CA2521498A1 - Nanowhiskers with pn junctions and methods of fabricating thereof - Google Patents
Nanowhiskers with pn junctions and methods of fabricating thereof Download PDFInfo
- Publication number
- CA2521498A1 CA2521498A1 CA002521498A CA2521498A CA2521498A1 CA 2521498 A1 CA2521498 A1 CA 2521498A1 CA 002521498 A CA002521498 A CA 002521498A CA 2521498 A CA2521498 A CA 2521498A CA 2521498 A1 CA2521498 A1 CA 2521498A1
- Authority
- CA
- Canada
- Prior art keywords
- nanowhisker
- nanoelement
- layer
- conductivity type
- regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims 24
- 239000000463 material Substances 0.000 claims abstract 56
- 239000002019 doping agent Substances 0.000 claims abstract 24
- 239000002800 charge carrier Substances 0.000 claims abstract 19
- 239000004065 semiconductor Substances 0.000 claims abstract 14
- 239000002861 polymer material Substances 0.000 claims abstract 9
- 239000000758 substrate Substances 0.000 claims 15
- 239000002178 crystalline material Substances 0.000 claims 8
- 238000009792 diffusion process Methods 0.000 claims 6
- 239000011159 matrix material Substances 0.000 claims 4
- 238000004871 chemical beam epitaxy Methods 0.000 claims 3
- 150000002500 ions Chemical class 0.000 claims 3
- 238000000137 annealing Methods 0.000 claims 2
- 230000002349 favourable effect Effects 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 239000012808 vapor phase Substances 0.000 claims 1
- 239000000969 carrier Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/04—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt
- C30B11/08—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt every component of the crystal composition being added during the crystallisation
- C30B11/12—Vaporous components, e.g. vapour-liquid-solid-growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
- C30B29/62—Whiskers or needles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02461—Phosphides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02463—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02543—Phosphides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02603—Nanowires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02653—Vapour-liquid-solid growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2258—Diffusion into or out of AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0676—Nanowires or nanotubes oriented perpendicular or at an angle to a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/068—Nanowires or nanotubes comprising a junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/88—Tunnel-effect diodes
- H01L29/885—Esaki diodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
Abstract
Nano-engineered structures are disclosed, incorporating nanowhiskers of high mobility conductivity and incorporating pn junctions. In one embodiment, a nanowhisker of a first semiconducting material has a first band gap, and an enclosure comprising at least one second material with a second band gap encloses said nanoelement along at least part of its length, the second material being doped to provide opposite conductivity type charge carriers in respective first and second regions along the length of the of the nanowhisker, whereby to create in the nanowhisker by transfer of charge carriers into the nanowhisker, corresponding first and second regions of opposite conductivity type charge carriers with a region depleted of free carriers therebetween. In another embodiment, a nanowhisker is surrounded by polymer material containing dopant material. In a further embodiment, a nanowhisker has a heterojunction between two different intrinsic materials, and Fermi level pinning creates a pn junction at the interface without doping.
Claims (35)
1. A nanoengineered structure comprising:
a one-dimensional nanoelement of a first crystalline semiconducting material having a first bandgap, an enclosure comprising at least one second material having a second bandgap enclosing and in contact with said nanoelement along at least part of its length, said second material being doped to provide opposite conductivity type charge carriers in respective first and second regions along the length of the of the nanoelement, whereby corresponding first and second regions of opposite conductivity type charge carriers are created within the nanoelement with a pn junction therebetween by transfer of charge carriers into said nanoelement, and wherein the bandgaps are such that it is energetically favorable for the charge carriers to remain in said nanoelement.
a one-dimensional nanoelement of a first crystalline semiconducting material having a first bandgap, an enclosure comprising at least one second material having a second bandgap enclosing and in contact with said nanoelement along at least part of its length, said second material being doped to provide opposite conductivity type charge carriers in respective first and second regions along the length of the of the nanoelement, whereby corresponding first and second regions of opposite conductivity type charge carriers are created within the nanoelement with a pn junction therebetween by transfer of charge carriers into said nanoelement, and wherein the bandgaps are such that it is energetically favorable for the charge carriers to remain in said nanoelement.
2. A structure as claimed in claim 1, wherein the nanoelement comprises a nanowhisker upstanding from a substrate.
3. A structure as claimed in claim 1, wherein said enclosure comprises a coaxial jacket
4. A structure as claimed in claim 1, wherein the enclosure is an encapsulating matrix.
5. A structure as claimed in claim 1, wherein said at least one second material comprises a semiconductor material deposited on the sides of said nanoelement.
6. A structure as claimed in claim 3, including a matrix at least partially surrounding said coaxial jacket, and providing dopant ions of at least one type thereto.
7. A structure as claimed in claim 1, wherein the doping levels are such as to create degenerate doping within each of the first and second regions of the nanoelement, so that the pn junction functions as a tunnel diode.
8. A method of forming a pn junction within a one-dimensional nanoelement, the method comprising, providing a one-dimensional nanoelement of a first semiconducting material having a first band gap, forming an enclosure comprising at least one second material having a second band gap enclosing and in contact with said nanoelement along at least part of its length, and doping said second material to provide opposite conductivity type charge carriers in respective first and second regions along the length of the of the nanoelement, whereby to create in the nanoelement corresponding first and second regions of opposite conductivity type charge carriers with a pn junction therebetween by transfer of charge carriers into the nanoelement, and wherein the band gaps are such that it is energetically favorable for the charge carriers to remain in said nanoelement.
