.
35. The error detection and purging system of claim 34, wherein the sense circuit includes a cross-coupled latch for receiving and latching the parity output, and a comparator circuit for comparing the latched parity output to the local row parity bit.
36. The error detection and purging system of claim 35, wherein the comparator circuit includes an exclusive OR gate.
37. The error detection and purging system of claim 32, wherein each memory block includes one of redundant rows and columns, and corresponding redundancy circuits.
38. The error detection and purging system of claim 32, wherein the parity block has a configuration identical to that of each memory block, and a parity block data I/O circuit for coupling bits of the column parity word to the column parity circuit.
39. The error detection and purging system of claim 38, wherein the column parity circuit includes a multiplexor circuit coupled between each local data I/O circuit and the global datalines for receiving the bits of the data word and for iteratively providing each bit of the data word to the global datalines, a parity block multiplexor circuit coupled to the parity block data I/O
circuit for receiving the bits of the column parity word and for providing one bit of the column parity word in each iteration, a parity evaluator circuit coupled to the global datalines and for receiving the one bit of the column parity word, the parity evaluator circuit comparing parity of the global datalines to the one column parity bit in each iteration and generating an active global parity fail flag in response to column parity failure, and a global dataline inverting circuit for receiving and inverting data of the global datalines in response to the active global parity fail flag.
40. The error detection system of claim 39, wherein the multiplexor circuit and the parity block multiplexor circuit each include a counter for controlling operation thereof.
41. The error detection and purging system of claim 39, wherein the global dataline inverting circuit includes a flip-flop having an input coupled to one global dataline, an output coupled to a complementary global dataline of the one global dataline, a complementary output coupled to the one global dataline, and a clock input for receiving the active global parity fail flag.
42. The error detection and purging system of claim 32, further including a column parity check circuit for selectively changing bits of the column parity word on the global datalines in a write operation, for writing a new word to an address of the data word stored in the memory block, the column parity check circuit including, a parity comparison circuit for storing the data word and the new word and comparing each bit position of the stared data word to each corresponding bit position of the stored new word, the parity comparison circuit providing a mismatch flag signal for each bit position having mismatching logic states, and a parity inverting circuit coupled to the global datalines and for receiving the mismatch flag signals, the parity inverting circuit inverting the logic state of the global datelines in response to the corresponding received mismatch flag signals.
43. A method for writing row and column parity bits to a memory system in a write operation, the memory system having a memory block for storing a data word and a corresponding row parity bit, and a parity block for storing column parity bits, the method comprising:
a. latching a stored data word read out from an address to which a new data word is to be written;
b. writing the new data word to the address and generating a corresponding row parity bit;
c. comparing data between each bit position of the stored data word and the new word; and, d. inverting the column parity bits corresponding to mis-matching bit positions.
44. The method of claim 43, wherein the step of latching includes reading the stored data word onto a global databus.
45. The method of claim 43, wherein the step of writing includes latching the new data word.
46. The method of claim 43, wherein the step of inverting includes reading the column parity bits onto a global databus.
47. The method of claim 46, wherein the step of inverting includes inverting the column parity bits of the global databus that correspond to bits of the stored data word that mis-match hits of the new data word.
48. The method of claim 43, further including a memory initialization step prior to the step of latching.
49. The method of claim 48, wherein the memory initialization step includes i. writing preset logic values to memory cells of an activated wordline, ii. reading out the preset logic values for latching by bitline sense amplifiers, and iii. activating all wordlines of the memory block to write the latched preset logic values thereto.
50. The method of claim 49, wherein the step of reading includes disabling bitline;
precharge and equalize circuits after the preset logic values are latched by the bitline sense amplifiers.
51. The method of claim 49, wherein the step of activating includes iteratively activating individual wordlines.
52. The method of claim 51, wherein the step of iteratively activating individual wordlines includes addressing each wordline with a refresh counter.
53. The method of claim 49, wherein the step of activating includes iteratively activating multiple wordlines simultaneously.
54. The method of claim 49, wherein the step of activating includes simultaneously activating all wordlines.
The method of claim 50, wherein the activated wordline includes a master wordline and the step of writing includes activating all column access devices to write the preset logic value to all the memory cells coupled to the master wordline.
