CA2491941A1 - Nanostructures and methods for manufacturing the same - Google Patents

Nanostructures and methods for manufacturing the same Download PDF

Info

Publication number
CA2491941A1
CA2491941A1 CA002491941A CA2491941A CA2491941A1 CA 2491941 A1 CA2491941 A1 CA 2491941A1 CA 002491941 A CA002491941 A CA 002491941A CA 2491941 A CA2491941 A CA 2491941A CA 2491941 A1 CA2491941 A1 CA 2491941A1
Authority
CA
Canada
Prior art keywords
nanowhisker
column
segment
substrate
crystalline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002491941A
Other languages
French (fr)
Other versions
CA2491941C (en
Inventor
Lars Ivar Samuelson
Jonas Bjoern Ohlsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
QuNano AB
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CA2741397A priority Critical patent/CA2741397A1/en
Publication of CA2491941A1 publication Critical patent/CA2491941A1/en
Application granted granted Critical
Publication of CA2491941C publication Critical patent/CA2491941C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035209Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions comprising a quantum structures
    • H01L31/035227Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions comprising a quantum structures the quantum structure being quantum wires, or nanorods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82BNANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82BNANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B11/00Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B11/00Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
    • C30B11/04Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt
    • C30B11/08Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt every component of the crystal composition being added during the crystallisation
    • C30B11/12Vaporous components, e.g. vapour-liquid-solid-growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/14Feed and outlet means for the gases; Modifying the flow of the reactive gases
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/18Epitaxial-layer growth characterised by the substrate
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/18Epitaxial-layer growth characterised by the substrate
    • C30B25/183Epitaxial-layer growth characterised by the substrate being provided with a buffer layer, e.g. a lattice matching layer
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/60Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
    • C30B29/605Products containing multiple oriented crystallites, e.g. columnar crystallites
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • H01L29/0669Nanowires or nanotubes
    • H01L29/0673Nanowires or nanotubes oriented parallel to a substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • H01L29/0669Nanowires or nanotubes
    • H01L29/068Nanowires or nanotubes comprising a junction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234Bipolar junction transistors [BJT]
    • H01L29/6631Bipolar junction transistors [BJT] with an active layer made of a group 13/15 material
    • H01L29/66318Heterojunction transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73Bipolar junction transistors
    • H01L29/737Hetero-junction transistors
    • H01L29/7371Vertical transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes
    • H01L29/88Tunnel-effect diodes
    • H01L29/882Resonant tunneling diodes, i.e. RTD, RTBD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/048Encapsulation of modules
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/70Nanostructure
    • Y10S977/762Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/70Nanostructure
    • Y10S977/762Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
    • Y10S977/763Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less formed along or from crystallographic terraces or ridges

Abstract

A resonant tunneling diode, and other one dimensional electronic, photonic structures, and electromechanical MEMS
devices, are formed as a heterostructure in a nanowhisker by forming length segments of the whisker with different materials having different band gaps. Thus a resonant tunneling diode comprises a nanowhisker having a seed particle melt at one end, and a column of a constant diameter with a nanometer dimension, such as to exhibit quantum confinement effects, the column comprising first and second semiconductor portions comprising respectively an emitter and a collector, and, disposed between the first and second semiconductor portions, third and fourth portions of material having a different band gap from that of the first and second semiconductor portions, and a fifth central portion of a semiconductor material having a different band gap from that of the third and fourth portions, disposed between the third and fourth portions and forming a quantum well. The RTD is made by a method including depositing a seed particle on a substrate, and exposing the seed particle to materials under controlled conditions of temperature and pressure such as to form a melt with the seed particle, so that the seed particle rises on top of a column whereby to form a nanowhisker, the column of the nanowhisker having a constant diameter of a nanometer dimension; during the growth of the column, selectively changing the compositions of said gases whereby to abruptly change the composition of the material of the column at regions along its length, whilst retaining epitaxial growth, wherein lattice mismatch between the materials of the portions is accommodated by radial outward bulging of the whisker at the boundaries.

Claims (137)

1. A nanowhisker comprising: a column with a diameter of nanometer dimension, the column including along its length at least first and second lengthwise segments of different crystalline materials with a composition boundary between the first and second segments, wherein said diameter of said column is such that lattice strain caused by lattice mismatch at the composition boundary is substantially accommodated by lateral outward atomic displacement and wherein the composition boundary between the crystalline materials of the first and second portions extends over an axial interval of not more than 8 diametral lattice planes.
2. A nanowhisker according to claim 1, wherein the diameter of the column is substantially constant along the length of the column.
3. A nanowhisker according to claim 1, wherein the nanowhisker is tapered such that the diameter changes in a controlled manner along the length of the column.
4. A nanowhisker according to claim 1, wherein the diameter of the column is such that the nanowhisker exhibits quantum confinement effects.
5. A nanowhisker according to claim 1, wherein the nanowhisker further comprises a catalytic particle at one end.
6. A nanowhisker according to claim 1, wherein the composition boundary between the crystalline materials of the first and second portions extends over an axial interval of not more than 7 diametral lattice planes.
7. A nanowhisker according to claim 1, wherein the materials of the first and second segments are semiconductor III-V materials.
8. An array comprising a plurality of the nanowhiskers of claim 1, each extending parallel to one another.
9. A nanowhisker comprising: a column with a diameter of nanometer dimension, the column including along its length at least first and second lengthwise segments of different crystalline materials, the first segment having a stoichiometric composition of the form A1-x B x C, and the second segment having a stoichiometric composition of the form A1-y B y C, where A, B and C are selected elements , and x and y are, different numbers in a range between 0 and 1, wherein a composition boundary disposed between the first and second segments exhibits a change from the variable x to the variable y over a predetermined number of diametral lattice planes.
10. A nanowhisker according to claim 9, wherein the diameter of the column is constant along the column.
11. A nanowhisker according to claim 9, wherein the nanowhisker is tapered such that the diameter changes in a controlled manner along the length of the column.
12. A nanowhisker according to claim 9, wherein the diameter of the column is such that the nanowhisker exhibits quantum confinement effects.
13. A nanowhisker according to claim 9, wherein the nanowhisker further comprises a catalytic particle at one end.
14. A nanowhisker according to claim 9, wherein lattice mismatch at the composition boundary is substantially accommodated by lateral outward atomic displacement.
15. A nanowhisker according to claim 9, wherein the materials of the first and second segments are semiconductor III-V materials.
16. An array comprising a plurality of the nanowhiskers of claim 9, each extending parallel to one another.
17. A nanowhisker comprising: a column with a diameter of nanometer dimension, the column including along its length at least first and second lengthwise segments of different crystalline materials with a diametral material boundary between the first and second segments, said material boundary defined by a transition between said different crystalline materials occurring within an axial interval of not more than eight diametral lattice planes.
18. A nanowhisker according to claim 17, wherein the diameter of the column is constant along the column.
19. A nanowhisker according to claim 17, wherein the nanowhisker is tapered to provide a diameter which changes in a controlled manner along the column.
20. A nanowhisker according to claim 17, wherein the diameter of the nanowhisker is such that the nanowhisker exhibits quantum confinement effects.
21. A nanowhisker according to claim 17, wherein the nanowhisker further comprises a catalytic particle at one end.
22. A nanowhisker according to claim 17, wherein the composition boundary between the crystalline materials of the first and second portions extends over an axial interval of 1 to 3 lattice planes.
23. A nanowhisker according to claim 17, wherein the materials of the first and second segments are semiconductor III-V materials.
24. An array comprising a plurality of the nanowhiskers of claim 1, each extending parallel to the others.
25. A heterostructure nanowhisker comprising: a column with a diameter of nanometer dimension, the column having disposed along its length a plurality of lengthwise segments of different material composition with predetermined composition boundaries between adjacent segments, said composition boundaries extending over a predetermined length of the nanowhisker column, and producing predetermined band gap changes at the boundaries.
26. A resonant tunneling diode, comprising a nanowhisker having a column with a diameter of nanometer dimension, such as to exhibit quantum confinement effects, the column comprising along its length, in order, an emitter segment, a first barrier segment a quantum well segment, a second barrier segment, and a collector segment, each of said barrier segments having a band gap greater than those of adjacent segments, and having a length such that charge carriers can tunnel between said emitter segment and said quantum well segment and between said quantum well segment and said collector segment.
27. A resonant tunneling diode according to claim 26, wherein the barrier segments are comprised of insulative wide band gap materials.
28. A resonant tunneling diode according to claim 26, wherein the emitter segment, the barrier segments, the quantum well segment and the collector segment are comprised of semiconductor materials.
29. A resonant tunneling diode according to claim 28, wherein the emitter segment, the quantum well segment, and the collector segment are formed from indium arsenide, and the barrier segments are formed from indium phosphide.
30. A resonant tunneling diode according to claim 26, wherein the diameter of the column is substantially constant along the length of the column.
31. A resonant tunneling diode according to claim 26, wherein the nanowhisker is tapered such that the diameter of the column changes in a controlled manner along the length of the column.
32. A heterobipolar transistor, comprising a nanowhisker having a column with a diameter of nanometer dimension, the column comprising along its length in sequence emitter, base, and collector semiconductor segments, each of said semiconductor segments having a band gap, wherein the band gap of the emitter semiconductor segment is greater than the band gaps of the base and collector semiconductor segments, and the base and semiconductor segments are doped of opposite type so as to provide a p-n junction therebetween.
33. A heterobipolar transistor according to claim 32, wherein said p-n junction between the base and collector semiconductor segments comprises a graded stoichiometric composition.
34. A single photon light source, comprising a one-dimensional nanoelement, having disposed along its length a volume of optically active material forming a quantum well, with tunneling barriers formed on either side of the quantum well, such that in use the quantum well is capable of emitting a single photon at a time.
35. A light emitting diode, comprising a nanowhisker having a column with a diameter of nanometer dimension, such as to exhibit quantum confinement effects, the column comprising along its length in sequence first, second and third semiconductor lengthwise segments comprising respectively an emitter, quantum well active segment and collector, said second semiconductor lengthwise segment having a different band gap from those of the first and third semiconductor lengthwise segments, and forming an active area of the light emitting diode.
36. A light emitting diode according to claim 35, comprising a laser, and including reflective mirror planes in said first and second segments.
37. A light emitting diode according to claim 36, wherein said reflective minor plates are formed by superlattices in said nanowhisker, each superlattice being formed by alternating sequences of different band gap materials.
38. A structure for near field selective excitation of biological material, the structure comprising:
a light emitting diode, the light emitting diode comprising a one-dimensional nanoelement, the nanoelement having disposed along its length a volume of optically active material sufficiently small to form a quantum well, with tunneling barriers formed on either side of the quantum well, for emission of electromagnetic radiation;
and a positioning device operative to position biological material adjacent to the diode such that near field radiation emitted by the diode excites the biological material.
39. An apparatus for patterning a photoresist layer in a nanoimprint lithography process, the apparatus comprising a carriage moveable over a photoresist surface and carrying a light emitting diode array, each light emitting diode of said array comprising a one-dimensional nanoelement having disposed along its length a volume of optically active material sufficiently small to form a quantum well, with tunneling barriers formed on either side of the quantum well, and the nanoelements being positioned side by side but being selectively energizable, whereby to produce a desired pattern in said photoresist surface.
40. A photodetector, comprising a nanowhisker having a column with a diameter of nanometer dimension, the column comprising along its length first and second segments having an interface forming a p-n junction.
41. A photodetector, comprising a nanowhisker having a column with a diameter of nanometer dimension, the column comprising a first p-doped semiconductor lengthwise segment, a second n-doped semiconductor lengthwise segment and a third intrinsic semiconductor lengthwise segment between said first and second semiconductor segments, to form a PIN diode.
42. A solar cell comprising:
an electrically conducting substrate;
a plurality of nanowhiskers extending from said substrate, each nanowhisker having a column with a diameter of nanometer dimension, the column comprising a first p-doped semiconductor lengthwise segment and a second n-doped semiconductor lengthwise segment, said first and second semiconductor segments having an interface therebetween forming a p-n junction, the nanowhiskers being encapsulated in a transparent material; and a transparent electrode extending over free ends of the whiskers and making electrical contact therewith.
43. A solar cell according to claim 42, wherein each nanowhisker has a plurality of p-n junctions between lengthwise semiconductor segments, said semiconductors being selected to form p-n junctions that absorb a plurality of different wavelengths of solar radiation.
44. A source of terahertz radiation, comprising a nanowhisker having a column with a diameter of nanometer dimension, the column including a multiplicity of layers of a first band gap semiconductor interleaved with a multiplicity of layers of a second band gap material, whereby to form a superlattice, the dimensions being selected such that electrons can move in said superlattice with a wave vector such as to radiate terahertz radiation.
45. A photonic crystal, comprising a substrate, and an array of one-dimensional nanoelements extending from one side of the substrate, each element extending upright from the substrate, and having a substantially constant diameter of nanometer dimension, wherein the array of nanoelements is arranged in a two-dimensional lattice, whereby to provide a photonic band gap for incident electromagnetic radiation.
46. A photonic crystal according to claim 45, wherein the diameter of each nanoelement is not greater than about 100 nm.
47. A photonic crystal according to claim 45, wherein the nanoelements are spaced apart by a distance of about 300 nm.
48. A photonic crystal according to Claim 45, wherein each nanoelement comprises a nanowhisker having a plurality of lengthwise segments of a first type, comprised of a material having a first refractive index and having a first predetermined length, said segments of said first type alternating with at least one segment of a second type, comprised of a material having a second refractive index and having a second predetermined length, said first and second refractive indices and said first and second predetermined lengths being selected to form a three dimensional photonic crystal.
49. A method of forming a photonic crystal, the method comprising:
forming on a substrate surface an array of seed particle forming areas, the array being disposed in a two-dimensional lattice configuration;
processing said areas to form seed particles; and employing said seed particles to grow nanowhiskers, so that each nanowhisker extends upright from the substrate, and has a substantially constant diameter of a predetermined dimension, whereby to provide a photonic band gap for incident electromagnetic radiation.
50. A method for forming an epitaxial layer of a second crystalline material on a substrate of a first crystalline material different from said second crystalline material, the method comprising:

forming on a surface of the substrate a plurality of seed particle material areas;
forming a layer of mask material around the seed particle material areas;
growing nanowhiskers of said second crystalline material from the seed particle material areas; and continuing to grow said second crystalline material, using the nanowhiskers as growth sites, whereby to create an epitaxial layer of said second crystalline material extending over said substrate.
51. A method according to claim 50, wherein the dielectric material is a carbon-based material.
52. A layered structure comprising:
a crystalline substrate comprised of a first crystalline material;
a layer of mask material covering a surface of said crystalline substrate, said layer of mask material being capable of inhibiting epitaxial growth on said surface of said crystalline substrate, and having an array of apertures of nanometer dimension therein exposing within said apertures epitaxial growth sites on said surface of said crystalline substrate; and an epitaxial layer of a second crystalline material grown from said epitaxial growth sites on said surface of said crystalline substrate.
53. A method for forming an epitaxial layer of a second crystalline material on a substrate of a first crystalline material, said first crystalline material being different from said second crystalline material, the method comprising:
forming on said substrate an array of catalytic seed particle material areas;
forming a layer of mask material around the seed particle areas;
catalytically growing underneath the catalytic seed particle areas initial growth areas of a crystalline phase of said second crystalline material; and continuing to grow said second crystalline material, using said initial growth areas as growth sites, thereby to create an epitaxial layer of said second crystalline material extending over said substrate of said first crystalline material.
54. A method for forming an epitaxial layer of a second crystalline material on a substrate of a first crystalline material said first crystalline material being different from said second crystalline material, the method comprising:
forming V-shaped grooves in an upper surface of said substrate of the first crystalline material;
providing a plurality of catalytic seed particles in said V-shaped grooves;
growing nanowhiskers of said second crystalline material from the catalytic seed particles; and continuing to grow said second crystalline material, using the nanowhiskers as growth nucleation sites, thereby to create an epitaxial layer of said second crystalline material extending over said substrate of said first crystalline material.
55. A method according to claim 54, wherein the upper surface of said substrate of the first crystalline material is a <100> surface, and the V-shaped grooves expose <111> surfaces in said V-shaped grooves.
56. A layered structure comprising:
an epitaxial layer of a second crystalline material grown on a surface of a substrate of a first crystalline material, said second crystalline material being different from said first crystalline material, wherein said surface of the substrate of a first crystalline material is provided with V-shaped grooves, and a plurality of nanowhiskers extending from said V-shaped grooves constitute nucleation sites for said grown epitaxial layer of said second crystalline material.
57. A method of forming nanowhiskers on a subtrate, the method, comprising:
providing a substrate;
forming a plurality of catalytic seed particles on a surface of said substrate;
initially growing nanowhiskers from said catalytic seed particles under first growth conditions that produce nanowhiskers extending from the substrate in a <111>