9. A method as claimed in claim 8, wherein said enclosure comprises a coaxial jacket.
10. A method as claimed in claim 9, additionally comprising providing a matrix at least partially surrounding said coaxial jacket, said matrix containing dopant ions of at least one conductivity type.
11. A method of producing a one-dimensional nanoelement of desired conductivity, the method comprising the steps of:
(1) forming a nanowhisker on a substrate by a chemical beam epitaxy method,, (2) changing at least one condition of growth in the chemical beam epitaxy method so that a coaxial layer is formed around the nanowhisker, and (3) introducing dopant material into the coaxial layer by a vapor phase method, whereby charge carriers from the dopant material diffuse into the nanowhisker to create said desired conductivity.
(1) forming a nanowhisker on a substrate by a chemical beam epitaxy method,, (2) changing at least one condition of growth in the chemical beam epitaxy method so that a coaxial layer is formed around the nanowhisker, and (3) introducing dopant material into the coaxial layer by a vapor phase method, whereby charge carriers from the dopant material diffuse into the nanowhisker to create said desired conductivity.
12. A method of forming a one-dimensional nanoelement of a desired conductivity, comprising:
(a) forming a one-dimensional nanoelement on a substrate, the nanoelement being formed of a first material;
(b) forming at least a first layer of a second material on the substrate, the second material surrounding, at least partially, the nanoelement, the second material having a first conductivity type dopant material therein, and (c) processing the second material so that said dopant material diffuses into the nanoelement, whereby to create a desired conductivity therein.
(a) forming a one-dimensional nanoelement on a substrate, the nanoelement being formed of a first material;
(b) forming at least a first layer of a second material on the substrate, the second material surrounding, at least partially, the nanoelement, the second material having a first conductivity type dopant material therein, and (c) processing the second material so that said dopant material diffuses into the nanoelement, whereby to create a desired conductivity therein.
13. A method according to claim 12, wherein, step (a) comprises forming a nanowhisker upstanding from the substrate, and in step (b) the first layer of the second material is formed by depositing a polymer material on the substrate.
14. A method according to claim 12, wherein step (c) is a thermal annealing step to create said diffusion.
15. A one-dimensional nanoelement of a desired conductivity type formed on a substrate, comprising:
a one-dimensional nanoelement of a first material disposed on the substrate, and at least a first layer of a second material formed on the substrate, surrounding the nanoelement at least partially and in contact with the nanoelement, the second material having a first conductivity type dopant material therein, said first conductivity type dopant material having diffused into the nanoelement, whereby to create a desired conductivity within the nanoelement.
a one-dimensional nanoelement of a first material disposed on the substrate, and at least a first layer of a second material formed on the substrate, surrounding the nanoelement at least partially and in contact with the nanoelement, the second material having a first conductivity type dopant material therein, said first conductivity type dopant material having diffused into the nanoelement, whereby to create a desired conductivity within the nanoelement.
16. A nanoelement according to claim 15, wherein the nanoelement comprises a nanowhisker upstanding from the substrate, and the second material comprises a polymer material.
17. A one-dimensional nanoelement with at least one pn junction therein, comprising:
a nanowhisker upstanding from a substrate;
a first layer of a material formed on the substrate and surrounding the nanowhisker and extending partway up the nanowhisker, the first layer having a first conductivity type dopant material therein; and a second layer of material formed on top of the first layer and surrounding the nanowhisker and extending towards the top of the nanowhisker, said second layer having a second conductivity type dopant material therein, whereby to create a pn junction within the nanowhisker between the first and second regions , by diffusion of charge carriers or dopant ions from said first and second layers into respective first and second regions of the nanowhisker.
a nanowhisker upstanding from a substrate;
a first layer of a material formed on the substrate and surrounding the nanowhisker and extending partway up the nanowhisker, the first layer having a first conductivity type dopant material therein; and a second layer of material formed on top of the first layer and surrounding the nanowhisker and extending towards the top of the nanowhisker, said second layer having a second conductivity type dopant material therein, whereby to create a pn junction within the nanowhisker between the first and second regions , by diffusion of charge carriers or dopant ions from said first and second layers into respective first and second regions of the nanowhisker.
18. A nanoelement according to claim 17, wherein the first and second layers are formed of semiconductor materials, and charge carriers from the first and second layers diffuse into respective first and second regions of the nanowhisker, whereby to create a pn junction within the nanowhisker between the first and second regions.
19. A nanoelement according to claim 17, wherein:
the first and second layers are formed of a polymer material, and said first conductivity type dopant material and said second conductivity type dopant material, having diffused into respective first and second regions of the nanowhisker, create a pn junction within the nanowhisker between the first and second regions.
the first and second layers are formed of a polymer material, and said first conductivity type dopant material and said second conductivity type dopant material, having diffused into respective first and second regions of the nanowhisker, create a pn junction within the nanowhisker between the first and second regions.
20. A nanoelement according to claim 17, additionally comprising:
a third layer of material on top of the second layer, said third layer of material surrounding the nanowhisker, being in contact with the nanowhisker, and extending towards the top of the nanowhisker, said third layer of material having said first conductivity type dopant material therein, so that diffusion from said third layer into a respective third region of the nanowhisker, creates a further pn junction within the nanowhisker between the second and third regions.
a third layer of material on top of the second layer, said third layer of material surrounding the nanowhisker, being in contact with the nanowhisker, and extending towards the top of the nanowhisker, said third layer of material having said first conductivity type dopant material therein, so that diffusion from said third layer into a respective third region of the nanowhisker, creates a further pn junction within the nanowhisker between the second and third regions.
