CA2552615A1 - Process device with improved power generation - Google Patents
Process device with improved power generation Download PDFInfo
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- CA2552615A1 CA2552615A1 CA002552615A CA2552615A CA2552615A1 CA 2552615 A1 CA2552615 A1 CA 2552615A1 CA 002552615 A CA002552615 A CA 002552615A CA 2552615 A CA2552615 A CA 2552615A CA 2552615 A1 CA2552615 A1 CA 2552615A1
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- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
- G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
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- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E70/00—Other energy conversion or management systems reducing GHG emissions
- Y02E70/30—Systems combining energy storage with energy generation of non-fossil origin
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/10—Internal combustion engine [ICE] based vehicles
- Y02T10/12—Improving ICE efficiencies
Abstract
A wireless field device (34, 50, 70, 80, 91, 100) is disclosed. The field device (34, 50, 70, 80, 91, 100) includes a wireless communications module (32) and an energy conversion module (38) . The wireless communications modu le (32) is configured to wirelessly communicate process-related information wit h another device. The energy conversion module (38) is coupled to the wireless communications module (32) . The energy conversion module (38) is configured to couple to a thermal source, and to generate electricity from thermal potential energy in the thermal source.
Description
PROCESS DEVICE WITH IMPROVED POWER
GEf3ER~T I0~3 BACKGROUND OF THE INVENTION
The present invention relates to .industrial process control and monitoring systems. More specifically, the present invention Jrelates to the generation of electrical power for field devices within such systems.
In industrial settings, control systems are used to monitor and control inventories of industrial and chemical processes, and the like. Typically, the control system performs these functions using field devices distributed at key locations ~in the industrial process and coupled to the control circuitry in the control room by a process control loop. The term "field device" refers to any device that performs a function in a distributed control or process monitoring system, including all devices used in the measurement, control and monitoring of industrial processes.
Field devices are used by the process control .and measurement industry for a variety of purposes. Usually such devices have a field-hardened enclosure so that they can be installed outdoors in.
relatively rugged environments and are able to withstand climatalogical extremes of temperature, humidity, vibration, mechanical shock, etc. These devices also can typically operate on relatively low power. For example, field devices are currently available that~receive all of their operating power from a known 4-20 mA loop.
Some field devices include a transducer. A
transducer is understood to mean either a device that generates an output signal based on a physical input or that generates a physical output based on an input signal. Typically, a transducer transforms an input into an output having a different form. Types of transducers include various analytical equipment, pressure sensors, thermistors, thermocouples, strain gauges, flow transmitters, positioners, actuators, solenoids, indicator lights, and others.
Typically, each field device also includes communication circuitry that is used for communicating with a process control room, or other circuitry, over a process control loop. In some installations, the process control loop is also used to deliver a regulated current and/or voltage to the field device for powering the field device.
Traditionally, analog field devices have been connected to the control room by two-wire process control current loops, with each device connected to the control room by a single two-wire control loop. Typically, a voltage differential is maintained between the two wires within a range of voltages from 12-45 volts for analog mode and 9-50 volts for digital mode. Some analog field devices transmit a signal to the control room by modulating the current running through the current loop to a current proportional to the sensed process variable.
Other analog field devices can perform an action under the control of the control room by controlling the magnitude of the current through the loop. In addition to, or in the alternative,, the process control loop can carry digital signals used for communication with field devices. Digital communication allows ~a much larger degree of communication than analog communication. Moreover, digital devices also do not require separate wiring for each field device. Field devices that communicate digitally can respond to and communicate selectively with the control room and/or' other field devices.
Further, such devices can provide additional signaling such as diagnostics and/or alarms.
In some installations, wireless technologies have begun to be used to communicate with field devices. Wireless operation simplifies field device wiring and setup. Wireless installations are currently used in which the field device is manufactured to include an internal battery, potentially charged by a solar cell without any sort of wired connection. Problems exist in using an internal battery as the energy demands of wireless devices may vary greatly depending on numerous factors such as the device reporting rate, device elements, et cetera.
GEf3ER~T I0~3 BACKGROUND OF THE INVENTION
The present invention relates to .industrial process control and monitoring systems. More specifically, the present invention Jrelates to the generation of electrical power for field devices within such systems.
In industrial settings, control systems are used to monitor and control inventories of industrial and chemical processes, and the like. Typically, the control system performs these functions using field devices distributed at key locations ~in the industrial process and coupled to the control circuitry in the control room by a process control loop. The term "field device" refers to any device that performs a function in a distributed control or process monitoring system, including all devices used in the measurement, control and monitoring of industrial processes.
Field devices are used by the process control .and measurement industry for a variety of purposes. Usually such devices have a field-hardened enclosure so that they can be installed outdoors in.
relatively rugged environments and are able to withstand climatalogical extremes of temperature, humidity, vibration, mechanical shock, etc. These devices also can typically operate on relatively low power. For example, field devices are currently available that~receive all of their operating power from a known 4-20 mA loop.
Some field devices include a transducer. A
transducer is understood to mean either a device that generates an output signal based on a physical input or that generates a physical output based on an input signal. Typically, a transducer transforms an input into an output having a different form. Types of transducers include various analytical equipment, pressure sensors, thermistors, thermocouples, strain gauges, flow transmitters, positioners, actuators, solenoids, indicator lights, and others.
Typically, each field device also includes communication circuitry that is used for communicating with a process control room, or other circuitry, over a process control loop. In some installations, the process control loop is also used to deliver a regulated current and/or voltage to the field device for powering the field device.
Traditionally, analog field devices have been connected to the control room by two-wire process control current loops, with each device connected to the control room by a single two-wire control loop. Typically, a voltage differential is maintained between the two wires within a range of voltages from 12-45 volts for analog mode and 9-50 volts for digital mode. Some analog field devices transmit a signal to the control room by modulating the current running through the current loop to a current proportional to the sensed process variable.
Other analog field devices can perform an action under the control of the control room by controlling the magnitude of the current through the loop. In addition to, or in the alternative,, the process control loop can carry digital signals used for communication with field devices. Digital communication allows ~a much larger degree of communication than analog communication. Moreover, digital devices also do not require separate wiring for each field device. Field devices that communicate digitally can respond to and communicate selectively with the control room and/or' other field devices.
Further, such devices can provide additional signaling such as diagnostics and/or alarms.
In some installations, wireless technologies have begun to be used to communicate with field devices. Wireless operation simplifies field device wiring and setup. Wireless installations are currently used in which the field device is manufactured to include an internal battery, potentially charged by a solar cell without any sort of wired connection. Problems exist in using an internal battery as the energy demands of wireless devices may vary greatly depending on numerous factors such as the device reporting rate, device elements, et cetera.
Difficulties also arise in installations where solar power is not reliable. For example, it becomes problematic to use solar power in areas that experience full shade twenty-four hours a day, indoors seven days a week, or in parts of the world where solar insolation numbers are very small, such as in the Arctic Circle. Accordingly, in these installations, powering a wireless process device using solar power is not reliable. Accordingly, there is an ongoing significant need for wireless process devices that can operate using an abundant renewable source of power that is not dependent upon the sun.
SUMMARY OF THE INZTENTION
A wireless field device is disclosed. The field device includes a wireless communications module and an energy conversion module.. The wireless communications module is configured to wirelessly communicate process-related information with another device. The energy conversion module is coupled to the wireless communications module. The energy conversion module is configured to couple to a thermal source, and to generate electricity from thermal potential energy in the thermal source.
A field device includes a controller, a wireless communications module, and a power generation module. The wireless communications module is coupled to the controller. The power generation module is located within the field device, and is coupled to the controller and to the wireless communications module. The power generation module is configured to interact with molecules proximate the exterior of the field device to generate electricity.
The power generation module is preferably a thermal generator that harvests energy from a temperature differential near the field device.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a diagrammatic view of an exemplary field device with which embodiments of the present invention~is particularly useful.
FIG. 2 is a block diagram of the field device shown in FIG. 1.
FIG. 3 is a block diagram of a field device including wireless communication circuitry for communicating with a remote device.
FIG. 4 is a diagrammatic view of a wireless field device operating in accordance with an embodiment of the present invention.
FIGS. 5A and 5B are diagrammatic views of a temperature-sensing field device deriving power in accordance with embodiments of the present invention.
FIGS. 6A and 6B are diagrammatic views of a field device deriving power from a semiconductor thermoelectric generator in accordance with embodiments of the present invention.
FIG. 7 is diagrammatic view of a field device deriving power from a semiconductor thermoelectric generator in accordance with an embodiment of the present invention.
DETAINED DESCRIPTION OF THE PREFERRED EMBODIMENTS
~ FIGS. 1 and 2 are diagrammatic and block diagram views of an exemplary field device with which embodiments of the present invention are useful.
Process control or monitoring system 10 includes a control room or control system 12 that couples to one or more field devices 14 over a two-wire process control loop 16. Examples of process control loop 16 include analog 4-20 mA communication, hybrid protocols which include both analog and digital communication such. as the Highway Addressable Remote Transducer (HART~) standard, as well as all-digital protocols such as the FOUNDATIONTM Fieldbus standard.
Generally process control loop protocols can both power the field device and allow communication between the field device and other devices.
In this example, field device 14 includes circuitry 18 coupled to actuator/transducer 20 and to process control loop 16 via terminal board 21 in housing 23. Field device 14 is illustrated as a process variable (PV) generator in that it couples to a process and senses an aspect, such as temperature, pressure, pH, flow, et cetera of the process and provides an indication thereof. Other examples of field devices include valves, actuators, controllers, ~"r and displays.
Generally field devices are characterized by their ability to operate in the "field" which may expose them to environmental stresses, such as temperature, humidity and pressure. In addition to environmental stresses, field devices must often withstand exposure to corrosive, hazardous and/or even explosive atmospheres. Further, such devices must also operate in the presence of vibration and/or electromagnetic interference.
FIG. 3 is a block diagram of a wireless field device in accordance with an embodiment of the present invention. Field device 34 includes power conversion module 38, controller 35, wireless communications module 32, and actuator/transducer 20.
Conversion module 38 can be any device that is able to convert thermal potential energy from the process into electrical energy. Conversion module 38 can be any device, known or later developed, that translates thermal potential energy available from molecules proximate field device 34 into electricity. For example, module 38 .can employ known thermopile devices to generate electricity from disparate temperatures using the Pettier Effect. Other temperature-based conversion devices can be used for module . 38. Such devices include thermoelectric diodes; solid state thermogenerators; and semiconductor thermoelectric generators. Moreover, any device now known, or later developed, that converts thermal potential energy to electricity may -g_ b~e used as or in combination with module 38.
Conversion module 38 can provide power for wireless communications module 32 alone, other portions of field device 34, or even all of the components within field device 34.
Wireless communication module 32 is coupled to controller ~35 and interacts with external wireless devices via antenna 26 based upon commands and/or ' data from controller 35. Wireless communication 32 can communicate process-related information as well as device-related information. Depending upon the application, wireless communication module 32 may be adapted to communicate in accordance with arty suitable wireless communication protocol including, but not limited to: wireless networking technologies (such as IEEE 802.11b wireless access points and wireless networking devices built by Linksys of Irvine, California), cellular or digital networking technologies (such as Microburst~ by Aeris Communications Inc. of San Jose, California), ultra wide band, free space optics, Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), spread spectrum technology, infrared communications techniques, SMS (Short Messaging Service/text messaging), or any other suitable wireless technology. Further, known data collision technology can be employed such that multiple units can coexist .within wireless operating rage of one another. Such collision prevention can include using a number of different radio-frequency channels and/or spread spectrum techniques.
Wireless communication module 32 can also include transducers for a plurality of wireless communication methods. For example, primary wireless communication could be performed using relatively long distance communication methods, such as GSM or GPRS, while a secondary, or additional communication method could be provided for technicians, or operators near the unit, using for example, IEEE
802.11b or Bluetooth.
Some wireless communications modules may include circuitry that can interact with the Global Positioning System (GPS). GPS can be advantageously employed in device 34 for mobile devices to allow finding the individual device 34 in a remote location. However, location sensing based upon other techniques can be used as well. ' Memory 37 is illustrated in FIG. 3 as being separate from controller 35, but may, in fact, be part of controller 35. Memory 37 can be any suitable type of memory including volatile memory (such as Random Access Memory), non-volatile memory (such as flash memory, EEPROM memory, ' etc.) and any combination thereof. Memory 37 may contain program instructions for controller 35 as well as any suitable administrative overhead data for device 34.
