CA2552615A1 - Process device with improved power generation - Google Patents

Process device with improved power generation Download PDF

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Publication number
CA2552615A1
CA2552615A1 CA002552615A CA2552615A CA2552615A1 CA 2552615 A1 CA2552615 A1 CA 2552615A1 CA 002552615 A CA002552615 A CA 002552615A CA 2552615 A CA2552615 A CA 2552615A CA 2552615 A1 CA2552615 A1 CA 2552615A1
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Canada
Prior art keywords
field device
coupled
conversion module
energy conversion
field
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Granted
Application number
CA002552615A
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French (fr)
Other versions
CA2552615C (en
Inventor
Robert J. Karschnia
Marcos Peluso
Adrian C. Toy
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Rosemount Inc
Original Assignee
Rosemount Inc.
Robert J. Karschnia
Marcos Peluso
Adrian C. Toy
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Application filed by Rosemount Inc., Robert J. Karschnia, Marcos Peluso, Adrian C. Toy filed Critical Rosemount Inc.
Publication of CA2552615A1 publication Critical patent/CA2552615A1/en
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Classifications

    • GPHYSICS
    • G08SIGNALLING
    • G08CTRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • GPHYSICS
    • G08SIGNALLING
    • G08CTRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E70/00Other energy conversion or management systems reducing GHG emissions
    • Y02E70/30Systems combining energy storage with energy generation of non-fossil origin
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02TCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00Road transport of goods or passengers
    • Y02T10/10Internal combustion engine [ICE] based vehicles
    • Y02T10/12Improving ICE efficiencies

Abstract

A wireless field device (34, 50, 70, 80, 91, 100) is disclosed. The field device (34, 50, 70, 80, 91, 100) includes a wireless communications module (32) and an energy conversion module (38) . The wireless communications modu le (32) is configured to wirelessly communicate process-related information wit h another device. The energy conversion module (38) is coupled to the wireless communications module (32) . The energy conversion module (38) is configured to couple to a thermal source, and to generate electricity from thermal potential energy in the thermal source.

Description

PROCESS DEVICE WITH IMPROVED POWER
GEf3ER~T I0~3 BACKGROUND OF THE INVENTION
The present invention relates to .industrial process control and monitoring systems. More specifically, the present invention Jrelates to the generation of electrical power for field devices within such systems.
In industrial settings, control systems are used to monitor and control inventories of industrial and chemical processes, and the like. Typically, the control system performs these functions using field devices distributed at key locations ~in the industrial process and coupled to the control circuitry in the control room by a process control loop. The term "field device" refers to any device that performs a function in a distributed control or process monitoring system, including all devices used in the measurement, control and monitoring of industrial processes.
Field devices are used by the process control .and measurement industry for a variety of purposes. Usually such devices have a field-hardened enclosure so that they can be installed outdoors in.
relatively rugged environments and are able to withstand climatalogical extremes of temperature, humidity, vibration, mechanical shock, etc. These devices also can typically operate on relatively low power. For example, field devices are currently available that~receive all of their operating power from a known 4-20 mA loop.
Some field devices include a transducer. A
transducer is understood to mean either a device that generates an output signal based on a physical input or that generates a physical output based on an input signal. Typically, a transducer transforms an input into an output having a different form. Types of transducers include various analytical equipment, pressure sensors, thermistors, thermocouples, strain gauges, flow transmitters, positioners, actuators, solenoids, indicator lights, and others.
Typically, each field device also includes communication circuitry that is used for communicating with a process control room, or other circuitry, over a process control loop. In some installations, the process control loop is also used to deliver a regulated current and/or voltage to the field device for powering the field device.
Traditionally, analog field devices have been connected to the control room by two-wire process control current loops, with each device connected to the control room by a single two-wire control loop. Typically, a voltage differential is maintained between the two wires within a range of voltages from 12-45 volts for analog mode and 9-50 volts for digital mode. Some analog field devices transmit a signal to the control room by modulating the current running through the current loop to a current proportional to the sensed process variable.
Other analog field devices can perform an action under the control of the control room by controlling the magnitude of the current through the loop. In addition to, or in the alternative,, the process control loop can carry digital signals used for communication with field devices. Digital communication allows ~a much larger degree of communication than analog communication. Moreover, digital devices also do not require separate wiring for each field device. Field devices that communicate digitally can respond to and communicate selectively with the control room and/or' other field devices.
Further, such devices can provide additional signaling such as diagnostics and/or alarms.
In some installations, wireless technologies have begun to be used to communicate with field devices. Wireless operation simplifies field device wiring and setup. Wireless installations are currently used in which the field device is manufactured to include an internal battery, potentially charged by a solar cell without any sort of wired connection. Problems exist in using an internal battery as the energy demands of wireless devices may vary greatly depending on numerous factors such as the device reporting rate, device elements, et cetera.
Difficulties also arise in installations where solar power is not reliable. For example, it becomes problematic to use solar power in areas that experience full shade twenty-four hours a day, indoors seven days a week, or in parts of the world where solar insolation numbers are very small, such as in the Arctic Circle. Accordingly, in these installations, powering a wireless process device using solar power is not reliable. Accordingly, there is an ongoing significant need for wireless process devices that can operate using an abundant renewable source of power that is not dependent upon the sun.
SUMMARY OF THE INZTENTION
A wireless field device is disclosed. The field device includes a wireless communications module and an energy conversion module.. The wireless communications module is configured to wirelessly communicate process-related information with another device. The energy conversion module is coupled to the wireless communications module. The energy conversion module is configured to couple to a thermal source, and to generate electricity from thermal potential energy in the thermal source.
A field device includes a controller, a wireless communications module, and a power generation module. The wireless communications module is coupled to the controller. The power generation module is located within the field device, and is coupled to the controller and to the wireless communications module. The power generation module is configured to interact with molecules proximate the exterior of the field device to generate electricity.
The power generation module is preferably a thermal generator that harvests energy from a temperature differential near the field device.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a diagrammatic view of an exemplary field device with which embodiments of the present invention~is particularly useful.
FIG. 2 is a block diagram of the field device shown in FIG. 1.
FIG. 3 is a block diagram of a field device including wireless communication circuitry for communicating with a remote device.
FIG. 4 is a diagrammatic view of a wireless field device operating in accordance with an embodiment of the present invention.
FIGS. 5A and 5B are diagrammatic views of a temperature-sensing field device deriving power in accordance with embodiments of the present invention.
FIGS. 6A and 6B are diagrammatic views of a field device deriving power from a semiconductor thermoelectric generator in accordance with embodiments of the present invention.
FIG. 7 is diagrammatic view of a field device deriving power from a semiconductor thermoelectric generator in accordance with an embodiment of the present invention.
DETAINED DESCRIPTION OF THE PREFERRED EMBODIMENTS
~ FIGS. 1 and 2 are diagrammatic and block diagram views of an exemplary field device with which embodiments of the present invention are useful.
Process control or monitoring system 10 includes a control room or control system 12 that couples to one or more field devices 14 over a two-wire process control loop 16. Examples of process control loop 16 include analog 4-20 mA communication, hybrid protocols which include both analog and digital communication such. as the Highway Addressable Remote Transducer (HART~) standard, as well as all-digital protocols such as the FOUNDATIONTM Fieldbus standard.
Generally process control loop protocols can both power the field device and allow communication between the field device and other devices.
In this example, field device 14 includes circuitry 18 coupled to actuator/transducer 20 and to process control loop 16 via terminal board 21 in housing 23. Field device 14 is illustrated as a process variable (PV) generator in that it couples to a process and senses an aspect, such as temperature, pressure, pH, flow, et cetera of the process and provides an indication thereof. Other examples of field devices include valves, actuators, controllers, ~"r and displays.