21. A nanoelement according to claim 20, wherein:
the material of the third layer comprises a polymer material, and at least a portion of the dopant material in said third layer has diffused into said third region.
the material of the third layer comprises a polymer material, and at least a portion of the dopant material in said third layer has diffused into said third region.
22. A nanoelement according to claim 20, wherein:
the material of the third layer comprises a semiconducting material, and charge carriers from the dopant material in said third layer have diffused into said third region.
the material of the third layer comprises a semiconducting material, and charge carriers from the dopant material in said third layer have diffused into said third region.
23. A method of forming a one-dimensional nanoelement with a pn junction therein, comprising:
(a) forming a nanowhisker upstanding from a substrate;
(b) forming a first layer of material on the substrate, said first layer surrounding the nanowhisker, being in contact with the nanowhisker, and extending partway up the nanowhisker, said first layer having a first conductivity type dopant material therein, and (c) forming a second layer of material on top of the first layer, said second layer surrounding the nanowhisker, being in contact with the nanowhisker, and extending towards the top of the nanowhisker, said second layer having a second conductivity type dopant material therein, whereby diffusion from the first and second layers into respective first and second regions of the nanowhisker creates a pn junction within the nanowhisker between the first and second regions.
(a) forming a nanowhisker upstanding from a substrate;
(b) forming a first layer of material on the substrate, said first layer surrounding the nanowhisker, being in contact with the nanowhisker, and extending partway up the nanowhisker, said first layer having a first conductivity type dopant material therein, and (c) forming a second layer of material on top of the first layer, said second layer surrounding the nanowhisker, being in contact with the nanowhisker, and extending towards the top of the nanowhisker, said second layer having a second conductivity type dopant material therein, whereby diffusion from the first and second layers into respective first and second regions of the nanowhisker creates a pn junction within the nanowhisker between the first and second regions.
24. A method according to claim 23, wherein:
the first and second layers are formed of semiconductor materials, and charge carriers from the first and second layers diffuse into respective first and second regions of the nanowhisker, whereby to create a pn junction within the nanowhisker between the first and second regions.
the first and second layers are formed of semiconductor materials, and charge carriers from the first and second layers diffuse into respective first and second regions of the nanowhisker, whereby to create a pn junction within the nanowhisker between the first and second regions.
25. A method according to claim 23, wherein:
the first and second layers are formed of a polymer material, and said first conductivity type dopant material and said second conductivity type dopant material have diffused into respective first and second regions of the nanowhisker to create a pn junction within the nanowhisker between the first and second regions.
the first and second layers are formed of a polymer material, and said first conductivity type dopant material and said second conductivity type dopant material have diffused into respective first and second regions of the nanowhisker to create a pn junction within the nanowhisker between the first and second regions.
26. A method according to claim 25, wherein the polymer materials in said first and second layers are formed by evaporating polymer materials onto the substrate.
27. A method according to claim 25, including a step of thermal annealing to cause said diffusion of said dopant materials.
28. A method according to claim 23, additionally comprising:
(d) forming a third layer of material on top of the second layer, said third layer surrounding the nanowhisker, being in contact with the nanowhisker, and extending towards the top of the nanowhisker, said third layer of material having said first conductivity type dopant material therein, whereby diffusion from the second and third layers into respective second and third regions of the nanowhisker creates a further pn junction within the nanowhisker between the second and third regions.
(d) forming a third layer of material on top of the second layer, said third layer surrounding the nanowhisker, being in contact with the nanowhisker, and extending towards the top of the nanowhisker, said third layer of material having said first conductivity type dopant material therein, whereby diffusion from the second and third layers into respective second and third regions of the nanowhisker creates a further pn junction within the nanowhisker between the second and third regions.
29. A method according to claim 28, wherein:
the third layer is formed of a semiconductor material and charge carriers from the third layer diffuse into a respective third region of the nanowhisker, whereby to create a pn junction within the nanowhisker between the second and third region.
the third layer is formed of a semiconductor material and charge carriers from the third layer diffuse into a respective third region of the nanowhisker, whereby to create a pn junction within the nanowhisker between the second and third region.
30. A method according to claim 28, wherein:
the third layer is formed of a polymer material, and said first conductivity type dopant material diffuses into a respective third region of the nanowhisker, to create a pn junction within the nanowhisker between the second and third regions.
the third layer is formed of a polymer material, and said first conductivity type dopant material diffuses into a respective third region of the nanowhisker, to create a pn junction within the nanowhisker between the second and third regions.
31. A one-dimensional nanoelement comprising: .
a first segment of a first semiconductor crystalline material, and a second segment of a second semiconductor crystalline material different from that of the first segment, whereby a heterojunction is formed between said first segment and second segment, wherein the first and second materials are selected such that charge carriers of opposite conductivity type are provided at opposite sides of the heterojunction so as to create a pn junction with predetermined characteristics, which characteristics are at least partially determined by Fermi level pinning.
a first segment of a first semiconductor crystalline material, and a second segment of a second semiconductor crystalline material different from that of the first segment, whereby a heterojunction is formed between said first segment and second segment, wherein the first and second materials are selected such that charge carriers of opposite conductivity type are provided at opposite sides of the heterojunction so as to create a pn junction with predetermined characteristics, which characteristics are at least partially determined by Fermi level pinning.