Memory 37~may contain a unique identifier for device 34, such that device 34 can distinguish wireless communications meant for it among other wireless communications. Examples of such an identifier could include, a Media Access Controller (MAC) address, Electronic Serial Number, global phone number, Internet Protocol (IP) address, or any other suitable identifier. Moreover, memory 37 may include information about attached field devices, such as their unique identifiers, configurations, and abilities. Finally, controller 35, using memory 37 can cause the output of device 34 to be provided in any suitable form. For example, configuration and interaction with field device' 34 and/or one or more associated field devices could be provided as HyperText Markup Language (HTML) web pages.
FIG. 4 is a diagrammatic view of a wireless field device operably coupled to energy conversion module 38 in accordance with an embodiment of the present invention. In the embodiment illustrated in FIG. 4, module 38 is disposed external to field device 34. Additionally, transducer 20 is illustrated in FIG. 4 as being a sensor. The sensor or sensor tap 20 and wireless field device 34 are, by virtue of the process to which they are coupled, maintained at a differential temperature. For example, sensor 20 may be coupled to process fluid that is at a higher temperature than the ambient temperature to which device 34 is exposed. Conversion module 38 is thermally coupled, illustrated by phantom lines 40, 42 to sensor 20 and field device 34, respectively.
The differential temperature coupled to conversion module 38 generates electricity within conversion module 38 that is provided to wireless field device 34 via line 44. When so powered, field device 34 generates and transmits wireless information to one or more remote transceivers 46, which may, in fact, be part of control system 12.
Given that conversion module 38 generally transforms thermal potential energy in or near the process fluid to electricity, one particularly synergistic application for embodiments of the present invention is that of temperature measuring field devices. In such embodiments, sensor 20 is a temperature sensor, such as a thermocouple, thermistor, or resistance temperature device (RTD).
While embodiments of the present invention will be described with respect to a temperature-sensing field device, embodiments of the present invention are practicable with any field device.
FIGS. 5A and 5B are diagrammatic views of field devices deriving power ,from thermal energy in accordance with embodiments of the present invention.
FIG. 5A illustrates a temperature-sensing . field device 50 having an electronics compartment 52 coupled to a thermowell 54 which is shaped, or otherwise configured, to engage a process fluid.
Within thermowell 54, a temperature sensor 56 provides an indication of process fluid temperature proximate end 58 of thermowell 54. Additionally, a portion of conversion module 38 (shown in FIG 4) is disposed proximate end 58. Specifically, device 60 is disposed proximate end 58 and electrically coupled to electronics compartment 52 via power.lines 62, 64.
Device 60 is preferably any suitable device that converts thermal energy into electricity. Thus, device 60 may be a thermopile, thermodiode (thermoelectric diode), a solid state thermogenerator, a semiconductor thermoelectric generator, or any combination thereof. Temperature sensing of field device 50 is accomplished via temperature sensor 56 providing a signal on signal lines 66 and 68 to electronics compartment 52.
FIG. 5B illustrates field device 70 having an electronics compartment 52 and a thermowell 54.
In contrast to field device 50, field device 70 employs device 72 that generates electricity related to the temperature to which it is exposed. Examples o.f suitable devices for device 72 include a thermopile or a thermoelectric diode. Such devices are suitable because they do not require a heat flow through the device, but instead generate electricity based upon exposure to a specific thermal source.
Technology advancements are currently increasing the feasibility of a field device such as that illustrated in FIGS. 5A and 5B. On the power generation side, solid state thermogenerators are becoming more and more efficient. Additionally, advancements in wireless technology are also increasing the feasibility of such field devices.
Specifically, wireless transmitters need less and less power to cover the same area. Additionally, even in embodiments where the transmission distance of a specific field device may be limited, such as to a radius of approximately 20 meters, embodiments of the present invention contemplate the use of repeating or mesh networks to increase the area covered by such devices. Thus, where a plurality of wireless field devices are disposed within the wireless transmission radius from one another, a first device can have its wireless information relayed by a second device thus extending the net range of the first device by that of the second device.
FIGS. 6A and 6B illustrate field devices that employ a semiconductor thermoelectric generator for thermoenergy scavenging in accordance with embodiments of the present invention. Semiconductor thermoelectric generators produce power when a temperature difference is maintained across the device. Thus, there is a flow of heat through the device, so the cool side should be properly heat sunk for advantageous power generation.
In FIG. ~A, field device 80 includes electronics compartment 52 and thermowell 54 having a semiconductor thermoelectric generator device 82 'disposed proximate distal end 58 of thermowell 54.
In order to allow device 52 to have heat flow therethrough, a'thermal conductor 84, such as a heat conducting member, is coupled to cold side 86 of device 82 and conveys heat in the direction of arrow 88 to one or more optional cooling fins 90 that, in some embodiments, may be disposed within electronics compartment 52. Conductor 84 may be any arrangement that conveys heat efficiently. For example, conductor 84 could be a copper rod.
FIG. 6B illustrates an alternate arrangement for generating electricity from thermoenergy. Field device 91 includes electronics compartment 52 and thermowell 54. However, semiconductor thermoelectric generator device 92 is disposed above thermowell 54 proximate electronics compartment 52. This allows device 92 to be relatively larger in comparison to device 82. In order to maintain advantageous heat flow across device 92, thermal conductor 84 is still coupled thermally to distal end 58 and conveys heat in the direction of arrow 88 to hot side 94 of device 92.
The cold side 96 of device 92 is coupled to one or more optional cooling fins 90 that may or may not be disposed within housing 52.
As illustrated in FIGS. 6A and 6B, there are different ways to conceptually achieve' thermal flow across a semiconductor thermoelectric element.
While FIGS. 6A and 6B illustrate a pair of examples, other possibilities may be practiced in accordance with embodiments of the present invention. In fact, the thermoelectric power generation element. need not be disposed proximate the field device itself.
FIG. 7 illustrates a diagrammatic view of field device 100 having an electronics compartment 52 coupled to a thermowell 54 for sensing a process temperature. A thermoelectric power-generating device 102 is disposed remote from field device 100 and coupled thereto via power conductors 104, 106. An elevated process temperature is coupled to hot side 108 of semiconductor thermoelectric generator device 110, which has one or more optional fins 90 coupled to its cold side 112. Since device 102 is mounted remote from field device 100, the physical size of device 102 is not constrained at all by the design of field device 100. This is advantageous because typically only small thermoelectric generating devices will fit within thermowell 54. Commercially available thermoelectric generating devices having a size on the order of 2 mm by 4 mm by 2 mm thick are believed to be able to fit within the thermowell, and to generate approximately 48 milivolts and 80 miliamps with a 50° C temperature different across hot and cold sides. This generated voltage is generally low and preferably is stepped up with a step up voltage conversion circuit known in the art of field devices. Accordingly, approximately 0.22 watts of heat flow through the thermoelectric generator device under such conditions. Although the operating efficiency is relatively low (approximately 20) the approximately. 4 milliwatts of generated power is believed to be sufficient for wireless field device operation.
However, if the thermoelectric generating device is disposed remote from the field device, it is reasonable that the thermoelectric generating device could be sized much larger than the example given above. Specifically, thermoelectric generating devices having a size of approximately 15 mm by 15 mm by 2 mm thick can be used. Such devices are commercially available and believed to generate 375 millivolts and 300 milliamps for the same 50° C
difference. While a step up voltage conversion circuit is still useful, the approximate 112 milliwatts of generated power makes the design of such a circuit much simpler and lower cost.
Approximately 6 watts of heat flow through the thermoelectric generating device under such conditions.
The conversion module can include, or be coupled to, additional power circuitry to provide additional functions related to power generation and/or storage. For example, a storage device, such as a capacitor or rechargeable cell can be operably coupled to the conversion module to maintain power levels when the amount of power available from the ' conversion module (via the thermal source) drops below that which could minimally operate the field device, or portions thereof., Additionally, any known power conditioning circuitry can be used to step up the voltage, remove noise from the power signal, isolate the power signal, smooth and/or otherwise shape the power signal. However, those skilled in the art will recognize that any desired functions can be accommodated with power conditioning circuitry as desired.
Although the present invention has been described with reference to preferred embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention.
SUMMARY OF THE INZTENTION
A wireless field device is disclosed. The field device includes a wireless communications module and an energy conversion module.. The wireless communications module is configured to wirelessly communicate process-related information with another device. The energy conversion module is coupled to the wireless communications module. The energy conversion module is configured to couple to a thermal source, and to generate electricity from thermal potential energy in the thermal source.
A field device includes a controller, a wireless communications module, and a power generation module. The wireless communications module is coupled to the controller. The power generation module is located within the field device, and is coupled to the controller and to the wireless communications module. The power generation module is configured to interact with molecules proximate the exterior of the field device to generate electricity.
The power generation module is preferably a thermal generator that harvests energy from a temperature differential near the field device.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a diagrammatic view of an exemplary field device with which embodiments of the present invention~is particularly useful.
FIG. 2 is a block diagram of the field device shown in FIG. 1.
FIG. 3 is a block diagram of a field device including wireless communication circuitry for communicating with a remote device.
FIG. 4 is a diagrammatic view of a wireless field device operating in accordance with an embodiment of the present invention.
FIGS. 5A and 5B are diagrammatic views of a temperature-sensing field device deriving power in accordance with embodiments of the present invention.
FIGS. 6A and 6B are diagrammatic views of a field device deriving power from a semiconductor thermoelectric generator in accordance with embodiments of the present invention.
FIG. 7 is diagrammatic view of a field device deriving power from a semiconductor thermoelectric generator in accordance with an embodiment of the present invention.
DETAINED DESCRIPTION OF THE PREFERRED EMBODIMENTS
~ FIGS. 1 and 2 are diagrammatic and block diagram views of an exemplary field device with which embodiments of the present invention are useful.
Process control or monitoring system 10 includes a control room or control system 12 that couples to one or more field devices 14 over a two-wire process control loop 16. Examples of process control loop 16 include analog 4-20 mA communication, hybrid protocols which include both analog and digital communication such. as the Highway Addressable Remote Transducer (HART~) standard, as well as all-digital protocols such as the FOUNDATIONTM Fieldbus standard.
Generally process control loop protocols can both power the field device and allow communication between the field device and other devices.
In this example, field device 14 includes circuitry 18 coupled to actuator/transducer 20 and to process control loop 16 via terminal board 21 in housing 23. Field device 14 is illustrated as a process variable (PV) generator in that it couples to a process and senses an aspect, such as temperature, pressure, pH, flow, et cetera of the process and provides an indication thereof. Other examples of field devices include valves, actuators, controllers, ~"r and displays.
Generally field devices are characterized by their ability to operate in the "field" which may expose them to environmental stresses, such as temperature, humidity and pressure. In addition to environmental stresses, field devices must often withstand exposure to corrosive, hazardous and/or even explosive atmospheres. Further, such devices must also operate in the presence of vibration and/or electromagnetic interference.
FIG. 3 is a block diagram of a wireless field device in accordance with an embodiment of the present invention. Field device 34 includes power conversion module 38, controller 35, wireless communications module 32, and actuator/transducer 20.
Conversion module 38 can be any device that is able to convert thermal potential energy from the process into electrical energy. Conversion module 38 can be any device, known or later developed, that translates thermal potential energy available from molecules proximate field device 34 into electricity. For example, module 38 .can employ known thermopile devices to generate electricity from disparate temperatures using the Pettier Effect. Other temperature-based conversion devices can be used for module . 38. Such devices include thermoelectric diodes; solid state thermogenerators; and semiconductor thermoelectric generators. Moreover, any device now known, or later developed, that converts thermal potential energy to electricity may -g_ b~e used as or in combination with module 38.
Conversion module 38 can provide power for wireless communications module 32 alone, other portions of field device 34, or even all of the components within field device 34.
Wireless communication module 32 is coupled to controller ~35 and interacts with external wireless devices via antenna 26 based upon commands and/or ' data from controller 35. Wireless communication 32 can communicate process-related information as well as device-related information. Depending upon the application, wireless communication module 32 may be adapted to communicate in accordance with arty suitable wireless communication protocol including, but not limited to: wireless networking technologies (such as IEEE 802.11b wireless access points and wireless networking devices built by Linksys of Irvine, California), cellular or digital networking technologies (such as Microburst~ by Aeris Communications Inc. of San Jose, California), ultra wide band, free space optics, Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), spread spectrum technology, infrared communications techniques, SMS (Short Messaging Service/text messaging), or any other suitable wireless technology. Further, known data collision technology can be employed such that multiple units can coexist .within wireless operating rage of one another. Such collision prevention can include using a number of different radio-frequency channels and/or spread spectrum techniques.