Generally field devices are characterized by their ability to operate in the "field" which may expose them to environmental stresses, such as temperature, humidity and pressure. In addition to environmental stresses, field devices must often withstand exposure to corrosive, hazardous and/or even explosive atmospheres. Further, such devices must also operate in the presence of vibration and/or electromagnetic interference.
FIG. 3 is a block diagram of a wireless field device in accordance with an embodiment of the present invention. Field device 34 includes power conversion module 38, controller 35, wireless communications module 32, and actuator/transducer 20.
Conversion module 38 can be any device that is able to convert thermal potential energy from the process into electrical energy. Conversion module 38 can be any device, known or later developed, that translates thermal potential energy available from molecules proximate field device 34 into electricity. For example, module 38 .can employ known thermopile devices to generate electricity from disparate temperatures using the Pettier Effect. Other temperature-based conversion devices can be used for module . 38. Such devices include thermoelectric diodes; solid state thermogenerators; and semiconductor thermoelectric generators. Moreover, any device now known, or later developed, that converts thermal potential energy to electricity may -g_ b~e used as or in combination with module 38.
Conversion module 38 can provide power for wireless communications module 32 alone, other portions of field device 34, or even all of the components within field device 34.
Wireless communication module 32 is coupled to controller ~35 and interacts with external wireless devices via antenna 26 based upon commands and/or ' data from controller 35. Wireless communication 32 can communicate process-related information as well as device-related information. Depending upon the application, wireless communication module 32 may be adapted to communicate in accordance with arty suitable wireless communication protocol including, but not limited to: wireless networking technologies (such as IEEE 802.11b wireless access points and wireless networking devices built by Linksys of Irvine, California), cellular or digital networking technologies (such as Microburst~ by Aeris Communications Inc. of San Jose, California), ultra wide band, free space optics, Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), spread spectrum technology, infrared communications techniques, SMS (Short Messaging Service/text messaging), or any other suitable wireless technology. Further, known data collision technology can be employed such that multiple units can coexist .within wireless operating rage of one another. Such collision prevention can include using a number of different radio-frequency channels and/or spread spectrum techniques.
Wireless communication module 32 can also include transducers for a plurality of wireless communication methods. For example, primary wireless communication could be performed using relatively long distance communication methods, such as GSM or GPRS, while a secondary, or additional communication method could be provided for technicians, or operators near the unit, using for example, IEEE
802.11b or Bluetooth.
Some wireless communications modules may include circuitry that can interact with the Global Positioning System (GPS). GPS can be advantageously employed in device 34 for mobile devices to allow finding the individual device 34 in a remote location. However, location sensing based upon other techniques can be used as well. ' Memory 37 is illustrated in FIG. 3 as being separate from controller 35, but may, in fact, be part of controller 35. Memory 37 can be any suitable type of memory including volatile memory (such as Random Access Memory), non-volatile memory (such as flash memory, EEPROM memory, ' etc.) and any combination thereof. Memory 37 may contain program instructions for controller 35 as well as any suitable administrative overhead data for device 34.
Memory 37~may contain a unique identifier for device 34, such that device 34 can distinguish wireless communications meant for it among other wireless communications. Examples of such an identifier could include, a Media Access Controller (MAC) address, Electronic Serial Number, global phone number, Internet Protocol (IP) address, or any other suitable identifier. Moreover, memory 37 may include information about attached field devices, such as their unique identifiers, configurations, and abilities. Finally, controller 35, using memory 37 can cause the output of device 34 to be provided in any suitable form. For example, configuration and interaction with field device' 34 and/or one or more associated field devices could be provided as HyperText Markup Language (HTML) web pages.
FIG. 4 is a diagrammatic view of a wireless field device operably coupled to energy conversion module 38 in accordance with an embodiment of the present invention. In the embodiment illustrated in FIG. 4, module 38 is disposed external to field device 34. Additionally, transducer 20 is illustrated in FIG. 4 as being a sensor. The sensor or sensor tap 20 and wireless field device 34 are, by virtue of the process to which they are coupled, maintained at a differential temperature. For example, sensor 20 may be coupled to process fluid that is at a higher temperature than the ambient temperature to which device 34 is exposed. Conversion module 38 is thermally coupled, illustrated by phantom lines 40, 42 to sensor 20 and field device 34, respectively.
The differential temperature coupled to conversion module 38 generates electricity within conversion module 38 that is provided to wireless field device 34 via line 44. When so powered, field device 34 generates and transmits wireless information to one or more remote transceivers 46, which may, in fact, be part of control system 12.
Given that conversion module 38 generally transforms thermal potential energy in or near the process fluid to electricity, one particularly synergistic application for embodiments of the present invention is that of temperature measuring field devices. In such embodiments, sensor 20 is a temperature sensor, such as a thermocouple, thermistor, or resistance temperature device (RTD).
While embodiments of the present invention will be described with respect to a temperature-sensing field device, embodiments of the present invention are practicable with any field device.
FIGS. 5A and 5B are diagrammatic views of field devices deriving power ,from thermal energy in accordance with embodiments of the present invention.
FIG. 5A illustrates a temperature-sensing . field device 50 having an electronics compartment 52 coupled to a thermowell 54 which is shaped, or otherwise configured, to engage a process fluid.
Within thermowell 54, a temperature sensor 56 provides an indication of process fluid temperature proximate end 58 of thermowell 54. Additionally, a portion of conversion module 38 (shown in FIG 4) is disposed proximate end 58. Specifically, device 60 is disposed proximate end 58 and electrically coupled to electronics compartment 52 via power.lines 62, 64.
Device 60 is preferably any suitable device that converts thermal energy into electricity. Thus, device 60 may be a thermopile, thermodiode (thermoelectric diode), a solid state thermogenerator, a semiconductor thermoelectric generator, or any combination thereof. Temperature sensing of field device 50 is accomplished via temperature sensor 56 providing a signal on signal lines 66 and 68 to electronics compartment 52.
FIG. 5B illustrates field device 70 having an electronics compartment 52 and a thermowell 54.
In contrast to field device 50, field device 70 employs device 72 that generates electricity related to the temperature to which it is exposed. Examples o.f suitable devices for device 72 include a thermopile or a thermoelectric diode. Such devices are suitable because they do not require a heat flow through the device, but instead generate electricity based upon exposure to a specific thermal source.
Technology advancements are currently increasing the feasibility of a field device such as that illustrated in FIGS. 5A and 5B. On the power generation side, solid state thermogenerators are becoming more and more efficient. Additionally, advancements in wireless technology are also increasing the feasibility of such field devices.
Specifically, wireless transmitters need less and less power to cover the same area. Additionally, even in embodiments where the transmission distance of a specific field device may be limited, such as to a radius of approximately 20 meters, embodiments of the present invention contemplate the use of repeating or mesh networks to increase the area covered by such devices. Thus, where a plurality of wireless field devices are disposed within the wireless transmission radius from one another, a first device can have its wireless information relayed by a second device thus extending the net range of the first device by that of the second device.
FIGS. 6A and 6B illustrate field devices that employ a semiconductor thermoelectric generator for thermoenergy scavenging in accordance with embodiments of the present invention. Semiconductor thermoelectric generators produce power when a temperature difference is maintained across the device. Thus, there is a flow of heat through the device, so the cool side should be properly heat sunk for advantageous power generation.
In FIG. ~A, field device 80 includes electronics compartment 52 and thermowell 54 having a semiconductor thermoelectric generator device 82 'disposed proximate distal end 58 of thermowell 54.
In order to allow device 52 to have heat flow therethrough, a'thermal conductor 84, such as a heat conducting member, is coupled to cold side 86 of device 82 and conveys heat in the direction of arrow 88 to one or more optional cooling fins 90 that, in some embodiments, may be disposed within electronics compartment 52. Conductor 84 may be any arrangement that conveys heat efficiently. For example, conductor 84 could be a copper rod.
FIG. 6B illustrates an alternate arrangement for generating electricity from thermoenergy. Field device 91 includes electronics compartment 52 and thermowell 54. However, semiconductor thermoelectric generator device 92 is disposed above thermowell 54 proximate electronics compartment 52. This allows device 92 to be relatively larger in comparison to device 82. In order to maintain advantageous heat flow across device 92, thermal conductor 84 is still coupled thermally to distal end 58 and conveys heat in the direction of arrow 88 to hot side 94 of device 92.
The cold side 96 of device 92 is coupled to one or more optional cooling fins 90 that may or may not be disposed within housing 52.
As illustrated in FIGS. 6A and 6B, there are different ways to conceptually achieve' thermal flow across a semiconductor thermoelectric element.
While FIGS. 6A and 6B illustrate a pair of examples, other possibilities may be practiced in accordance with embodiments of the present invention. In fact, the thermoelectric power generation element. need not be disposed proximate the field device itself.
FIG. 7 illustrates a diagrammatic view of field device 100 having an electronics compartment 52 coupled to a thermowell 54 for sensing a process temperature. A thermoelectric power-generating device 102 is disposed remote from field device 100 and coupled thereto via power conductors 104, 106. An elevated process temperature is coupled to hot side 108 of semiconductor thermoelectric generator device 110, which has one or more optional fins 90 coupled to its cold side 112. Since device 102 is mounted remote from field device 100, the physical size of device 102 is not constrained at all by the design of field device 100. This is advantageous because typically only small thermoelectric generating devices will fit within thermowell 54. Commercially available thermoelectric generating devices having a size on the order of 2 mm by 4 mm by 2 mm thick are believed to be able to fit within the thermowell, and to generate approximately 48 milivolts and 80 miliamps with a 50° C temperature different across hot and cold sides. This generated voltage is generally low and preferably is stepped up with a step up voltage conversion circuit known in the art of field devices. Accordingly, approximately 0.22 watts of heat flow through the thermoelectric generator device under such conditions. Although the operating efficiency is relatively low (approximately 20) the approximately. 4 milliwatts of generated power is believed to be sufficient for wireless field device operation.
However, if the thermoelectric generating device is disposed remote from the field device, it is reasonable that the thermoelectric generating device could be sized much larger than the example given above. Specifically, thermoelectric generating devices having a size of approximately 15 mm by 15 mm by 2 mm thick can be used. Such devices are commercially available and believed to generate 375 millivolts and 300 milliamps for the same 50° C
difference. While a step up voltage conversion circuit is still useful, the approximate 112 milliwatts of generated power makes the design of such a circuit much simpler and lower cost.
Approximately 6 watts of heat flow through the thermoelectric generating device under such conditions.
The conversion module can include, or be coupled to, additional power circuitry to provide additional functions related to power generation and/or storage. For example, a storage device, such as a capacitor or rechargeable cell can be operably coupled to the conversion module to maintain power levels when the amount of power available from the ' conversion module (via the thermal source) drops below that which could minimally operate the field device, or portions thereof., Additionally, any known power conditioning circuitry can be used to step up the voltage, remove noise from the power signal, isolate the power signal, smooth and/or otherwise shape the power signal. However, those skilled in the art will recognize that any desired functions can be accommodated with power conditioning circuitry as desired.
Although the present invention has been described with reference to preferred embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention.

Claims (22)

1. A field device comprising:
a wireless communications module configured to wirelessly communicate process-related information with another device; and an energy conversion module coupled to the wireless communications module, the energy conversion module configured to couple to a thermal source, and to convert thermal potential energy into electricity to power circuitry within the field device.
2. The field device of claim 1, wherein the energy conversion module includes a thermopile.
3. The field device of claim 1, wherein the energy conversion module includes a thermoelectric diode.
4. The field device of claim 1, wherein the energy conversion module includes a semiconductor thermoelectric generator.
5. The field device of claim 1, wherein the energy conversion module is disposed proximate the field device.
6. The field device of claim 1, wherein the energy conversion device is disposed remote from the field device.
7. The field device of claim 1, and further comprising:

a controller coupled to the energy conversion module and to the wireless communication module; and a transducer coupled to the process and the controller.
8. The field device of claim 7, wherein the transducer is a sensor.
9. The field device of claim 8, wherein the sensor is a temperature sensor.
10. The field device of claim 9, wherein the temperature sensor generates electricity and is a component of the energy conversion module.
11. The field device of claim 9, and further comprising:
a thermowell configured to couple to a process fluid.
12. The field device of claim 11, and further comprising a heat conducting member disposed within the thermowell and configured to convey heat away from the process fluid.
13. The field device of claim 12, wherein the energy conversion module includes a semiconductor thermoelectric generator operably coupled to the heat conducting member.
14. The field device of claim 13, wherein the semiconductor thermoelectric generator has a hot side thermally coupled to the process fluid, and a cold side thermally coupled to the heat conducting member.
15. The field device, of claim 14, wherein the heat conducting member has a first end coupled to the thermoelectric generator, and a second end coupled to at least one cooling fin.
16. The field device of claim 13, wherein the semiconductor thermoelectric generator has a hot side coupled to a first end of the heat conducting member, and a cold side coupled to at least one cooling fin, and wherein a second end of the heat conducting member is thermally coupled to the. process fluid.
17. The field device of claim 1, wherein the amount of electricity converted by the conversion module is used to provide a temperature indication related to the thermal source.
18. The field device of claim 1, wherein the thermal source is a process thermal source.
19. The field device of claim 1, and further comprising a power storage device coupled to the conversion module.
20. A method of providing electricity to a wireless field device, the method comprising:
thermally coupling a thermoelectric device to a source of thermal potential energy; and electrically coupling the thermoelectric device to a wireless communication module of the field device.
21. The method of claim 20, wherein thermally coupling the thermoelectric device includes conveying heat through the thermoelectric device.
22. A field device comprising:
a wireless communications module configured to wirelessly communicate process-related information with another device; and means for converting thermal potential energy in a process thermal source to electricity to power the field device.
CA2552615A 2004-03-02 2005-03-02 Process device with improved power generation Active CA2552615C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US54963704P 2004-03-02 2004-03-02
US60/549,637 2004-03-02
PCT/US2005/006596 WO2005086331A2 (en) 2004-03-02 2005-03-02 Process device with improved power generation

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CA2552615C CA2552615C (en) 2014-08-26

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US (1) US7957708B2 (en)
EP (1) EP1721067B1 (en)
JP (1) JP5058785B2 (en)
CN (1) CN1954138B (en)
CA (1) CA2552615C (en)
DE (1) DE602005018749D1 (en)
RU (1) RU2347921C2 (en)
WO (1) WO2005086331A2 (en)

