CA2523700A1 - Preformed emi/rfi shielding compositions in shaped form - Google Patents

Preformed emi/rfi shielding compositions in shaped form Download PDF

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Publication number
CA2523700A1
CA2523700A1 CA002523700A CA2523700A CA2523700A1 CA 2523700 A1 CA2523700 A1 CA 2523700A1 CA 002523700 A CA002523700 A CA 002523700A CA 2523700 A CA2523700 A CA 2523700A CA 2523700 A1 CA2523700 A1 CA 2523700A1
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CA
Canada
Prior art keywords
composition
preformed
weight
preformed composition
aperture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002523700A
Other languages
French (fr)
Other versions
CA2523700C (en
Inventor
Michael A. Cosman
Adrian Balladares
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PRC Desoto International Inc
Original Assignee
Prc-Desoto International, Inc.
Michael A. Cosman
Adrian Balladares
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Prc-Desoto International, Inc., Michael A. Cosman, Adrian Balladares filed Critical Prc-Desoto International, Inc.
Publication of CA2523700A1 publication Critical patent/CA2523700A1/en
Application granted granted Critical
Publication of CA2523700C publication Critical patent/CA2523700C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/04—Polysulfides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D181/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Coating compositions based on polysulfones; Coating compositions based on derivatives of such polymers
    • C09D181/04—Polysulfides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties

Abstract

Electrically conductive preformed compositions comprising sulfur-containing polymers in shaped form and the use of preformed compositions in shaped form to seal apertures are disclosed. The preformed compositions can be used to seal an aperture having EMI/RFI shielding effectiveness.

Claims (27)

1. A performed composition in shaped-form comprising:

a base composition comprising at least one sulfur-containing polymer, and at least one electrically conductive filler; and a curing agent composition;
wherein the preformed composition is capable of shielding EMI/RFI
radiation.
2. The preformed composition of claim 1, wherein the preformed composition comprises 5 parts to 20 parts by weight of the curing agent composition, and 100 parts by weight of the base composition.
3. The preformed composition of claim 1, wherein the at least one sulfur-containing polymer is present in an amount ranging from 10% by weight to 50%
by weight of the total weight of the base composition.
4. The preformed composition of claim 1, wherein the at least one sulfur-containing polymer is chosen from a polysulfide polymer, a mercapto-terminated polymer, and a combination of a polysulfide polymer and a mercapto-terminated polymer.
5. The preformed composition of claim 1, wherein the at least one electrically conductive filler is present in an amount ranging from 40% to 80%
by weight of the total weight of the base composition.
6. The preformed composition of claim 1, wherein the at least one electrically conductive filler comprises Ni fiber, and Ni-coated graphite.
7. The preformed composition of claim 6, wherein the Ni fiber is present in an amount ranging from 4% to 8% by weight of the total weight of the base composition, and the Ni-coated graphite is present in an amount ranging from 50% to 70% of the total weight of the base composition.
8. The performed composition of claim 1, further comprising at least one corrosion inhibitor.
9. The preformed composition of claim 8, wherein the at least one corrosion inhibitor inhibits galvanic corrosion.
10. The preformed composition of claim 8, wherein the at least one corrosion inhibitor comprises calcium chromate.
11. The preformed composition of claim 8, wherein the at least one corrosion inhibitor is present in an amount ranging from 3% by weight to 7% by weight of the total weight of the base composition.
12. The preformed composition of claim 1, further comprising at least one adhesion promoter.
13. The preformed composition of claim 12, wherein the at least one adhesion promoter comprises a phenolic adhesion promoter, a mercapto-silane adhesion promoter, and an epoxy-silane adhesion promoter.
14. The preformed composition of claim 12, wherein the at least one adhesion promoter is present in an amount ranging from 1% by weight to 6% by weight of the total weight of the base composition.
15. The preformed composition of claim 1, wherein the preformed composition is curable at a temperature ranging from 10°C to 30°C.
16. The preformed composition of claim 1, wherein the preformed composition is refrigerated prior to application.
17. The preformed composition of claim 1, wherein the cured preformed composition exhibits a surface resistivity of less than 0.50 .OMEGA./ .
18. The preformed composition of claim 1, wherein the curing agent composition comprises a manganese dioxide curing agent.
19. The preformed composition of claim 18, wherein the manganese dioxide is present in the curing agent composition in an amount ranging from 25% to 75% by weight of the total weight of the curing agent composition.
20. A method of sealing an aperture to provide EMI/RFI shielding effectiveness comprising applying a preformed composition in shaped-form comprising at least one sulfur-containing polymer, and at least one electrically conductive filler to a surface associated with an aperture to seal the aperture and provide EMI/RFI shielding effectiveness.
21. The method of claim 20, wherein the performed composition comprises a preformed composition according to claim 1.
22. The method of claim 20, wherein the surface is a surface of a removable panel.
23. The method of claim 20, wherein the surface is a surface adjacent to an opening.
24. The method of claim 20, wherein the aperture is on an aviation or an aerospace vehicle.
25. The method of claim 20, further comprising applying an adhesion promoter to at least one surface associated with the aperture prior to application of the preformed composition.
26. The method of claim 20, further comprising applying a release agent to a least one surface associated with the aperture prior to application of the preformed composition.
27. The method of claim 20, wherein the sealed aperture exhibits shielding effectiveness from 1 MHz to 18 GHz.
CA2523700A 2003-04-30 2004-04-30 Preformed emi/rfi shielding compositions in shaped form Active CA2523700C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US46698103P 2003-04-30 2003-04-30
US60/466,981 2003-04-30
PCT/US2004/011269 WO2004099317A1 (en) 2003-04-30 2004-04-30 Preformed emi/rfi shielding compositions in shaped form