Wireless communication module 32 can also include transducers for a plurality of wireless communication methods. For example, primary wireless communication could be performed using relatively long distance communication methods, such as GSM or GPRS, while a secondary, or additional communication method could be provided for technicians, or operators near the unit, using for example, IEEE
802.11b or Bluetooth.
Some wireless communications modules may include circuitry that can interact with the Global Positioning System (GPS). GPS can be advantageously employed in device 34 for mobile devices to allow finding the individual device 34 in a remote location. However, location sensing based upon other techniques can be used as well. ' Memory 37 is illustrated in FIG. 3 as being separate from controller 35, but may, in fact, be part of controller 35. Memory 37 can be any suitable type of memory including volatile memory (such as Random Access Memory), non-volatile memory (such as flash memory, EEPROM memory, ' etc.) and any combination thereof. Memory 37 may contain program instructions for controller 35 as well as any suitable administrative overhead data for device 34.
Memory 37~may contain a unique identifier for device 34, such that device 34 can distinguish wireless communications meant for it among other wireless communications. Examples of such an identifier could include, a Media Access Controller (MAC) address, Electronic Serial Number, global phone number, Internet Protocol (IP) address, or any other suitable identifier. Moreover, memory 37 may include information about attached field devices, such as their unique identifiers, configurations, and abilities. Finally, controller 35, using memory 37 can cause the output of device 34 to be provided in any suitable form. For example, configuration and interaction with field device' 34 and/or one or more associated field devices could be provided as HyperText Markup Language (HTML) web pages.
FIG. 4 is a diagrammatic view of a wireless field device operably coupled to energy conversion module 38 in accordance with an embodiment of the present invention. In the embodiment illustrated in FIG. 4, module 38 is disposed external to field device 34. Additionally, transducer 20 is illustrated in FIG. 4 as being a sensor. The sensor or sensor tap 20 and wireless field device 34 are, by virtue of the process to which they are coupled, maintained at a differential temperature. For example, sensor 20 may be coupled to process fluid that is at a higher temperature than the ambient temperature to which device 34 is exposed. Conversion module 38 is thermally coupled, illustrated by phantom lines 40, 42 to sensor 20 and field device 34, respectively.
The differential temperature coupled to conversion module 38 generates electricity within conversion module 38 that is provided to wireless field device 34 via line 44. When so powered, field device 34 generates and transmits wireless information to one or more remote transceivers 46, which may, in fact, be part of control system 12.
Given that conversion module 38 generally transforms thermal potential energy in or near the process fluid to electricity, one particularly synergistic application for embodiments of the present invention is that of temperature measuring field devices. In such embodiments, sensor 20 is a temperature sensor, such as a thermocouple, thermistor, or resistance temperature device (RTD).
While embodiments of the present invention will be described with respect to a temperature-sensing field device, embodiments of the present invention are practicable with any field device.
FIGS. 5A and 5B are diagrammatic views of field devices deriving power ,from thermal energy in accordance with embodiments of the present invention.
FIG. 5A illustrates a temperature-sensing . field device 50 having an electronics compartment 52 coupled to a thermowell 54 which is shaped, or otherwise configured, to engage a process fluid.
Within thermowell 54, a temperature sensor 56 provides an indication of process fluid temperature proximate end 58 of thermowell 54. Additionally, a portion of conversion module 38 (shown in FIG 4) is disposed proximate end 58. Specifically, device 60 is disposed proximate end 58 and electrically coupled to electronics compartment 52 via power.lines 62, 64.
Device 60 is preferably any suitable device that converts thermal energy into electricity. Thus, device 60 may be a thermopile, thermodiode (thermoelectric diode), a solid state thermogenerator, a semiconductor thermoelectric generator, or any combination thereof. Temperature sensing of field device 50 is accomplished via temperature sensor 56 providing a signal on signal lines 66 and 68 to electronics compartment 52.
FIG. 5B illustrates field device 70 having an electronics compartment 52 and a thermowell 54.
In contrast to field device 50, field device 70 employs device 72 that generates electricity related to the temperature to which it is exposed. Examples o.f suitable devices for device 72 include a thermopile or a thermoelectric diode. Such devices are suitable because they do not require a heat flow through the device, but instead generate electricity based upon exposure to a specific thermal source.
Technology advancements are currently increasing the feasibility of a field device such as that illustrated in FIGS. 5A and 5B. On the power generation side, solid state thermogenerators are becoming more and more efficient. Additionally, advancements in wireless technology are also increasing the feasibility of such field devices.
Specifically, wireless transmitters need less and less power to cover the same area. Additionally, even in embodiments where the transmission distance of a specific field device may be limited, such as to a radius of approximately 20 meters, embodiments of the present invention contemplate the use of repeating or mesh networks to increase the area covered by such devices. Thus, where a plurality of wireless field devices are disposed within the wireless transmission radius from one another, a first device can have its wireless information relayed by a second device thus extending the net range of the first device by that of the second device.
FIGS. 6A and 6B illustrate field devices that employ a semiconductor thermoelectric generator for thermoenergy scavenging in accordance with embodiments of the present invention. Semiconductor thermoelectric generators produce power when a temperature difference is maintained across the device. Thus, there is a flow of heat through the device, so the cool side should be properly heat sunk for advantageous power generation.
In FIG. ~A, field device 80 includes electronics compartment 52 and thermowell 54 having a semiconductor thermoelectric generator device 82 'disposed proximate distal end 58 of thermowell 54.
In order to allow device 52 to have heat flow therethrough, a'thermal conductor 84, such as a heat conducting member, is coupled to cold side 86 of device 82 and conveys heat in the direction of arrow 88 to one or more optional cooling fins 90 that, in some embodiments, may be disposed within electronics compartment 52. Conductor 84 may be any arrangement that conveys heat efficiently. For example, conductor 84 could be a copper rod.
FIG. 6B illustrates an alternate arrangement for generating electricity from thermoenergy. Field device 91 includes electronics compartment 52 and thermowell 54. However, semiconductor thermoelectric generator device 92 is disposed above thermowell 54 proximate electronics compartment 52. This allows device 92 to be relatively larger in comparison to device 82. In order to maintain advantageous heat flow across device 92, thermal conductor 84 is still coupled thermally to distal end 58 and conveys heat in the direction of arrow 88 to hot side 94 of device 92.
The cold side 96 of device 92 is coupled to one or more optional cooling fins 90 that may or may not be disposed within housing 52.
As illustrated in FIGS. 6A and 6B, there are different ways to conceptually achieve' thermal flow across a semiconductor thermoelectric element.
While FIGS. 6A and 6B illustrate a pair of examples, other possibilities may be practiced in accordance with embodiments of the present invention. In fact, the thermoelectric power generation element. need not be disposed proximate the field device itself.
FIG. 7 illustrates a diagrammatic view of field device 100 having an electronics compartment 52 coupled to a thermowell 54 for sensing a process temperature. A thermoelectric power-generating device 102 is disposed remote from field device 100 and coupled thereto via power conductors 104, 106. An elevated process temperature is coupled to hot side 108 of semiconductor thermoelectric generator device 110, which has one or more optional fins 90 coupled to its cold side 112. Since device 102 is mounted remote from field device 100, the physical size of device 102 is not constrained at all by the design of field device 100. This is advantageous because typically only small thermoelectric generating devices will fit within thermowell 54. Commercially available thermoelectric generating devices having a size on the order of 2 mm by 4 mm by 2 mm thick are believed to be able to fit within the thermowell, and to generate approximately 48 milivolts and 80 miliamps with a 50° C temperature different across hot and cold sides. This generated voltage is generally low and preferably is stepped up with a step up voltage conversion circuit known in the art of field devices. Accordingly, approximately 0.22 watts of heat flow through the thermoelectric generator device under such conditions. Although the operating efficiency is relatively low (approximately 20) the approximately. 4 milliwatts of generated power is believed to be sufficient for wireless field device operation.
However, if the thermoelectric generating device is disposed remote from the field device, it is reasonable that the thermoelectric generating device could be sized much larger than the example given above. Specifically, thermoelectric generating devices having a size of approximately 15 mm by 15 mm by 2 mm thick can be used. Such devices are commercially available and believed to generate 375 millivolts and 300 milliamps for the same 50° C
difference. While a step up voltage conversion circuit is still useful, the approximate 112 milliwatts of generated power makes the design of such a circuit much simpler and lower cost.
Approximately 6 watts of heat flow through the thermoelectric generating device under such conditions.
The conversion module can include, or be coupled to, additional power circuitry to provide additional functions related to power generation and/or storage. For example, a storage device, such as a capacitor or rechargeable cell can be operably coupled to the conversion module to maintain power levels when the amount of power available from the ' conversion module (via the thermal source) drops below that which could minimally operate the field device, or portions thereof., Additionally, any known power conditioning circuitry can be used to step up the voltage, remove noise from the power signal, isolate the power signal, smooth and/or otherwise shape the power signal. However, those skilled in the art will recognize that any desired functions can be accommodated with power conditioning circuitry as desired.
Although the present invention has been described with reference to preferred embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention.
Claims (22)
1. A field device comprising:
a wireless communications module configured to wirelessly communicate process-related information with another device; and an energy conversion module coupled to the wireless communications module, the energy conversion module configured to couple to a thermal source, and to convert thermal potential energy into electricity to power circuitry within the field device.
a wireless communications module configured to wirelessly communicate process-related information with another device; and an energy conversion module coupled to the wireless communications module, the energy conversion module configured to couple to a thermal source, and to convert thermal potential energy into electricity to power circuitry within the field device.
2. The field device of claim 1, wherein the energy conversion module includes a thermopile.
3. The field device of claim 1, wherein the energy conversion module includes a thermoelectric diode.
4. The field device of claim 1, wherein the energy conversion module includes a semiconductor thermoelectric generator.
5. The field device of claim 1, wherein the energy conversion module is disposed proximate the field device.
6. The field device of claim 1, wherein the energy conversion device is disposed remote from the field device.
7. The field device of claim 1, and further comprising:
a controller coupled to the energy conversion module and to the wireless communication module; and a transducer coupled to the process and the controller.
a controller coupled to the energy conversion module and to the wireless communication module; and a transducer coupled to the process and the controller.
8. The field device of claim 7, wherein the transducer is a sensor.
9. The field device of claim 8, wherein the sensor is a temperature sensor.
10. The field device of claim 9, wherein the temperature sensor generates electricity and is a component of the energy conversion module.
11. The field device of claim 9, and further comprising:
a thermowell configured to couple to a process fluid.
a thermowell configured to couple to a process fluid.
12. The field device of claim 11, and further comprising a heat conducting member disposed within the thermowell and configured to convey heat away from the process fluid.
13. The field device of claim 12, wherein the energy conversion module includes a semiconductor thermoelectric generator operably coupled to the heat conducting member.
14. The field device of claim 13, wherein the semiconductor thermoelectric generator has a hot side thermally coupled to the process fluid, and a cold side thermally coupled to the heat conducting member.
15. The field device, of claim 14, wherein the heat conducting member has a first end coupled to the thermoelectric generator, and a second end coupled to at least one cooling fin.
16. The field device of claim 13, wherein the semiconductor thermoelectric generator has a hot side coupled to a first end of the heat conducting member, and a cold side coupled to at least one cooling fin, and wherein a second end of the heat conducting member is thermally coupled to the. process fluid.
17. The field device of claim 1, wherein the amount of electricity converted by the conversion module is used to provide a temperature indication related to the thermal source.
18. The field device of claim 1, wherein the thermal source is a process thermal source.
19. The field device of claim 1, and further comprising a power storage device coupled to the conversion module.
20. A method of providing electricity to a wireless field device, the method comprising:
thermally coupling a thermoelectric device to a source of thermal potential energy; and electrically coupling the thermoelectric device to a wireless communication module of the field device.
thermally coupling a thermoelectric device to a source of thermal potential energy; and electrically coupling the thermoelectric device to a wireless communication module of the field device.