Families Citing this family (339)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2552615C (en) 2004-03-02 2014-08-26 Rosemount Inc. Process device with improved power generation
US8538560B2 (en) 2004-04-29 2013-09-17 Rosemount Inc. Wireless power and communication unit for process field devices
US8145180B2 (en) * 2004-05-21 2012-03-27 Rosemount Inc. Power generation for process devices
US8160535B2 (en) * 2004-06-28 2012-04-17 Rosemount Inc. RF adapter for field device
US8787848B2 (en) * 2004-06-28 2014-07-22 Rosemount Inc. RF adapter for field device with low voltage intrinsic safety clamping
US20060176660A1 (en) * 2005-02-07 2006-08-10 Ahmad Amiri Ultra mobile communicating computer
US9184364B2 (en) 2005-03-02 2015-11-10 Rosemount Inc. Pipeline thermoelectric generator assembly
DE102005043771A1 (en) * 2005-09-13 2007-03-15 Endress + Hauser Flowtec Ag Method for power supply of a field device of automation technology
DE202006020838U1 (en) * 2006-03-29 2010-06-24 Abb Ag Device for supplying energy to field devices
US7913566B2 (en) 2006-05-23 2011-03-29 Rosemount Inc. Industrial process device utilizing magnetic induction
JP5198455B2 (en) * 2006-09-28 2013-05-15 ローズマウント インコーポレイテッド Improved industrial thermoelectric generator
US8188359B2 (en) * 2006-09-28 2012-05-29 Rosemount Inc. Thermoelectric generator assembly for field process devices
CN101517827B (en) 2006-09-28 2013-06-12 罗斯蒙德公司 Wireless field device with antenna and radome for industrial locations
US8217782B2 (en) * 2007-05-24 2012-07-10 Rosemount Inc. Industrial field device with reduced power consumption
US8250924B2 (en) 2008-04-22 2012-08-28 Rosemount Inc. Industrial process device utilizing piezoelectric transducer
WO2009154756A1 (en) 2008-06-17 2009-12-23 Rosemount Inc. Rf adapter for field device with variable voltage drop
US8694060B2 (en) 2008-06-17 2014-04-08 Rosemount Inc. Form factor and electromagnetic interference protection for process device wireless adapters
US8929948B2 (en) 2008-06-17 2015-01-06 Rosemount Inc. Wireless communication adapter for field devices
US8362959B2 (en) * 2008-10-13 2013-01-29 Rosemount Inc. Wireless field device with rugged antenna and rotation stop
US7977924B2 (en) 2008-11-03 2011-07-12 Rosemount Inc. Industrial process power scavenging device and method of deriving process device power from an industrial process
US10378106B2 (en) 2008-11-14 2019-08-13 Asm Ip Holding B.V. Method of forming insulation film by modified PEALD
US8262287B2 (en) 2008-12-08 2012-09-11 Asm America, Inc. Thermocouple
US9394608B2 (en) 2009-04-06 2016-07-19 Asm America, Inc. Semiconductor processing reactor and components thereof
WO2010124665A1 (en) * 2009-04-30 2010-11-04 Siemens Aktiengesellschaft Apparatus and temperature measurement unit for the contactless measurement and transmission of temperatures by temperature-sensing parts and use of such an apparatus
US8382370B2 (en) 2009-05-06 2013-02-26 Asm America, Inc. Thermocouple assembly with guarded thermocouple junction
US9297705B2 (en) * 2009-05-06 2016-03-29 Asm America, Inc. Smart temperature measuring device
US20100318007A1 (en) * 2009-06-10 2010-12-16 O'brien Donald J Electromechanical tactile stimulation devices and methods
US8626087B2 (en) 2009-06-16 2014-01-07 Rosemount Inc. Wire harness for field devices used in a hazardous locations
US9674976B2 (en) 2009-06-16 2017-06-06 Rosemount Inc. Wireless process communication adapter with improved encapsulation
US8802201B2 (en) 2009-08-14 2014-08-12 Asm America, Inc. Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
DE102009056699B4 (en) * 2009-12-02 2015-04-30 Abb Technology Ag Autonomous temperature transmitter
CN103380556B (en) 2010-03-24 2016-02-03 马克·辛莱希 For Wireless Telecom Equipment electric power management circuit and use its process control system
DE102010022025B4 (en) * 2010-05-29 2021-03-04 Abb Schweiz Ag Power supply device for autonomous field devices
US8276458B2 (en) 2010-07-12 2012-10-02 Rosemount Inc. Transmitter output with scalable rangeability
US10761524B2 (en) 2010-08-12 2020-09-01 Rosemount Inc. Wireless adapter with process diagnostics
GB2483293A (en) * 2010-09-03 2012-03-07 Spirax Sarco Ltd Steam flow meter with thermoelectric power source
JP5640800B2 (en) * 2011-02-21 2014-12-17 ソニー株式会社 Wireless power supply apparatus and wireless power supply method
DE102011006638A1 (en) * 2011-04-01 2012-10-04 Robert Bosch Gmbh Apparatus and method for reporting an event and monitoring system
US9312155B2 (en) 2011-06-06 2016-04-12 Asm Japan K.K. High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules
JP5881979B2 (en) * 2011-06-27 2016-03-09 セイコーインスツル株式会社 Terminal device and communication system
US10364496B2 (en) 2011-06-27 2019-07-30 Asm Ip Holding B.V. Dual section module having shared and unshared mass flow controllers
US20130005372A1 (en) 2011-06-29 2013-01-03 Rosemount Inc. Integral thermoelectric generator for wireless devices
US10854498B2 (en) 2011-07-15 2020-12-01 Asm Ip Holding B.V. Wafer-supporting device and method for producing same
US20130023129A1 (en) 2011-07-20 2013-01-24 Asm America, Inc. Pressure transmitter for a semiconductor processing environment
TWI474161B (en) * 2011-10-17 2015-02-21 Finetek Co Ltd A process controller with a power regulation function
US9310794B2 (en) 2011-10-27 2016-04-12 Rosemount Inc. Power supply for industrial process field device
US9017481B1 (en) 2011-10-28 2015-04-28 Asm America, Inc. Process feed management for semiconductor substrate processing
JP5980591B2 (en) * 2012-06-29 2016-08-31 ナブテスコ株式会社 Color sensor and machinery remote monitoring system
CN202918218U (en) 2012-08-16 2013-05-01 中兴通讯股份有限公司 Energy conservation and environmental protection apparatus of communication system equipment
US9659799B2 (en) 2012-08-28 2017-05-23 Asm Ip Holding B.V. Systems and methods for dynamic semiconductor process scheduling
RU2662400C2 (en) * 2012-09-21 2018-07-25 Хоум Контрол Сингапур Пте. Лтд. Handheld information processing device with remote control output mode
US10714315B2 (en) 2012-10-12 2020-07-14 Asm Ip Holdings B.V. Semiconductor reaction chamber showerhead
US10910962B2 (en) 2012-10-19 2021-02-02 University Of Southern California Pervasive power generation system
USD702188S1 (en) 2013-03-08 2014-04-08 Asm Ip Holding B.V. Thermocouple
US9484191B2 (en) 2013-03-08 2016-11-01 Asm Ip Holding B.V. Pulsed remote plasma method and system
US9589770B2 (en) 2013-03-08 2017-03-07 Asm Ip Holding B.V. Method and systems for in-situ formation of intermediate reactive species
US9240412B2 (en) 2013-09-27 2016-01-19 Asm Ip Holding B.V. Semiconductor structure and device and methods of forming same using selective epitaxial process
JP5772912B2 (en) * 2013-09-30 2015-09-02 横河電機株式会社 Wireless equipment
DE102013114195A1 (en) * 2013-12-17 2015-06-18 Endress + Hauser Flowtec Ag Field device of process automation
EP2887511A1 (en) * 2013-12-20 2015-06-24 ABB Technology AG Sensor assembly for measuring at least a temperature on a moving part of an electric machine
US10683571B2 (en) 2014-02-25 2020-06-16 Asm Ip Holding B.V. Gas supply manifold and method of supplying gases to chamber using same
CN103822667A (en) * 2014-03-04 2014-05-28 上海理工大学 Temperature-humidity acquisition system based on Bluetooth technology
US10167557B2 (en) 2014-03-18 2019-01-01 Asm Ip Holding B.V. Gas distribution system, reactor including the system, and methods of using the same
US11015245B2 (en) 2014-03-19 2021-05-25 Asm Ip Holding B.V. Gas-phase reactor and system having exhaust plenum and components thereof
US9704373B2 (en) 2014-05-29 2017-07-11 Thomas & Betts International Llc Smart lug system
US10858737B2 (en) 2014-07-28 2020-12-08 Asm Ip Holding B.V. Showerhead assembly and components thereof
US9890456B2 (en) 2014-08-21 2018-02-13 Asm Ip Holding B.V. Method and system for in situ formation of gas-phase compounds
JP6398486B2 (en) * 2014-09-03 2018-10-03 株式会社デンソー Actuator device
US10941490B2 (en) 2014-10-07 2021-03-09 Asm Ip Holding B.V. Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
US9657845B2 (en) 2014-10-07 2017-05-23 Asm Ip Holding B.V. Variable conductance gas distribution apparatus and method
US9885610B2 (en) 2014-12-22 2018-02-06 Rosemount Inc. Thermowell system with vibration detection
KR102263121B1 (en) 2014-12-22 2021-06-09 에이에스엠 아이피 홀딩 비.브이. Semiconductor device and manufacuring method thereof
US10529542B2 (en) 2015-03-11 2020-01-07 Asm Ip Holdings B.V. Cross-flow reactor and method
US10276355B2 (en) 2015-03-12 2019-04-30 Asm Ip Holding B.V. Multi-zone reactor, system including the reactor, and method of using the same
DE102015004578A1 (en) * 2015-04-14 2016-10-20 Dräger Safety AG & Co. KGaA Method for data transmission between measuring devices and a data processing device in a measured data acquisition system
US10458018B2 (en) 2015-06-26 2019-10-29 Asm Ip Holding B.V. Structures including metal carbide material, devices including the structures, and methods of forming same
US9891111B2 (en) * 2015-06-30 2018-02-13 Rosemount Inc. Thermowell with infrared sensor
US10600673B2 (en) 2015-07-07 2020-03-24 Asm Ip Holding B.V. Magnetic susceptor to baseplate seal
CN105069981A (en) * 2015-07-15 2015-11-18 北京依米康科技发展有限公司 Thermoelectric flood alarm device by utilizing decalescence and/or heat release which occur when compound dissolves in water
US9960072B2 (en) 2015-09-29 2018-05-01 Asm Ip Holding B.V. Variable adjustment for precise matching of multiple chamber cavity housings
US10211308B2 (en) 2015-10-21 2019-02-19 Asm Ip Holding B.V. NbMC layers
US10322384B2 (en) 2015-11-09 2019-06-18 Asm Ip Holding B.V. Counter flow mixer for process chamber
US11139308B2 (en) 2015-12-29 2021-10-05 Asm Ip Holding B.V. Atomic layer deposition of III-V compounds to form V-NAND devices
US10529554B2 (en) 2016-02-19 2020-01-07 Asm Ip Holding B.V. Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
US10468251B2 (en) 2016-02-19 2019-11-05 Asm Ip Holding B.V. Method for forming spacers using silicon nitride film for spacer-defined multiple patterning