32. A one-dimensional nanoelement comprising:
a first segment of a first semiconductor crystalline material, and a second segment of a second semiconductor crystalline material different from that of the first segment, whereby a heterojunction is formed between said first segment and second segment, wherein Fermi level pinning.at side facets of said first semiconductor crystalline material and said second semiconductor crystalline material determines the conductivity type of said first segment and said second segment.
a first segment of a first semiconductor crystalline material, and a second segment of a second semiconductor crystalline material different from that of the first segment, whereby a heterojunction is formed between said first segment and second segment, wherein Fermi level pinning.at side facets of said first semiconductor crystalline material and said second semiconductor crystalline material determines the conductivity type of said first segment and said second segment.
33. A method of forming a pn junction comprising:
forming a one-dimensional nanoelement having a first segment of a first crystalline material, and a second segment of a second crystalline material different from that of the first segment, whereby a heterojunction is formed between said first segment and said segment , wherein the first and second materials are selected so as to provide charge carriers of opposite conductivity type atopposite sides of the heterojunction so as to create a pn junction with predetermined characteristics, which characteristics are at least partially determined by Fermi level pinning.
forming a one-dimensional nanoelement having a first segment of a first crystalline material, and a second segment of a second crystalline material different from that of the first segment, whereby a heterojunction is formed between said first segment and said segment , wherein the first and second materials are selected so as to provide charge carriers of opposite conductivity type atopposite sides of the heterojunction so as to create a pn junction with predetermined characteristics, which characteristics are at least partially determined by Fermi level pinning.
34. A method according to claim 33, wherein the nanoelement is grown as a nanowhisker by Chemical Beam Epitaxy.
35. A method according to claim 33, wherein the nanowhisker is grown under Group III-rich conditions to create an excess of Group III atoms at the surface of the nanowhisker.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45999003P | 2003-04-04 | 2003-04-04 | |
US60/459,990 | 2003-04-04 | ||
PCT/GB2004/001406 WO2004088755A1 (en) | 2003-04-04 | 2004-04-01 | Nanowhiskers with pn junctions and methods of fabricating thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2521498A1 true CA2521498A1 (en) | 2004-10-14 |
CA2521498C CA2521498C (en) | 2012-06-05 |
Family
ID=33131909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA2521498A Expired - Fee Related CA2521498C (en) | 2003-04-04 | 2004-04-01 | Nanowhiskers with pn junctions and methods of fabricating thereof |
Country Status (7)
Country | Link |
---|---|
US (4) | US7432522B2 (en) |
EP (1) | EP1634334A1 (en) |
JP (1) | JP5122812B2 (en) |
KR (1) | KR101064318B1 (en) |
CN (1) | CN1826694B (en) |
CA (1) | CA2521498C (en) |
WO (1) | WO2004088755A1 (en) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7335908B2 (en) | 2002-07-08 | 2008-02-26 | Qunano Ab | Nanostructures and methods for manufacturing the same |
WO2004088755A1 (en) * | 2003-04-04 | 2004-10-14 | Startskottet 22286 Ab | Nanowhiskers with pn junctions and methods of fabricating thereof |
US7662706B2 (en) * | 2003-11-26 | 2010-02-16 | Qunano Ab | Nanostructures formed of branched nanowhiskers and methods of producing the same |
KR100601949B1 (en) * | 2004-04-07 | 2006-07-14 | 삼성전자주식회사 | Nanowire light emitting device |
KR100624419B1 (en) * | 2004-04-07 | 2006-09-19 | 삼성전자주식회사 | Nanowire light emitting device and method of fabricating the same |
KR100552707B1 (en) * | 2004-04-07 | 2006-02-20 | 삼성전자주식회사 | Nanowire light emitting device and method of fabricating the same |
GB0413310D0 (en) | 2004-06-15 | 2004-07-14 | Koninkl Philips Electronics Nv | Nanowire semiconductor device |
US7528002B2 (en) * | 2004-06-25 | 2009-05-05 | Qunano Ab | Formation of nanowhiskers on a substrate of dissimilar material |
US7400665B2 (en) * | 2004-11-05 | 2008-07-15 | Hewlett-Packard Developement Company, L.P. | Nano-VCSEL device and fabrication thereof using nano-colonnades |
US7307271B2 (en) * | 2004-11-05 | 2007-12-11 | Hewlett-Packard Development Company, L.P. | Nanowire interconnection and nano-scale device applications |