21. The method of claim 20, wherein thermally coupling the thermoelectric device includes conveying heat through the thermoelectric device.
22. A field device comprising:
a wireless communications module configured to wirelessly communicate process-related information with another device; and means for converting thermal potential energy in a process thermal source to electricity to power the field device.
a wireless communications module configured to wirelessly communicate process-related information with another device; and means for converting thermal potential energy in a process thermal source to electricity to power the field device.
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---|---|
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Families Citing this family (339)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2552615C (en) | 2004-03-02 | 2014-08-26 | Rosemount Inc. | Process device with improved power generation |
US8538560B2 (en) | 2004-04-29 | 2013-09-17 | Rosemount Inc. | Wireless power and communication unit for process field devices |
US8145180B2 (en) * | 2004-05-21 | 2012-03-27 | Rosemount Inc. | Power generation for process devices |
US8160535B2 (en) * | 2004-06-28 | 2012-04-17 | Rosemount Inc. | RF adapter for field device |
US8787848B2 (en) * | 2004-06-28 | 2014-07-22 | Rosemount Inc. | RF adapter for field device with low voltage intrinsic safety clamping |
US20060176660A1 (en) * | 2005-02-07 | 2006-08-10 | Ahmad Amiri | Ultra mobile communicating computer |
US9184364B2 (en) | 2005-03-02 | 2015-11-10 | Rosemount Inc. | Pipeline thermoelectric generator assembly |
DE102005043771A1 (en) * | 2005-09-13 | 2007-03-15 | Endress + Hauser Flowtec Ag | Method for power supply of a field device of automation technology |
DE202006020838U1 (en) * | 2006-03-29 | 2010-06-24 | Abb Ag | Device for supplying energy to field devices |
US7913566B2 (en) | 2006-05-23 | 2011-03-29 | Rosemount Inc. | Industrial process device utilizing magnetic induction |
JP5198455B2 (en) * | 2006-09-28 | 2013-05-15 | ローズマウント インコーポレイテッド | Improved industrial thermoelectric generator |
US8188359B2 (en) * | 2006-09-28 | 2012-05-29 | Rosemount Inc. | Thermoelectric generator assembly for field process devices |
CN101517827B (en) | 2006-09-28 | 2013-06-12 | 罗斯蒙德公司 | Wireless field device with antenna and radome for industrial locations |
US8217782B2 (en) * | 2007-05-24 | 2012-07-10 | Rosemount Inc. | Industrial field device with reduced power consumption |
US8250924B2 (en) | 2008-04-22 | 2012-08-28 | Rosemount Inc. | Industrial process device utilizing piezoelectric transducer |
WO2009154756A1 (en) | 2008-06-17 | 2009-12-23 | Rosemount Inc. | Rf adapter for field device with variable voltage drop |
US8694060B2 (en) | 2008-06-17 | 2014-04-08 | Rosemount Inc. | Form factor and electromagnetic interference protection for process device wireless adapters |
US8929948B2 (en) | 2008-06-17 | 2015-01-06 | Rosemount Inc. | Wireless communication adapter for field devices |
US8362959B2 (en) * | 2008-10-13 | 2013-01-29 | Rosemount Inc. | Wireless field device with rugged antenna and rotation stop |
US7977924B2 (en) | 2008-11-03 | 2011-07-12 | Rosemount Inc. | Industrial process power scavenging device and method of deriving process device power from an industrial process |
US10378106B2 (en) | 2008-11-14 | 2019-08-13 | Asm Ip Holding B.V. | Method of forming insulation film by modified PEALD |
US8262287B2 (en) | 2008-12-08 | 2012-09-11 | Asm America, Inc. | Thermocouple |
US9394608B2 (en) | 2009-04-06 | 2016-07-19 | Asm America, Inc. | Semiconductor processing reactor and components thereof |
WO2010124665A1 (en) * | 2009-04-30 | 2010-11-04 | Siemens Aktiengesellschaft | Apparatus and temperature measurement unit for the contactless measurement and transmission of temperatures by temperature-sensing parts and use of such an apparatus |
US8382370B2 (en) | 2009-05-06 | 2013-02-26 | Asm America, Inc. | Thermocouple assembly with guarded thermocouple junction |
US9297705B2 (en) * | 2009-05-06 | 2016-03-29 | Asm America, Inc. | Smart temperature measuring device |
US20100318007A1 (en) * | 2009-06-10 | 2010-12-16 | O'brien Donald J | Electromechanical tactile stimulation devices and methods |
US8626087B2 (en) | 2009-06-16 | 2014-01-07 | Rosemount Inc. | Wire harness for field devices used in a hazardous locations |
US9674976B2 (en) | 2009-06-16 | 2017-06-06 | Rosemount Inc. | Wireless process communication adapter with improved encapsulation |
US8802201B2 (en) | 2009-08-14 | 2014-08-12 | Asm America, Inc. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species |
DE102009056699B4 (en) * | 2009-12-02 | 2015-04-30 | Abb Technology Ag | Autonomous temperature transmitter |
CN103380556B (en) | 2010-03-24 | 2016-02-03 | 马克·辛莱希 | For Wireless Telecom Equipment electric power management circuit and use its process control system |
DE102010022025B4 (en) * | 2010-05-29 | 2021-03-04 | Abb Schweiz Ag | Power supply device for autonomous field devices |
US8276458B2 (en) | 2010-07-12 | 2012-10-02 | Rosemount Inc. | Transmitter output with scalable rangeability |
US10761524B2 (en) | 2010-08-12 | 2020-09-01 | Rosemount Inc. | Wireless adapter with process diagnostics |
GB2483293A (en) * | 2010-09-03 | 2012-03-07 | Spirax Sarco Ltd | Steam flow meter with thermoelectric power source |
JP5640800B2 (en) * | 2011-02-21 | 2014-12-17 | ソニー株式会社 | Wireless power supply apparatus and wireless power supply method |
DE102011006638A1 (en) * | 2011-04-01 | 2012-10-04 | Robert Bosch Gmbh | Apparatus and method for reporting an event and monitoring system |
US9312155B2 (en) | 2011-06-06 | 2016-04-12 | Asm Japan K.K. | High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules |
JP5881979B2 (en) * | 2011-06-27 | 2016-03-09 | セイコーインスツル株式会社 | Terminal device and communication system |
US10364496B2 (en) | 2011-06-27 | 2019-07-30 | Asm Ip Holding B.V. | Dual section module having shared and unshared mass flow controllers |
US20130005372A1 (en) | 2011-06-29 | 2013-01-03 | Rosemount Inc. | Integral thermoelectric generator for wireless devices |
US10854498B2 (en) | 2011-07-15 | 2020-12-01 | Asm Ip Holding B.V. | Wafer-supporting device and method for producing same |
US20130023129A1 (en) | 2011-07-20 | 2013-01-24 | Asm America, Inc. | Pressure transmitter for a semiconductor processing environment |
TWI474161B (en) * | 2011-10-17 | 2015-02-21 | Finetek Co Ltd | A process controller with a power regulation function |
US9310794B2 (en) | 2011-10-27 | 2016-04-12 | Rosemount Inc. | Power supply for industrial process field device |
US9017481B1 (en) | 2011-10-28 | 2015-04-28 | Asm America, Inc. | Process feed management for semiconductor substrate processing |
JP5980591B2 (en) * | 2012-06-29 | 2016-08-31 | ナブテスコ株式会社 | Color sensor and machinery remote monitoring system |
CN202918218U (en) | 2012-08-16 | 2013-05-01 | 中兴通讯股份有限公司 | Energy conservation and environmental protection apparatus of communication system equipment |
US9659799B2 (en) | 2012-08-28 | 2017-05-23 | Asm Ip Holding B.V. | Systems and methods for dynamic semiconductor process scheduling |
RU2662400C2 (en) * | 2012-09-21 | 2018-07-25 | Хоум Контрол Сингапур Пте. Лтд. | Handheld information processing device with remote control output mode |
US10714315B2 (en) | 2012-10-12 | 2020-07-14 | Asm Ip Holdings B.V. | Semiconductor reaction chamber showerhead |
US10910962B2 (en) | 2012-10-19 | 2021-02-02 | University Of Southern California | Pervasive power generation system |
USD702188S1 (en) | 2013-03-08 | 2014-04-08 | Asm Ip Holding B.V. | Thermocouple |
US9484191B2 (en) | 2013-03-08 | 2016-11-01 | Asm Ip Holding B.V. | Pulsed remote plasma method and system |
US9589770B2 (en) | 2013-03-08 | 2017-03-07 | Asm Ip Holding B.V. | Method and systems for in-situ formation of intermediate reactive species |
US9240412B2 (en) | 2013-09-27 | 2016-01-19 | Asm Ip Holding B.V. | Semiconductor structure and device and methods of forming same using selective epitaxial process |
JP5772912B2 (en) * | 2013-09-30 | 2015-09-02 | 横河電機株式会社 | Wireless equipment |
DE102013114195A1 (en) * | 2013-12-17 | 2015-06-18 | Endress + Hauser Flowtec Ag | Field device of process automation |
EP2887511A1 (en) * | 2013-12-20 | 2015-06-24 | ABB Technology AG | Sensor assembly for measuring at least a temperature on a moving part of an electric machine |
US10683571B2 (en) | 2014-02-25 | 2020-06-16 | Asm Ip Holding B.V. | Gas supply manifold and method of supplying gases to chamber using same |
CN103822667A (en) * | 2014-03-04 | 2014-05-28 | 上海理工大学 | Temperature-humidity acquisition system based on Bluetooth technology |
US10167557B2 (en) | 2014-03-18 | 2019-01-01 | Asm Ip Holding B.V. | Gas distribution system, reactor including the system, and methods of using the same |
US11015245B2 (en) | 2014-03-19 | 2021-05-25 | Asm Ip Holding B.V. | Gas-phase reactor and system having exhaust plenum and components thereof |
US9704373B2 (en) | 2014-05-29 | 2017-07-11 | Thomas & Betts International Llc | Smart lug system |
US10858737B2 (en) | 2014-07-28 | 2020-12-08 | Asm Ip Holding B.V. | Showerhead assembly and components thereof |
US9890456B2 (en) | 2014-08-21 | 2018-02-13 | Asm Ip Holding B.V. | Method and system for in situ formation of gas-phase compounds |
JP6398486B2 (en) * | 2014-09-03 | 2018-10-03 | 株式会社デンソー | Actuator device |
US10941490B2 (en) | 2014-10-07 | 2021-03-09 | Asm Ip Holding B.V. | Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same |
US9657845B2 (en) | 2014-10-07 | 2017-05-23 | Asm Ip Holding B.V. | Variable conductance gas distribution apparatus and method |
US9885610B2 (en) | 2014-12-22 | 2018-02-06 | Rosemount Inc. | Thermowell system with vibration detection |
KR102263121B1 (en) | 2014-12-22 | 2021-06-09 | 에이에스엠 아이피 홀딩 비.브이. | Semiconductor device and manufacuring method thereof |
US10529542B2 (en) | 2015-03-11 | 2020-01-07 | Asm Ip Holdings B.V. | Cross-flow reactor and method |
US10276355B2 (en) | 2015-03-12 | 2019-04-30 | Asm Ip Holding B.V. | Multi-zone reactor, system including the reactor, and method of using the same |
DE102015004578A1 (en) * | 2015-04-14 | 2016-10-20 | Dräger Safety AG & Co. KGaA | Method for data transmission between measuring devices and a data processing device in a measured data acquisition system |
US10458018B2 (en) | 2015-06-26 | 2019-10-29 | Asm Ip Holding B.V. | Structures including metal carbide material, devices including the structures, and methods of forming same |
US9891111B2 (en) * | 2015-06-30 | 2018-02-13 | Rosemount Inc. | Thermowell with infrared sensor |
US10600673B2 (en) | 2015-07-07 | 2020-03-24 | Asm Ip Holding B.V. | Magnetic susceptor to baseplate seal |
CN105069981A (en) * | 2015-07-15 | 2015-11-18 | 北京依米康科技发展有限公司 | Thermoelectric flood alarm device by utilizing decalescence and/or heat release which occur when compound dissolves in water |
US9960072B2 (en) | 2015-09-29 | 2018-05-01 | Asm Ip Holding B.V. | Variable adjustment for precise matching of multiple chamber cavity housings |
US10211308B2 (en) | 2015-10-21 | 2019-02-19 | Asm Ip Holding B.V. | NbMC layers |
US10322384B2 (en) | 2015-11-09 | 2019-06-18 | Asm Ip Holding B.V. | Counter flow mixer for process chamber |
US11139308B2 (en) | 2015-12-29 | 2021-10-05 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