US10501866B2 (en) 2016-03-09 2019-12-10 Asm Ip Holding B.V. Gas distribution apparatus for improved film uniformity in an epitaxial system
US10343920B2 (en) 2016-03-18 2019-07-09 Asm Ip Holding B.V. Aligned carbon nanotubes
US9892913B2 (en) 2016-03-24 2018-02-13 Asm Ip Holding B.V. Radial and thickness control via biased multi-port injection settings
US10865475B2 (en) 2016-04-21 2020-12-15 Asm Ip Holding B.V. Deposition of metal borides and silicides
US10190213B2 (en) 2016-04-21 2019-01-29 Asm Ip Holding B.V. Deposition of metal borides
US10032628B2 (en) 2016-05-02 2018-07-24 Asm Ip Holding B.V. Source/drain performance through conformal solid state doping
US10367080B2 (en) 2016-05-02 2019-07-30 Asm Ip Holding B.V. Method of forming a germanium oxynitride film
KR102592471B1 (en) 2016-05-17 2023-10-20 에이에스엠 아이피 홀딩 비.브이. Method of forming metal interconnection and method of fabricating semiconductor device using the same
US11453943B2 (en) 2016-05-25 2022-09-27 Asm Ip Holding B.V. Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
US10388509B2 (en) 2016-06-28 2019-08-20 Asm Ip Holding B.V. Formation of epitaxial layers via dislocation filtering
US10612137B2 (en) 2016-07-08 2020-04-07 Asm Ip Holdings B.V. Organic reactants for atomic layer deposition
US9859151B1 (en) 2016-07-08 2018-01-02 Asm Ip Holding B.V. Selective film deposition method to form air gaps
US10714385B2 (en) 2016-07-19 2020-07-14 Asm Ip Holding B.V. Selective deposition of tungsten
US10381226B2 (en) 2016-07-27 2019-08-13 Asm Ip Holding B.V. Method of processing substrate
JP6448093B2 (en) * 2016-07-27 2019-01-09 ナブテスコ株式会社 Sensor device
US10395919B2 (en) 2016-07-28 2019-08-27 Asm Ip Holding B.V. Method and apparatus for filling a gap
US9887082B1 (en) 2016-07-28 2018-02-06 Asm Ip Holding B.V. Method and apparatus for filling a gap
KR102532607B1 (en) 2016-07-28 2023-05-15 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus and method of operating the same
US9812320B1 (en) 2016-07-28 2017-11-07 Asm Ip Holding B.V. Method and apparatus for filling a gap
KR102613349B1 (en) 2016-08-25 2023-12-14 에이에스엠 아이피 홀딩 비.브이. Exhaust apparatus and substrate processing apparatus and thin film fabricating method using the same
US10410943B2 (en) 2016-10-13 2019-09-10 Asm Ip Holding B.V. Method for passivating a surface of a semiconductor and related systems
US10643826B2 (en) 2016-10-26 2020-05-05 Asm Ip Holdings B.V. Methods for thermally calibrating reaction chambers
US11532757B2 (en) 2016-10-27 2022-12-20 Asm Ip Holding B.V. Deposition of charge trapping layers
US10435790B2 (en) 2016-11-01 2019-10-08 Asm Ip Holding B.V. Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap
US10714350B2 (en) 2016-11-01 2020-07-14 ASM IP Holdings, B.V. Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US10229833B2 (en) 2016-11-01 2019-03-12 Asm Ip Holding B.V. Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US10643904B2 (en) 2016-11-01 2020-05-05 Asm Ip Holdings B.V. Methods for forming a semiconductor device and related semiconductor device structures
US10134757B2 (en) 2016-11-07 2018-11-20 Asm Ip Holding B.V. Method of processing a substrate and a device manufactured by using the method
KR102546317B1 (en) 2016-11-15 2023-06-21 에이에스엠 아이피 홀딩 비.브이. Gas supply unit and substrate processing apparatus including the same
US10340135B2 (en) 2016-11-28 2019-07-02 Asm Ip Holding B.V. Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride
KR20180068582A (en) 2016-12-14 2018-06-22 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US11447861B2 (en) 2016-12-15 2022-09-20 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus and a method of forming a patterned structure
US11581186B2 (en) 2016-12-15 2023-02-14 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus
KR20180070971A (en) 2016-12-19 2018-06-27 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US10269558B2 (en) 2016-12-22 2019-04-23 Asm Ip Holding B.V. Method of forming a structure on a substrate
US10867788B2 (en) 2016-12-28 2020-12-15 Asm Ip Holding B.V. Method of forming a structure on a substrate
US10655221B2 (en) 2017-02-09 2020-05-19 Asm Ip Holding B.V. Method for depositing oxide film by thermal ALD and PEALD
US10468261B2 (en) 2017-02-15 2019-11-05 Asm Ip Holding B.V. Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
US10529563B2 (en) 2017-03-29 2020-01-07 Asm Ip Holdings B.V. Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
US10283353B2 (en) 2017-03-29 2019-05-07 Asm Ip Holding B.V. Method of reforming insulating film deposited on substrate with recess pattern
KR102457289B1 (en) 2017-04-25 2022-10-21 에이에스엠 아이피 홀딩 비.브이. Method for depositing a thin film and manufacturing a semiconductor device
US10892156B2 (en) 2017-05-08 2021-01-12 Asm Ip Holding B.V. Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
US10770286B2 (en) 2017-05-08 2020-09-08 Asm Ip Holdings B.V. Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
US10446393B2 (en) 2017-05-08 2019-10-15 Asm Ip Holding B.V. Methods for forming silicon-containing epitaxial layers and related semiconductor device structures
DE102017207783B3 (en) 2017-05-09 2018-06-07 Vega Grieshaber Kg Radar level gauge with a phase locked loop
US10504742B2 (en) 2017-05-31 2019-12-10 Asm Ip Holding B.V. Method of atomic layer etching using hydrogen plasma
US10886123B2 (en) 2017-06-02 2021-01-05 Asm Ip Holding B.V. Methods for forming low temperature semiconductor layers and related semiconductor device structures
US11306395B2 (en) 2017-06-28 2022-04-19 Asm Ip Holding B.V. Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
US10685834B2 (en) 2017-07-05 2020-06-16 Asm Ip Holdings B.V. Methods for forming a silicon germanium tin layer and related semiconductor device structures
KR20190009245A (en) 2017-07-18 2019-01-28 에이에스엠 아이피 홀딩 비.브이. Methods for forming a semiconductor device structure and related semiconductor device structures
US11018002B2 (en) 2017-07-19 2021-05-25 Asm Ip Holding B.V. Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
US10541333B2 (en) 2017-07-19 2020-01-21 Asm Ip Holding B.V. Method for depositing a group IV semiconductor and related semiconductor device structures
US11374112B2 (en) 2017-07-19 2022-06-28 Asm Ip Holding B.V. Method for depositing a group IV semiconductor and related semiconductor device structures
US10605530B2 (en) 2017-07-26 2020-03-31 Asm Ip Holding B.V. Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace
US10590535B2 (en) 2017-07-26 2020-03-17 Asm Ip Holdings B.V. Chemical treatment, deposition and/or infiltration apparatus and method for using the same
US10312055B2 (en) 2017-07-26 2019-06-04 Asm Ip Holding B.V. Method of depositing film by PEALD using negative bias
US10770336B2 (en) 2017-08-08 2020-09-08 Asm Ip Holding B.V. Substrate lift mechanism and reactor including same
US10692741B2 (en) 2017-08-08 2020-06-23 Asm Ip Holdings B.V. Radiation shield
US11139191B2 (en) 2017-08-09 2021-10-05 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
US11769682B2 (en) 2017-08-09 2023-09-26 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
US10249524B2 (en) 2017-08-09 2019-04-02 Asm Ip Holding B.V. Cassette holder assembly for a substrate cassette and holding member for use in such assembly
USD900036S1 (en) 2017-08-24 2020-10-27 Asm Ip Holding B.V. Heater electrical connector and adapter
US11830730B2 (en) 2017-08-29 2023-11-28 Asm Ip Holding B.V. Layer forming method and apparatus
KR102491945B1 (en) 2017-08-30 2023-01-26 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US11295980B2 (en) 2017-08-30 2022-04-05 Asm Ip Holding B.V. Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
US11056344B2 (en) 2017-08-30 2021-07-06 Asm Ip Holding B.V. Layer forming method
US10607895B2 (en) 2017-09-18 2020-03-31 Asm Ip Holdings B.V. Method for forming a semiconductor device structure comprising a gate fill metal
KR102630301B1 (en) 2017-09-21 2024-01-29 에이에스엠 아이피 홀딩 비.브이. Method of sequential infiltration synthesis treatment of infiltrateable material and structures and devices formed using same
US10844484B2 (en) 2017-09-22 2020-11-24 Asm Ip Holding B.V. Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
US10658205B2 (en) 2017-09-28 2020-05-19 Asm Ip Holdings B.V. Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
US10403504B2 (en) 2017-10-05 2019-09-03 Asm Ip Holding B.V. Method for selectively depositing a metallic film on a substrate
US10319588B2 (en) 2017-10-10 2019-06-11 Asm Ip Holding B.V. Method for depositing a metal chalcogenide on a substrate by cyclical deposition
US10923344B2 (en) 2017-10-30 2021-02-16 Asm Ip Holding B.V. Methods for forming a semiconductor structure and related semiconductor structures
US10910262B2 (en) 2017-11-16 2021-02-02 Asm Ip Holding B.V. Method of selectively depositing a capping layer structure on a semiconductor device structure
KR102443047B1 (en) 2017-11-16 2022-09-14 에이에스엠 아이피 홀딩 비.브이. Method of processing a substrate and a device manufactured by the same
US11022879B2 (en) 2017-11-24 2021-06-01 Asm Ip Holding B.V. Method of forming an enhanced unexposed photoresist layer
JP7214724B2 (en) 2017-11-27 2023-01-30 エーエスエム アイピー ホールディング ビー.ブイ. Storage device for storing wafer cassettes used in batch furnaces
TWI791689B (en) 2017-11-27 2023-02-11 荷蘭商Asm智慧財產控股私人有限公司 Apparatus including a clean mini environment
US10290508B1 (en) 2017-12-05 2019-05-14 Asm Ip Holding B.V. Method for forming vertical spacers for spacer-defined patterning
US10872771B2 (en) 2018-01-16 2020-12-22 Asm Ip Holding B. V. Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
WO2019142055A2 (en) 2018-01-19 2019-07-25 Asm Ip Holding B.V. Method for depositing a gap-fill layer by plasma-assisted deposition
TWI799494B (en) 2018-01-19 2023-04-21 荷蘭商Asm 智慧財產控股公司 Deposition method
USD903477S1 (en) 2018-01-24 2020-12-01 Asm Ip Holdings B.V. Metal clamp
US11018047B2 (en) 2018-01-25 2021-05-25 Asm Ip Holding B.V. Hybrid lift pin
US10535516B2 (en) 2018-02-01 2020-01-14 Asm Ip Holdings B.V. Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures
USD880437S1 (en) 2018-02-01 2020-04-07 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
US11081345B2 (en) 2018-02-06 2021-08-03 Asm Ip Holding B.V. Method of post-deposition treatment for silicon oxide film
US10896820B2 (en) 2018-02-14 2021-01-19 Asm Ip Holding B.V. Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
US11685991B2 (en) 2018-02-14 2023-06-27 Asm Ip Holding B.V. Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
US10731249B2 (en) 2018-02-15 2020-08-04 Asm Ip Holding B.V. Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus
US10658181B2 (en) 2018-02-20 2020-05-19 Asm Ip Holding B.V. Method of spacer-defined direct patterning in semiconductor fabrication
KR102636427B1 (en) 2018-02-20 2024-02-13 에이에스엠 아이피 홀딩 비.브이. Substrate processing method and apparatus
US10975470B2 (en) 2018-02-23 2021-04-13 Asm Ip Holding B.V. Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
US11473195B2 (en) 2018-03-01 2022-10-18 Asm Ip Holding B.V. Semiconductor processing apparatus and a method for processing a substrate
US11629406B2 (en) 2018-03-09 2023-04-18 Asm Ip Holding B.V. Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
US11114283B2 (en) 2018-03-16 2021-09-07 Asm Ip Holding B.V. Reactor, system including the reactor, and methods of manufacturing and using same
KR102646467B1 (en) 2018-03-27 2024-03-11 에이에스엠 아이피 홀딩 비.브이. Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
US10510536B2 (en) 2018-03-29 2019-12-17 Asm Ip Holding B.V. Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber
US11230766B2 (en) 2018-03-29 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
US11088002B2 (en) 2018-03-29 2021-08-10 Asm Ip Holding B.V. Substrate rack and a substrate processing system and method
KR102501472B1 (en) 2018-03-30 2023-02-20 에이에스엠 아이피 홀딩 비.브이. Substrate processing method
DE102018110165A1 (en) * 2018-04-27 2019-10-31 Gemü Gebr. Müller Apparatebau Gmbh & Co. Kommanditgesellschaft Device for mounting on a component of an industrial plant
TWI811348B (en) 2018-05-08 2023-08-11 荷蘭商Asm 智慧財產控股公司 Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structures
KR20190129718A (en) 2018-05-11 2019-11-20 에이에스엠 아이피 홀딩 비.브이. Methods for forming a doped metal carbide film on a substrate and related semiconductor device structures
KR102596988B1 (en) 2018-05-28 2023-10-31 에이에스엠 아이피 홀딩 비.브이. Method of processing a substrate and a device manufactured by the same
US11718913B2 (en) 2018-06-04 2023-08-08 Asm Ip Holding B.V. Gas distribution system and reactor system including same
TW202013553A (en) 2018-06-04 2020-04-01 荷蘭商Asm 智慧財產控股公司 Wafer handling chamber with moisture reduction
US11286562B2 (en) 2018-06-08 2022-03-29 Asm Ip Holding B.V. Gas-phase chemical reactor and method of using same
KR102568797B1 (en) 2018-06-21 2023-08-21 에이에스엠 아이피 홀딩 비.브이. Substrate processing system
US10797133B2 (en) 2018-06-21 2020-10-06 Asm Ip Holding B.V. Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
JP2021529880A (en) 2018-06-27 2021-11-04 エーエスエム・アイピー・ホールディング・ベー・フェー Periodic deposition methods for forming metal-containing materials and films and structures containing metal-containing materials
CN112292478A (en) 2018-06-27 2021-01-29 Asm Ip私人控股有限公司 Cyclic deposition methods for forming metal-containing materials and films and structures containing metal-containing materials
US10612136B2 (en) 2018-06-29 2020-04-07 ASM IP Holding, B.V. Temperature-controlled flange and reactor system including same
KR20200002519A (en) 2018-06-29 2020-01-08 에이에스엠 아이피 홀딩 비.브이. Method for depositing a thin film and manufacturing a semiconductor device
US10388513B1 (en) 2018-07-03 2019-08-20 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US10755922B2 (en) 2018-07-03 2020-08-25 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US10767789B2 (en) 2018-07-16 2020-09-08 Asm Ip Holding B.V. Diaphragm valves, valve components, and methods for forming valve components
US10483099B1 (en) 2018-07-26 2019-11-19 Asm Ip Holding B.V. Method for forming thermally stable organosilicon polymer film
US11053591B2 (en) 2018-08-06 2021-07-06 Asm Ip Holding B.V. Multi-port gas injection system and reactor system including same
US10883175B2 (en) 2018-08-09 2021-01-05 Asm Ip Holding B.V. Vertical furnace for processing substrates and a liner for use therein
US10829852B2 (en) 2018-08-16 2020-11-10 Asm Ip Holding B.V. Gas distribution device for a wafer processing apparatus
US11430674B2 (en) 2018-08-22 2022-08-30 Asm Ip Holding B.V. Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
US11024523B2 (en) 2018-09-11 2021-06-01 Asm Ip Holding B.V. Substrate processing apparatus and method
KR20200030162A (en) 2018-09-11 2020-03-20 에이에스엠 아이피 홀딩 비.브이. Method for deposition of a thin film
US11049751B2 (en) 2018-09-14 2021-06-29 Asm Ip Holding B.V. Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
CN110970344A (en) 2018-10-01 2020-04-07 Asm Ip控股有限公司 Substrate holding apparatus, system including the same, and method of using the same
US11232963B2 (en) 2018-10-03 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
KR102592699B1 (en) 2018-10-08 2023-10-23 에이에스엠 아이피 홀딩 비.브이. Substrate support unit and apparatuses for depositing thin film and processing the substrate including the same
US10847365B2 (en) 2018-10-11 2020-11-24 Asm Ip Holding B.V. Method of forming conformal silicon carbide film by cyclic CVD
US10811256B2 (en) 2018-10-16 2020-10-20 Asm Ip Holding B.V. Method for etching a carbon-containing feature
KR102546322B1 (en) 2018-10-19 2023-06-21 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus and substrate processing method
KR102605121B1 (en) 2018-10-19 2023-11-23 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus and substrate processing method
USD948463S1 (en) 2018-10-24 2022-04-12 Asm Ip Holding B.V. Susceptor for semiconductor substrate supporting apparatus
US10381219B1 (en) 2018-10-25 2019-08-13 Asm Ip Holding B.V. Methods for forming a silicon nitride film
US11087997B2 (en) 2018-10-31 2021-08-10 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
KR20200051105A (en) 2018-11-02 2020-05-13 에이에스엠 아이피 홀딩 비.브이. Substrate support unit and substrate processing apparatus including the same
US11572620B2 (en) 2018-11-06 2023-02-07 Asm Ip Holding B.V. Methods for selectively depositing an amorphous silicon film on a substrate
US11031242B2 (en) 2018-11-07 2021-06-08 Asm Ip Holding B.V. Methods for depositing a boron doped silicon germanium film
US10847366B2 (en) 2018-11-16 2020-11-24 Asm Ip Holding B.V. Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
US10818758B2 (en) 2018-11-16 2020-10-27 Asm Ip Holding B.V. Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
US10559458B1 (en) 2018-11-26 2020-02-11 Asm Ip Holding B.V. Method of forming oxynitride film
US11217444B2 (en) 2018-11-30 2022-01-04 Asm Ip Holding B.V. Method for forming an ultraviolet radiation responsive metal oxide-containing film
KR102636428B1 (en) 2018-12-04 2024-02-13 에이에스엠 아이피 홀딩 비.브이. A method for cleaning a substrate processing apparatus
US11158513B2 (en) 2018-12-13 2021-10-26 Asm Ip Holding B.V. Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
TW202037745A (en) 2018-12-14 2020-10-16 荷蘭商Asm Ip私人控股有限公司 Method of forming device structure, structure formed by the method and system for performing the method
TWI819180B (en) 2019-01-17 2023-10-21 荷蘭商Asm 智慧財產控股公司 Methods of forming a transition metal containing film on a substrate by a cyclical deposition process
KR20200091543A (en) 2019-01-22 2020-07-31 에이에스엠 아이피 홀딩 비.브이. Semiconductor processing device
CN111524788B (en) 2019-02-01 2023-11-24 Asm Ip私人控股有限公司 Method for topologically selective film formation of silicon oxide
JP2020136677A (en) 2019-02-20 2020-08-31 エーエスエム・アイピー・ホールディング・ベー・フェー Periodic accumulation method for filing concave part formed inside front surface of base material, and device
KR102626263B1 (en) 2019-02-20 2024-01-16 에이에스엠 아이피 홀딩 비.브이. Cyclical deposition method including treatment step and apparatus for same
KR20200102357A (en) 2019-02-20 2020-08-31 에이에스엠 아이피 홀딩 비.브이. Apparatus and methods for plug fill deposition in 3-d nand applications
JP2020136678A (en) 2019-02-20 2020-08-31 エーエスエム・アイピー・ホールディング・ベー・フェー Method for filing concave part formed inside front surface of base material, and device
TW202100794A (en) 2019-02-22 2021-01-01 荷蘭商Asm Ip私人控股有限公司 Substrate processing apparatus and method for processing substrate
KR20200108242A (en) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. Method for Selective Deposition of Silicon Nitride Layer and Structure Including Selectively-Deposited Silicon Nitride Layer
US11742198B2 (en) 2019-03-08 2023-08-29 Asm Ip Holding B.V. Structure including SiOCN layer and method of forming same
KR20200108243A (en) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. Structure Including SiOC Layer and Method of Forming Same
JP2020167398A (en) 2019-03-28 2020-10-08 エーエスエム・アイピー・ホールディング・ベー・フェー Door opener and substrate processing apparatus provided therewith
KR20200116855A (en) 2019-04-01 2020-10-13 에이에스엠 아이피 홀딩 비.브이. Method of manufacturing semiconductor device
US11447864B2 (en) 2019-04-19 2022-09-20 Asm Ip Holding B.V. Layer forming method and apparatus
KR20200125453A (en) 2019-04-24 2020-11-04 에이에스엠 아이피 홀딩 비.브이. Gas-phase reactor system and method of using same
KR20200130118A (en) 2019-05-07 2020-11-18 에이에스엠 아이피 홀딩 비.브이. Method for Reforming Amorphous Carbon Polymer Film
KR20200130121A (en) 2019-05-07 2020-11-18 에이에스엠 아이피 홀딩 비.브이. Chemical source vessel with dip tube
KR20200130652A (en) 2019-05-10 2020-11-19 에이에스엠 아이피 홀딩 비.브이. Method of depositing material onto a surface and structure formed according to the method
JP2020188255A (en) 2019-05-16 2020-11-19 エーエスエム アイピー ホールディング ビー.ブイ. Wafer boat handling device, vertical batch furnace, and method
USD975665S1 (en) 2019-05-17 2023-01-17 Asm Ip Holding B.V. Susceptor shaft
USD947913S1 (en) 2019-05-17 2022-04-05 Asm Ip Holding B.V. Susceptor shaft
USD935572S1 (en) 2019-05-24 2021-11-09 Asm Ip Holding B.V. Gas channel plate