JP2006239857A (en) * | 2005-02-25 | 2006-09-14 | Samsung Electronics Co Ltd | Silicon nano-wire, semiconductor element including silicon nano-wire, and method for manufacturing silicon nano-wire |
US7305161B2 (en) * | 2005-02-25 | 2007-12-04 | Board Of Regents, The University Of Texas System | Encapsulated photonic crystal structures |
KR100677771B1 (en) * | 2005-03-31 | 2007-02-02 | 주식회사 하이닉스반도체 | Capacitor with nanotube and method for manufacturing the same |
US8330173B2 (en) | 2005-06-25 | 2012-12-11 | Seoul Opto Device Co., Ltd. | Nanostructure having a nitride-based quantum well and light emitting diode employing the same |
WO2007057802A1 (en) * | 2005-11-18 | 2007-05-24 | Nxp B.V. | Metal-base nanowire transistor |
FR2897195B1 (en) * | 2006-02-09 | 2008-05-02 | Commissariat Energie Atomique | FERROMAGNETIC SEMICONDUCTOR, METHOD FOR MANUFACTURING THE SAME, INCORPORATING COMPONENTS, AND USES THEREOF FOR THE SEMICONDUCTOR |
JP4635897B2 (en) * | 2006-02-15 | 2011-02-23 | 株式会社東芝 | Semiconductor device and manufacturing method thereof |
US7826336B2 (en) * | 2006-02-23 | 2010-11-02 | Qunano Ab | Data storage nanostructures |
US20080008844A1 (en) * | 2006-06-05 | 2008-01-10 | Martin Bettge | Method for growing arrays of aligned nanostructures on surfaces |
FR2904146B1 (en) * | 2006-07-20 | 2008-10-17 | Commissariat Energie Atomique | METHOD FOR MANUFACTURING NANOSTRUCTURE BASED ON INTERCONNECTED NANOWIRES, NANOSTRUCTURE AND USE AS A THERMOELECTRIC CONVERTER |
WO2008034823A1 (en) | 2006-09-18 | 2008-03-27 | Qunano Ab | Method of producing precision vertical and horizontal layers in a vertical semiconductor structure |
JP2010503981A (en) * | 2006-09-19 | 2010-02-04 | クナノ アーベー | Nanoscale field-effect transistor structure |
US8183587B2 (en) * | 2006-12-22 | 2012-05-22 | Qunano Ab | LED with upstanding nanowire structure and method of producing such |
US8049203B2 (en) | 2006-12-22 | 2011-11-01 | Qunano Ab | Nanoelectronic structure and method of producing such |
KR20090096704A (en) * | 2006-12-22 | 2009-09-14 | 큐나노 에이비 | Led with upstanding nanowire structure and method of producing such |
US8227817B2 (en) * | 2006-12-22 | 2012-07-24 | Qunano Ab | Elevated LED |
EP2095426A4 (en) * | 2006-12-22 | 2012-10-10 | Qunano Ab | Nanoelectronic structure and method of producing such |
US20080157354A1 (en) * | 2007-01-03 | 2008-07-03 | Sharp Laboratories Of America, Inc. | Multiple stacked nanostructure arrays and methods for making the same |
US20080315430A1 (en) * | 2007-06-22 | 2008-12-25 | Qimonda Ag | Nanowire vias |
JP5096824B2 (en) * | 2007-07-24 | 2012-12-12 | 日本電信電話株式会社 | Nanostructure and method for producing nanostructure |
EP2058908A1 (en) | 2007-10-22 | 2009-05-13 | Commissariat A L'energie Atomique | Structure for an optoelectronical device including micropillar like semi-conductors and corresponding processes. |
FR2922685B1 (en) * | 2007-10-22 | 2011-02-25 | Commissariat Energie Atomique | AN OPTOELECTRONIC DEVICE BASED ON NANOWIRES AND CORRESPONDING METHODS |
US7915146B2 (en) * | 2007-10-23 | 2011-03-29 | International Business Machines Corporation | Controlled doping of semiconductor nanowires |
KR20090041765A (en) * | 2007-10-24 | 2009-04-29 | 삼성모바일디스플레이주식회사 | Carbon nanotubes and method of growing the same, hybrid structure and method of growing the same and light emitting device |
US8084337B2 (en) | 2007-10-26 | 2011-12-27 | Qunano Ab | Growth of III-V compound semiconductor nanowires on silicon substrates |
US7947580B2 (en) * | 2007-12-11 | 2011-05-24 | International Business Machines Corporation | Hybrid semiconductor structure |
US8148800B2 (en) * | 2008-01-11 | 2012-04-03 | Hewlett-Packard Development Company, L.P. | Nanowire-based semiconductor device and method employing removal of residual carriers |
TWI437106B (en) * | 2008-12-03 | 2014-05-11 | Tatung Co | One dimension nano magnetic wires and manufacturing method thereof |
FR2941325B1 (en) | 2009-01-22 | 2011-04-22 | Commissariat Energie Atomique | METHOD FOR PERFORMING PN HOMOJUNCTION IN NANOSTRUCTURE |
WO2010087832A1 (en) * | 2009-01-29 | 2010-08-05 | Hewlett-Packard Development Company, L.P. | Semiconductor heterostructure thermoelectric device |
US8389388B2 (en) | 2009-04-30 | 2013-03-05 | Hewlett-Packard Development Company, L.P. | Photonic device and method of making the same |
US8211735B2 (en) * | 2009-06-08 | 2012-07-03 | International Business Machines Corporation | Nano/microwire solar cell fabricated by nano/microsphere lithography |
KR20120099441A (en) * | 2009-10-22 | 2012-09-10 | 솔 발테익스 에이비 | Nanowire tunnel diode and method for making the same |