US10529554B2 (en) | 2016-02-19 | 2020-01-07 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches |
US10468251B2 (en) | 2016-02-19 | 2019-11-05 | Asm Ip Holding B.V. | Method for forming spacers using silicon nitride film for spacer-defined multiple patterning |
US10501866B2 (en) | 2016-03-09 | 2019-12-10 | Asm Ip Holding B.V. | Gas distribution apparatus for improved film uniformity in an epitaxial system |
US10343920B2 (en) | 2016-03-18 | 2019-07-09 | Asm Ip Holding B.V. | Aligned carbon nanotubes |
US9892913B2 (en) | 2016-03-24 | 2018-02-13 | Asm Ip Holding B.V. | Radial and thickness control via biased multi-port injection settings |
US10865475B2 (en) | 2016-04-21 | 2020-12-15 | Asm Ip Holding B.V. | Deposition of metal borides and silicides |
US10190213B2 (en) | 2016-04-21 | 2019-01-29 | Asm Ip Holding B.V. | Deposition of metal borides |
US10032628B2 (en) | 2016-05-02 | 2018-07-24 | Asm Ip Holding B.V. | Source/drain performance through conformal solid state doping |
US10367080B2 (en) | 2016-05-02 | 2019-07-30 | Asm Ip Holding B.V. | Method of forming a germanium oxynitride film |
KR102592471B1 (en) | 2016-05-17 | 2023-10-20 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming metal interconnection and method of fabricating semiconductor device using the same |
US11453943B2 (en) | 2016-05-25 | 2022-09-27 | Asm Ip Holding B.V. | Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor |
US10388509B2 (en) | 2016-06-28 | 2019-08-20 | Asm Ip Holding B.V. | Formation of epitaxial layers via dislocation filtering |
US10612137B2 (en) | 2016-07-08 | 2020-04-07 | Asm Ip Holdings B.V. | Organic reactants for atomic layer deposition |
US9859151B1 (en) | 2016-07-08 | 2018-01-02 | Asm Ip Holding B.V. | Selective film deposition method to form air gaps |
US10714385B2 (en) | 2016-07-19 | 2020-07-14 | Asm Ip Holding B.V. | Selective deposition of tungsten |
US10381226B2 (en) | 2016-07-27 | 2019-08-13 | Asm Ip Holding B.V. | Method of processing substrate |
JP6448093B2 (en) * | 2016-07-27 | 2019-01-09 | ナブテスコ株式会社 | Sensor device |
US10395919B2 (en) | 2016-07-28 | 2019-08-27 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US9887082B1 (en) | 2016-07-28 | 2018-02-06 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
KR102532607B1 (en) | 2016-07-28 | 2023-05-15 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus and method of operating the same |
US9812320B1 (en) | 2016-07-28 | 2017-11-07 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
KR102613349B1 (en) | 2016-08-25 | 2023-12-14 | 에이에스엠 아이피 홀딩 비.브이. | Exhaust apparatus and substrate processing apparatus and thin film fabricating method using the same |
US10410943B2 (en) | 2016-10-13 | 2019-09-10 | Asm Ip Holding B.V. | Method for passivating a surface of a semiconductor and related systems |
US10643826B2 (en) | 2016-10-26 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for thermally calibrating reaction chambers |
US11532757B2 (en) | 2016-10-27 | 2022-12-20 | Asm Ip Holding B.V. | Deposition of charge trapping layers |
US10435790B2 (en) | 2016-11-01 | 2019-10-08 | Asm Ip Holding B.V. | Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap |
US10714350B2 (en) | 2016-11-01 | 2020-07-14 | ASM IP Holdings, B.V. | Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10229833B2 (en) | 2016-11-01 | 2019-03-12 | Asm Ip Holding B.V. | Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10643904B2 (en) | 2016-11-01 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for forming a semiconductor device and related semiconductor device structures |
US10134757B2 (en) | 2016-11-07 | 2018-11-20 | Asm Ip Holding B.V. | Method of processing a substrate and a device manufactured by using the method |
KR102546317B1 (en) | 2016-11-15 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | Gas supply unit and substrate processing apparatus including the same |
US10340135B2 (en) | 2016-11-28 | 2019-07-02 | Asm Ip Holding B.V. | Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride |
KR20180068582A (en) | 2016-12-14 | 2018-06-22 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
US11447861B2 (en) | 2016-12-15 | 2022-09-20 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
US11581186B2 (en) | 2016-12-15 | 2023-02-14 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus |
KR20180070971A (en) | 2016-12-19 | 2018-06-27 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
US10269558B2 (en) | 2016-12-22 | 2019-04-23 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US10867788B2 (en) | 2016-12-28 | 2020-12-15 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US10655221B2 (en) | 2017-02-09 | 2020-05-19 | Asm Ip Holding B.V. | Method for depositing oxide film by thermal ALD and PEALD |
US10468261B2 (en) | 2017-02-15 | 2019-11-05 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures |
US10529563B2 (en) | 2017-03-29 | 2020-01-07 | Asm Ip Holdings B.V. | Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures |
US10283353B2 (en) | 2017-03-29 | 2019-05-07 | Asm Ip Holding B.V. | Method of reforming insulating film deposited on substrate with recess pattern |
KR102457289B1 (en) | 2017-04-25 | 2022-10-21 | 에이에스엠 아이피 홀딩 비.브이. | Method for depositing a thin film and manufacturing a semiconductor device |
US10892156B2 (en) | 2017-05-08 | 2021-01-12 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film on a substrate and related semiconductor device structures |
US10770286B2 (en) | 2017-05-08 | 2020-09-08 | Asm Ip Holdings B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
US10446393B2 (en) | 2017-05-08 | 2019-10-15 | Asm Ip Holding B.V. | Methods for forming silicon-containing epitaxial layers and related semiconductor device structures |
DE102017207783B3 (en) | 2017-05-09 | 2018-06-07 | Vega Grieshaber Kg | Radar level gauge with a phase locked loop |
US10504742B2 (en) | 2017-05-31 | 2019-12-10 | Asm Ip Holding B.V. | Method of atomic layer etching using hydrogen plasma |
US10886123B2 (en) | 2017-06-02 | 2021-01-05 | Asm Ip Holding B.V. | Methods for forming low temperature semiconductor layers and related semiconductor device structures |
US11306395B2 (en) | 2017-06-28 | 2022-04-19 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
US10685834B2 (en) | 2017-07-05 | 2020-06-16 | Asm Ip Holdings B.V. | Methods for forming a silicon germanium tin layer and related semiconductor device structures |
KR20190009245A (en) | 2017-07-18 | 2019-01-28 | 에이에스엠 아이피 홀딩 비.브이. | Methods for forming a semiconductor device structure and related semiconductor device structures |
US11018002B2 (en) | 2017-07-19 | 2021-05-25 | Asm Ip Holding B.V. | Method for selectively depositing a Group IV semiconductor and related semiconductor device structures |
US10541333B2 (en) | 2017-07-19 | 2020-01-21 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US11374112B2 (en) | 2017-07-19 | 2022-06-28 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US10605530B2 (en) | 2017-07-26 | 2020-03-31 | Asm Ip Holding B.V. | Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace |
US10590535B2 (en) | 2017-07-26 | 2020-03-17 | Asm Ip Holdings B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
US10312055B2 (en) | 2017-07-26 | 2019-06-04 | Asm Ip Holding B.V. | Method of depositing film by PEALD using negative bias |
US10770336B2 (en) | 2017-08-08 | 2020-09-08 | Asm Ip Holding B.V. | Substrate lift mechanism and reactor including same |
US10692741B2 (en) | 2017-08-08 | 2020-06-23 | Asm Ip Holdings B.V. | Radiation shield |
US11139191B2 (en) | 2017-08-09 | 2021-10-05 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US10249524B2 (en) | 2017-08-09 | 2019-04-02 | Asm Ip Holding B.V. | Cassette holder assembly for a substrate cassette and holding member for use in such assembly |
USD900036S1 (en) | 2017-08-24 | 2020-10-27 | Asm Ip Holding B.V. | Heater electrical connector and adapter |
US11830730B2 (en) | 2017-08-29 | 2023-11-28 | Asm Ip Holding B.V. | Layer forming method and apparatus |
KR102491945B1 (en) | 2017-08-30 | 2023-01-26 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
US11295980B2 (en) | 2017-08-30 | 2022-04-05 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
US11056344B2 (en) | 2017-08-30 | 2021-07-06 | Asm Ip Holding B.V. | Layer forming method |
US10607895B2 (en) | 2017-09-18 | 2020-03-31 | Asm Ip Holdings B.V. | Method for forming a semiconductor device structure comprising a gate fill metal |
KR102630301B1 (en) | 2017-09-21 | 2024-01-29 | 에이에스엠 아이피 홀딩 비.브이. | Method of sequential infiltration synthesis treatment of infiltrateable material and structures and devices formed using same |
US10844484B2 (en) | 2017-09-22 | 2020-11-24 | Asm Ip Holding B.V. | Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US10658205B2 (en) | 2017-09-28 | 2020-05-19 | Asm Ip Holdings B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
US10403504B2 (en) | 2017-10-05 | 2019-09-03 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
US10319588B2 (en) | 2017-10-10 | 2019-06-11 | Asm Ip Holding B.V. | Method for depositing a metal chalcogenide on a substrate by cyclical deposition |
US10923344B2 (en) | 2017-10-30 | 2021-02-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
US10910262B2 (en) | 2017-11-16 | 2021-02-02 | Asm Ip Holding B.V. | Method of selectively depositing a capping layer structure on a semiconductor device structure |
KR102443047B1 (en) | 2017-11-16 | 2022-09-14 | 에이에스엠 아이피 홀딩 비.브이. | Method of processing a substrate and a device manufactured by the same |
US11022879B2 (en) | 2017-11-24 | 2021-06-01 | Asm Ip Holding B.V. | Method of forming an enhanced unexposed photoresist layer |
JP7214724B2 (en) | 2017-11-27 | 2023-01-30 | エーエスエム アイピー ホールディング ビー.ブイ. | Storage device for storing wafer cassettes used in batch furnaces |
TWI791689B (en) | 2017-11-27 | 2023-02-11 | 荷蘭商Asm智慧財產控股私人有限公司 | Apparatus including a clean mini environment |
US10290508B1 (en) | 2017-12-05 | 2019-05-14 | Asm Ip Holding B.V. | Method for forming vertical spacers for spacer-defined patterning |
US10872771B2 (en) | 2018-01-16 | 2020-12-22 | Asm Ip Holding B. V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
WO2019142055A2 (en) | 2018-01-19 | 2019-07-25 | Asm Ip Holding B.V. | Method for depositing a gap-fill layer by plasma-assisted deposition |
TWI799494B (en) | 2018-01-19 | 2023-04-21 | 荷蘭商Asm 智慧財產控股公司 | Deposition method |
USD903477S1 (en) | 2018-01-24 | 2020-12-01 | Asm Ip Holdings B.V. | Metal clamp |
US11018047B2 (en) | 2018-01-25 | 2021-05-25 | Asm Ip Holding B.V. | Hybrid lift pin |
US10535516B2 (en) | 2018-02-01 | 2020-01-14 | Asm Ip Holdings B.V. | Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures |
USD880437S1 (en) | 2018-02-01 | 2020-04-07 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
US11081345B2 (en) | 2018-02-06 | 2021-08-03 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
US10896820B2 (en) | 2018-02-14 | 2021-01-19 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US11685991B2 (en) | 2018-02-14 | 2023-06-27 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US10731249B2 (en) | 2018-02-15 | 2020-08-04 | Asm Ip Holding B.V. | Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus |
US10658181B2 (en) | 2018-02-20 | 2020-05-19 | Asm Ip Holding B.V. | Method of spacer-defined direct patterning in semiconductor fabrication |
KR102636427B1 (en) | 2018-02-20 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing method and apparatus |