USD922229S1 (en) 2019-06-05 2021-06-15 Asm Ip Holding B.V. Device for controlling a temperature of a gas supply unit
KR20200141003A (en) 2019-06-06 2020-12-17 에이에스엠 아이피 홀딩 비.브이. Gas-phase reactor system including a gas detector
KR20200143254A (en) 2019-06-11 2020-12-23 에이에스엠 아이피 홀딩 비.브이. Method of forming an electronic structure using an reforming gas, system for performing the method, and structure formed using the method
USD944946S1 (en) 2019-06-14 2022-03-01 Asm Ip Holding B.V. Shower plate
USD931978S1 (en) 2019-06-27 2021-09-28 Asm Ip Holding B.V. Showerhead vacuum transport
KR20210005515A (en) 2019-07-03 2021-01-14 에이에스엠 아이피 홀딩 비.브이. Temperature control assembly for substrate processing apparatus and method of using same
JP2021015791A (en) 2019-07-09 2021-02-12 エーエスエム アイピー ホールディング ビー.ブイ. Plasma device and substrate processing method using coaxial waveguide
CN112216646A (en) 2019-07-10 2021-01-12 Asm Ip私人控股有限公司 Substrate supporting assembly and substrate processing device comprising same
KR20210010307A (en) 2019-07-16 2021-01-27 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
KR20210010820A (en) 2019-07-17 2021-01-28 에이에스엠 아이피 홀딩 비.브이. Methods of forming silicon germanium structures
KR20210010816A (en) 2019-07-17 2021-01-28 에이에스엠 아이피 홀딩 비.브이. Radical assist ignition plasma system and method
US11643724B2 (en) 2019-07-18 2023-05-09 Asm Ip Holding B.V. Method of forming structures using a neutral beam
TW202121506A (en) 2019-07-19 2021-06-01 荷蘭商Asm Ip私人控股有限公司 Method of forming topology-controlled amorphous carbon polymer film
TW202113936A (en) 2019-07-29 2021-04-01 荷蘭商Asm Ip私人控股有限公司 Methods for selective deposition utilizing n-type dopants and/or alternative dopants to achieve high dopant incorporation
CN112309900A (en) 2019-07-30 2021-02-02 Asm Ip私人控股有限公司 Substrate processing apparatus
CN112309899A (en) 2019-07-30 2021-02-02 Asm Ip私人控股有限公司 Substrate processing apparatus
US11587814B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11587815B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11227782B2 (en) 2019-07-31 2022-01-18 Asm Ip Holding B.V. Vertical batch furnace assembly
CN112323048B (en) 2019-08-05 2024-02-09 Asm Ip私人控股有限公司 Liquid level sensor for chemical source container
USD965044S1 (en) 2019-08-19 2022-09-27 Asm Ip Holding B.V. Susceptor shaft
USD965524S1 (en) 2019-08-19 2022-10-04 Asm Ip Holding B.V. Susceptor support
JP2021031769A (en) 2019-08-21 2021-03-01 エーエスエム アイピー ホールディング ビー.ブイ. Production apparatus of mixed gas of film deposition raw material and film deposition apparatus
USD979506S1 (en) 2019-08-22 2023-02-28 Asm Ip Holding B.V. Insulator
USD949319S1 (en) 2019-08-22 2022-04-19 Asm Ip Holding B.V. Exhaust duct
USD930782S1 (en) 2019-08-22 2021-09-14 Asm Ip Holding B.V. Gas distributor
KR20210024423A (en) 2019-08-22 2021-03-05 에이에스엠 아이피 홀딩 비.브이. Method for forming a structure with a hole
USD940837S1 (en) 2019-08-22 2022-01-11 Asm Ip Holding B.V. Electrode
KR20210024420A (en) 2019-08-23 2021-03-05 에이에스엠 아이피 홀딩 비.브이. Method for depositing silicon oxide film having improved quality by peald using bis(diethylamino)silane
US11286558B2 (en) 2019-08-23 2022-03-29 Asm Ip Holding B.V. Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
KR20210029090A (en) 2019-09-04 2021-03-15 에이에스엠 아이피 홀딩 비.브이. Methods for selective deposition using a sacrificial capping layer
KR20210029663A (en) 2019-09-05 2021-03-16 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US11562901B2 (en) 2019-09-25 2023-01-24 Asm Ip Holding B.V. Substrate processing method
CN112593212B (en) 2019-10-02 2023-12-22 Asm Ip私人控股有限公司 Method for forming topologically selective silicon oxide film by cyclic plasma enhanced deposition process
TW202129060A (en) 2019-10-08 2021-08-01 荷蘭商Asm Ip控股公司 Substrate processing device, and substrate processing method
KR20210043460A (en) 2019-10-10 2021-04-21 에이에스엠 아이피 홀딩 비.브이. Method of forming a photoresist underlayer and structure including same
KR20210045930A (en) 2019-10-16 2021-04-27 에이에스엠 아이피 홀딩 비.브이. Method of Topology-Selective Film Formation of Silicon Oxide
US11637014B2 (en) 2019-10-17 2023-04-25 Asm Ip Holding B.V. Methods for selective deposition of doped semiconductor material
KR20210047808A (en) 2019-10-21 2021-04-30 에이에스엠 아이피 홀딩 비.브이. Apparatus and methods for selectively etching films
US11646205B2 (en) 2019-10-29 2023-05-09 Asm Ip Holding B.V. Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
KR20210054983A (en) 2019-11-05 2021-05-14 에이에스엠 아이피 홀딩 비.브이. Structures with doped semiconductor layers and methods and systems for forming same
US11501968B2 (en) 2019-11-15 2022-11-15 Asm Ip Holding B.V. Method for providing a semiconductor device with silicon filled gaps
KR20210062561A (en) 2019-11-20 2021-05-31 에이에스엠 아이피 홀딩 비.브이. Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure
CN112951697A (en) 2019-11-26 2021-06-11 Asm Ip私人控股有限公司 Substrate processing apparatus
KR20210065848A (en) 2019-11-26 2021-06-04 에이에스엠 아이피 홀딩 비.브이. Methods for selectivley forming a target film on a substrate comprising a first dielectric surface and a second metallic surface
CN112885693A (en) 2019-11-29 2021-06-01 Asm Ip私人控股有限公司 Substrate processing apparatus
CN112885692A (en) 2019-11-29 2021-06-01 Asm Ip私人控股有限公司 Substrate processing apparatus
JP2021090042A (en) 2019-12-02 2021-06-10 エーエスエム アイピー ホールディング ビー.ブイ. Substrate processing apparatus and substrate processing method
KR20210070898A (en) 2019-12-04 2021-06-15 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
JP2021097227A (en) 2019-12-17 2021-06-24 エーエスエム・アイピー・ホールディング・ベー・フェー Method of forming vanadium nitride layer and structure including vanadium nitride layer
KR20210080214A (en) 2019-12-19 2021-06-30 에이에스엠 아이피 홀딩 비.브이. Methods for filling a gap feature on a substrate and related semiconductor structures
KR20210095050A (en) 2020-01-20 2021-07-30 에이에스엠 아이피 홀딩 비.브이. Method of forming thin film and method of modifying surface of thin film
TW202130846A (en) 2020-02-03 2021-08-16 荷蘭商Asm Ip私人控股有限公司 Method of forming structures including a vanadium or indium layer
KR20210100010A (en) 2020-02-04 2021-08-13 에이에스엠 아이피 홀딩 비.브이. Method and apparatus for transmittance measurements of large articles
US11776846B2 (en) 2020-02-07 2023-10-03 Asm Ip Holding B.V. Methods for depositing gap filling fluids and related systems and devices
TW202146715A (en) 2020-02-17 2021-12-16 荷蘭商Asm Ip私人控股有限公司 Method for growing phosphorous-doped silicon layer and system of the same
US11876356B2 (en) 2020-03-11 2024-01-16 Asm Ip Holding B.V. Lockout tagout assembly and system and method of using same
KR20210116240A (en) 2020-03-11 2021-09-27 에이에스엠 아이피 홀딩 비.브이. Substrate handling device with adjustable joints
KR20210124042A (en) 2020-04-02 2021-10-14 에이에스엠 아이피 홀딩 비.브이. Thin film forming method
TW202146689A (en) 2020-04-03 2021-12-16 荷蘭商Asm Ip控股公司 Method for forming barrier layer and method for manufacturing semiconductor device
TW202145344A (en) 2020-04-08 2021-12-01 荷蘭商Asm Ip私人控股有限公司 Apparatus and methods for selectively etching silcon oxide films
US11821078B2 (en) 2020-04-15 2023-11-21 Asm Ip Holding B.V. Method for forming precoat film and method for forming silicon-containing film
KR20210132576A (en) 2020-04-24 2021-11-04 에이에스엠 아이피 홀딩 비.브이. Method of forming vanadium nitride-containing layer and structure comprising the same
KR20210132605A (en) 2020-04-24 2021-11-04 에이에스엠 아이피 홀딩 비.브이. Vertical batch furnace assembly comprising a cooling gas supply
KR20210132600A (en) 2020-04-24 2021-11-04 에이에스엠 아이피 홀딩 비.브이. Methods and systems for depositing a layer comprising vanadium, nitrogen, and a further element
KR20210134869A (en) 2020-05-01 2021-11-11 에이에스엠 아이피 홀딩 비.브이. Fast FOUP swapping with a FOUP handler
KR20210141379A (en) 2020-05-13 2021-11-23 에이에스엠 아이피 홀딩 비.브이. Laser alignment fixture for a reactor system
KR20210143653A (en) 2020-05-19 2021-11-29 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
KR20210145078A (en) 2020-05-21 2021-12-01 에이에스엠 아이피 홀딩 비.브이. Structures including multiple carbon layers and methods of forming and using same
TW202201602A (en) 2020-05-29 2022-01-01 荷蘭商Asm Ip私人控股有限公司 Substrate processing device
TW202218133A (en) 2020-06-24 2022-05-01 荷蘭商Asm Ip私人控股有限公司 Method for forming a layer provided with silicon
TW202217953A (en) 2020-06-30 2022-05-01 荷蘭商Asm Ip私人控股有限公司 Substrate processing method
TW202219628A (en) 2020-07-17 2022-05-16 荷蘭商Asm Ip私人控股有限公司 Structures and methods for use in photolithography
TW202204662A (en) 2020-07-20 2022-02-01 荷蘭商Asm Ip私人控股有限公司 Method and system for depositing molybdenum layers
KR20220027026A (en) 2020-08-26 2022-03-07 에이에스엠 아이피 홀딩 비.브이. Method and system for forming metal silicon oxide and metal silicon oxynitride
USD990534S1 (en) 2020-09-11 2023-06-27 Asm Ip Holding B.V. Weighted lift pin
USD1012873S1 (en) 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus
TW202229613A (en) 2020-10-14 2022-08-01 荷蘭商Asm Ip私人控股有限公司 Method of depositing material on stepped structure
KR20220053482A (en) 2020-10-22 2022-04-29 에이에스엠 아이피 홀딩 비.브이. Method of depositing vanadium metal, structure, device and a deposition assembly
TW202223136A (en) 2020-10-28 2022-06-16 荷蘭商Asm Ip私人控股有限公司 Method for forming layer on substrate, and semiconductor processing system
KR20220076343A (en) 2020-11-30 2022-06-08 에이에스엠 아이피 홀딩 비.브이. an injector configured for arrangement within a reaction chamber of a substrate processing apparatus
US11946137B2 (en) 2020-12-16 2024-04-02 Asm Ip Holding B.V. Runout and wobble measurement fixtures
TW202231903A (en) 2020-12-22 2022-08-16 荷蘭商Asm Ip私人控股有限公司 Transition metal deposition method, transition metal layer, and deposition assembly for depositing transition metal on substrate
USD981973S1 (en) 2021-05-11 2023-03-28 Asm Ip Holding B.V. Reactor wall for substrate processing apparatus
USD980813S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD980814S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD990441S1 (en) 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate

Family Cites Families (202)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2883489A (en) * 1954-12-06 1959-04-21 Daystrom Inc Encased electrical instrument
US3232712A (en) * 1962-08-16 1966-02-01 Continental Lab Inc Gas detector and analyzer
GB1027719A (en) * 1963-12-02
US3568762A (en) * 1967-05-23 1971-03-09 Rca Corp Heat pipe
US3612851A (en) 1970-04-17 1971-10-12 Lewis Eng Co Rotatably adjustable indicator instrument
US3881962A (en) * 1971-07-29 1975-05-06 Gen Atomic Co Thermoelectric generator including catalytic burner and cylindrical jacket containing heat exchange fluid
GB1397435A (en) * 1972-08-25 1975-06-11 Hull F R Regenerative vapour power plant
US3931532A (en) * 1974-03-19 1976-01-06 The United States Of America As Represented By The United States National Aeronautics And Space Administration Thermoelectric power system
GB1525709A (en) 1975-04-10 1978-09-20 Chloride Silent Power Ltd Thermo-electric generators
US4125122A (en) 1975-08-11 1978-11-14 Stachurski John Z O Direct energy conversion device
US4026348A (en) * 1975-10-06 1977-05-31 Bell Telephone Laboratories, Incorporated Heat pipe switch
GR67600B (en) * 1979-06-29 1981-08-31 Payot Jocelyne
US4370890A (en) * 1980-10-06 1983-02-01 Rosemount Inc. Capacitive pressure transducer with isolated sensing diaphragm
US4485670A (en) 1981-02-13 1984-12-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Heat pipe cooled probe
US4383801A (en) * 1981-03-02 1983-05-17 Pryor Dale H Wind turbine with adjustable air foils
US4389895A (en) * 1981-07-27 1983-06-28 Rosemount Inc. Capacitance pressure sensor
US4475047A (en) 1982-04-29 1984-10-02 At&T Bell Laboratories Uninterruptible power supplies
SE445389B (en) * 1982-06-28 1986-06-16 Geotronics Ab PROCEDURE AND DEVICE FOR RECEIVING METDATA FROM A CHEMICAL PROCESS
US4476853A (en) 1982-09-28 1984-10-16 Arbogast Clayton C Solar energy recovery system
GB2145876A (en) 1983-08-24 1985-04-03 Shlomo Beitner DC power generation for telemetry and like equipment from geothermal energy
DE3340834A1 (en) 1983-11-11 1985-05-23 Philips Patentverwaltung Gmbh, 2000 Hamburg Circuit arrangement for keeping the temperature-dependent sensitivity of a differential-pressure measurement apparatus constant
US4639542A (en) * 1984-06-11 1987-01-27 Ga Technologies Inc. Modular thermoelectric conversion system
GB8426964D0 (en) 1984-10-25 1984-11-28 Sieger Ltd Adjusting circuit parameter
US4651019A (en) * 1984-11-16 1987-03-17 Pennsylvania Power & Light Company Dual fueled thermoelectric generator
DE3503347A1 (en) * 1985-02-01 1986-08-14 Dr.Ing.H.C. F. Porsche Ag, 7000 Stuttgart DEVICE FOR WIRELESS MEASURING SIGNAL TRANSMISSION
US4860232A (en) 1987-04-22 1989-08-22 Massachusetts Institute Of Technology Digital technique for precise measurement of variable capacitance
CH672368A5 (en) * 1987-08-20 1989-11-15 Rudolf Staempfli Solar thermal power plant with expansive heat engine - utilises pressure increase of working fluid in thermal storage heater transmitting energy between two closed circuits
US4878012A (en) 1988-06-10 1989-10-31 Rosemount Inc. Charge balanced feedback transmitter
US4977480A (en) 1988-09-14 1990-12-11 Fuji Koki Mfg. Co., Ltd. Variable-capacitance type sensor and variable-capacitance type sensor system using the same
DE3907209C1 (en) 1989-01-18 1990-03-01 Danfoss A/S, Nordborg, Dk
US4982412A (en) * 1989-03-13 1991-01-01 Moore Push-Pin Company Apparatus and method for counting a plurality of similar articles
JPH0769750B2 (en) * 1989-09-08 1995-07-31 三菱電機株式会社 Solar battery power system
SU1746056A1 (en) 1990-02-21 1992-07-07 Рижский технический университет Windmill
USD331370S (en) 1990-11-15 1992-12-01 Titan Industries, Inc. Programmable additive controller
JP2753389B2 (en) * 1990-11-28 1998-05-20 株式会社日立製作所 Fieldbus system
US5094109A (en) * 1990-12-06 1992-03-10 Rosemount Inc. Pressure transmitter with stress isolation depression
RU1813916C (en) 1990-12-10 1993-05-07 Ч.-КАБудревич Wind motor
DE4124662A1 (en) 1991-07-25 1993-01-28 Fibronix Sensoren Gmbh RELATIVE PRESSURE SENSOR
US5329818A (en) 1992-05-28 1994-07-19 Rosemount Inc. Correction of a pressure indication in a pressure transducer due to variations of an environmental condition
USD345107S (en) * 1992-06-01 1994-03-15 Titan Industries, Inc. Programmable additive controller
US5313831A (en) * 1992-07-31 1994-05-24 Paul Beckman Radial junction thermal flowmeter
JPH08557B2 (en) * 1992-10-30 1996-01-10 川崎重工業株式会社 Emergency heat exhaust device for heat engine power generation system with pressure shell for deep sea
US5506757A (en) * 1993-06-14 1996-04-09 Macsema, Inc. Compact electronic data module with nonvolatile memory
US5412535A (en) * 1993-08-24 1995-05-02 Convex Computer Corporation Apparatus and method for cooling electronic devices
SG44494A1 (en) * 1993-09-07 1997-12-19 R0Semount Inc Multivariable transmitter
US5606513A (en) * 1993-09-20 1997-02-25 Rosemount Inc. Transmitter having input for receiving a process variable from a remote sensor
JP3111816B2 (en) 1993-10-08 2000-11-27 株式会社日立製作所 Process state detector
US5642301A (en) * 1994-01-25 1997-06-24 Rosemount Inc. Transmitter with improved compensation
US5531936A (en) * 1994-08-31 1996-07-02 Board Of Trustees Operating Michigan State University Alkali metal quaternary chalcogenides and process for the preparation thereof
GB2293446A (en) 1994-09-17 1996-03-27 Liang Chung Lee Cooling assembly
BR9509503A (en) 1994-10-24 1997-12-30 Fisher Rosemount Systems Inc Networked field device distributed control system bridge field module designed to transmit information from a distribution network to a bridge / converter control network
US5793963A (en) 1994-10-24 1998-08-11 Fisher Rosemount Systems, Inc. Apparatus for providing non-redundant secondary access to field devices in a distributed control system
US5656782A (en) 1994-12-06 1997-08-12 The Foxboro Company Pressure sealed housing apparatus and methods
US5637802A (en) * 1995-02-28 1997-06-10 Rosemount Inc. Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates
US5644185A (en) 1995-06-19 1997-07-01 Miller; Joel V. Multi stage thermoelectric power generation using an ammonia absorption refrigeration cycle and thermoelectric elements at numerous locations in the cycle
US5705978A (en) * 1995-09-29 1998-01-06 Rosemount Inc. Process control transmitter
JPH09130289A (en) 1995-10-31 1997-05-16 Mitsubishi Electric Corp Portable analog communication equipment
DE19608310C1 (en) 1996-02-22 1997-07-17 Hartmann & Braun Ag Differential pressure transmitter unit with an overload protection system
US5665899A (en) 1996-02-23 1997-09-09 Rosemount Inc. Pressure sensor diagnostics in a process transmitter
US7949495B2 (en) * 1996-03-28 2011-05-24 Rosemount, Inc. Process variable transmitter with diagnostics
US6907383B2 (en) * 1996-03-28 2005-06-14 Rosemount Inc. Flow diagnostic system
FR2747238B1 (en) 1996-04-04 1998-07-10 France Etat THERMOELECTRIC GENERATOR
US5811201A (en) 1996-08-16 1998-09-22 Southern California Edison Company Power generation system utilizing turbine and fuel cell
ES2127122B1 (en) * 1996-09-02 1999-12-16 Blaquez Navarro Vicente AUTONOMOUS ELECTRONIC IMPROVED MONITORING SYSTEM FOR PURGERS, VALVES AND INSTALLATIONS IN REAL TIME.
US5803604A (en) * 1996-09-30 1998-09-08 Exergen Corporation Thermocouple transmitter
US5851083A (en) 1996-10-04 1998-12-22 Rosemount Inc. Microwave level gauge having an adapter with a thermal barrier
US5954526A (en) 1996-10-04 1999-09-21 Rosemount Inc. Process control transmitter with electrical feedthrough assembly
FR2758009B1 (en) 1996-12-26 1999-03-19 France Etat UNDERWATER THERMOELECTRIC GENERATOR WITH THERMOELECTRIC MODULES ARRANGED IN SLEEVES
PL334922A1 (en) * 1997-02-12 2000-03-27 Siemens Ag Circuit arrangement for and method of obtaining high-frequency encoded signals
JP3633180B2 (en) * 1997-02-14 2005-03-30 株式会社日立製作所 Remote monitoring system
US6458319B1 (en) 1997-03-18 2002-10-01 California Institute Of Technology High performance P-type thermoelectric materials and methods of preparation
US6013204A (en) * 1997-03-28 2000-01-11 Board Of Trustees Operating Michigan State University Alkali metal chalcogenides of bismuth alone or with antimony
US6792259B1 (en) * 1997-05-09 2004-09-14 Ronald J. Parise Remote power communication system and method thereof
US7068991B2 (en) * 1997-05-09 2006-06-27 Parise Ronald J Remote power recharge for electronic equipment
US5872494A (en) * 1997-06-27 1999-02-16 Rosemount Inc. Level gage waveguide process seal having wavelength-based dimensions
RU2131934C1 (en) * 1997-09-01 1999-06-20 Санков Олег Николаевич Installation for heat treatment of materials
US6282247B1 (en) * 1997-09-12 2001-08-28 Ericsson Inc. Method and apparatus for digital compensation of radio distortion over a wide range of temperatures
US6437692B1 (en) 1998-06-22 2002-08-20 Statsignal Systems, Inc. System and method for monitoring and controlling remote devices
US6891838B1 (en) * 1998-06-22 2005-05-10 Statsignal Ipc, Llc System and method for monitoring and controlling residential devices
KR20010071587A (en) * 1998-06-26 2001-07-28 홀 케네스 알. Thermocouple for use in gasification process
US6360277B1 (en) * 1998-07-22 2002-03-19 Crydom Corporation Addressable intelligent relay
US6480699B1 (en) * 1998-08-28 2002-11-12 Woodtoga Holdings Company Stand-alone device for transmitting a wireless signal containing data from a memory or a sensor
US6405139B1 (en) * 1998-09-15 2002-06-11 Bently Nevada Corporation System for monitoring plant assets including machinery
US6312617B1 (en) 1998-10-13 2001-11-06 Board Of Trustees Operating Michigan State University Conductive isostructural compounds
US7640007B2 (en) 1999-02-12 2009-12-29 Fisher-Rosemount Systems, Inc. Wireless handheld communicator in a process control environment
US6127739A (en) 1999-03-22 2000-10-03 Appa; Kari Jet assisted counter rotating wind turbine
US6783167B2 (en) * 1999-03-24 2004-08-31 Donnelly Corporation Safety system for a closed compartment of a vehicle
FI111760B (en) * 1999-04-16 2003-09-15 Metso Automation Oy Wireless control of a field device in an industrial process
JP2000321361A (en) 1999-05-07 2000-11-24 Kubota Corp Communication system
US6508131B2 (en) * 1999-05-14 2003-01-21 Rosemount Inc. Process sensor module having a single ungrounded input/output conductor
US6295875B1 (en) 1999-05-14 2001-10-02 Rosemount Inc. Process pressure measurement devices with improved error compensation
US7064671B2 (en) 2000-06-23 2006-06-20 Fisher Controls International Llc Low power regulator system and method
US6255010B1 (en) 1999-07-19 2001-07-03 Siemens Westinghouse Power Corporation Single module pressurized fuel cell turbine generator system
US6385972B1 (en) * 1999-08-30 2002-05-14 Oscar Lee Fellows Thermoacoustic resonator
US6667594B2 (en) 1999-11-23 2003-12-23 Honeywell International Inc. Determination of maximum travel of linear actuator
RU2168062C1 (en) 1999-12-07 2001-05-27 Открытое акционерное общество "Всероссийский научно-исследовательский институт гидротехники им. Б.Е. Веденеева" Windmill generator
US6934862B2 (en) 2000-01-07 2005-08-23 Robertshaw Controls Company Appliance retrofit monitoring device with a memory storing an electronic signature
JP2001222787A (en) 2000-02-07 2001-08-17 Mitsui Eng & Shipbuild Co Ltd Measuring system for rotary drum
DE10014272B4 (en) * 2000-03-22 2008-06-05 Endress + Hauser Gmbh + Co. Kg Field device, and method for reprogramming a field device
US6744814B1 (en) * 2000-03-31 2004-06-01 Agere Systems Inc. Method and apparatus for reduced state sequence estimation with tap-selectable decision-feedback
AT410041B (en) 2000-04-17 2003-01-27 Voest Alpine Ind Anlagen METHOD AND DEVICE FOR RECORDING MEASUREMENT DATA IN A SHELL MILL
US6441747B1 (en) 2000-04-18 2002-08-27 Motorola, Inc. Wireless system protocol for telemetry monitoring