CA2447204A 2002-11-29 2003-10-28 Error correction scheme for memory Expired - Fee Related CA2447204C (en)

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US60/429,556 2002-11-29

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Families Citing this family (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7461176B2 (en) * 2003-05-02 2008-12-02 Hitachi, Ltd. Method for initialization of storage systems
JP4093197B2 (en) * 2004-03-23 2008-06-04 セイコーエプソン株式会社 Display driver and electronic device
US7099221B2 (en) * 2004-05-06 2006-08-29 Micron Technology, Inc. Memory controller method and system compensating for memory cell data losses
US7490283B2 (en) 2004-05-13 2009-02-10 Sandisk Corporation Pipelined data relocation and improved chip architectures
US20060010339A1 (en) * 2004-06-24 2006-01-12 Klein Dean A Memory system and method having selective ECC during low power refresh
US7340668B2 (en) * 2004-06-25 2008-03-04 Micron Technology, Inc. Low power cost-effective ECC memory system and method
US7116602B2 (en) 2004-07-15 2006-10-03 Micron Technology, Inc. Method and system for controlling refresh to avoid memory cell data losses
US6965537B1 (en) * 2004-08-31 2005-11-15 Micron Technology, Inc. Memory system and method using ECC to achieve low power refresh
US7849381B2 (en) * 2004-12-21 2010-12-07 Sandisk Corporation Method for copying data in reprogrammable non-volatile memory
US7409473B2 (en) * 2004-12-21 2008-08-05 Sandisk Corporation Off-chip data relocation
DE102005016050A1 (en) * 2005-04-07 2006-10-12 Infineon Technologies Ag Semiconductor memory error detection device for use in motor vehicle electronics, has detecting unit that is designed for detecting error measure of memory when test parity value does not correspond to reference parity
DE102005016051B4 (en) * 2005-04-07 2019-06-13 Infineon Technologies Ag Memory checking device and method for checking a memory
US20060256615A1 (en) * 2005-05-10 2006-11-16 Larson Thane M Horizontal and vertical error correction coding (ECC) system and method
US20060282755A1 (en) * 2005-05-31 2006-12-14 Jong-Hoon Oh Random access memory having ECC
US7382673B2 (en) * 2005-06-15 2008-06-03 Infineon Technologies Ag Memory having parity generation circuit
US7440309B2 (en) * 2005-06-15 2008-10-21 Infineon Technologies Ag Memory having parity error correction
US7471569B2 (en) * 2005-06-15 2008-12-30 Infineon Technologies Ag Memory having parity error correction
US8327104B2 (en) 2006-07-31 2012-12-04 Google Inc. Adjusting the timing of signals associated with a memory system
US8359187B2 (en) 2005-06-24 2013-01-22 Google Inc. Simulating a different number of memory circuit devices
US8244971B2 (en) 2006-07-31 2012-08-14 Google Inc. Memory circuit system and method
US8060774B2 (en) 2005-06-24 2011-11-15 Google Inc. Memory systems and memory modules
US8055833B2 (en) 2006-10-05 2011-11-08 Google Inc. System and method for increasing capacity, performance, and flexibility of flash storage
US8041881B2 (en) 2006-07-31 2011-10-18 Google Inc. Memory device with emulated characteristics
US9542352B2 (en) 2006-02-09 2017-01-10 Google Inc. System and method for reducing command scheduling constraints of memory circuits
US8089795B2 (en) 2006-02-09 2012-01-03 Google Inc. Memory module with memory stack and interface with enhanced capabilities
US8130560B1 (en) 2006-11-13 2012-03-06 Google Inc. Multi-rank partial width memory modules
US7386656B2 (en) 2006-07-31 2008-06-10 Metaram, Inc. Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit
US7472220B2 (en) * 2006-07-31 2008-12-30 Metaram, Inc. Interface circuit system and method for performing power management operations utilizing power management signals
US20080028136A1 (en) 2006-07-31 2008-01-31 Schakel Keith R Method and apparatus for refresh management of memory modules