US10975470B2 (en) | 2018-02-23 | 2021-04-13 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
US11473195B2 (en) | 2018-03-01 | 2022-10-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus and a method for processing a substrate |
US11629406B2 (en) | 2018-03-09 | 2023-04-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate |
US11114283B2 (en) | 2018-03-16 | 2021-09-07 | Asm Ip Holding B.V. | Reactor, system including the reactor, and methods of manufacturing and using same |
KR102646467B1 (en) | 2018-03-27 | 2024-03-11 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming an electrode on a substrate and a semiconductor device structure including an electrode |
US10510536B2 (en) | 2018-03-29 | 2019-12-17 | Asm Ip Holding B.V. | Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber |
US11230766B2 (en) | 2018-03-29 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11088002B2 (en) | 2018-03-29 | 2021-08-10 | Asm Ip Holding B.V. | Substrate rack and a substrate processing system and method |
KR102501472B1 (en) | 2018-03-30 | 2023-02-20 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing method |
DE102018110165A1 (en) * | 2018-04-27 | 2019-10-31 | Gemü Gebr. Müller Apparatebau Gmbh & Co. Kommanditgesellschaft | Device for mounting on a component of an industrial plant |
TWI811348B (en) | 2018-05-08 | 2023-08-11 | 荷蘭商Asm 智慧財產控股公司 | Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structures |
KR20190129718A (en) | 2018-05-11 | 2019-11-20 | 에이에스엠 아이피 홀딩 비.브이. | Methods for forming a doped metal carbide film on a substrate and related semiconductor device structures |
KR102596988B1 (en) | 2018-05-28 | 2023-10-31 | 에이에스엠 아이피 홀딩 비.브이. | Method of processing a substrate and a device manufactured by the same |
US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
TW202013553A (en) | 2018-06-04 | 2020-04-01 | 荷蘭商Asm 智慧財產控股公司 | Wafer handling chamber with moisture reduction |
US11286562B2 (en) | 2018-06-08 | 2022-03-29 | Asm Ip Holding B.V. | Gas-phase chemical reactor and method of using same |
KR102568797B1 (en) | 2018-06-21 | 2023-08-21 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing system |
US10797133B2 (en) | 2018-06-21 | 2020-10-06 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
JP2021529880A (en) | 2018-06-27 | 2021-11-04 | エーエスエム・アイピー・ホールディング・ベー・フェー | Periodic deposition methods for forming metal-containing materials and films and structures containing metal-containing materials |
CN112292478A (en) | 2018-06-27 | 2021-01-29 | Asm Ip私人控股有限公司 | Cyclic deposition methods for forming metal-containing materials and films and structures containing metal-containing materials |
US10612136B2 (en) | 2018-06-29 | 2020-04-07 | ASM IP Holding, B.V. | Temperature-controlled flange and reactor system including same |
KR20200002519A (en) | 2018-06-29 | 2020-01-08 | 에이에스엠 아이피 홀딩 비.브이. | Method for depositing a thin film and manufacturing a semiconductor device |
US10388513B1 (en) | 2018-07-03 | 2019-08-20 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10755922B2 (en) | 2018-07-03 | 2020-08-25 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10767789B2 (en) | 2018-07-16 | 2020-09-08 | Asm Ip Holding B.V. | Diaphragm valves, valve components, and methods for forming valve components |
US10483099B1 (en) | 2018-07-26 | 2019-11-19 | Asm Ip Holding B.V. | Method for forming thermally stable organosilicon polymer film |
US11053591B2 (en) | 2018-08-06 | 2021-07-06 | Asm Ip Holding B.V. | Multi-port gas injection system and reactor system including same |
US10883175B2 (en) | 2018-08-09 | 2021-01-05 | Asm Ip Holding B.V. | Vertical furnace for processing substrates and a liner for use therein |
US10829852B2 (en) | 2018-08-16 | 2020-11-10 | Asm Ip Holding B.V. | Gas distribution device for a wafer processing apparatus |
US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US11024523B2 (en) | 2018-09-11 | 2021-06-01 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
KR20200030162A (en) | 2018-09-11 | 2020-03-20 | 에이에스엠 아이피 홀딩 비.브이. | Method for deposition of a thin film |
US11049751B2 (en) | 2018-09-14 | 2021-06-29 | Asm Ip Holding B.V. | Cassette supply system to store and handle cassettes and processing apparatus equipped therewith |
CN110970344A (en) | 2018-10-01 | 2020-04-07 | Asm Ip控股有限公司 | Substrate holding apparatus, system including the same, and method of using the same |
US11232963B2 (en) | 2018-10-03 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
KR102592699B1 (en) | 2018-10-08 | 2023-10-23 | 에이에스엠 아이피 홀딩 비.브이. | Substrate support unit and apparatuses for depositing thin film and processing the substrate including the same |
US10847365B2 (en) | 2018-10-11 | 2020-11-24 | Asm Ip Holding B.V. | Method of forming conformal silicon carbide film by cyclic CVD |
US10811256B2 (en) | 2018-10-16 | 2020-10-20 | Asm Ip Holding B.V. | Method for etching a carbon-containing feature |
KR102546322B1 (en) | 2018-10-19 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus and substrate processing method |
KR102605121B1 (en) | 2018-10-19 | 2023-11-23 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus and substrate processing method |
USD948463S1 (en) | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
US10381219B1 (en) | 2018-10-25 | 2019-08-13 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film |
US11087997B2 (en) | 2018-10-31 | 2021-08-10 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
KR20200051105A (en) | 2018-11-02 | 2020-05-13 | 에이에스엠 아이피 홀딩 비.브이. | Substrate support unit and substrate processing apparatus including the same |
US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
US11031242B2 (en) | 2018-11-07 | 2021-06-08 | Asm Ip Holding B.V. | Methods for depositing a boron doped silicon germanium film |
US10847366B2 (en) | 2018-11-16 | 2020-11-24 | Asm Ip Holding B.V. | Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process |
US10818758B2 (en) | 2018-11-16 | 2020-10-27 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US10559458B1 (en) | 2018-11-26 | 2020-02-11 | Asm Ip Holding B.V. | Method of forming oxynitride film |
US11217444B2 (en) | 2018-11-30 | 2022-01-04 | Asm Ip Holding B.V. | Method for forming an ultraviolet radiation responsive metal oxide-containing film |
KR102636428B1 (en) | 2018-12-04 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | A method for cleaning a substrate processing apparatus |
US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
TW202037745A (en) | 2018-12-14 | 2020-10-16 | 荷蘭商Asm Ip私人控股有限公司 | Method of forming device structure, structure formed by the method and system for performing the method |
TWI819180B (en) | 2019-01-17 | 2023-10-21 | 荷蘭商Asm 智慧財產控股公司 | Methods of forming a transition metal containing film on a substrate by a cyclical deposition process |
KR20200091543A (en) | 2019-01-22 | 2020-07-31 | 에이에스엠 아이피 홀딩 비.브이. | Semiconductor processing device |
CN111524788B (en) | 2019-02-01 | 2023-11-24 | Asm Ip私人控股有限公司 | Method for topologically selective film formation of silicon oxide |
JP2020136677A (en) | 2019-02-20 | 2020-08-31 | エーエスエム・アイピー・ホールディング・ベー・フェー | Periodic accumulation method for filing concave part formed inside front surface of base material, and device |
KR102626263B1 (en) | 2019-02-20 | 2024-01-16 | 에이에스엠 아이피 홀딩 비.브이. | Cyclical deposition method including treatment step and apparatus for same |
KR20200102357A (en) | 2019-02-20 | 2020-08-31 | 에이에스엠 아이피 홀딩 비.브이. | Apparatus and methods for plug fill deposition in 3-d nand applications |
JP2020136678A (en) | 2019-02-20 | 2020-08-31 | エーエスエム・アイピー・ホールディング・ベー・フェー | Method for filing concave part formed inside front surface of base material, and device |
TW202100794A (en) | 2019-02-22 | 2021-01-01 | 荷蘭商Asm Ip私人控股有限公司 | Substrate processing apparatus and method for processing substrate |
KR20200108242A (en) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | Method for Selective Deposition of Silicon Nitride Layer and Structure Including Selectively-Deposited Silicon Nitride Layer |
US11742198B2 (en) | 2019-03-08 | 2023-08-29 | Asm Ip Holding B.V. | Structure including SiOCN layer and method of forming same |
KR20200108243A (en) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | Structure Including SiOC Layer and Method of Forming Same |
JP2020167398A (en) | 2019-03-28 | 2020-10-08 | エーエスエム・アイピー・ホールディング・ベー・フェー | Door opener and substrate processing apparatus provided therewith |
KR20200116855A (en) | 2019-04-01 | 2020-10-13 | 에이에스엠 아이피 홀딩 비.브이. | Method of manufacturing semiconductor device |
US11447864B2 (en) | 2019-04-19 | 2022-09-20 | Asm Ip Holding B.V. | Layer forming method and apparatus |
KR20200125453A (en) | 2019-04-24 | 2020-11-04 | 에이에스엠 아이피 홀딩 비.브이. | Gas-phase reactor system and method of using same |
KR20200130118A (en) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | Method for Reforming Amorphous Carbon Polymer Film |
KR20200130121A (en) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | Chemical source vessel with dip tube |
KR20200130652A (en) | 2019-05-10 | 2020-11-19 | 에이에스엠 아이피 홀딩 비.브이. | Method of depositing material onto a surface and structure formed according to the method |
JP2020188255A (en) | 2019-05-16 | 2020-11-19 | エーエスエム アイピー ホールディング ビー.ブイ. | Wafer boat handling device, vertical batch furnace, and method |
USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
USD947913S1 (en) | 2019-05-17 | 2022-04-05 | Asm Ip Holding B.V. | Susceptor shaft |
USD935572S1 (en) | 2019-05-24 | 2021-11-09 | Asm Ip Holding B.V. | Gas channel plate |
USD922229S1 (en) | 2019-06-05 | 2021-06-15 | Asm Ip Holding B.V. | Device for controlling a temperature of a gas supply unit |
KR20200141003A (en) | 2019-06-06 | 2020-12-17 | 에이에스엠 아이피 홀딩 비.브이. | Gas-phase reactor system including a gas detector |
KR20200143254A (en) | 2019-06-11 | 2020-12-23 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming an electronic structure using an reforming gas, system for performing the method, and structure formed using the method |
USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
USD931978S1 (en) | 2019-06-27 | 2021-09-28 | Asm Ip Holding B.V. | Showerhead vacuum transport |
KR20210005515A (en) | 2019-07-03 | 2021-01-14 | 에이에스엠 아이피 홀딩 비.브이. | Temperature control assembly for substrate processing apparatus and method of using same |
JP2021015791A (en) | 2019-07-09 | 2021-02-12 | エーエスエム アイピー ホールディング ビー.ブイ. | Plasma device and substrate processing method using coaxial waveguide |
CN112216646A (en) | 2019-07-10 | 2021-01-12 | Asm Ip私人控股有限公司 | Substrate supporting assembly and substrate processing device comprising same |
KR20210010307A (en) | 2019-07-16 | 2021-01-27 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
KR20210010820A (en) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | Methods of forming silicon germanium structures |
KR20210010816A (en) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | Radical assist ignition plasma system and method |
US11643724B2 (en) | 2019-07-18 | 2023-05-09 | Asm Ip Holding B.V. | Method of forming structures using a neutral beam |
TW202121506A (en) | 2019-07-19 | 2021-06-01 | 荷蘭商Asm Ip私人控股有限公司 | Method of forming topology-controlled amorphous carbon polymer film |