growth direction; and subsequently changing the <111> growth direction of said nanowhiskers to a <100> direction by growing a short segment of a barrier material in said nanowhiskers, said barrier material being selected to redirect said <111>
growth direction to said <100> growth direction.
58. A method of forming nanowhiskers on a substrate, comprising:
providing a substrate:
forming a plurality of catalytic seed particles on a surface of said substrate;
initially growing nanowhiskers from said catalytic seed particles under first growth conditions that produce nanowhiskers extending from the substrate in a <111>
growth direction; and subsequently changing the <111> growth direction of said nanowhiskers to a <100> direction by changing the first growth conditions to second growth conditions that produce growth of said nanowhiskers in a <100> growth direction.
59. A nanowhisker formed on a substrate, the nanowhisker extending from the substrate initially in a <111> direction, and the greater part of the length of the nanowhisker extending in a <100> direction.
60. A field emission display comprising:
a substrate having an array of individually addressable electrical contact areas on a surface thereof;
at least one one-dimensional nanoelement extending from substantially each of said contact areas and terminating in a free end; and a phosphor display screen disposed adjacent the free end of said at least one one-dimensional nanoelement, thereby to provide a field emission display, wherein the elements of the display are individually addressable.
61. A display system for up-converting an image in the infrared region to an image in the visible light region, the system comprising:
an electrically conductive substrate transparent to infrared radiation for receiving on one surface an infrared image; and an array of one-dimensional electrically conductive nanoelements extending from an opposite side of the substrate, each of said one-dimensional nanoelements terminating in a free end; and a phosphor display screen incorporating an electrode disposed adjacent the free ends of the one dimensional nanoelements, for producing a visible light version of the infrared image.
62. An antenna for infrared or visible or ultraviolet electromagnetic radiation, comprising a one-dimensional electrically conductive nanoelement extending from a metallised contact region on a substrate, the one-dimensional nanoelement having a length which is about one quarter wavelength of said electromagnetic radiation.
63. A method of forming a resonant tunneling diode, the method comprising:
forming a nanowhisker comprising a column with a diameter of nanometer dimension and comprised of crystalline semiconductor materials provided on a substrate by a process comprising:
depositing a catalytic seed particle having a diameter of nanometer dimension on the substrate;
heating said substrate and said catalytic seed particle to a temperature at which said catalytic seed particle is molten;
supplying to the seed particle ingredients for forming a first semiconductor material under controlled conditions of temperature and pressure such that said ingredients dissolve in said molten catalytic seed particle and crystallize therefrom to form a first segment of said nanowhisker extending from said substrate, said first segment of said nanowhisker comprised of said first crystalline semiconductor material;
discontinuing said supplying to the seed particle ingredients for forming said first semiconductor material;
supplying to the seed particle ingredients for forming a second semiconductor material having a band gap greater than that of said first semiconductor material, for a period of time sufficient to form a second segment of said nanowhisker having a length effective to permit tunneling of charge carriers therethrough;
discontinuing said supplying to the seed particle ingredients for forming said second semiconductor material;
supplying to the seed particle ingredients for forming a third semiconductor material having a band gap less than that of said second semiconductor material, for a period of time sufficient to form a third segment of said nanowhisker having a length such that said third segment forms a quantum well;
discontinuing said supplying to the seed particle ingredients for forming said third semiconductor material;
supplying to the seed particle ingredients for forming a fourth semiconductor material having a band gap greater than that of said third semiconductor material, for a period of time sufficient to form a fourth segment of said nanowhisker having a length effective to permit tunneling of charge carriers therethrough; and discontinuing said supplying to the seed particle ingredients for forming said fourth semiconductor material;
supplying to the seed particle ingredients for forming a fifth semiconductor material having a band gap less than that of said fourth semiconductor material, for a period of time sufficient to form a fifth segment of said nanowhisker;
and making electrical contact between said first and fifth segments of said nanowhisker and electrical terminals, whereby to form an emitter and a collector of said resonant tunneling diode.
64. A method of forming a nanowhisker, the method comprising:
depositing a seed particle having a diameter of nanometer dimension on a substrate;
heating said substrate and said catalytic seed particle to at temperature at which said catalytic seed particle is molten;
supplying to the seed particle ingredients for forming a first semiconductor material under controlled conditions of temperature and pressure such that said ingredients dissolve in said molten catalytic seed particle and crystallize therefrom to form a first segment of said nanowhisker extending from said substrate, said first segment of said nanowhisker comprised of said first crystalline semiconductor material;
discontinuing said supplying to the seed particle ingredients for forming said first crystalline semiconductor material and supplying to the seed particle ingredients for forming a second crystalline semiconductor material having a band gap different from that of said first semiconductor material, to form a second segment of said nanowhisker having a composition boundary with said first segment of said nanowhisker whereby to form a column with at least first and second semiconductor segments, wherein the lattice strain caused by lattice mismatch between the materials of the segments is substantially accommodated by lateral outward atomic displacement.
65. A method of forming a nanowhisker, the method comprising:
depositing a seed particle having a diameter of nanometer dimension on a substrate;
heating said substrate and said catalytic seed particle to a temperature at which said catalytic seed particle is molten;
supplying to the seed particle ingredients for forming a first semiconductor material under controlled conditions of temperature and pressure such that said ingredients dissolve in said molten catalytic seed particle and crystallize therefrom to form a first segment of said nanowhisker extending from said substrate, said first segment of said nanowhisker comprised of said first crystalline semiconductor material;
discontinuing said supplying to the seed particle ingredients for forming said first crystalline semiconductor material; and supplying to the seed particle ingredients for forming a second crystalline semiconductor material having a band gap different from that of said first semiconductor material, to form a second segment of said nanowhisker having a composition boundary with said first segment of said nanowhisker whereby to form a column with at least first and second semiconductor segments, and wherein the composition boundary extends over an axial interval of not more than eight lattice planes.
66. A method according to claim 65, wherein said substrate is mounted in an ultra high vacuum chamber and said ingredients are supplied to the seed particle as molecular beams introduced into the ultra high vacuum chamber.
67. A method according to claim 65, wherein rapid switching between different compositions is obtained via a sequence wherein the rate of growth is reduced to an insignificant amount, and then supersaturation conditions for continued growth are re-established.
68. A method according to claim 65, wherein said catalytic seed particles are gold aerosol particles having a size selected to result in said nanowhiskers having a uniform diameter between about 10 and about 50 nm.
69. A method according to claim 65, wherein one of said first semiconductor material and said second semiconductor material is a III-V material comprised of at least one group III element and at least one group V element and the diffusion constant of the group III element is selectively changed during formation of the nanowhisker by changing said controlled condition of temperature.
70. An electrode structure comprising a substrate, with a matrix of electrical contact areas formed on one surface, and, on selected electrical contact areas one, or a plurality of, nanowhiskers are formed so as to be upstanding from the substrate's surface, whereby each said nanowhisker, or each said plurality of nanowhiskers, is individually addressable by electrical signals.
71. An electrode structure according to claim 70, adapted for implantation into a nerve structure.
72. A nanowhisker, wherein the nanowhisker is formed of a material which may be oxidised, and the nanowhisker is oxidised to form a surrounding layer of oxide along its length, but with a catalytic seed particle melt at the free end of the nanowhisker remaining free of oxide.
73. A nanowhisker, wherein the nanowhisker is formed of a material having a first band gap, and the nanowhisker is treated to form a surrounding layer of a material of a second band gap along its length, but with a catalytic seed particle melt at the free end of the nanowhisker remaining free of the material of a second band gap.
74. A cantilever beam array, comprising a base member with a plurality of nanowhiskers extending therefrom side by side and spaced apart to form a row of nanowhiskers, each nanowhisker serving as a beam which bends under application of an external force, and means for detecting bending movement of the beams.
75. An array according to claim 74, wherein a coating is provided on the beams which is sensitive to certain organic molecules or biological molecules, such that a molecule, when making contact with a cantilever beam undergoes a certain chemical reaction to produce a bending stress.
76. A nanowhisker structure comprising a substrate with a layer of insulative material thereon, and a conductive layer formed on the insulative layer, an aperture formed within the conductive layer and the insulative layer, and a nanowhisker formed within the aperture and extending from the substrate so that a conductive seed particle melt at the free end of the nanowhisker is roughly level with the conductive layer, whereby mechanical vibration of the nanowhisker creates an electrical oscillatory signal in said conductive layer.
77. A nanowhisker structure according to claim 76, wherein the nanowhisker has a coating thereon to attract molecules of a certain type, whereby the deposition of a molecule onto the nanowhisker will change the inertial characteristics of the nanowhisker and therefore the frequency of the oscillatory signal in said conductive layer.
78. A nanowhisker structure according to claim 76, wherein the structure provides a standard current generator, wherein one single electron is transferred through the conductive layer via the conductive seed particle melt, per single period of oscillation of the nanowhisker.
79. A tip of a scanning tunneling microscope, comprising a flexible cantilever beam, and formed, at or towards the end of the beam, a nanowhisker upstanding from the cantilever beam.
80. A nanowhisker according to claim 1, wherein the composition boundary between the crystalline materials of the first and second segments extends over an axial interval of not more than 6 diametral lattice planes.
81. A nanowhisker according to claim 1, wherein the composition boundary between the crystalline materials of the first and second segments extends over an axial interval of not more than 5 diametral lattice planes.
82. A nanowhisker according to claim l, wherein the composition boundary between the crystalline materials of the first and second segments extends over an axial interval of not more than 4 diametral lattice planes.
83. A nanowhisker according to claim 1, wherein the composition boundary between the crystalline materials of the first and second segments extends over an axial interval of not more than 3 diametral lattice planes.
84. A nanowhisker according to claim 1, wherein the composition boundary between the crystalline materials of the first and second segments extends over an axial interval of not more than 2 diametral lattice planes.
85. A nanowhisker according to claim 1, wherein the composition boundary between the crystalline materials of the first and second segments extends over an axial interval of not more than 1 diametral lattice plane.
86. A method of forming a resonant tunneling diode, comprising:
forming a nanowhisker comprising a column with a diameter of nanometer dimension and comprised of crystalline semiconductor materials on a substrate by a process comprising:
providing a catalytic seed particle having a diameter of nanometer dimension on the substrate, heating said substrate and said catalytic seed particle to a temperature at which said catalytic seed particle is operative as a catalyst;
supplying to the seed particle ingredients for forming a first semiconductor material under controlled conditions of temperature and pressure such that said ingredients crystallize from said seed particle to form a first segment of said nanowhisker extending from said substrate, said first segment of said nanowhisker comprised of said first crystalline semiconductor material; and discontinuing said supplying to the seed particle ingredients for forming said first semiconductor material;
supplying to the seed particle ingredients for forming a second semiconductor material having a band gap greater than that of said first semiconductor material, for a period of time sufficient to form a second segment of said nanowhisker having a length effective to permit tunneling of charge carriers therethrough;
discontinuing said supplying to the seed particle ingredients for forming said second semiconductor material;
supplying to the seed particle ingredients for forming a third semiconductor material having a band gap less than that of said second semiconductor material, for a period of time sufficient to form a third segment of said nanowhisker having a length such that said third segment forms a quantum well;
discontinuing said supplying to the seed particle ingredients for forming said third semiconductor material;
supplying to the seed particle ingredients for forming a fourth semiconductor material having a band gap greater than that of said third semiconductor material, for a period of time sufficient to form a fourth segment of said nanowhisker having a length effective to permit tunneling of charge carriers therethrough;
discontinuing said supplying to the seed particle ingredients for forming said fourth semiconductor material;
supplying to the seed particle ingredients for forming a fifth semiconductor material having a band gap less than that of said fourth semiconductor material, for a period of time sufficient to form a fifth segment of said nanowhisker; and making electrical contact between said first and fifth segments of said nanowhisker and electrical terminals, whereby to form an emitter and a collector of said resonant tunneling diode.
87. A method of forming a nanowhisker, comprising:
providing a seed particle having a diameter of manometer dimension on a substrate:
heating said substrate and said catalytic seed particle to a temperature at which said catalytic seed article is operative as a catalyst;
supplying to the seed particle ingredients for forming a first semiconductor material under controlled conditions of temperature and pressure such that said ingredients crystallize from said seed particle to form a first segment of said nanowhisker extending from said substrate, said first segment of said nanowhisker comprised of said first crystalline semiconductor material;
discontinuing said supplying to the seed particle ingredients for forming said first crystalline semiconductor material, and supplying to the seed particle ingredients for forming a second crystalline semiconductor material having a band gap different from that of said first semiconductor material, to form a second segment of said nanowhisker having a composition boundary with said first segment of said nanowhisker whereby to form a column with at least first and second semiconductor segments, wherein lattice strain caused by lattice mismatch between the materials of the segments is accommodated by lateral atomic displacement.
88. A method of forming a nanowhisker, comprising:
providing a seed particle having a diameter of manometer dimension on a substrate;
heating said substrate and said catalytic seed particle to a temperature at which said catalytic seed particle is operative as a catalyst;
supplying to the seed particle ingredients for forming a first semiconductor material under controlled conditions of temperature and pressure such that said ingredients crystallize from said seed particle to form a first segment of said nanowhisker extending from said substrate, said first segment of said nanowhisker comprised of said first crystalline semiconductor material;
discontinuing said supplying to the seed particle ingredients for forming said first crystalline semiconductor material; and supplying to the seed particle ingredients for forming a second crystalline semiconductor material having a band gap different from that of said first semiconductor material to form a second segment of said nanowhisker having a composition boundary with said first segment of said nanowhisker whereby to form a column with at least first and second semiconductor segments, and wherein the composition boundary extends over an axial interval of less than eight lattice planes.
89. A method according to claim 88, wherein said substrate is mounted in an ultra high vacuum chamber and said ingredients are supplied to the seed as molecular beams introduced into the ultra high vacuum chamber.
90. A method according to claim 88, wherein rapid switching between different compositions is obtained via a sequence wherein the rate of growth is reduced to an insignificant amount, and then supersaturation conditions for continued growth are re-established.
91. A method according to claim 88, wherein said catalytic seed particles are gold aerosol particles having a size selected to result in said nanowhiskers having a unifoum diameter between about 10 and and about 50 nm.
92. A method according to claim 88, wherein one of said first semiconductor material and said second semiconductor material is a III-V
material comprised of at least one group III element and at least one group V element and the diffusion constant of the group III element is selectively changed during formation of the nanowhisker by changing said controlled condition of temperature.
93. A method according to claim 88, wherein said catalytic seed particles are formed by a process of nanoimprint lithography to result in said nanowhiskers having a uniform diameter between about 10 and about 50 nm.
94. A nanowhisker comprising, a column having a longitudinal axis, said column having a length along said axis and at least one dimension perpendicular to said axis, said dimension perpendicular to said axis not exceeding about 500 nm;
said column comprising at least:
a first lengthwise segment of a first crystalline semiconductor material having a first composition; and a second lengthwise segment of a second crystalline semiconductor material having a second composition, said first lengthwise segment and said second lengthwise segment being in contact at an interface, said interface constituting a junction at which said first composition changes to said second composition within an axial distance of not greater than 8 diametral lattice planes.
95. The nanowhisker of Claim 94, wherein said at least one dimension perpendicular to said axis does not exceed about 100 nm.
96. The nanowhisker of Claim 94, wherein said at least one dimension perpendicular to said axis does not exceed about 50 nm.
97. The nanowhisker of Claim 94, wherein said at least one dimension perpendicular to said axis does not exceed about 30 nm.
98. The nanowhisker of Claim 94, wherein said at least one dimension perpendicular to said axis does not exceed about 20 nm.
99. The nanowhisker of Claim 94, wherein said at least one dimension perpendicular to said axis does not exceed about 10 nm.
100. The nanowhisker of Claim 94, wherein said at least one dimension perpendicular to said axis does not exceed about 5 nm.
101. The nanowhisker of Claim 94, wherein said first composition changes to said second composition within an axial distance of not greater than 7 diametral lattice planes.
102. The nanowhisker of Claim 94, wherein said first composition changes to said second composition within an axial distance of not greater than 6 diametral lattice planes.
103. The nanowhisker of Claim 94, wherein said first composition changes to said second composition within an axial distance of not greater than 5 diametral lattice planes.
104. The nanowhisker of Claim 94, wherein said first composition changes to said second composition within an axial distance of not greater than 4 diametral lattice planes.
105. The nanowhisker of Claim 94, wherein said first composition changes to said second composition within an axial distance of not greater than 3 diametral lattice planes.
106. The nanowhisker of Claim 94, wherein said first composition changes to said second composition within an axial distance of not greater than 2 diametral lattice planes.
107. The nanowhisker of Claim 94, wherein said first composition changes to said second composition within an axial distance of not greater than 1 diametral lattice plane.
108. The nanowhisker of Claim 94, wherein said column has a generally circular or polygonal cross-section and said at least one dimension perpendicular to said axis of said column is a diameter thereof.
109. The nanowhisker of Claim 108, wherein said diameter of said column is generally constant along said axis of said column.
110. The nanowhisker of Claim 108, wherein said column is tapered, whereby said diameter of said column decreases along said axis of said column.
111. The nanowhisker of Claim 108, wherein said diameter of said column is such that at least a portion of said length of said column along said axis exhibits quantum confinement effects.
112. The nanowhisker of Claim 94, wherein said column additionally comprises a catalytic particle integral with an end thereof.
113. The nanowhisker of Claim 94, wherein said first and second crystalline materials are selected from the group consisting of III-V semiconductor materials.
114. An array of nanowhiskers comprising a plurality of nanowhiskers according to Claim 94, each extending parallel to one another.
115. An array of nanowhiskers according to Claim 114, wherein each of said nanowhiskers is attached to a substrate at an end thereof.
116. A nanowhisker of Claim 94, wherein said first crystalline semiconductor material has a stoichiometric composition of the form A1-x B x C and said second crystalline semiconductor material has a stoichiometric composition of the form A1-y B y C, where A, B, and C are selected elements and x and y are different numbers in the range from 0 to 1.
117. A nanowhisker of Claim 116, wherein said elements A and B are Group III semiconductors and said element C is a Group V semiconductor.
118. A nanowhisker of Claim 94, wherein said first and second crystalline semiconductor materials are selected to produce a predetermined band gap change at said junction.
119. A nanowhisker comprising, a column having a longitudinal axis, said column having a length along said axis and at least one dimension perpendicular to said axis;
said column comprising at least:
a first lengthwise segment of a first crystalline semiconductor material having a first composition and a first crystal lattice; and a second lengthwise segment of a second crystalline semiconductor material having a second composition and a second crystal lattice, said first lengthwise segment and said second lengthwise segment being in contact at an interface, said interface constituting a junction at which said first composition changes to said second composition within an axial distance of not greater than 8 diametral lattice planes.
said dimension perpendicular to said axis being such that lattice strain caused by lattice mismatch between said first crystal lattice and said second crystal lattice at said interface between said first lengthwise segment and said second lengthwise segment can be substantially accommodated by lateral atomic displacement.
120. The nanowhisker of Claim 119, wherein said first composition changes to said second composition within an axial distance of not greater than 7 diametral lattice planes.
121. The nanowhisker of Claim 119, wherein said first composition changes to said second composition within an axial distance of not greater than 6 diametral lattice planes.
122. The nanowhisker of Claim 119, wherein said first composition changes to said second composition within an axial distance of not greater than 5 diametral lattice planes.
123. The nanowhisker of Claim 119, wherein said first composition changes to said second composition within an axial distance of not greater than 4 diametral lattice planes.
124. The nanowhisker of Claim 119, wherein said first composition changes to said second composition within an axial distance of not greater than 3 diametral lattice planes.
125. The nanowhisker of Claim 119, wherein said first composition changes to said second composition within an axial distance of not greater than 2 diametral lattice planes.
126. The nanowhisker of Claim 119, wherein said first composition changes to said second composition within an axial distance of not greater than 1 diametral lattice plane.
127. The nanowhisker of Claim 119, wherein said column has a generally circular or polygonal cross-section and said at least one dimension perpendicular to said axis of said column is a diameter thereof.
128. The nanowhisker of Claim 127, wherein said diameter of said column is generally constant along said axis of said column.
129. The nanowhisker of Claim 127, wherein said column is tapered, whereby said diameter of said column decreases along said axis of said column.
130. The nanowhisker of Claim 127, wherein said diameter of said column is such that at least a portion of said length of said column along said axis exhibits quantum confinement effects.
131. The nanowhisker of Claim 119, wherein said column additionally comprises a catalytic particle integral with an end thereof.
132. The nanowhisker of Claim 119, wherein said first and second crystalline materials are selected from the group consisting of III-V semiconductor materials.
133. An array of nanowhiskers comprising a plurality of nanowhiskers according to Claim 119, each extending parallel to one another.
134. An array of nanowhiskers according to Claim 133, wherein each of said nanowhiskers is attached to a substrate at an end thereof.
135. A nanowhisker of Claim 119, wherein said first crystalline semiconductor material has a stoichiometric composition of the form A1-x B x C
and said second crystalline semiconductor material has a stoiehiometric composition of the form A1-y B y C, where A, B, and C are selected elements and x and y are different numbers in the range from 0 to 1.
136. A nanowhisker of Claim 135, wherein said elements A and B are Group III semiconductors, and said element C is a Group V semiconductor.
137. A nanowhisker of Claim 119, wherein said first and second crystalline semiconductor materials are selected to produce a predetermined band gap change at said junction.
CA2491941A 2002-07-08 2003-07-08 Nanostructures and methods for manufacturing the same Expired - Fee Related CA2491941C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA2741397A CA2741397A1 (en) 2002-07-08 2003-07-08 Nanostructures and methods for manufacturing the same