US6574515B1 (en) * 2000-05-12 2003-06-03 Rosemount Inc. Two-wire field-mounted process device
US6326764B1 (en) 2000-06-05 2001-12-04 Clement Virtudes Portable solar-powered CD player and electrical generator
FI114507B (en) * 2000-07-07 2004-10-29 Metso Automation Oy System for diagnostics of a device
JP3553001B2 (en) 2000-08-04 2004-08-11 高圧ガス保安協会 Gas monitoring system
DE60018072T2 (en) 2000-10-27 2005-12-29 Invensys Systems, Inc., Foxboro Field device with a transmitter and / or receiver for wireless data transmission
ATE298962T1 (en) 2001-01-12 2005-07-15 Vector Informatik Gmbh METHOD AND DEVICE FOR CHECKING THE RELEVANCE OF AN IDENTIFIER
US6686831B2 (en) 2001-01-23 2004-02-03 Invensys Systems, Inc. Variable power control for process control instruments
US6728603B2 (en) 2001-02-08 2004-04-27 Electronic Data Systems Corporation System and method for managing wireless vehicular communications
US6625990B2 (en) 2001-02-09 2003-09-30 Bsst Llc Thermoelectric power generation systems
JP3394996B2 (en) 2001-03-09 2003-04-07 独立行政法人産業技術総合研究所 Maximum power operating point tracking method and device
DE20107112U1 (en) * 2001-04-25 2001-07-05 Abb Patent Gmbh Device for supplying energy to field devices
DE10125058B4 (en) * 2001-05-22 2014-02-27 Enocean Gmbh Thermally fed transmitter and sensor system
JP2002369554A (en) 2001-06-06 2002-12-20 Nec Tokin Corp Indicator
DE10128447A1 (en) 2001-06-12 2003-01-02 Abb Patent Gmbh Electropneumatic actuator drive has position sensor and is fitted with wireless communications interface corresponding to that of position sensor
US6564859B2 (en) * 2001-06-27 2003-05-20 Intel Corporation Efficient heat pumping from mobile platforms using on platform assembled heat pipe
US20030012563A1 (en) * 2001-07-10 2003-01-16 Darrell Neugebauer Space heater with remote control
JP2003051894A (en) 2001-08-08 2003-02-21 Mitsubishi Electric Corp Work management system for plant
US6781249B2 (en) * 2001-08-29 2004-08-24 Hewlett-Packard Development Company, L.P. Retrofittable power supply
EP1293853A1 (en) 2001-09-12 2003-03-19 ENDRESS + HAUSER WETZER GmbH + Co. KG Transceiver module for a field device
US20030134161A1 (en) 2001-09-20 2003-07-17 Gore Makarand P. Protective container with preventative agent therein
US6995685B2 (en) * 2001-09-25 2006-02-07 Landis+Gyr, Inc. Utility meter power arrangements and methods
JP4114334B2 (en) * 2001-10-09 2008-07-09 株式会社ジェイテクト Rolling bearing
JP3815603B2 (en) 2001-10-29 2006-08-30 横河電機株式会社 Communications system
CA2460290A1 (en) * 2001-11-01 2003-05-08 Bliss C. Carkhuff Techniques for monitoring health of vessels containing fluids
JP2003149058A (en) * 2001-11-14 2003-05-21 Toshiba Corp Temperature sensor and plant temperature measuring device
JP2003168182A (en) 2001-12-04 2003-06-13 Nsk Ltd Wireless sensor
US7301454B2 (en) * 2001-12-21 2007-11-27 Bae Systems Plc Sensor system
US7002800B2 (en) * 2002-01-25 2006-02-21 Lockheed Martin Corporation Integrated power and cooling architecture
US6778100B2 (en) 2002-03-06 2004-08-17 Automatika, Inc. Conduit network system
US7035773B2 (en) 2002-03-06 2006-04-25 Fisher-Rosemount Systems, Inc. Appendable system and devices for data acquisition, analysis and control
US6839546B2 (en) * 2002-04-22 2005-01-04 Rosemount Inc. Process transmitter with wireless communication link
US20030204371A1 (en) 2002-04-30 2003-10-30 Chevron U.S.A. Inc. Temporary wireless sensor network system
US20040203984A1 (en) * 2002-06-11 2004-10-14 Tai-Her Yang Wireless information device with its transmission power lever adjustable
JP2004021877A (en) 2002-06-20 2004-01-22 Yokogawa Electric Corp Field apparatus
US6843110B2 (en) * 2002-06-25 2005-01-18 Fluid Components International Llc Method and apparatus for validating the accuracy of a flowmeter
AU2003279616A1 (en) 2002-06-28 2004-01-19 Advanced Bionics Corporation Microstimulator having self-contained power source and bi-directional telemetry system
US20040140002A1 (en) 2002-07-05 2004-07-22 Brown Jacob E. Apparatus, system, and method of mechanically coupling photovoltaic modules
US7709766B2 (en) * 2002-08-05 2010-05-04 Research Foundation Of The State University Of New York System and method for manufacturing embedded conformal electronics
US6838859B2 (en) * 2002-08-13 2005-01-04 Reza H. Shah Device for increasing power of extremely low DC voltage
US7063537B2 (en) * 2002-08-15 2006-06-20 Smar Research Corporation Rotatable assemblies and methods of securing such assemblies
AU2002357654A1 (en) * 2002-09-13 2004-04-30 Proton Energy Systems, Inc. Method and system for balanced control of backup power
US6910332B2 (en) * 2002-10-15 2005-06-28 Oscar Lee Fellows Thermoacoustic engine-generator
US7440735B2 (en) 2002-10-23 2008-10-21 Rosemount Inc. Virtual wireless transmitter
US20040081872A1 (en) * 2002-10-28 2004-04-29 Herman Gregory S. Fuel cell stack with heat exchanger
US6926440B2 (en) * 2002-11-01 2005-08-09 The Boeing Company Infrared temperature sensors for solar panel
WO2004043843A1 (en) 2002-11-12 2004-05-27 Mitsubishi Denki Kabushiki Kaisha Rope for elevator and elevator equipment
JP2004208476A (en) 2002-12-26 2004-07-22 Toyota Motor Corp Waste heat power generator
US20040159235A1 (en) * 2003-02-19 2004-08-19 Marganski Paul J. Low pressure drop canister for fixed bed scrubber applications and method of using same
AU2003212340A1 (en) * 2003-03-12 2004-09-30 Abb Research Ltd. Arrangement and method for continuously supplying electric power to a field device in a technical system
US6904476B2 (en) 2003-04-04 2005-06-07 Rosemount Inc. Transmitter with dual protocol interface
US7326851B2 (en) 2003-04-11 2008-02-05 Basf Aktiengesellschaft Pb-Ge-Te-compounds for thermoelectric generators or Peltier arrangements
US6891477B2 (en) * 2003-04-23 2005-05-10 Baker Hughes Incorporated Apparatus and methods for remote monitoring of flow conduits
US20040214543A1 (en) * 2003-04-28 2004-10-28 Yasuo Osone Variable capacitor system, microswitch and transmitter-receiver
JP2004350479A (en) 2003-05-26 2004-12-09 Hitachi Powdered Metals Co Ltd Thermoelectric conversion power generating unit and tunnel type furnace equipped with same
US7272454B2 (en) 2003-06-05 2007-09-18 Fisher-Rosemount Systems, Inc. Multiple-input/multiple-output control blocks with non-linear predictive capabilities
US7460865B2 (en) 2003-06-18 2008-12-02 Fisher-Rosemount Systems, Inc. Self-configuring communication networks for use with process control systems
US7436797B2 (en) 2003-06-18 2008-10-14 Fisher-Rosemount Systems, Inc. Wireless architecture and support for process control systems
US7275213B2 (en) * 2003-08-11 2007-09-25 Ricoh Company, Ltd. Configuring a graphical user interface on a multifunction peripheral
US20050046595A1 (en) * 2003-08-26 2005-03-03 Mr.John Blyth Solar powered sign annunciator
US8481843B2 (en) * 2003-09-12 2013-07-09 Board Of Trustees Operating Michigan State University Silver-containing p-type semiconductor
US7627441B2 (en) * 2003-09-30 2009-12-01 Rosemount Inc. Process device with vibration based diagnostics
US6932561B2 (en) * 2003-10-01 2005-08-23 Wafermasters, Inc. Power generation system
US7508671B2 (en) * 2003-10-10 2009-03-24 Intel Corporation Computer system having controlled cooling
US20050082949A1 (en) * 2003-10-21 2005-04-21 Michio Tsujiura Piezoelectric generator
US7655331B2 (en) * 2003-12-01 2010-02-02 Societe Bic Fuel cell supply including information storage device and control system
US20050139250A1 (en) * 2003-12-02 2005-06-30 Battelle Memorial Institute Thermoelectric devices and applications for the same
US8455751B2 (en) * 2003-12-02 2013-06-04 Battelle Memorial Institute Thermoelectric devices and applications for the same
US7330695B2 (en) * 2003-12-12 2008-02-12 Rosemount, Inc. Bus powered wireless transmitter
US7234084B2 (en) 2004-02-18 2007-06-19 Emerson Process Management System and method for associating a DLPDU received by an interface chip with a data measurement made by an external circuit
US6984899B1 (en) * 2004-03-01 2006-01-10 The United States Of America As Represented By The Secretary Of The Navy Wind dam electric generator and method
CA2552615C (en) 2004-03-02 2014-08-26 Rosemount Inc. Process device with improved power generation
US20050201349A1 (en) 2004-03-15 2005-09-15 Honeywell International Inc. Redundant wireless node network with coordinated receiver diversity
US7515977B2 (en) 2004-03-30 2009-04-07 Fisher-Rosemount Systems, Inc. Integrated configuration system for use in a process plant
US6971274B2 (en) * 2004-04-02 2005-12-06 Sierra Instruments, Inc. Immersible thermal mass flow meter
US8538560B2 (en) 2004-04-29 2013-09-17 Rosemount Inc. Wireless power and communication unit for process field devices
US7620409B2 (en) 2004-06-17 2009-11-17 Honeywell International Inc. Wireless communication system with channel hopping and redundant connectivity
US7262693B2 (en) 2004-06-28 2007-08-28 Rosemount Inc. Process field device with radio frequency communication
US8929228B2 (en) * 2004-07-01 2015-01-06 Honeywell International Inc. Latency controlled redundant routing
US20060063522A1 (en) * 2004-09-21 2006-03-23 Mcfarland Norman R Self-powering automated building control components
KR20060027578A (en) * 2004-09-23 2006-03-28 삼성에스디아이 주식회사 System for controlling temperature of secondary battery module
US20060077917A1 (en) * 2004-10-07 2006-04-13 Honeywell International Inc. Architecture and method for enabling use of wireless devices in industrial control
JP4792851B2 (en) * 2004-11-01 2011-10-12 横河電機株式会社 Field equipment
AU2005316972B2 (en) * 2004-11-24 2011-11-10 Abbvie Inc. Chromanylurea compounds that inhibit vanilloid receptor subtype 1 (VR1) receptor and uses thereof
US7680460B2 (en) 2005-01-03 2010-03-16 Rosemount Inc. Wireless process field device diagnostics
US7173343B2 (en) * 2005-01-28 2007-02-06 Moshe Kugel EMI energy harvester
US9184364B2 (en) * 2005-03-02 2015-11-10 Rosemount Inc. Pipeline thermoelectric generator assembly
US20060227729A1 (en) 2005-04-12 2006-10-12 Honeywell International Inc. Wireless communication system with collision avoidance protocol
US7649138B2 (en) 2005-05-25 2010-01-19 Hi-Z Technology, Inc. Thermoelectric device with surface conforming heat conductor
US7742394B2 (en) 2005-06-03 2010-06-22 Honeywell International Inc. Redundantly connected wireless sensor networking methods
US7848223B2 (en) 2005-06-03 2010-12-07 Honeywell International Inc. Redundantly connected wireless sensor networking methods
KR100635405B1 (en) * 2005-06-10 2006-10-19 한국과학기술연구원 Micro power generator
US8463319B2 (en) 2005-06-17 2013-06-11 Honeywell International Inc. Wireless application installation, configuration and management tool
ES2420805T3 (en) * 2005-06-28 2013-08-26 Afognak Native Corporation Method and apparatus for biomass power generation, modular, automated
US7271679B2 (en) 2005-06-30 2007-09-18 Intermec Ip Corp. Apparatus and method to facilitate wireless communications of automatic data collection devices in potentially hazardous environments
US20070030816A1 (en) * 2005-08-08 2007-02-08 Honeywell International Inc. Data compression and abnormal situation detection in a wireless sensor network
US7801094B2 (en) * 2005-08-08 2010-09-21 Honeywell International Inc. Integrated infrastructure supporting multiple wireless devices
US8204078B2 (en) 2006-03-31 2012-06-19 Honeywell International Inc. Apparatus, system, and method for integration of wireless devices with a distributed control system
US7848827B2 (en) 2006-03-31 2010-12-07 Honeywell International Inc. Apparatus, system, and method for wireless diagnostics
KR100744902B1 (en) * 2006-05-24 2007-08-01 삼성전기주식회사 Mobile wireless manipulator
US7644633B2 (en) * 2006-12-18 2010-01-12 Rosemount Inc. Vortex flowmeter with temperature compensation

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