TW202113936A (en) | 2019-07-29 | 2021-04-01 | 荷蘭商Asm Ip私人控股有限公司 | Methods for selective deposition utilizing n-type dopants and/or alternative dopants to achieve high dopant incorporation |
CN112309900A (en) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
CN112309899A (en) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587815B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11227782B2 (en) | 2019-07-31 | 2022-01-18 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
CN112323048B (en) | 2019-08-05 | 2024-02-09 | Asm Ip私人控股有限公司 | Liquid level sensor for chemical source container |
USD965044S1 (en) | 2019-08-19 | 2022-09-27 | Asm Ip Holding B.V. | Susceptor shaft |
USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
JP2021031769A (en) | 2019-08-21 | 2021-03-01 | エーエスエム アイピー ホールディング ビー.ブイ. | Production apparatus of mixed gas of film deposition raw material and film deposition apparatus |
USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
USD949319S1 (en) | 2019-08-22 | 2022-04-19 | Asm Ip Holding B.V. | Exhaust duct |
USD930782S1 (en) | 2019-08-22 | 2021-09-14 | Asm Ip Holding B.V. | Gas distributor |
KR20210024423A (en) | 2019-08-22 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | Method for forming a structure with a hole |
USD940837S1 (en) | 2019-08-22 | 2022-01-11 | Asm Ip Holding B.V. | Electrode |
KR20210024420A (en) | 2019-08-23 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | Method for depositing silicon oxide film having improved quality by peald using bis(diethylamino)silane |
US11286558B2 (en) | 2019-08-23 | 2022-03-29 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
KR20210029090A (en) | 2019-09-04 | 2021-03-15 | 에이에스엠 아이피 홀딩 비.브이. | Methods for selective deposition using a sacrificial capping layer |
KR20210029663A (en) | 2019-09-05 | 2021-03-16 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
US11562901B2 (en) | 2019-09-25 | 2023-01-24 | Asm Ip Holding B.V. | Substrate processing method |
CN112593212B (en) | 2019-10-02 | 2023-12-22 | Asm Ip私人控股有限公司 | Method for forming topologically selective silicon oxide film by cyclic plasma enhanced deposition process |
TW202129060A (en) | 2019-10-08 | 2021-08-01 | 荷蘭商Asm Ip控股公司 | Substrate processing device, and substrate processing method |
KR20210043460A (en) | 2019-10-10 | 2021-04-21 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming a photoresist underlayer and structure including same |
KR20210045930A (en) | 2019-10-16 | 2021-04-27 | 에이에스엠 아이피 홀딩 비.브이. | Method of Topology-Selective Film Formation of Silicon Oxide |
US11637014B2 (en) | 2019-10-17 | 2023-04-25 | Asm Ip Holding B.V. | Methods for selective deposition of doped semiconductor material |
KR20210047808A (en) | 2019-10-21 | 2021-04-30 | 에이에스엠 아이피 홀딩 비.브이. | Apparatus and methods for selectively etching films |
US11646205B2 (en) | 2019-10-29 | 2023-05-09 | Asm Ip Holding B.V. | Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same |
KR20210054983A (en) | 2019-11-05 | 2021-05-14 | 에이에스엠 아이피 홀딩 비.브이. | Structures with doped semiconductor layers and methods and systems for forming same |
US11501968B2 (en) | 2019-11-15 | 2022-11-15 | Asm Ip Holding B.V. | Method for providing a semiconductor device with silicon filled gaps |
KR20210062561A (en) | 2019-11-20 | 2021-05-31 | 에이에스엠 아이피 홀딩 비.브이. | Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure |
CN112951697A (en) | 2019-11-26 | 2021-06-11 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
KR20210065848A (en) | 2019-11-26 | 2021-06-04 | 에이에스엠 아이피 홀딩 비.브이. | Methods for selectivley forming a target film on a substrate comprising a first dielectric surface and a second metallic surface |
CN112885693A (en) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
CN112885692A (en) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
JP2021090042A (en) | 2019-12-02 | 2021-06-10 | エーエスエム アイピー ホールディング ビー.ブイ. | Substrate processing apparatus and substrate processing method |
KR20210070898A (en) | 2019-12-04 | 2021-06-15 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
JP2021097227A (en) | 2019-12-17 | 2021-06-24 | エーエスエム・アイピー・ホールディング・ベー・フェー | Method of forming vanadium nitride layer and structure including vanadium nitride layer |
KR20210080214A (en) | 2019-12-19 | 2021-06-30 | 에이에스엠 아이피 홀딩 비.브이. | Methods for filling a gap feature on a substrate and related semiconductor structures |
KR20210095050A (en) | 2020-01-20 | 2021-07-30 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming thin film and method of modifying surface of thin film |
TW202130846A (en) | 2020-02-03 | 2021-08-16 | 荷蘭商Asm Ip私人控股有限公司 | Method of forming structures including a vanadium or indium layer |
KR20210100010A (en) | 2020-02-04 | 2021-08-13 | 에이에스엠 아이피 홀딩 비.브이. | Method and apparatus for transmittance measurements of large articles |
US11776846B2 (en) | 2020-02-07 | 2023-10-03 | Asm Ip Holding B.V. | Methods for depositing gap filling fluids and related systems and devices |
TW202146715A (en) | 2020-02-17 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | Method for growing phosphorous-doped silicon layer and system of the same |
US11876356B2 (en) | 2020-03-11 | 2024-01-16 | Asm Ip Holding B.V. | Lockout tagout assembly and system and method of using same |
KR20210116240A (en) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | Substrate handling device with adjustable joints |
KR20210124042A (en) | 2020-04-02 | 2021-10-14 | 에이에스엠 아이피 홀딩 비.브이. | Thin film forming method |
TW202146689A (en) | 2020-04-03 | 2021-12-16 | 荷蘭商Asm Ip控股公司 | Method for forming barrier layer and method for manufacturing semiconductor device |
TW202145344A (en) | 2020-04-08 | 2021-12-01 | 荷蘭商Asm Ip私人控股有限公司 | Apparatus and methods for selectively etching silcon oxide films |
US11821078B2 (en) | 2020-04-15 | 2023-11-21 | Asm Ip Holding B.V. | Method for forming precoat film and method for forming silicon-containing film |
KR20210132576A (en) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming vanadium nitride-containing layer and structure comprising the same |
KR20210132605A (en) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | Vertical batch furnace assembly comprising a cooling gas supply |
KR20210132600A (en) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | Methods and systems for depositing a layer comprising vanadium, nitrogen, and a further element |
KR20210134869A (en) | 2020-05-01 | 2021-11-11 | 에이에스엠 아이피 홀딩 비.브이. | Fast FOUP swapping with a FOUP handler |
KR20210141379A (en) | 2020-05-13 | 2021-11-23 | 에이에스엠 아이피 홀딩 비.브이. | Laser alignment fixture for a reactor system |
KR20210143653A (en) | 2020-05-19 | 2021-11-29 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
KR20210145078A (en) | 2020-05-21 | 2021-12-01 | 에이에스엠 아이피 홀딩 비.브이. | Structures including multiple carbon layers and methods of forming and using same |
TW202201602A (en) | 2020-05-29 | 2022-01-01 | 荷蘭商Asm Ip私人控股有限公司 | Substrate processing device |
TW202218133A (en) | 2020-06-24 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | Method for forming a layer provided with silicon |
TW202217953A (en) | 2020-06-30 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | Substrate processing method |
TW202219628A (en) | 2020-07-17 | 2022-05-16 | 荷蘭商Asm Ip私人控股有限公司 | Structures and methods for use in photolithography |
TW202204662A (en) | 2020-07-20 | 2022-02-01 | 荷蘭商Asm Ip私人控股有限公司 | Method and system for depositing molybdenum layers |
KR20220027026A (en) | 2020-08-26 | 2022-03-07 | 에이에스엠 아이피 홀딩 비.브이. | Method and system for forming metal silicon oxide and metal silicon oxynitride |
USD990534S1 (en) | 2020-09-11 | 2023-06-27 | Asm Ip Holding B.V. | Weighted lift pin |
USD1012873S1 (en) | 2020-09-24 | 2024-01-30 | Asm Ip Holding B.V. | Electrode for semiconductor processing apparatus |
TW202229613A (en) | 2020-10-14 | 2022-08-01 | 荷蘭商Asm Ip私人控股有限公司 | Method of depositing material on stepped structure |
KR20220053482A (en) | 2020-10-22 | 2022-04-29 | 에이에스엠 아이피 홀딩 비.브이. | Method of depositing vanadium metal, structure, device and a deposition assembly |
TW202223136A (en) | 2020-10-28 | 2022-06-16 | 荷蘭商Asm Ip私人控股有限公司 | Method for forming layer on substrate, and semiconductor processing system |
KR20220076343A (en) | 2020-11-30 | 2022-06-08 | 에이에스엠 아이피 홀딩 비.브이. | an injector configured for arrangement within a reaction chamber of a substrate processing apparatus |
US11946137B2 (en) | 2020-12-16 | 2024-04-02 | Asm Ip Holding B.V. | Runout and wobble measurement fixtures |
TW202231903A (en) | 2020-12-22 | 2022-08-16 | 荷蘭商Asm Ip私人控股有限公司 | Transition metal deposition method, transition metal layer, and deposition assembly for depositing transition metal on substrate |
USD981973S1 (en) | 2021-05-11 | 2023-03-28 | Asm Ip Holding B.V. | Reactor wall for substrate processing apparatus |
USD980813S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
USD980814S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD990441S1 (en) | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
Family Cites Families (202)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2883489A (en) * | 1954-12-06 | 1959-04-21 | Daystrom Inc | Encased electrical instrument |
US3232712A (en) * | 1962-08-16 | 1966-02-01 | Continental Lab Inc | Gas detector and analyzer |
GB1027719A (en) * | 1963-12-02 | |||
US3568762A (en) * | 1967-05-23 | 1971-03-09 | Rca Corp | Heat pipe |
US3612851A (en) | 1970-04-17 | 1971-10-12 | Lewis Eng Co | Rotatably adjustable indicator instrument |
US3881962A (en) * | 1971-07-29 | 1975-05-06 | Gen Atomic Co | Thermoelectric generator including catalytic burner and cylindrical jacket containing heat exchange fluid |
GB1397435A (en) * | 1972-08-25 | 1975-06-11 | Hull F R | Regenerative vapour power plant |
US3931532A (en) * | 1974-03-19 | 1976-01-06 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Thermoelectric power system |
GB1525709A (en) | 1975-04-10 | 1978-09-20 | Chloride Silent Power Ltd | Thermo-electric generators |
US4125122A (en) | 1975-08-11 | 1978-11-14 | Stachurski John Z O | Direct energy conversion device |
US4026348A (en) * | 1975-10-06 | 1977-05-31 | Bell Telephone Laboratories, Incorporated | Heat pipe switch |
GR67600B (en) * | 1979-06-29 | 1981-08-31 | Payot Jocelyne | |
US4370890A (en) * | 1980-10-06 | 1983-02-01 | Rosemount Inc. | Capacitive pressure transducer with isolated sensing diaphragm |
US4485670A (en) | 1981-02-13 | 1984-12-04 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Heat pipe cooled probe |
US4383801A (en) * | 1981-03-02 | 1983-05-17 | Pryor Dale H | Wind turbine with adjustable air foils |
US4389895A (en) * | 1981-07-27 | 1983-06-28 | Rosemount Inc. | Capacitance pressure sensor |
US4475047A (en) | 1982-04-29 | 1984-10-02 | At&T Bell Laboratories | Uninterruptible power supplies |
SE445389B (en) * | 1982-06-28 | 1986-06-16 | Geotronics Ab | PROCEDURE AND DEVICE FOR RECEIVING METDATA FROM A CHEMICAL PROCESS |
US4476853A (en) | 1982-09-28 | 1984-10-16 | Arbogast Clayton C | Solar energy recovery system |
GB2145876A (en) | 1983-08-24 | 1985-04-03 | Shlomo Beitner | DC power generation for telemetry and like equipment from geothermal energy |
DE3340834A1 (en) | 1983-11-11 | 1985-05-23 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Circuit arrangement for keeping the temperature-dependent sensitivity of a differential-pressure measurement apparatus constant |
US4639542A (en) * | 1984-06-11 | 1987-01-27 | Ga Technologies Inc. | Modular thermoelectric conversion system |