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US39383502P 2002-07-08 2002-07-08
US60/393,835 2002-07-08
US45998203P 2003-04-04 2003-04-04
US60/459,982 2003-04-04
PCT/GB2003/002929 WO2004004927A2 (en) 2002-07-08 2003-07-08 Nanostructures and methods for manufacturing the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CA2741397A Division CA2741397A1 (en) 2002-07-08 2003-07-08 Nanostructures and methods for manufacturing the same

Publications (2)

Publication Number Publication Date
CA2491941A1 true CA2491941A1 (en) 2004-01-15
CA2491941C CA2491941C (en) 2011-08-16

Family

ID=30118388

Family Applications (2)

Application Number Title Priority Date Filing Date
CA2741397A Abandoned CA2741397A1 (en) 2002-07-08 2003-07-08 Nanostructures and methods for manufacturing the same
CA2491941A Expired - Fee Related CA2491941C (en) 2002-07-08 2003-07-08 Nanostructures and methods for manufacturing the same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CA2741397A Abandoned CA2741397A1 (en) 2002-07-08 2003-07-08 Nanostructures and methods for manufacturing the same

Country Status (11)

Country Link
US (6) US7335908B2 (en)
EP (2) EP1525339B1 (en)
JP (2) JP4948766B2 (en)
KR (1) KR101147053B1 (en)
CN (2) CN100500950C (en)
AT (1) ATE557116T1 (en)
AU (1) AU2003244851A1 (en)
CA (2) CA2741397A1 (en)
HK (1) HK1135798A1 (en)
TW (1) TWI318418B (en)
WO (1) WO2004004927A2 (en)