US8563395B2 (en) * | 2009-11-30 | 2013-10-22 | The Royal Institute For The Advancement Of Learning/Mcgill University | Method of growing uniform semiconductor nanowires without foreign metal catalyst and devices thereof |
US9112085B2 (en) * | 2009-11-30 | 2015-08-18 | The Royal Institution For The Advancement Of Learning/Mcgill University | High efficiency broadband semiconductor nanowire devices |
EP2509119B1 (en) | 2009-12-01 | 2017-03-08 | National University Corporation Hokkaido University | Light emitting element and method for manufacturing same |
EP2541625A1 (en) | 2010-02-25 | 2013-01-02 | National University Corporation Hokkaido University | Semiconductor device and method for manufacturing semiconductor device |
EP2754176A4 (en) * | 2011-09-08 | 2015-04-15 | Univ California | Sensor for law force-noise detection in liquids |
US9142400B1 (en) | 2012-07-17 | 2015-09-22 | Stc.Unm | Method of making a heteroepitaxial layer on a seed area |
FR2997420B1 (en) | 2012-10-26 | 2017-02-24 | Commissariat Energie Atomique | PROCESS FOR GROWING AT LEAST ONE NANOFIL FROM A TWO-STEP NITRIDE TRANSITION METAL LAYER |
FR2997557B1 (en) | 2012-10-26 | 2016-01-01 | Commissariat Energie Atomique | NANOFIL ELECTRONIC DEVICE WITH TRANSITION METAL BUFFER LAYER, METHOD OF GROWING AT LEAST ONE NANOWIL, AND DEVICE MANUFACTURING METHOD |
US10828400B2 (en) | 2014-06-10 | 2020-11-10 | The Research Foundation For The State University Of New York | Low temperature, nanostructured ceramic coatings |
DE102017002935A1 (en) * | 2017-03-24 | 2018-09-27 | 3-5 Power Electronics GmbH | III-V semiconductor diode |
JP6954562B2 (en) * | 2017-09-15 | 2021-10-27 | セイコーエプソン株式会社 | Light emitting device and its manufacturing method, and projector |
Family Cites Families (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2658839B1 (en) | 1990-02-23 | 1997-06-20 | Thomson Csf | METHOD FOR CONTROLLED GROWTH OF ACICULAR CRYSTALS AND APPLICATION TO THE PRODUCTION OF POINTED MICROCATHODES. |
US5362972A (en) * | 1990-04-20 | 1994-11-08 | Hitachi, Ltd. | Semiconductor device using whiskers |
US5332910A (en) * | 1991-03-22 | 1994-07-26 | Hitachi, Ltd. | Semiconductor optical device with nanowhiskers |
US5196396A (en) * | 1991-07-16 | 1993-03-23 | The President And Fellows Of Harvard College | Method of making a superconducting fullerene composition by reacting a fullerene with an alloy containing alkali metal |
JP2697474B2 (en) * | 1992-04-30 | 1998-01-14 | 松下電器産業株式会社 | Manufacturing method of microstructure |
JP2821061B2 (en) | 1992-05-22 | 1998-11-05 | 電気化学工業株式会社 | Single crystal manufacturing method |
US5252835A (en) * | 1992-07-17 | 1993-10-12 | President And Trustees Of Harvard College | Machining oxide thin-films with an atomic force microscope: pattern and object formation on the nanometer scale |
JPH06244457A (en) * | 1993-02-16 | 1994-09-02 | Nisshin Steel Co Ltd | Manufacture of light emitting diode |
AU8070294A (en) * | 1993-07-15 | 1995-02-13 | President And Fellows Of Harvard College | Extended nitride material comprising beta -c3n4 |
IT231978Y1 (en) * | 1993-09-27 | 1999-08-10 | Albatros System Spa | HYDRAULIC FITTING FOR BATHTUB, OR SIMILAR |
US6307241B1 (en) * | 1995-06-07 | 2001-10-23 | The Regents Of The Unversity Of California | Integrable ferromagnets for high density storage |
US6190634B1 (en) * | 1995-06-07 | 2001-02-20 | President And Fellows Of Harvard College | Carbide nanomaterials |
US5897945A (en) * | 1996-02-26 | 1999-04-27 | President And Fellows Of Harvard College | Metal oxide nanorods |
US6036774A (en) | 1996-02-26 | 2000-03-14 | President And Fellows Of Harvard College | Method of producing metal oxide nanorods |
JPH10106960A (en) * | 1996-09-25 | 1998-04-24 | Sony Corp | Manufacture of quantum thin line |
JPH10112543A (en) * | 1996-10-04 | 1998-04-28 | Oki Electric Ind Co Ltd | Semiconductor element and its manufacture |
US5976957A (en) * | 1996-10-28 | 1999-11-02 | Sony Corporation | Method of making silicon quantum wires on a substrate |
IL119719A0 (en) * | 1996-11-29 | 1997-02-18 | Yeda Res & Dev | Inorganic fullerene-like structures of metal chalcogenides |
US5997832A (en) * | 1997-03-07 | 1999-12-07 | President And Fellows Of Harvard College | Preparation of carbide nanorods |
KR100223807B1 (en) * | 1997-06-04 | 1999-10-15 | 구본준 | Method of manufacturing semiconductor device |
US6159742A (en) * | 1998-06-05 | 2000-12-12 | President And Fellows Of Harvard College | Nanometer-scale microscopy probes |
JP4362874B2 (en) | 1998-08-24 | 2009-11-11 | ソニー株式会社 | Semiconductor device having quantum structure and manufacturing method thereof |
US7030408B1 (en) * | 1999-03-29 | 2006-04-18 | Hewlett-Packard Development Company, L.P. | Molecular wire transistor (MWT) |