US8111566B1 (en) 2007-11-16 2012-02-07 Google, Inc. Optimal channel design for memory devices for providing a high-speed memory interface
US8335894B1 (en) 2008-07-25 2012-12-18 Google Inc. Configurable memory system with interface circuit
US10013371B2 (en) 2005-06-24 2018-07-03 Google Llc Configurable memory circuit system and method
US7392338B2 (en) 2006-07-31 2008-06-24 Metaram, Inc. Interface circuit system and method for autonomously performing power management operations in conjunction with a plurality of memory circuits
US20080082763A1 (en) 2006-10-02 2008-04-03 Metaram, Inc. Apparatus and method for power management of memory circuits by a system or component thereof
US8397013B1 (en) 2006-10-05 2013-03-12 Google Inc. Hybrid memory module
US8081474B1 (en) 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
US8796830B1 (en) 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
US8090897B2 (en) 2006-07-31 2012-01-03 Google Inc. System and method for simulating an aspect of a memory circuit
US9507739B2 (en) 2005-06-24 2016-11-29 Google Inc. Configurable memory circuit system and method
US8077535B2 (en) 2006-07-31 2011-12-13 Google Inc. Memory refresh apparatus and method
US9171585B2 (en) 2005-06-24 2015-10-27 Google Inc. Configurable memory circuit system and method
US8438328B2 (en) 2008-02-21 2013-05-07 Google Inc. Emulation of abstracted DIMMs using abstracted DRAMs
US8386722B1 (en) 2008-06-23 2013-02-26 Google Inc. Stacked DIMM memory interface
US7550858B1 (en) * 2005-07-19 2009-06-23 Xilinx, Inc. Random sequence generation using alpha particle emission
WO2007028109A2 (en) 2005-09-02 2007-03-08 Metaram, Inc. Methods and apparatus of stacking drams
US7656717B2 (en) * 2005-09-29 2010-02-02 Hynix Semiconductor, Inc. Memory device having latch for charging or discharging data input/output line
DE602005011628D1 (en) * 2005-10-10 2009-01-22 Hynix Semiconductor Inc Method for programming and verifying cells of a non-volatile memory and a corresponding NAND flash memory
US7702988B2 (en) * 2005-10-24 2010-04-20 Platform Computing Corporation Systems and methods for message encoding and decoding
US9632929B2 (en) 2006-02-09 2017-04-25 Google Inc. Translating an address associated with a command communicated between a system and memory circuits
US7751486B2 (en) 2006-05-19 2010-07-06 Platform Computing Corporation Systems and methods for transmitting data
US7724589B2 (en) 2006-07-31 2010-05-25 Google Inc. System and method for delaying a signal communicated from a system to at least one of a plurality of memory circuits
US7894289B2 (en) 2006-10-11 2011-02-22 Micron Technology, Inc. Memory system and method using partial ECC to achieve low power refresh and fast access to data
US7900120B2 (en) 2006-10-18 2011-03-01 Micron Technology, Inc. Memory system and method using ECC with flag bit to identify modified data
US7483325B2 (en) * 2007-03-20 2009-01-27 International Business Machines Corporation Retention-time control and error management in a cache system comprising dynamic storage
US8122317B1 (en) 2007-06-27 2012-02-21 Arizona Board Of Regents For And On Behalf Of Arizona State University Two-dimensional parity technique to facilitate error detection and correction in memory arrays
US8209479B2 (en) 2007-07-18 2012-06-26 Google Inc. Memory circuit system and method
US8080874B1 (en) 2007-09-14 2011-12-20 Google Inc. Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween
DE202010017690U1 (en) 2009-06-09 2012-05-29 Google, Inc. Programming dimming terminating resistor values
JP5692780B2 (en) * 2010-10-05 2015-04-01 日本電気株式会社 Multi-core type error correction processing system and error correction processing device
KR101212759B1 (en) * 2010-10-29 2012-12-14 에스케이하이닉스 주식회사 Data transfer method with data error check, semiconductor memory and memory system with data error check