Families Citing this family (293)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101798057A (en) * 2000-08-22 2010-08-11 哈佛学院董事会 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
US7301199B2 (en) * 2000-08-22 2007-11-27 President And Fellows Of Harvard College Nanoscale wires and related devices
US20060175601A1 (en) * 2000-08-22 2006-08-10 President And Fellows Of Harvard College Nanoscale wires and related devices
CA2430888C (en) * 2000-12-11 2013-10-22 President And Fellows Of Harvard College Nanosensors
US7335908B2 (en) * 2002-07-08 2008-02-26 Qunano Ab Nanostructures and methods for manufacturing the same
EP1634334A1 (en) * 2003-04-04 2006-03-15 Startskottet 22286 AB Nanowhiskers with pn junctions and methods of fabricating thereof
EP1642300A2 (en) * 2003-07-08 2006-04-05 Qunamo AB Probe structures incorporating nanowhiskers, production methods thereof, and methods of forming nanowhiskers
US6989325B2 (en) * 2003-09-03 2006-01-24 Industrial Technology Research Institute Self-assembled nanometer conductive bumps and method for fabricating
WO2005027201A1 (en) * 2003-09-12 2005-03-24 Københavns Universitet Method of fabrication and device comprising elongated nanosize elements
US7012279B2 (en) 2003-10-21 2006-03-14 Lumileds Lighting U.S., Llc Photonic crystal light emitting device
US7662706B2 (en) * 2003-11-26 2010-02-16 Qunano Ab Nanostructures formed of branched nanowhiskers and methods of producing the same
US7208094B2 (en) * 2003-12-17 2007-04-24 Hewlett-Packard Development Company, L.P. Methods of bridging lateral nanowires and device using same
US7354850B2 (en) * 2004-02-06 2008-04-08 Qunano Ab Directionally controlled growth of nanowhiskers
US20090227107A9 (en) * 2004-02-13 2009-09-10 President And Fellows Of Havard College Nanostructures Containing Metal Semiconductor Compounds
KR100584188B1 (en) * 2004-03-08 2006-05-29 한국과학기술연구원 Nanowire light sensor and kit with the same
US20050205883A1 (en) 2004-03-19 2005-09-22 Wierer Jonathan J Jr Photonic crystal light emitting device
US7597814B2 (en) * 2004-03-23 2009-10-06 Hewlett Packard Development Company, L.P. Structure formed with template having nanoscale features
US20070264623A1 (en) * 2004-06-15 2007-11-15 President And Fellows Of Harvard College Nanosensors
EP1766108A1 (en) * 2004-06-25 2007-03-28 Btg International Limited Formation of nanowhiskers on a substrate of dissimilar material
EP1771884B1 (en) * 2004-07-20 2010-10-06 Nxp B.V. Semiconductor device and method of manufacturing the same
US7442964B2 (en) 2004-08-04 2008-10-28 Philips Lumileds Lighting Company, Llc Photonic crystal light emitting device with multiple lattices
US7705415B1 (en) 2004-08-12 2010-04-27 Drexel University Optical and electronic devices based on nano-plasma
US7078697B2 (en) * 2004-10-07 2006-07-18 Raytheon Company Thermally powered terahertz radiation source using photonic crystals
US20070240757A1 (en) * 2004-10-15 2007-10-18 The Trustees Of Boston College Solar cells using arrays of optical rectennas
DE102004053646A1 (en) * 2004-11-03 2006-05-04 Otto-Von-Guericke-Universität Magdeburg Locally defined production of Si nanocrystals on an Si substrate with insulating layer useful in electronic switching technology with gas phase Ga deposition in holes in the insulated layer at which nanocrystals grow out from Ga-Si eutectic
US8029186B2 (en) * 2004-11-05 2011-10-04 International Business Machines Corporation Method for thermal characterization under non-uniform heat load
US7400665B2 (en) * 2004-11-05 2008-07-15 Hewlett-Packard Developement Company, L.P. Nano-VCSEL device and fabrication thereof using nano-colonnades
US7307271B2 (en) * 2004-11-05 2007-12-11 Hewlett-Packard Development Company, L.P. Nanowire interconnection and nano-scale device applications
JP2008523590A (en) * 2004-12-06 2008-07-03 プレジデント・アンド・フェロウズ・オブ・ハーバード・カレッジ Nanoscale wire-based data storage device
US8120014B2 (en) * 2004-12-15 2012-02-21 Drexel University Nanowire based plasmonics
US7387578B2 (en) * 2004-12-17 2008-06-17 Integran Technologies Inc. Strong, lightweight article containing a fine-grained metallic layer
US7587645B2 (en) * 2005-01-24 2009-09-08 Samsung Electronics Co., Ltd. Input circuit of semiconductor memory device and test system having the same
EP1696473A3 (en) * 2005-02-25 2009-06-10 Samsung Electronics Co.,Ltd. Silicon nano wires, semiconductor device including the same, and method of manufacturing the silicon nano wires
US8324660B2 (en) 2005-05-17 2012-12-04 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US9153645B2 (en) 2005-05-17 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US20060263974A1 (en) * 2005-05-18 2006-11-23 Micron Technology, Inc. Methods of electrically interconnecting different elevation conductive structures, methods of forming capacitors, methods of forming an interconnect between a substrate bit line contact and a bit line in DRAM, and methods of forming DRAM memory cell
US7230286B2 (en) * 2005-05-23 2007-06-12 International Business Machines Corporation Vertical FET with nanowire channels and a silicided bottom contact
US20100227382A1 (en) * 2005-05-25 2010-09-09 President And Fellows Of Harvard College Nanoscale sensors
WO2006132659A2 (en) * 2005-06-06 2006-12-14 President And Fellows Of Harvard College Nanowire heterostructures
CN100417117C (en) * 2005-06-15 2008-09-03 华为技术有限公司 Method for recognizing node accessibility in automatically switched optical network
AU2006258261A1 (en) 2005-06-16 2006-12-21 Qunano Ab Semiconductor nanowire transistor
US8163575B2 (en) 2005-06-17 2012-04-24 Philips Lumileds Lighting Company Llc Grown photonic crystals in semiconductor light emitting devices
WO2007001098A1 (en) * 2005-06-25 2007-01-04 Seoul Opto Device Co., Ltd. Nanostructure having a nitride-based quantum well and light emitting diode employing the same
US7700936B2 (en) * 2005-07-01 2010-04-20 University Of Delaware Fabrication of quantum dots embedded in three-dimensional photonic crystal lattice
US7847180B2 (en) * 2005-08-22 2010-12-07 Q1 Nanosystems, Inc. Nanostructure and photovoltaic cell implementing same
US8268405B2 (en) * 2005-08-23 2012-09-18 Uwm Research Foundation, Inc. Controlled decoration of carbon nanotubes with aerosol nanoparticles
US8240190B2 (en) * 2005-08-23 2012-08-14 Uwm Research Foundation, Inc. Ambient-temperature gas sensor
EP1917557A4 (en) 2005-08-24 2015-07-22 Trustees Boston College Apparatus and methods for solar energy conversion using nanoscale cometal structures
US7649665B2 (en) * 2005-08-24 2010-01-19 The Trustees Of Boston College Apparatus and methods for optical switching using nanoscale optics
US7623746B2 (en) * 2005-08-24 2009-11-24 The Trustees Of Boston College Nanoscale optical microscope
US7589880B2 (en) * 2005-08-24 2009-09-15 The Trustees Of Boston College Apparatus and methods for manipulating light using nanoscale cometal structures
US7754964B2 (en) * 2005-08-24 2010-07-13 The Trustees Of Boston College Apparatus and methods for solar energy conversion using nanocoax structures
KR100723384B1 (en) * 2005-09-06 2007-05-30 삼성에스디아이 주식회사 Nano wire electromechanical device and fabrication method of the same
WO2007086009A1 (en) * 2006-01-25 2007-08-02 Nxp B.V. Nanowire tunneling transistor
US7570355B2 (en) * 2006-01-27 2009-08-04 Hewlett-Packard Development Company, L.P. Nanowire heterostructures and methods of forming the same
US7826336B2 (en) * 2006-02-23 2010-11-02 Qunano Ab Data storage nanostructures
US8691011B2 (en) * 2006-03-08 2014-04-08 Qunano Ab Method for metal-free synthesis of epitaxial semiconductor nanowires on si
US7777250B2 (en) 2006-03-24 2010-08-17 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures and related methods for device fabrication
WO2007145701A2 (en) * 2006-04-07 2007-12-21 President And Fellows Of Harvard College Nanoscale wire methods and devices
US7465954B2 (en) * 2006-04-28 2008-12-16 Hewlett-Packard Development Company, L.P. Nanowire devices and systems, light-emitting nanowires, and methods of precisely positioning nanoparticles
WO2008051316A2 (en) 2006-06-12 2008-05-02 President And Fellows Of Harvard College Nanosensors and related technologies
JP2008034482A (en) * 2006-07-26 2008-02-14 Matsushita Electric Works Ltd Compound semiconductor light-emitting element, illumination apparatus using the same and method of manufacturing the compound semiconductor element
JP2008034483A (en) * 2006-07-26 2008-02-14 Matsushita Electric Works Ltd Compound semiconductor element, illumination apparatus using the same and method of manufacturing the same
EP2062290B1 (en) 2006-09-07 2019-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Defect reduction using aspect ratio trapping
US8058640B2 (en) 2006-09-11 2011-11-15 President And Fellows Of Harvard College Branched nanoscale wires
EP1900681B1 (en) * 2006-09-15 2017-03-15 Imec Tunnel Field-Effect Transistors based on silicon nanowires
JP5171161B2 (en) * 2006-09-15 2013-03-27 アイメック Nanowire tunnel field effect transistor semiconductor device and manufacturing method thereof
EP1901354B1 (en) * 2006-09-15 2016-08-24 Imec A tunnel field-effect transistor with gated tunnel barrier
EP1901355B1 (en) * 2006-09-15 2015-11-11 Imec Tunnel effect transistors based on monocrystalline nanowires having a heterostructure
EP2064745A1 (en) 2006-09-18 2009-06-03 QuNano AB Method of producing precision vertical and horizontal layers in a vertical semiconductor structure
JP2010503981A (en) 2006-09-19 2010-02-04 クナノ アーベー Nanoscale field-effect transistor structure
CN101517404A (en) * 2006-09-22 2009-08-26 皇家飞利浦电子股份有限公司 Semiconductor sensor device, diagnostic instrument comprising such a device and method of manufacturing such a device
US7875958B2 (en) * 2006-09-27 2011-01-25 Taiwan Semiconductor Manufacturing Company, Ltd. Quantum tunneling devices and circuits with lattice-mismatched semiconductor structures
US7872318B2 (en) * 2006-09-29 2011-01-18 Hewlett-Packard Development Company, L.P. Sensing devices and methods for forming the same
US8595654B1 (en) * 2006-10-03 2013-11-26 Hrl Laboratories, Llc Semiconductor device coding using quantum dot technology
US7608905B2 (en) * 2006-10-17 2009-10-27 Hewlett-Packard Development Company, L.P. Independently addressable interdigitated nanowires
US20080187018A1 (en) 2006-10-19 2008-08-07 Amberwave Systems Corporation Distributed feedback lasers formed via aspect ratio trapping
US9360509B2 (en) * 2006-11-17 2016-06-07 Trustees Of Boston College Nanoscale sensors with nanoporous material
US8575663B2 (en) * 2006-11-22 2013-11-05 President And Fellows Of Harvard College High-sensitivity nanoscale wire sensors
JP4167718B2 (en) * 2006-12-13 2008-10-22 松下電器産業株式会社 Nanowire, device including nanowire, and method for manufacturing the same
US8049203B2 (en) * 2006-12-22 2011-11-01 Qunano Ab Nanoelectronic structure and method of producing such
WO2008079078A1 (en) 2006-12-22 2008-07-03 Qunano Ab Elevated led and method of producing such
US7663148B2 (en) * 2006-12-22 2010-02-16 Philips Lumileds Lighting Company, Llc III-nitride light emitting device with reduced strain light emitting layer
JP5453105B2 (en) * 2006-12-22 2014-03-26 クナノ アーベー Nanostructured LEDs and devices
US8183587B2 (en) * 2006-12-22 2012-05-22 Qunano Ab LED with upstanding nanowire structure and method of producing such
CN1996029A (en) * 2006-12-25 2007-07-11 欧阳征标 THz signal highly-sensitive detector and camera
CN101681813B (en) 2007-01-12 2012-07-11 昆南诺股份有限公司 Nitride nanowires and method of producing the same
US7566657B2 (en) 2007-01-17 2009-07-28 Hewlett-Packard Development Company, L.P. Methods of forming through-substrate interconnects
US7544591B2 (en) * 2007-01-18 2009-06-09 Hewlett-Packard Development Company, L.P. Method of creating isolated electrodes in a nanowire-based device
JP4825697B2 (en) * 2007-01-25 2011-11-30 株式会社ミツトヨ Digital displacement measuring instrument
CN101627479B (en) * 2007-01-30 2011-06-15 索拉斯特公司 Photovoltaic cell and method of making thereof
JP2010518623A (en) * 2007-02-12 2010-05-27 ソーラスタ インコーポレイテッド Photocell with reduced hot carrier cooling
CA2716991C (en) 2007-02-28 2015-11-24 Jeffrey Olson Method for stimulating retinal response using photoactive devices
JP2008252086A (en) 2007-03-12 2008-10-16 Interuniv Micro Electronica Centrum Vzw Tunnel field-effect transistor with gated tunnel barrier
JP4965294B2 (en) * 2007-03-19 2012-07-04 パナソニック株式会社 Semiconductor light emitting device, illumination device using the same, and method for manufacturing semiconductor light emitting device
US8890117B2 (en) * 2007-03-28 2014-11-18 Qunano Ab Nanowire circuit architecture
US8304805B2 (en) 2009-01-09 2012-11-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor diodes fabricated by aspect ratio trapping with coalesced films
US8237151B2 (en) 2009-01-09 2012-08-07 Taiwan Semiconductor Manufacturing Company, Ltd. Diode-based devices and methods for making the same
US9508890B2 (en) * 2007-04-09 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Photovoltaics on silicon
US7825328B2 (en) 2007-04-09 2010-11-02 Taiwan Semiconductor Manufacturing Company, Ltd. Nitride-based multi-junction solar cell modules and methods for making the same
US8212235B2 (en) * 2007-04-25 2012-07-03 Hewlett-Packard Development Company, L.P. Nanowire-based opto-electronic device
US7880318B1 (en) * 2007-04-27 2011-02-01 Hewlett-Packard Development Company, L.P. Sensing system and method of making the same
US7905013B2 (en) * 2007-06-04 2011-03-15 Sharp Laboratories Of America, Inc. Method for forming an iridium oxide (IrOx) nanowire neural sensor array
US8329541B2 (en) 2007-06-15 2012-12-11 Taiwan Semiconductor Manufacturing Company, Ltd. InP-based transistor fabrication
KR101547711B1 (en) 2007-06-19 2015-08-26 큐나노 에이비 Nanowire-based solar cell structure
US7663202B2 (en) * 2007-06-26 2010-02-16 Hewlett-Packard Development Company, L.P. Nanowire photodiodes and methods of making nanowire photodiodes
KR20100039371A (en) * 2007-07-03 2010-04-15 솔라스타, 인코포레이티드 Distributed coax photovoltaic device
JP5096824B2 (en) * 2007-07-24 2012-12-12 日本電信電話株式会社 Nanostructure and method for producing nanostructure
US8945304B2 (en) * 2007-08-13 2015-02-03 The Board of Regents of the Nevada System of Higher Education on behalf of the University of Nevada, Las Vegas University of Nevada Ultrahigh vacuum process for the deposition of nanotubes and nanowires
JP2010538495A (en) 2007-09-07 2010-12-09 アンバーウェーブ・システムズ・コーポレーション Multi-junction solar cell
JP5247109B2 (en) * 2007-10-05 2013-07-24 パナソニック株式会社 Semiconductor light emitting device, illumination device using the same, and method for manufacturing semiconductor light emitting device
US7927905B2 (en) * 2007-12-21 2011-04-19 Palo Alto Research Center Incorporated Method of producing microsprings having nanowire tip structures
US7923098B2 (en) * 2008-01-02 2011-04-12 The Board Of Regents Of The University Of Oklahoma Low-defect-density crystalline structure and method for making same
KR100960130B1 (en) * 2008-01-29 2010-05-27 광주과학기술원 Method and apparatus for measuring characteristics of material, Method and apparatus for imaging material
US7776699B2 (en) * 2008-02-05 2010-08-17 Chartered Semiconductor Manufacturing, Ltd. Strained channel transistor structure and method
KR100960691B1 (en) * 2008-03-05 2010-05-31 전북대학교산학협력단 Method of fabricating a bipolar-junction transistor using a nanowire
GB2459251A (en) 2008-04-01 2009-10-21 Sharp Kk Semiconductor nanowire devices
US20110089400A1 (en) * 2008-04-15 2011-04-21 Qunano Ab Nanowire wrap gate devices
US7960715B2 (en) * 2008-04-24 2011-06-14 University Of Iowa Research Foundation Semiconductor heterostructure nanowire devices
US8203127B2 (en) * 2008-05-06 2012-06-19 The United States Of America, As Represented By The Secretary Of The Army Terahertz radiation device using polar semiconductor materials and method of generating terahertz radiation
US7919764B2 (en) * 2008-05-06 2011-04-05 The United States Of America As Represented By The Secretary Of The Army Method and apparatus for enhanced terahertz radiation from high stacking fault density
US7902540B2 (en) * 2008-05-21 2011-03-08 International Business Machines Corporation Fast P-I-N photodetector with high responsitivity
US8491718B2 (en) * 2008-05-28 2013-07-23 Karin Chaudhari Methods of growing heteroepitaxial single crystal or large grained semiconductor films and devices thereon
US8183667B2 (en) 2008-06-03 2012-05-22 Taiwan Semiconductor Manufacturing Co., Ltd. Epitaxial growth of crystalline material
US8274097B2 (en) 2008-07-01 2012-09-25 Taiwan Semiconductor Manufacturing Company, Ltd. Reduction of edge effects from aspect ratio trapping
KR20110042178A (en) * 2008-07-09 2011-04-25 큐나노 에이비 Nanostructured memory device
SE533090C2 (en) * 2008-07-09 2010-06-22 Qunano Ab Nanostructured LED
US8138493B2 (en) * 2008-07-09 2012-03-20 Qunano Ab Optoelectronic semiconductor device
US8981427B2 (en) 2008-07-15 2015-03-17 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing of small composite semiconductor materials
CN101660207B (en) * 2008-08-26 2012-03-07 北京有色金属研究总院 Method for synthesizing gallium phosphide polycrystal
US8384007B2 (en) 2009-10-07 2013-02-26 Zena Technologies, Inc. Nano wire based passive pixel image sensor
US8748799B2 (en) 2010-12-14 2014-06-10 Zena Technologies, Inc. Full color single pixel including doublet or quadruplet si nanowires for image sensors
US9299866B2 (en) 2010-12-30 2016-03-29 Zena Technologies, Inc. Nanowire array based solar energy harvesting device
US8546742B2 (en) 2009-06-04 2013-10-01 Zena Technologies, Inc. Array of nanowires in a single cavity with anti-reflective coating on substrate
US9478685B2 (en) 2014-06-23 2016-10-25 Zena Technologies, Inc. Vertical pillar structured infrared detector and fabrication method for the same
US20100304061A1 (en) * 2009-05-26 2010-12-02 Zena Technologies, Inc. Fabrication of high aspect ratio features in a glass layer by etching
US8735797B2 (en) 2009-12-08 2014-05-27 Zena Technologies, Inc. Nanowire photo-detector grown on a back-side illuminated image sensor
US20110115041A1 (en) * 2009-11-19 2011-05-19 Zena Technologies, Inc. Nanowire core-shell light pipes
KR20100028412A (en) * 2008-09-04 2010-03-12 삼성전자주식회사 Light emitting diode using nano-rod and method for manufacturing the same
US9515218B2 (en) * 2008-09-04 2016-12-06 Zena Technologies, Inc. Vertical pillar structured photovoltaic devices with mirrors and optical claddings
US9406709B2 (en) 2010-06-22 2016-08-02 President And Fellows Of Harvard College Methods for fabricating and using nanowires
US8269985B2 (en) 2009-05-26 2012-09-18 Zena Technologies, Inc. Determination of optimal diameters for nanowires