AU782000B2 (en) | 1999-07-02 | 2005-06-23 | President And Fellows Of Harvard College | Nanoscopic wire-based devices, arrays, and methods of their manufacture |
US6322713B1 (en) * | 1999-07-15 | 2001-11-27 | Agere Systems Guardian Corp. | Nanoscale conductive connectors and method for making same |
US6286226B1 (en) * | 1999-09-24 | 2001-09-11 | Agere Systems Guardian Corp. | Tactile sensor comprising nanowires and method for making the same |
US6340822B1 (en) * | 1999-10-05 | 2002-01-22 | Agere Systems Guardian Corp. | Article comprising vertically nano-interconnected circuit devices and method for making the same |
GB0008546D0 (en) | 2000-04-06 | 2000-05-24 | Btg Int Ltd | Optoelectronic devices |
KR100756211B1 (en) * | 2000-05-04 | 2007-09-06 | 비티지 인터내셔널 리미티드 | Nanostructures |
AU2001271293A1 (en) | 2000-06-28 | 2002-01-08 | Motorola, Inc. | Semiconductor structure, device, circuit, and process |
JP4544382B2 (en) * | 2000-06-30 | 2010-09-15 | 株式会社アドヴィックス | Hydraulic brake device for vehicle |
US7301199B2 (en) * | 2000-08-22 | 2007-11-27 | President And Fellows Of Harvard College | Nanoscale wires and related devices |
WO2003005450A2 (en) | 2001-05-18 | 2003-01-16 | President And Fellows Of Harvard College | Nanoscale wires and related devices |
KR100984585B1 (en) * | 2000-08-22 | 2010-09-30 | 프레지던트 앤드 펠로우즈 오브 하버드 칼리지 | Nanosensors |
US6768754B1 (en) * | 2000-09-13 | 2004-07-27 | National Research Council Of Canada | Quantum dot tunable external cavity lasers (QD-TEC lasers) |
WO2002022499A1 (en) * | 2000-09-18 | 2002-03-21 | President And Fellows Of Harvard College | Fabrication of nanotube microscopy tips |
US6743408B2 (en) * | 2000-09-29 | 2004-06-01 | President And Fellows Of Harvard College | Direct growth of nanotubes, and their use in nanotweezers |
KR20090049095A (en) | 2000-12-11 | 2009-05-15 | 프레지던트 앤드 펠로우즈 오브 하버드 칼리지 | Nanosensors |
JP2002220300A (en) * | 2001-01-18 | 2002-08-09 | Vision Arts Kk | Nanofiber and method of producing the same |
US6882051B2 (en) * | 2001-03-30 | 2005-04-19 | The Regents Of The University Of California | Nanowires, nanostructures and devices fabricated therefrom |
DE10118405A1 (en) * | 2001-04-12 | 2002-10-24 | Infineon Technologies Ag | Heterostructure component used in electronic devices comprises a single hetero-nanotube having regions made from nanotube materials having different energy band gaps value |
WO2003040446A2 (en) * | 2001-06-15 | 2003-05-15 | The Pennsylvania State Research Foundation | Method of purifying nanotubes and nanofibers using electromagnetic radiation |
JP3918073B2 (en) * | 2001-06-25 | 2007-05-23 | 独立行政法人科学技術振興機構 | Method for synthesizing 3C-SiC nanowhiskers and 3C-SiC nanowhiskers |
US20050064731A1 (en) | 2001-07-20 | 2005-03-24 | Hongkun Park | Transition metal oxide nanowires |
US6586965B2 (en) * | 2001-10-29 | 2003-07-01 | Hewlett Packard Development Company Lp | Molecular crossbar latch |
US6882767B2 (en) * | 2001-12-27 | 2005-04-19 | The Regents Of The University Of California | Nanowire optoelectric switching device and method |
AU2003216070A1 (en) * | 2002-01-18 | 2003-09-02 | California Institute Of Technology | Array-based architecture for molecular electronics |
US7335908B2 (en) * | 2002-07-08 | 2008-02-26 | Qunano Ab | Nanostructures and methods for manufacturing the same |
WO2004010552A1 (en) | 2002-07-19 | 2004-01-29 | President And Fellows Of Harvard College | Nanoscale coherent optical components |
CN1829654B (en) * | 2003-04-04 | 2013-04-17 | 库纳诺公司 | Precisely positioned nanowhiskers and nanowhisker arrays and method for preparing them |
WO2004088755A1 (en) * | 2003-04-04 | 2004-10-14 | Startskottet 22286 Ab | Nanowhiskers with pn junctions and methods of fabricating thereof |
EP1642300A2 (en) * | 2003-07-08 | 2006-04-05 | Qunamo AB | Probe structures incorporating nanowhiskers, production methods thereof, and methods of forming nanowhiskers |
JP4438049B2 (en) * | 2003-08-11 | 2010-03-24 | キヤノン株式会社 | Field effect transistor, sensor using the same, and manufacturing method thereof |
US7662706B2 (en) * | 2003-11-26 | 2010-02-16 | Qunano Ab | Nanostructures formed of branched nanowhiskers and methods of producing the same |
US7208094B2 (en) * | 2003-12-17 | 2007-04-24 | Hewlett-Packard Development Company, L.P. | Methods of bridging lateral nanowires and device using same |
US7354850B2 (en) * | 2004-02-06 | 2008-04-08 | Qunano Ab | Directionally controlled growth of nanowhiskers |
US7528002B2 (en) * | 2004-06-25 | 2009-05-05 | Qunano Ab | Formation of nanowhiskers on a substrate of dissimilar material |