US8797813B2 (en) 2011-05-17 2014-08-05 Maxlinear, Inc. Method and apparatus for memory power and/or area reduction
US9165677B2 (en) 2011-05-17 2015-10-20 Maxlinear, Inc. Method and apparatus for memory fault tolerance
US9054840B2 (en) 2011-12-15 2015-06-09 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Error detection and correction of a data transmission
KR101684045B1 (en) 2012-05-31 2016-12-07 휴렛 팩커드 엔터프라이즈 디벨롭먼트 엘피 Local error detection and global error correction
TWI594254B (en) * 2012-07-17 2017-08-01 慧榮科技股份有限公司 Method for reading data from block of flash memory and associated memory device
KR20140082173A (en) * 2012-12-24 2014-07-02 에스케이하이닉스 주식회사 Address Counting Circuit and Semiconductor Apparatus Using the same
US9153310B2 (en) 2013-01-16 2015-10-06 Maxlinear, Inc. Dynamic random access memory for communications systems
US9262263B2 (en) 2013-11-25 2016-02-16 Qualcomm Incorporated Bit recovery system
US9378081B2 (en) 2014-01-02 2016-06-28 Qualcomm Incorporated Bit remapping system
US9454422B2 (en) 2014-01-30 2016-09-27 International Business Machines Corporation Error feedback and logging with memory on-chip error checking and correcting (ECC)
US9760438B2 (en) 2014-06-17 2017-09-12 Arm Limited Error detection in stored data values
US9558069B2 (en) 2014-08-07 2017-01-31 Pure Storage, Inc. Failure mapping in a storage array
US9766972B2 (en) 2014-08-07 2017-09-19 Pure Storage, Inc. Masking defective bits in a storage array
JP5851570B1 (en) * 2014-08-29 2016-02-03 株式会社日立製作所 Semiconductor device
US9496021B2 (en) 2014-09-25 2016-11-15 Kilopass Technology, Inc. Power reduction in thyristor random access memory
US9564199B2 (en) 2014-09-25 2017-02-07 Kilopass Technology, Inc. Methods of reading and writing data in a thyristor random access memory
US9530482B2 (en) 2014-09-25 2016-12-27 Kilopass Technology, Inc. Methods of retaining and refreshing data in a thyristor random access memory
US9449669B2 (en) 2014-09-25 2016-09-20 Kilopass Technology, Inc. Cross-coupled thyristor SRAM circuits and methods of operation
US9460771B2 (en) 2014-09-25 2016-10-04 Kilopass Technology, Inc. Two-transistor thyristor SRAM circuit and methods of operation
WO2016049608A1 (en) * 2014-09-25 2016-03-31 Kilopass Technology, Inc. Power reduction in thyristor random access memory
US9741413B2 (en) 2014-09-25 2017-08-22 Kilopass Technology, Inc. Methods of reading six-transistor cross-coupled thyristor-based SRAM memory cells
US9564441B2 (en) 2014-09-25 2017-02-07 Kilopass Technology, Inc. Two-transistor SRAM semiconductor structure and methods of fabrication
US20160093624A1 (en) 2014-09-25 2016-03-31 Kilopass Technology, Inc. Thyristor Volatile Random Access Memory and Methods of Manufacture
DE102014015585A1 (en) * 2014-10-21 2016-04-21 Infineon Technologies Ag Device, system and method for protecting data
KR102238706B1 (en) * 2014-11-28 2021-04-09 삼성전자주식회사 Semiconductor memory device and memory system including the same
US9632867B2 (en) * 2014-12-08 2017-04-25 Cypress Semiconductor Corporation Methods, circuits, devices, systems and machine executable code for reading from a non-volatile memory array
US9891976B2 (en) * 2015-02-26 2018-02-13 Arm Limited Error detection circuitry for use with memory
KR20170035103A (en) 2015-09-22 2017-03-30 삼성전자주식회사 Semiconductor memory device and memory system including the same
US9880900B2 (en) 2015-12-08 2018-01-30 Nvidia Corporation Method for scrubbing and correcting DRAM memory data with internal error-correcting code (ECC) bits contemporaneously during self-refresh state
US10049006B2 (en) 2015-12-08 2018-08-14 Nvidia Corporation Controller-based memory scrub for DRAMs with internal error-correcting code (ECC) bits contemporaneously during auto refresh or by using masked write commands
US9823964B2 (en) 2015-12-08 2017-11-21 Nvidia Corporation Method for memory scrub of DRAM with internal error correcting code (ECC) bits during either memory activate and/or precharge operation