US8791470B2 (en) 2009-10-05 2014-07-29 Zena Technologies, Inc. Nano structured LEDs
US8866065B2 (en) 2010-12-13 2014-10-21 Zena Technologies, Inc. Nanowire arrays comprising fluorescent nanowires
US8889455B2 (en) 2009-12-08 2014-11-18 Zena Technologies, Inc. Manufacturing nanowire photo-detector grown on a back-side illuminated image sensor
US8835831B2 (en) 2010-06-22 2014-09-16 Zena Technologies, Inc. Polarized light detecting device and fabrication methods of the same
US8299472B2 (en) 2009-12-08 2012-10-30 Young-June Yu Active pixel sensor with nanowire structured photodetectors
US8890271B2 (en) 2010-06-30 2014-11-18 Zena Technologies, Inc. Silicon nitride light pipes for image sensors
US8229255B2 (en) * 2008-09-04 2012-07-24 Zena Technologies, Inc. Optical waveguides in image sensors
US9082673B2 (en) 2009-10-05 2015-07-14 Zena Technologies, Inc. Passivated upstanding nanostructures and methods of making the same
US8507840B2 (en) 2010-12-21 2013-08-13 Zena Technologies, Inc. Vertically structured passive pixel arrays and methods for fabricating the same
US9000353B2 (en) 2010-06-22 2015-04-07 President And Fellows Of Harvard College Light absorption and filtering properties of vertically oriented semiconductor nano wires
US8519379B2 (en) 2009-12-08 2013-08-27 Zena Technologies, Inc. Nanowire structured photodiode with a surrounding epitaxially grown P or N layer
US9343490B2 (en) 2013-08-09 2016-05-17 Zena Technologies, Inc. Nanowire structured color filter arrays and fabrication method of the same
US8274039B2 (en) 2008-11-13 2012-09-25 Zena Technologies, Inc. Vertical waveguides with various functionality on integrated circuits
US8357960B1 (en) * 2008-09-18 2013-01-22 Banpil Photonics, Inc. Multispectral imaging device and manufacturing thereof
US20100072515A1 (en) 2008-09-19 2010-03-25 Amberwave Systems Corporation Fabrication and structures of crystalline material
WO2010033813A2 (en) 2008-09-19 2010-03-25 Amberwave System Corporation Formation of devices by epitaxial layer overgrowth
US8253211B2 (en) 2008-09-24 2012-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor sensor structures with reduced dislocation defect densities
US20110247676A1 (en) * 2008-09-30 2011-10-13 The Regents Of The University Of California Photonic Crystal Solar Cell
TWI382551B (en) * 2008-11-06 2013-01-11 Ind Tech Res Inst Solar concentrating module
US8228129B2 (en) * 2008-11-06 2012-07-24 Raytheon Company Photonic crystal resonant defect cavities with nano-scale oscillators for generation of terahertz or infrared radiation
US8261557B2 (en) * 2008-12-05 2012-09-11 Raytheon Company Heat transfer devices based on thermodynamic cycling of a photonic crystal with coupled resonant defect cavities
SE533531C2 (en) 2008-12-19 2010-10-19 Glo Ab Nanostructured device
US10022543B2 (en) 2009-01-13 2018-07-17 The Regents Of The University Of Colorado, A Body Corporate Cell stimulation using quantum dots
FR2941688B1 (en) 2009-01-30 2011-04-01 Commissariat Energie Atomique PROCESS FOR FORMING NANO-THREADS
JP2010182824A (en) * 2009-02-04 2010-08-19 Toshiba Corp Method of manufacturing magnetic random access memory, and method of manufacturing embedded memory
US8766395B2 (en) 2009-03-25 2014-07-01 Qunano Ab Schottky device
EP2415083B1 (en) 2009-04-02 2017-06-21 Taiwan Semiconductor Manufacturing Company, Ltd. Devices formed from a non-polar plane of a crystalline material and method of making the same
KR101633953B1 (en) 2009-04-15 2016-06-27 솔 발테익스 에이비 Multi-junction photovoltaic cell with nanowires
CN101893659B (en) * 2009-05-19 2012-06-20 清华大学 Method and device for detecting polarization direction of electromagnetic wave
US8809672B2 (en) * 2009-05-27 2014-08-19 The Regents Of The University Of California Nanoneedle plasmonic photodetectors and solar cells
WO2011009465A1 (en) * 2009-07-23 2011-01-27 Danmarks Tekniske Universitet An electrically driven single photon source
US8337943B2 (en) * 2009-08-31 2012-12-25 Corning Incorporated Nano-whisker growth and films
US9297796B2 (en) 2009-09-24 2016-03-29 President And Fellows Of Harvard College Bent nanowires and related probing of species
JP2013508966A (en) 2009-10-22 2013-03-07 ソル ヴォルタイクス アーベー Nanowire tunnel diode and manufacturing method thereof
US8563395B2 (en) * 2009-11-30 2013-10-22 The Royal Institute For The Advancement Of Learning/Mcgill University Method of growing uniform semiconductor nanowires without foreign metal catalyst and devices thereof
US9112085B2 (en) * 2009-11-30 2015-08-18 The Royal Institution For The Advancement Of Learning/Mcgill University High efficiency broadband semiconductor nanowire devices
KR100974626B1 (en) * 2009-12-22 2010-08-09 동국대학교 산학협력단 Semiconductor device having active nanorods array and manufacturing method thereof
JP5753192B2 (en) 2009-12-22 2015-07-22 クナノ・アーベー Method for manufacturing a nanowire structure
TWI466816B (en) * 2009-12-30 2015-01-01 Univ Tunghai Vertically oriented nanowires array structure and method thereof
US9202954B2 (en) * 2010-03-03 2015-12-01 Q1 Nanosystems Corporation Nanostructure and photovoltaic cell implementing same
EP2569466A4 (en) * 2010-05-11 2013-12-18 Qunano Ab Gas-phase synthesis of wires
US8772080B2 (en) * 2010-06-15 2014-07-08 Tel Solar Ag Photovoltaic cell and methods for producing a photovoltaic cell
AU2011268135B2 (en) 2010-06-18 2014-06-12 Glo Ab Nanowire LED structure and method for manufacturing the same
JP2012023343A (en) * 2010-06-18 2012-02-02 Semiconductor Energy Lab Co Ltd Photoelectric conversion device and method of producing the same
EP2586062A4 (en) 2010-06-24 2015-06-03 Glo Ab Substrate with buffer layer for oriented nanowire growth
JP5841752B2 (en) * 2010-07-02 2016-01-13 株式会社半導体エネルギー研究所 Semiconductor device
CN101949844B (en) * 2010-08-25 2012-07-25 中国科学院上海微系统与信息技术研究所 Test system for improving photoluminescence test effect of semiconductor material
US8450690B2 (en) 2010-10-04 2013-05-28 Trustees Of Boston University Thermal imager using metamaterials
GB201021112D0 (en) 2010-12-13 2011-01-26 Ntnu Technology Transfer As Nanowires
US8647915B2 (en) 2010-12-21 2014-02-11 Ut-Battelle, Llc Hetero-junction photovoltaic device and method of fabricating the device
US9688533B2 (en) * 2011-01-31 2017-06-27 The Regents Of The University Of California Using millisecond pulsed laser welding in MEMS packaging
WO2012105900A1 (en) 2011-02-01 2012-08-09 Qunano Ab Nanowire device for manipulating charged molecules
KR101209357B1 (en) * 2011-03-23 2012-12-06 서울대학교산학협력단 Retinal prosthesis system using nanowire photodetector and method for manufacturing the same
CN102185058B (en) * 2011-04-02 2013-09-25 映瑞光电科技(上海)有限公司 Nitride light-emitting diode (LED) structure and preparation method thereof
CN102185060B (en) * 2011-04-15 2014-07-16 映瑞光电科技(上海)有限公司 Nitride light emitting diode (LED) structure and preparation method thereof
US9795787B2 (en) 2011-05-16 2017-10-24 Seoul National University R&Db Foundation Retinal prosthesis system using nanowire light detector, and manufacturing method thereof
US9064808B2 (en) 2011-07-25 2015-06-23 Synopsys, Inc. Integrated circuit devices having features with reduced edge curvature and methods for manufacturing the same
CN102916343B (en) * 2011-08-05 2015-07-15 苏州大学 Production device and production method for quantum dot material
US20130051530A1 (en) * 2011-08-30 2013-02-28 Fujifilm Corporation High Aspect Ratio Grid for Phase Contrast X-ray Imaging and Method of Making the Same
US8609550B2 (en) * 2011-09-08 2013-12-17 Synopsys, Inc. Methods for manufacturing integrated circuit devices having features with reduced edge curvature
US8350251B1 (en) 2011-09-26 2013-01-08 Glo Ab Nanowire sized opto-electronic structure and method for manufacturing the same
CN103030096A (en) * 2011-10-09 2013-04-10 中国科学院高能物理研究所 Silicon material with nano-structure surface and manufacturing method thereof
US20130092222A1 (en) * 2011-10-14 2013-04-18 Nanograss Solar Llc Nanostructured Solar Cells Utilizing Charge Plasma
CN102420244B (en) * 2011-11-14 2013-10-09 清华大学 One-dimensional metal/semiconductor nanometer heterojunction transistor and preparation method thereof
WO2013080052A2 (en) 2011-11-30 2013-06-06 Qunano Ab Nanowire-based devices for light-induced and electrical stimulation of biological cells
TWI506801B (en) 2011-12-09 2015-11-01 Hon Hai Prec Ind Co Ltd Solar battery
CN103165690B (en) 2011-12-16 2015-11-25 清华大学 Solar cell
CN103165719B (en) 2011-12-16 2016-04-13 清华大学 Solar cell
US9245989B2 (en) * 2011-12-19 2016-01-26 Intel Corporation High voltage field effect transistors
CN103187476B (en) 2011-12-29 2016-06-15 清华大学 The preparation method of solaode
CN103187453B (en) 2011-12-29 2016-04-13 清华大学 Solar cell
CN103187456B (en) 2011-12-29 2015-08-26 清华大学 Solar cell
WO2013114218A2 (en) * 2012-02-03 2013-08-08 Qunano Ab High-throughput continuous gas-phase synthesis of nanowires with tunable properties
WO2013118048A1 (en) * 2012-02-07 2013-08-15 Koninklijke Philips N.V. Flexible nanowire based solar cell
JP6196987B2 (en) 2012-02-14 2017-09-13 ヘキサジェム アーベー Electronics based on gallium nitride nanowires
US10090425B2 (en) * 2012-02-21 2018-10-02 California Institute Of Technology Axially-integrated epitaxially-grown tandem wire arrays
US9425254B1 (en) * 2012-04-04 2016-08-23 Ball Aerospace & Technologies Corp. Hybrid integrated nanotube and nanostructure substrate systems and methods
JP2013239690A (en) * 2012-04-16 2013-11-28 Sharp Corp Superlattice structure, semiconductor device and semiconductor light emitting device including the superlattice structure, and method of making the superlattice structure
US9574286B2 (en) * 2012-05-25 2017-02-21 Sol Voltaics Ab Concentric flower reactor
CN104508825A (en) 2012-06-07 2015-04-08 昆南诺股份有限公司 A method of manufacturing a structure adapted to be transferred to a non-crystalline layer and a structure manufactured using said method
GB201211038D0 (en) 2012-06-21 2012-08-01 Norwegian Univ Sci & Tech Ntnu Solar cells
JP6290199B2 (en) 2012-07-06 2018-03-07 クナノ・アーベー Radial nanowire Esaki diode device and method
WO2014037380A1 (en) * 2012-09-04 2014-03-13 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Method and apparatus for the fabrication of nanostructures, network of interconnected nanostructures and nanostructure
US9178106B2 (en) 2012-10-26 2015-11-03 Glo Ab Nanowire sized opto-electronic structure and method for modifying selected portions of same
JP6353845B2 (en) 2012-10-26 2018-07-04 グロ アーベーGlo Ab Manufacturing method of nanowire LED structure
FR2997557B1 (en) 2012-10-26 2016-01-01 Commissariat Energie Atomique NANOFIL ELECTRONIC DEVICE WITH TRANSITION METAL BUFFER LAYER, METHOD OF GROWING AT LEAST ONE NANOWIL, AND DEVICE MANUFACTURING METHOD
FR2997420B1 (en) * 2012-10-26 2017-02-24 Commissariat Energie Atomique PROCESS FOR GROWING AT LEAST ONE NANOFIL FROM A TWO-STEP NITRIDE TRANSITION METAL LAYER
EP2912699B1 (en) 2012-10-26 2019-12-18 Glo Ab Method for modifying selected portions of nanowire sized opto-electronic structure
CN103043600B (en) * 2012-12-13 2015-03-25 中国科学院物理研究所 Preparation method of three-dimensional self-supporting micro-nano functional structure based on thin film material
DE102012025088A1 (en) * 2012-12-20 2014-06-26 Forschungszentrum Jülich GmbH Mass production single photon source and manufacturing process
US9082911B2 (en) 2013-01-28 2015-07-14 Q1 Nanosystems Corporation Three-dimensional metamaterial device with photovoltaic bristles
US9954126B2 (en) 2013-03-14 2018-04-24 Q1 Nanosystems Corporation Three-dimensional photovoltaic devices including cavity-containing cores and methods of manufacture
US20140264998A1 (en) 2013-03-14 2014-09-18 Q1 Nanosystems Corporation Methods for manufacturing three-dimensional metamaterial devices with photovoltaic bristles
DE102013204475A1 (en) * 2013-03-14 2014-09-18 Robert Bosch Gmbh Production method for a micromechanical component and corresponding micromechanical component
JP2016519421A (en) 2013-03-15 2016-06-30 グロ アーベーGlo Ab High dielectric film for improving the extraction efficiency of nanowire LEDs
EP2973756B1 (en) 2013-03-15 2018-06-27 Glo Ab Nanowire led structure with decreased leakage and method of making same
US20140342254A1 (en) * 2013-05-17 2014-11-20 Sunpower Technologies Llc Photo-catalytic Systems for Production of Hydrogen
US9196787B2 (en) 2013-06-07 2015-11-24 Glo Ab Nanowire LED structure with decreased leakage and method of making same
TW201515269A (en) 2013-06-18 2015-04-16 Glo Ab Insulating layer for planarization and definition of the active region of a nanowire device
GB201311101D0 (en) 2013-06-21 2013-08-07 Norwegian Univ Sci & Tech Ntnu Semiconducting Films
US9142745B2 (en) 2013-08-27 2015-09-22 Glo Ab Packaged LED device with castellations
US8999737B2 (en) 2013-08-27 2015-04-07 Glo Ab Method of making molded LED package
WO2015031179A1 (en) 2013-08-27 2015-03-05 Glo Ab Molded led package and method of making same
US9112130B2 (en) 2013-11-01 2015-08-18 Samsung Electronics Co., Ltd. Quantum interference based logic devices including electron monochromator
TW201525525A (en) 2013-12-09 2015-07-01 Glo Ab Optical display system
US9972750B2 (en) 2013-12-13 2018-05-15 Glo Ab Use of dielectric film to reduce resistivity of transparent conductive oxide in nanowire LEDs
US9287516B2 (en) * 2014-04-07 2016-03-15 International Business Machines Corporation Forming pn junction contacts by different dielectrics
CN103943725B (en) * 2014-04-18 2016-06-01 上海师范大学 A kind of metallic oxide nanocrystal palpus/Si matrix material and catalytic growth method thereof
US9343569B2 (en) 2014-05-21 2016-05-17 International Business Machines Corporation Vertical compound semiconductor field effect transistor on a group IV semiconductor substrate
JP6158248B2 (en) * 2014-05-27 2017-07-05 ザ・ボード・オブ・トラスティーズ・オブ・ザ・ユニバーシティ・オブ・イリノイThe Board Of Trustees Of The University Of Illinois Nanostructured material methods and devices
US10828400B2 (en) 2014-06-10 2020-11-10 The Research Foundation For The State University Of New York Low temperature, nanostructured ceramic coatings
US9951420B2 (en) 2014-11-10 2018-04-24 Sol Voltaics Ab Nanowire growth system having nanoparticles aerosol generator
JP6271401B2 (en) * 2014-11-20 2018-01-31 日本電信電話株式会社 Method for producing quantum dot nanowire
CN105845741A (en) * 2015-01-12 2016-08-10 中国科学院苏州纳米技术与纳米仿生研究所 Resonant tunneling diode based on InGaAs/AlAs material
WO2016207415A1 (en) * 2015-06-26 2016-12-29 University Of Copenhagen Network of nanostructures as grown on a substrate
CN108352424B (en) * 2015-07-13 2022-02-01 科莱约纳诺公司 Nanowires or nanopyramids grown on graphite substrates
TWI772266B (en) * 2015-07-13 2022-08-01 挪威商卡亞奈米公司 Light emitting diode device and photodetector device
CN108156828A (en) * 2015-07-31 2018-06-12 科莱约纳诺公司 For growing the method for nano wire or nanometer pyramid on graphite substrate
CN108028287B (en) 2015-08-28 2020-11-27 京瓷株式会社 Photoelectric conversion device
EP3347748B1 (en) * 2015-09-08 2023-05-10 University of Washington Alvarez lens with low contrast metasurfaces
FR3041202B1 (en) * 2015-09-14 2017-09-15 Valeo Vision MICRO- OR NANO-WIRE LED LIGHT SOURCE COMPRISING MEANS FOR MEASURING TEMPERATURE
JP6873409B2 (en) * 2016-04-21 2021-05-19 富士通株式会社 Light emitting element and its manufacturing method
JP2019515489A (en) 2016-04-22 2019-06-06 グロ アーベーGlo Ab Narrow-pitch direct-view display and method of manufacturing the same
WO2018022154A2 (en) * 2016-04-25 2018-02-01 Stc. Unm Rugged, single crystal wide-band-gap-material-scanning-tunneling microscopy/lithography tips
WO2017215770A1 (en) * 2016-06-13 2017-12-21 Heiner Linke A photodetector and a method for producing a photocurrent using the photodetector
CN109416326B (en) * 2016-06-30 2021-12-14 国立大学法人京都大学 Method for manufacturing probe and probe
JP6669608B2 (en) * 2016-08-03 2020-03-18 日本電信電話株式会社 Semiconductor nanowire laser and method of manufacturing the same
US9952097B1 (en) * 2016-10-25 2018-04-24 Institut National D'optique Infrared scene projector and conversion chip therefore
DE102016121462A1 (en) * 2016-11-09 2018-05-09 Aixtron Se Structured germ layer
CN106653952B (en) * 2017-01-17 2018-05-08 南京大学 A kind of preparation method of the middle infrared antireflective micro-structure of silicon
GB201705755D0 (en) 2017-04-10 2017-05-24 Norwegian Univ Of Science And Tech (Ntnu) Nanostructure
CN107154447B (en) * 2017-05-24 2024-01-30 中国电子科技集团公司第十三研究所 Silicon-based detector and preparation method thereof
CN109427488A (en) * 2017-08-28 2019-03-05 絜静精微有限公司 In conjunction with electrochemistry and the thin-film solar cells epitaxy method of nanometer transfer printing
US11527835B2 (en) * 2017-09-15 2022-12-13 Commscope Technologies Llc Methods of preparing a composite dielectric material
KR20190074067A (en) * 2017-12-19 2019-06-27 삼성전자주식회사 Light emitting device package
CN108470674B (en) * 2018-01-16 2020-07-14 长春理工大学 Preparation method for realizing pure-phase GaAs nanowire by utilizing stress regulation
JP6863909B2 (en) * 2018-01-18 2021-04-21 日本電信電話株式会社 Nanowire optical device
US10854714B2 (en) * 2018-04-20 2020-12-01 Taiwan Semiconductor Manufacturing Co., Ltd. Germanium containing nanowires and methods for forming the same
US11402672B2 (en) * 2018-05-03 2022-08-02 X Development Llc Quantum confined nanostructures with improved homogeneity and methods for making the same
US11139402B2 (en) 2018-05-14 2021-10-05 Synopsys, Inc. Crystal orientation engineering to achieve consistent nanowire shapes
KR102057700B1 (en) * 2018-05-18 2019-12-19 연세대학교 산학협력단 Layered GaAs, manufacturing method thereof and exfoliated GaAs nanosheet therefrom
CN109103271B (en) * 2018-07-16 2020-11-20 中国空间技术研究院 X-ray detector based on nano carbon material/silicon heterojunction and preparation method thereof
CA3131807C (en) 2019-03-08 2024-03-26 Infinite Potential Laboratories Lp Quantum control devices and methods
US11264458B2 (en) 2019-05-20 2022-03-01 Synopsys, Inc. Crystal orientation engineering to achieve consistent nanowire shapes
CN110272016B (en) * 2019-06-24 2022-05-20 西安交通大学 Construction method of solid surface three-dimensional nanostructure
TWI740241B (en) * 2019-10-22 2021-09-21 國立勤益科技大學 Production method of flexible visible light detector
US11695100B2 (en) 2020-01-21 2023-07-04 Nanosys, Inc. Light emitting diode containing a grating and methods of making the same
CN111446618B (en) * 2020-02-27 2021-03-05 电子科技大学 Three-end 8-shaped annular quantum cascade laser
TWI759872B (en) * 2020-09-21 2022-04-01 行政院原子能委員會核能研究所 Measuring device for solar cells
TWI809959B (en) * 2022-06-30 2023-07-21 南亞科技股份有限公司 Shift measurement device and operating method thereof
CN116053729B (en) * 2023-03-31 2023-06-20 南京大学 Reconfigurable spin wave transmission channel based on nano magnet array