US20060263974A1 (en) * | 2005-05-18 | 2006-11-23 | Micron Technology, Inc. | Methods of electrically interconnecting different elevation conductive structures, methods of forming capacitors, methods of forming an interconnect between a substrate bit line contact and a bit line in DRAM, and methods of forming DRAM memory cell |
US7826336B2 (en) * | 2006-02-23 | 2010-11-02 | Qunano Ab | Data storage nanostructures |
US8183587B2 (en) * | 2006-12-22 | 2012-05-22 | Qunano Ab | LED with upstanding nanowire structure and method of producing such |
US8183566B2 (en) * | 2007-03-01 | 2012-05-22 | Hewlett-Packard Development Company, L.P. | Hetero-crystalline semiconductor device and method of making same |
SE532485C2 (en) * | 2007-03-27 | 2010-02-02 | Qunano Ab | Nanostructure for charge storage |
-
2004
- 2004-04-01 WO PCT/GB2004/001406 patent/WO2004088755A1/en active Search and Examination
- 2004-04-01 CN CN2004800155045A patent/CN1826694B/en not_active Expired - Fee Related
- 2004-04-01 US US10/814,630 patent/US7432522B2/en not_active Expired - Fee Related
- 2004-04-01 JP JP2006506067A patent/JP5122812B2/en not_active Expired - Fee Related
- 2004-04-01 EP EP04725089A patent/EP1634334A1/en not_active Ceased
- 2004-04-01 CA CA2521498A patent/CA2521498C/en not_active Expired - Fee Related
- 2004-04-01 KR KR1020057018920A patent/KR101064318B1/en not_active IP Right Cessation
-
2008
- 2008-08-22 US US12/230,086 patent/US7910492B2/en active Active
-
2011
- 2011-02-23 US US13/033,111 patent/US8120009B2/en not_active Expired - Fee Related
-
2012
- 2012-01-18 US US13/352,533 patent/US8242481B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR101064318B1 (en) | 2011-09-14 |
US8120009B2 (en) | 2012-02-21 |
US20050006673A1 (en) | 2005-01-13 |
CN1826694A (en) | 2006-08-30 |
CA2521498C (en) | 2012-06-05 |
US8242481B2 (en) | 2012-08-14 |
WO2004088755A1 (en) | 2004-10-14 |
JP2006522472A (en) | 2006-09-28 |
CN1826694B (en) | 2012-04-25 |
KR20050118229A (en) | 2005-12-15 |
JP5122812B2 (en) | 2013-01-16 |
US20110193055A1 (en) | 2011-08-11 |
US7432522B2 (en) | 2008-10-07 |
US20120126200A1 (en) | 2012-05-24 |
US7910492B2 (en) | 2011-03-22 |
EP1634334A1 (en) | 2006-03-15 |
WO2004088755A8 (en) | 2005-08-18 |
US20090014711A1 (en) | 2009-01-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2521498A1 (en) | Nanowhiskers with pn junctions and methods of fabricating thereof | |
US10236177B1 (en) | Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures | |
US7023018B2 (en) | SiGe transistor with strained layers | |
CN104051502B (en) | FORMATION OF BULK SiGe FIN WITH DIELECTRIC ISOLATION BY ANODIZATION | |
US8143144B2 (en) | Semiconductor nanowire and its manufacturing method | |
US7736919B2 (en) | Method of producing a light-emitting diode comprising a nanostructured PN junction and diode thus obtained | |
US20090242869A1 (en) | Super lattice/quantum well nanowires | |
US7737534B2 (en) | Semiconductor devices that include germanium nanofilm layer disposed within openings of silicon dioxide layer | |
CA2530067A1 (en) | Semiconductor device including band-engineered superlattice | |
DE112008003839T5 (en) | Photodiode based on nanowires | |
US20220367675A1 (en) | Methods for making bipolar junction transistors including emitter-base and base-collector superlattices | |
EP3141523A1 (en) | Method of forming nanostructure, method of manufacturing semiconductor device using the same, and semiconductor device including nanostructure | |
WO2006100640B1 (en) | Method of manufacturing a semiconductor device having a buried doped region | |
CN104600070A (en) | Substrate structure, cmos device, and method of manufacturing cmos device | |
Paquette et al. | Inhibition of Te surfactant effect on surface morphology of heavily Te-doped GaAs | |
US6599817B1 (en) | Semiconductor constructions, and methods of forming semiconductor constructions | |
US20060269745A1 (en) | Nano wires and method of manufacturing the same | |
KR970704246A (en) | Method for preparing a semiconductor substrate and semiconductor device according to the method | |
CN113035954B (en) | Full-surrounding gate horizontal penetration type transistor and preparation method thereof | |
US7449723B2 (en) | Semiconductor device | |
KR101599193B1 (en) | Nano wire solar cell and method of fabricating therof | |
CN117378053A (en) | Optoelectronic component and method for producing an optoelectronic component | |
JPH04132268A (en) | Semiconductor device and manufacture thereof | |
JPH07162015A (en) | Semiconductor element having fine wire structure and manufacture thereof | |
KR940027195A (en) | Emitter-Collector Self-Matching Transistor and Manufacturing Method Thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |
Effective date: 20170403 |