KR102558044B1 (en) 2016-06-14 2023-07-20 에스케이하이닉스 주식회사 Comparison circuit and semiconductor device
US9747158B1 (en) * 2017-01-13 2017-08-29 Pure Storage, Inc. Intelligent refresh of 3D NAND
US10325049B2 (en) 2017-01-18 2019-06-18 International Business Machines Corporation Placement-driven generation of error detecting structures in integrated circuits
US10312944B2 (en) 2017-03-17 2019-06-04 Micron Technology, Inc. Error correction code (ECC) operations in memory for providing redundant error correction
KR20180106494A (en) * 2017-03-20 2018-10-01 에스케이하이닉스 주식회사 Semiconductor device
CN107134294B (en) * 2017-05-27 2020-04-24 北京东土军悦科技有限公司 ECC information acquisition method and system
US10700713B2 (en) * 2017-08-01 2020-06-30 Microsemi Storage Solutions, Inc. System and method for error correction in data communications
KR20190087180A (en) * 2018-01-16 2019-07-24 에스케이하이닉스 주식회사 Memory device detecting and correcting data error, and operation method thereof
KR102540772B1 (en) * 2018-04-30 2023-06-08 에스케이하이닉스 주식회사 Error correction circuit and method thereof
US11342044B2 (en) 2019-05-28 2022-05-24 Nuvoton Technology Corporation System and method for prioritization of bit error correction attempts
US11475170B2 (en) 2019-05-28 2022-10-18 Nuvoton Technology Corporation System and method for correction of memory errors
US11263078B2 (en) 2019-12-31 2022-03-01 Micron Technology, Inc. Apparatuses, systems, and methods for error correction
US11657889B2 (en) * 2020-03-23 2023-05-23 Intel Corporation Error correction for dynamic data in a memory that is row addressable and column addressable
CN114203228B (en) * 2020-09-18 2023-09-15 长鑫存储技术有限公司 Memory device
US11468939B2 (en) * 2020-11-30 2022-10-11 Micron Technology, Inc. Conditional row activation and access during refresh for memory devices and associated methods and systems
US11853157B2 (en) * 2021-11-17 2023-12-26 Nxp B.V. Address fault detection system

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4183463A (en) * 1978-07-31 1980-01-15 Sperry Rand Corporation RAM error correction using two dimensional parity checking
JPS6042560B2 (en) * 1981-03-17 1985-09-24 日本電信電話株式会社 semiconductor storage device
JPS60183653A (en) * 1984-03-01 1985-09-19 Toshiba Corp Memory provided with bit error detecting function
JPS6150293A (en) * 1984-08-17 1986-03-12 Fujitsu Ltd Semiconductor memory
JPS61264599A (en) * 1985-05-16 1986-11-22 Fujitsu Ltd Semiconductor memory device
US4747080A (en) * 1985-11-12 1988-05-24 Nippon Telegraph & Telephone Corporation Semiconductor memory having self correction function
JP2509297B2 (en) * 1987-08-31 1996-06-19 沖電気工業株式会社 Semiconductor memory device with self-correction function and microcomputer
US4942575A (en) * 1988-06-17 1990-07-17 Modular Computer Systems, Inc. Error connection device for parity protected memory systems
US5134616A (en) * 1990-02-13 1992-07-28 International Business Machines Corporation Dynamic ram with on-chip ecc and optimized bit and word redundancy
US5127014A (en) * 1990-02-13 1992-06-30 Hewlett-Packard Company Dram on-chip error correction/detection
US6125466A (en) * 1992-01-10 2000-09-26 Cabletron Systems, Inc. DRAM parity protection scheme
KR100266748B1 (en) * 1997-12-31 2000-10-02 윤종용 Semiconductor memory device and error correction method thereof
US6185718B1 (en) * 1998-02-27 2001-02-06 International Business Machines Corporation Memory card design with parity and ECC for non-parity and non-ECC systems
US6353910B1 (en) * 1999-04-09 2002-03-05 International Business Machines Corporation Method and apparatus for implementing error correction coding (ECC) in a dynamic random access memory utilizing vertical ECC storage
JP4877894B2 (en) * 2001-07-04 2012-02-15 ルネサスエレクトロニクス株式会社 Semiconductor device

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