Family Cites Families (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58191421A (en) * 1982-05-04 1983-11-08 Nec Corp Substrate for growing compound semiconductor and manufacture of compound semiconductor
FR2658839B1 (en) 1990-02-23 1997-06-20 Thomson Csf METHOD FOR CONTROLLED GROWTH OF ACICULAR CRYSTALS AND APPLICATION TO THE PRODUCTION OF POINTED MICROCATHODES.
US5362972A (en) 1990-04-20 1994-11-08 Hitachi, Ltd. Semiconductor device using whiskers
US5332910A (en) 1991-03-22 1994-07-26 Hitachi, Ltd. Semiconductor optical device with nanowhiskers
JPH04296060A (en) * 1991-03-26 1992-10-20 Hitachi Ltd Solar cell
JPH059099A (en) 1991-06-28 1993-01-19 Canon Inc Method for growing crystal
US5196396A (en) 1991-07-16 1993-03-23 The President And Fellows Of Harvard College Method of making a superconducting fullerene composition by reacting a fullerene with an alloy containing alkali metal
US5296719A (en) * 1991-07-22 1994-03-22 Matsushita Electric Industrial Co., Ltd. Quantum device and fabrication method thereof
JPH0555502A (en) * 1991-08-29 1993-03-05 Hitachi Ltd Quantum coupling memory
JPH0585899A (en) 1991-10-01 1993-04-06 Nippon Telegr & Teleph Corp <Ntt> Preparation of needlelike single crystal
US5362910A (en) * 1991-10-08 1994-11-08 Nicca Chemical Co., Ltd. Germicidal and fungicidal agent and a germicidal and fungicidal method
JP2697474B2 (en) 1992-04-30 1998-01-14 松下電器産業株式会社 Manufacturing method of microstructure
JP2821061B2 (en) 1992-05-22 1998-11-05 電気化学工業株式会社 Single crystal manufacturing method
US5252835A (en) 1992-07-17 1993-10-12 President And Trustees Of Harvard College Machining oxide thin-films with an atomic force microscope: pattern and object formation on the nanometer scale
WO1995002709A2 (en) 1993-07-15 1995-01-26 President And Fellows Of Harvard College EXTENDED NITRIDE MATERIAL COMPRISING β-C3N¿4?
JPH07211951A (en) 1994-01-21 1995-08-11 Sanyo Electric Co Ltd Formation of thin film
JP2615437B2 (en) * 1994-09-20 1997-05-28 工業技術院長 High strength and high toughness silicon nitride sintered body and method for producing the same
GB9421138D0 (en) 1994-10-20 1994-12-07 Hitachi Europ Ltd Memory device
US6190634B1 (en) 1995-06-07 2001-02-20 President And Fellows Of Harvard College Carbide nanomaterials
US6307241B1 (en) 1995-06-07 2001-10-23 The Regents Of The Unversity Of California Integrable ferromagnets for high density storage
US5897945A (en) 1996-02-26 1999-04-27 President And Fellows Of Harvard College Metal oxide nanorods
US6036774A (en) 1996-02-26 2000-03-14 President And Fellows Of Harvard College Method of producing metal oxide nanorods
JP2923753B2 (en) * 1996-08-21 1999-07-26 工業技術院長 Method for forming group III atomic layer
JPH10106960A (en) 1996-09-25 1998-04-24 Sony Corp Manufacture of quantum thin line
US5976957A (en) 1996-10-28 1999-11-02 Sony Corporation Method of making silicon quantum wires on a substrate
US5997832A (en) 1997-03-07 1999-12-07 President And Fellows Of Harvard College Preparation of carbide nanorods
JP3183845B2 (en) * 1997-03-21 2001-07-09 財団法人ファインセラミックスセンター Method for producing carbon nanotube and carbon nanotube film
WO1998048456A1 (en) * 1997-04-24 1998-10-29 Massachusetts Institute Of Technology Nanowire arrays
KR100223807B1 (en) 1997-06-04 1999-10-15 구본준 Method of manufacturing semiconductor device
JPH1160389A (en) 1997-08-07 1999-03-02 Denso Corp Production of silicon carbide single crystal
US5879827A (en) * 1997-10-10 1999-03-09 Minnesota Mining And Manufacturing Company Catalyst for membrane electrode assembly and method of making
JPH11177067A (en) * 1997-12-09 1999-07-02 Sony Corp Memory element and memory array
JP4651138B2 (en) * 1998-04-30 2011-03-16 旭化成株式会社 Method for producing zinc oxide structure
US6159742A (en) 1998-06-05 2000-12-12 President And Fellows Of Harvard College Nanometer-scale microscopy probes
JP4362874B2 (en) 1998-08-24 2009-11-11 ソニー株式会社 Semiconductor device having quantum structure and manufacturing method thereof
US6855202B2 (en) 2001-11-30 2005-02-15 The Regents Of The University Of California Shaped nanocrystal particles and methods for making the same
CN1086426C (en) * 1999-01-07 2002-06-19 南京化工大学 Prodn. method of potassium titanate whisker and fiber
US6559468B1 (en) 1999-03-29 2003-05-06 Hewlett-Packard Development Company Lp Molecular wire transistor (MWT)
US6358854B1 (en) * 1999-04-21 2002-03-19 Sandia Corporation Method to fabricate layered material compositions
JP4259677B2 (en) * 1999-06-30 2009-04-30 旭化成株式会社 METAL OXIDE STRUCTURE HAVING PROJECTION IN A SPECIFIC POSITION AND PROCESS FOR PRODUCING THE SAME
ATE481745T1 (en) 1999-07-02 2010-10-15 Harvard College ARRANGEMENT CONTAINING NANOSCOPIC WIRE, LOGICAL FIELDS AND METHOD FOR THE PRODUCTION THEREOF
JP2001020073A (en) * 1999-07-06 2001-01-23 Asahi Chem Ind Co Ltd Metallic oxide having laminated projection
US6322713B1 (en) 1999-07-15 2001-11-27 Agere Systems Guardian Corp. Nanoscale conductive connectors and method for making same
CN1112466C (en) * 1999-07-21 2003-06-25 中国科学院山西煤炭化学研究所 Preparation method of nanometer silicon carbide whiskers
US6286226B1 (en) 1999-09-24 2001-09-11 Agere Systems Guardian Corp. Tactile sensor comprising nanowires and method for making the same
US6340822B1 (en) * 1999-10-05 2002-01-22 Agere Systems Guardian Corp. Article comprising vertically nano-interconnected circuit devices and method for making the same
JP2001114600A (en) * 1999-10-14 2001-04-24 Asahi Kasei Corp Metal oxide structure and method for producing the same
GB0008546D0 (en) 2000-04-06 2000-05-24 Btg Int Ltd Optoelectronic devices
CN100335968C (en) 2000-05-04 2007-09-05 英国技术集团国际有限公司 Nanostructures
US6919119B2 (en) 2000-05-30 2005-07-19 The Penn State Research Foundation Electronic and opto-electronic devices fabricated from nanostructured high surface to volume ratio thin films
WO2002001648A1 (en) 2000-06-28 2002-01-03 Motorola, Inc. Semiconductor structure, device, circuit, and process
US7301199B2 (en) 2000-08-22 2007-11-27 President And Fellows Of Harvard College Nanoscale wires and related devices
CN101798057A (en) 2000-08-22 2010-08-11 哈佛学院董事会 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
US6620710B1 (en) * 2000-09-18 2003-09-16 Hewlett-Packard Development Company, L.P. Forming a single crystal semiconductor film on a non-crystalline surface
AU2001294585A1 (en) 2000-09-18 2002-03-26 President And Fellows Of Harvard College Fabrication of nanotube microscopy tips
US6743408B2 (en) 2000-09-29 2004-06-01 President And Fellows Of Harvard College Direct growth of nanotubes, and their use in nanotweezers
JP2002141633A (en) * 2000-10-25 2002-05-17 Lucent Technol Inc Article comprising vertically nano-interconnected circuit device and method for making the same
CA2430888C (en) 2000-12-11 2013-10-22 President And Fellows Of Harvard College Nanosensors
JP2002220300A (en) 2001-01-18 2002-08-09 Vision Arts Kk Nanofiber and method of producing the same
WO2002073699A2 (en) * 2001-03-14 2002-09-19 University Of Massachusetts Nanofabrication
TW554388B (en) 2001-03-30 2003-09-21 Univ California Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
DE10118405A1 (en) * 2001-04-12 2002-10-24 Infineon Technologies Ag Heterostructure component used in electronic devices comprises a single hetero-nanotube having regions made from nanotube materials having different energy band gaps value
US7084507B2 (en) * 2001-05-02 2006-08-01 Fujitsu Limited Integrated circuit device and method of producing the same
JP2004535066A (en) 2001-05-18 2004-11-18 プレジデント・アンド・フェロウズ・オブ・ハーバード・カレッジ Nanoscale wires and related devices
WO2003040446A2 (en) 2001-06-15 2003-05-15 The Pennsylvania State Research Foundation Method of purifying nanotubes and nanofibers using electromagnetic radiation
US6813077B2 (en) * 2001-06-19 2004-11-02 Corning Incorporated Method for fabricating an integrated optical isolator and a novel wire grid structure
AU2002364928C1 (en) 2001-07-20 2008-09-11 President And Fellows Of Harvard College Transition metal oxide nanowires, and devices incorporating them
US6586965B2 (en) 2001-10-29 2003-07-01 Hewlett Packard Development Company Lp Molecular crossbar latch
US6882767B2 (en) 2001-12-27 2005-04-19 The Regents Of The University Of California Nanowire optoelectric switching device and method
AU2003216070A1 (en) 2002-01-18 2003-09-02 California Institute Of Technology Array-based architecture for molecular electronics
US6759693B2 (en) * 2002-06-19 2004-07-06 Nantero, Inc. Nanotube permeable base transistor
AU2003290510A1 (en) * 2002-06-26 2004-04-19 Cornell Research Foundation, Inc. Small scale wires with microelectromechanical devices
US20040003838A1 (en) * 2002-07-05 2004-01-08 Curtin Lawrence F. Nano photovoltaic/solar cells
US7335908B2 (en) 2002-07-08 2008-02-26 Qunano Ab Nanostructures and methods for manufacturing the same
AU2003261205A1 (en) 2002-07-19 2004-02-09 President And Fellows Of Harvard College Nanoscale coherent optical components
EP1634334A1 (en) 2003-04-04 2006-03-15 Startskottet 22286 AB Nanowhiskers with pn junctions and methods of fabricating thereof
CN1829654B (en) 2003-04-04 2013-04-17 库纳诺公司 Precisely positioned nanowhiskers and nanowhisker arrays and method for preparing them
EP1642300A2 (en) 2003-07-08 2006-04-05 Qunamo AB Probe structures incorporating nanowhiskers, production methods thereof, and methods of forming nanowhiskers
US7662706B2 (en) 2003-11-26 2010-02-16 Qunano Ab Nanostructures formed of branched nanowhiskers and methods of producing the same
US7208094B2 (en) 2003-12-17 2007-04-24 Hewlett-Packard Development Company, L.P. Methods of bridging lateral nanowires and device using same
US7354850B2 (en) 2004-02-06 2008-04-08 Qunano Ab Directionally controlled growth of nanowhiskers
EP1766108A1 (en) 2004-06-25 2007-03-28 Btg International Limited Formation of nanowhiskers on a substrate of dissimilar material
US20060223211A1 (en) 2004-12-02 2006-10-05 The Regents Of The University Of California Semiconductor devices based on coalesced nano-rod arrays
AU2006258261A1 (en) 2005-06-16 2006-12-21 Qunano Ab Semiconductor nanowire transistor
US7826336B2 (en) 2006-02-23 2010-11-02 Qunano Ab Data storage nanostructures
US8183587B2 (en) 2006-12-22 2012-05-22 Qunano Ab LED with upstanding nanowire structure and method of producing such
US8049203B2 (en) 2006-12-22 2011-11-01 Qunano Ab Nanoelectronic structure and method of producing such