Publications (2)

Publication Number Publication Date
CA2523700A1 true CA2523700A1 (en) 2004-11-18
CA2523700C CA2523700C (en) 2010-06-29

Family

ID=33435001

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2523700A Active CA2523700C (en) 2003-04-30 2004-04-30 Preformed emi/rfi shielding compositions in shaped form

Country Status (16)

Country Link
US (2) US20040220327A1 (en)
EP (1) EP1618152B9 (en)
JP (2) JP4989963B2 (en)
KR (1) KR100697920B1 (en)
CN (1) CN1826382B (en)
AT (1) ATE412704T1 (en)
AU (1) AU2004236652B2 (en)
BR (1) BRPI0409821B1 (en)
CA (1) CA2523700C (en)
DE (1) DE602004017446D1 (en)
DK (1) DK1618152T3 (en)
ES (1) ES2314423T3 (en)
IL (1) IL171550A (en)
MX (1) MXPA05011558A (en)
RU (1) RU2336288C2 (en)
WO (1) WO2004099317A1 (en)

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Also Published As

Publication number Publication date
KR20060004966A (en) 2006-01-16
EP1618152A1 (en) 2006-01-25
JP2009102665A (en) 2009-05-14
US20040220327A1 (en) 2004-11-04
RU2005137190A (en) 2006-04-27
AU2004236652A1 (en) 2004-11-18
ES2314423T3 (en) 2009-03-16
BRPI0409821B1 (en) 2017-03-21
DK1618152T3 (en) 2009-01-12
MXPA05011558A (en) 2005-12-14
US20070034839A1 (en) 2007-02-15
JP2006524720A (en) 2006-11-02
CA2523700C (en) 2010-06-29
KR100697920B1 (en) 2007-03-20
EP1618152B9 (en) 2009-08-26
EP1618152B1 (en) 2008-10-29
CN1826382A (en) 2006-08-30
WO2004099317A1 (en) 2004-11-18
IL171550A (en) 2011-07-31
JP4989963B2 (en) 2012-08-01
RU2336288C2 (en) 2008-10-20
ATE412704T1 (en) 2008-11-15
CN1826382B (en) 2010-06-16
US7425604B2 (en) 2008-09-16
DE602004017446D1 (en) 2008-12-11
AU2004236652B2 (en) 2007-04-26
BRPI0409821A (en) 2006-05-09

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