Also Published As

Publication number Publication date
AU2003244851A1 (en) 2004-01-23
WO2004004927A8 (en) 2004-03-04
CN100500950C (en) 2009-06-17
EP1525339A2 (en) 2005-04-27
EP2302108A1 (en) 2011-03-30
ATE557116T1 (en) 2012-05-15
JP5437229B2 (en) 2014-03-12
CN1681975A (en) 2005-10-12
CN101562205A (en) 2009-10-21
HK1135798A1 (en) 2010-06-11
EP1525339B1 (en) 2016-03-16
JP4948766B2 (en) 2012-06-06
WO2004004927A2 (en) 2004-01-15
US8450717B1 (en) 2013-05-28
CA2491941C (en) 2011-08-16
US8772626B2 (en) 2014-07-08
KR20050042774A (en) 2005-05-10
US9680039B2 (en) 2017-06-13
US7335908B2 (en) 2008-02-26
US7745813B2 (en) 2010-06-29
US20080188064A1 (en) 2008-08-07
US20080142784A1 (en) 2008-06-19
JP2005532181A (en) 2005-10-27
TWI318418B (en) 2009-12-11
KR101147053B1 (en) 2012-05-17
CA2741397A1 (en) 2004-01-15
CN101562205B (en) 2011-07-06
US20080105296A1 (en) 2008-05-08
US20150027523A1 (en) 2015-01-29
TW200406814A (en) 2004-05-01
US20040075464A1 (en) 2004-04-22
US7682943B2 (en) 2010-03-23
EP2302108B1 (en) 2012-05-09
JP2011121862A (en) 2011-06-23
AU2003244851A8 (en) 2004-01-23
US20130146835A1 (en) 2013-06-13

Similar Documents

Publication Publication Date Title
CA2491941A1 (en) Nanostructures and methods for manufacturing the same
KR102461045B1 (en) Lasers or LEDs based on nanowires grown on graphene-type substrates
KR101108998B1 (en) Precisely positioned nanowhiskers and nanowhisker arrays and method for preparing them
US7465954B2 (en) Nanowire devices and systems, light-emitting nanowires, and methods of precisely positioning nanoparticles
US7400665B2 (en) Nano-VCSEL device and fabrication thereof using nano-colonnades
CN101443887B (en) Pulsed growth of GAN nanowires and applications in group III nitride semiconductor substrate materials and devices
JP2005532181A5 (en)
JPH06510163A (en) Selective area regrowth of surface emitting lasers and other sharp shapes
US7026640B2 (en) Method and systems for dynamically controlling electromagnetic wave motion through a photonic crystal
CN108028513A (en) Nanowire lasers structure and manufacture method
EP3522203A1 (en) Nanoelement device with at least one nanoelement for electrical and/or optical coupling, and method of manufacturing thereof
JP3615453B2 (en) Crystal growth apparatus and method
CN1331195C (en) Method of producing integrated semiconductor components on a semiconductor substrate
JP2017195364A (en) Optical device and method for manufacturing the same

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed

Effective date: 20170710