GB8426964D0 (en) | 1984-10-25 | 1984-11-28 | Sieger Ltd | Adjusting circuit parameter |
US4651019A (en) * | 1984-11-16 | 1987-03-17 | Pennsylvania Power & Light Company | Dual fueled thermoelectric generator |
DE3503347A1 (en) * | 1985-02-01 | 1986-08-14 | Dr.Ing.H.C. F. Porsche Ag, 7000 Stuttgart | DEVICE FOR WIRELESS MEASURING SIGNAL TRANSMISSION |
US4860232A (en) | 1987-04-22 | 1989-08-22 | Massachusetts Institute Of Technology | Digital technique for precise measurement of variable capacitance |
CH672368A5 (en) * | 1987-08-20 | 1989-11-15 | Rudolf Staempfli | Solar thermal power plant with expansive heat engine - utilises pressure increase of working fluid in thermal storage heater transmitting energy between two closed circuits |
US4878012A (en) | 1988-06-10 | 1989-10-31 | Rosemount Inc. | Charge balanced feedback transmitter |
US4977480A (en) | 1988-09-14 | 1990-12-11 | Fuji Koki Mfg. Co., Ltd. | Variable-capacitance type sensor and variable-capacitance type sensor system using the same |
DE3907209C1 (en) | 1989-01-18 | 1990-03-01 | Danfoss A/S, Nordborg, Dk | |
US4982412A (en) * | 1989-03-13 | 1991-01-01 | Moore Push-Pin Company | Apparatus and method for counting a plurality of similar articles |
JPH0769750B2 (en) * | 1989-09-08 | 1995-07-31 | 三菱電機株式会社 | Solar battery power system |
SU1746056A1 (en) | 1990-02-21 | 1992-07-07 | Рижский технический университет | Windmill |
USD331370S (en) | 1990-11-15 | 1992-12-01 | Titan Industries, Inc. | Programmable additive controller |
JP2753389B2 (en) * | 1990-11-28 | 1998-05-20 | 株式会社日立製作所 | Fieldbus system |
US5094109A (en) * | 1990-12-06 | 1992-03-10 | Rosemount Inc. | Pressure transmitter with stress isolation depression |
RU1813916C (en) | 1990-12-10 | 1993-05-07 | Ч.-КАБудревич | Wind motor |
DE4124662A1 (en) | 1991-07-25 | 1993-01-28 | Fibronix Sensoren Gmbh | RELATIVE PRESSURE SENSOR |
US5329818A (en) | 1992-05-28 | 1994-07-19 | Rosemount Inc. | Correction of a pressure indication in a pressure transducer due to variations of an environmental condition |
USD345107S (en) * | 1992-06-01 | 1994-03-15 | Titan Industries, Inc. | Programmable additive controller |
US5313831A (en) * | 1992-07-31 | 1994-05-24 | Paul Beckman | Radial junction thermal flowmeter |
JPH08557B2 (en) * | 1992-10-30 | 1996-01-10 | 川崎重工業株式会社 | Emergency heat exhaust device for heat engine power generation system with pressure shell for deep sea |
US5506757A (en) * | 1993-06-14 | 1996-04-09 | Macsema, Inc. | Compact electronic data module with nonvolatile memory |
US5412535A (en) * | 1993-08-24 | 1995-05-02 | Convex Computer Corporation | Apparatus and method for cooling electronic devices |
SG44494A1 (en) * | 1993-09-07 | 1997-12-19 | R0Semount Inc | Multivariable transmitter |
US5606513A (en) * | 1993-09-20 | 1997-02-25 | Rosemount Inc. | Transmitter having input for receiving a process variable from a remote sensor |
JP3111816B2 (en) | 1993-10-08 | 2000-11-27 | 株式会社日立製作所 | Process state detector |
US5642301A (en) * | 1994-01-25 | 1997-06-24 | Rosemount Inc. | Transmitter with improved compensation |
US5531936A (en) * | 1994-08-31 | 1996-07-02 | Board Of Trustees Operating Michigan State University | Alkali metal quaternary chalcogenides and process for the preparation thereof |
GB2293446A (en) | 1994-09-17 | 1996-03-27 | Liang Chung Lee | Cooling assembly |
BR9509503A (en) | 1994-10-24 | 1997-12-30 | Fisher Rosemount Systems Inc | Networked field device distributed control system bridge field module designed to transmit information from a distribution network to a bridge / converter control network |
US5793963A (en) | 1994-10-24 | 1998-08-11 | Fisher Rosemount Systems, Inc. | Apparatus for providing non-redundant secondary access to field devices in a distributed control system |
US5656782A (en) | 1994-12-06 | 1997-08-12 | The Foxboro Company | Pressure sealed housing apparatus and methods |
US5637802A (en) * | 1995-02-28 | 1997-06-10 | Rosemount Inc. | Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates |
US5644185A (en) | 1995-06-19 | 1997-07-01 | Miller; Joel V. | Multi stage thermoelectric power generation using an ammonia absorption refrigeration cycle and thermoelectric elements at numerous locations in the cycle |
US5705978A (en) * | 1995-09-29 | 1998-01-06 | Rosemount Inc. | Process control transmitter |
JPH09130289A (en) | 1995-10-31 | 1997-05-16 | Mitsubishi Electric Corp | Portable analog communication equipment |
DE19608310C1 (en) | 1996-02-22 | 1997-07-17 | Hartmann & Braun Ag | Differential pressure transmitter unit with an overload protection system |
US5665899A (en) | 1996-02-23 | 1997-09-09 | Rosemount Inc. | Pressure sensor diagnostics in a process transmitter |
US7949495B2 (en) * | 1996-03-28 | 2011-05-24 | Rosemount, Inc. | Process variable transmitter with diagnostics |
US6907383B2 (en) * | 1996-03-28 | 2005-06-14 | Rosemount Inc. | Flow diagnostic system |
FR2747238B1 (en) | 1996-04-04 | 1998-07-10 | France Etat | THERMOELECTRIC GENERATOR |
US5811201A (en) | 1996-08-16 | 1998-09-22 | Southern California Edison Company | Power generation system utilizing turbine and fuel cell |
ES2127122B1 (en) * | 1996-09-02 | 1999-12-16 | Blaquez Navarro Vicente | AUTONOMOUS ELECTRONIC IMPROVED MONITORING SYSTEM FOR PURGERS, VALVES AND INSTALLATIONS IN REAL TIME. |
US5803604A (en) * | 1996-09-30 | 1998-09-08 | Exergen Corporation | Thermocouple transmitter |
US5851083A (en) | 1996-10-04 | 1998-12-22 | Rosemount Inc. | Microwave level gauge having an adapter with a thermal barrier |
US5954526A (en) | 1996-10-04 | 1999-09-21 | Rosemount Inc. | Process control transmitter with electrical feedthrough assembly |
FR2758009B1 (en) | 1996-12-26 | 1999-03-19 | France Etat | UNDERWATER THERMOELECTRIC GENERATOR WITH THERMOELECTRIC MODULES ARRANGED IN SLEEVES |
PL334922A1 (en) * | 1997-02-12 | 2000-03-27 | Siemens Ag | Circuit arrangement for and method of obtaining high-frequency encoded signals |
JP3633180B2 (en) * | 1997-02-14 | 2005-03-30 | 株式会社日立製作所 | Remote monitoring system |
US6458319B1 (en) | 1997-03-18 | 2002-10-01 | California Institute Of Technology | High performance P-type thermoelectric materials and methods of preparation |
US6013204A (en) * | 1997-03-28 | 2000-01-11 | Board Of Trustees Operating Michigan State University | Alkali metal chalcogenides of bismuth alone or with antimony |
US6792259B1 (en) * | 1997-05-09 | 2004-09-14 | Ronald J. Parise | Remote power communication system and method thereof |
US7068991B2 (en) * | 1997-05-09 | 2006-06-27 | Parise Ronald J | Remote power recharge for electronic equipment |
US5872494A (en) * | 1997-06-27 | 1999-02-16 | Rosemount Inc. | Level gage waveguide process seal having wavelength-based dimensions |
RU2131934C1 (en) * | 1997-09-01 | 1999-06-20 | Санков Олег Николаевич | Installation for heat treatment of materials |
US6282247B1 (en) * | 1997-09-12 | 2001-08-28 | Ericsson Inc. | Method and apparatus for digital compensation of radio distortion over a wide range of temperatures |
US6437692B1 (en) | 1998-06-22 | 2002-08-20 | Statsignal Systems, Inc. | System and method for monitoring and controlling remote devices |
US6891838B1 (en) * | 1998-06-22 | 2005-05-10 | Statsignal Ipc, Llc | System and method for monitoring and controlling residential devices |
KR20010071587A (en) * | 1998-06-26 | 2001-07-28 | 홀 케네스 알. | Thermocouple for use in gasification process |
US6360277B1 (en) * | 1998-07-22 | 2002-03-19 | Crydom Corporation | Addressable intelligent relay |
US6480699B1 (en) * | 1998-08-28 | 2002-11-12 | Woodtoga Holdings Company | Stand-alone device for transmitting a wireless signal containing data from a memory or a sensor |
US6405139B1 (en) * | 1998-09-15 | 2002-06-11 | Bently Nevada Corporation | System for monitoring plant assets including machinery |
US6312617B1 (en) | 1998-10-13 | 2001-11-06 | Board Of Trustees Operating Michigan State University | Conductive isostructural compounds |
US7640007B2 (en) | 1999-02-12 | 2009-12-29 | Fisher-Rosemount Systems, Inc. | Wireless handheld communicator in a process control environment |
US6127739A (en) | 1999-03-22 | 2000-10-03 | Appa; Kari | Jet assisted counter rotating wind turbine |
US6783167B2 (en) * | 1999-03-24 | 2004-08-31 | Donnelly Corporation | Safety system for a closed compartment of a vehicle |
FI111760B (en) * | 1999-04-16 | 2003-09-15 | Metso Automation Oy | Wireless control of a field device in an industrial process |
JP2000321361A (en) | 1999-05-07 | 2000-11-24 | Kubota Corp | Communication system |
US6508131B2 (en) * | 1999-05-14 | 2003-01-21 | Rosemount Inc. | Process sensor module having a single ungrounded input/output conductor |
US6295875B1 (en) | 1999-05-14 | 2001-10-02 | Rosemount Inc. | Process pressure measurement devices with improved error compensation |
US7064671B2 (en) | 2000-06-23 | 2006-06-20 | Fisher Controls International Llc | Low power regulator system and method |
US6255010B1 (en) | 1999-07-19 | 2001-07-03 | Siemens Westinghouse Power Corporation | Single module pressurized fuel cell turbine generator system |
US6385972B1 (en) * | 1999-08-30 | 2002-05-14 | Oscar Lee Fellows | Thermoacoustic resonator |
US6667594B2 (en) | 1999-11-23 | 2003-12-23 | Honeywell International Inc. | Determination of maximum travel of linear actuator |
RU2168062C1 (en) | 1999-12-07 | 2001-05-27 | Открытое акционерное общество "Всероссийский научно-исследовательский институт гидротехники им. Б.Е. Веденеева" | Windmill generator |
US6934862B2 (en) | 2000-01-07 | 2005-08-23 | Robertshaw Controls Company | Appliance retrofit monitoring device with a memory storing an electronic signature |
JP2001222787A (en) | 2000-02-07 | 2001-08-17 | Mitsui Eng & Shipbuild Co Ltd | Measuring system for rotary drum |
DE10014272B4 (en) * | 2000-03-22 | 2008-06-05 | Endress + Hauser Gmbh + Co. Kg | Field device, and method for reprogramming a field device |
US6744814B1 (en) * | 2000-03-31 | 2004-06-01 | Agere Systems Inc. | Method and apparatus for reduced state sequence estimation with tap-selectable decision-feedback |
AT410041B (en) | 2000-04-17 | 2003-01-27 | Voest Alpine Ind Anlagen | METHOD AND DEVICE FOR RECORDING MEASUREMENT DATA IN A SHELL MILL |
US6441747B1 (en) | 2000-04-18 | 2002-08-27 | Motorola, Inc. | Wireless system protocol for telemetry monitoring |
US6574515B1 (en) * | 2000-05-12 | 2003-06-03 | Rosemount Inc. | Two-wire field-mounted process device |
US6326764B1 (en) | 2000-06-05 | 2001-12-04 | Clement Virtudes | Portable solar-powered CD player and electrical generator |
FI114507B (en) * | 2000-07-07 | 2004-10-29 | Metso Automation Oy | System for diagnostics of a device |
JP3553001B2 (en) | 2000-08-04 | 2004-08-11 | 高圧ガス保安協会 | Gas monitoring system |
DE60018072T2 (en) | 2000-10-27 | 2005-12-29 | Invensys Systems, Inc., Foxboro | Field device with a transmitter and / or receiver for wireless data transmission |
ATE298962T1 (en) | 2001-01-12 | 2005-07-15 | Vector Informatik Gmbh | METHOD AND DEVICE FOR CHECKING THE RELEVANCE OF AN IDENTIFIER |
US6686831B2 (en) | 2001-01-23 | 2004-02-03 | Invensys Systems, Inc. | Variable power control for process control instruments |
US6728603B2 (en) | 2001-02-08 | 2004-04-27 | Electronic Data Systems Corporation | System and method for managing wireless vehicular communications |
US6625990B2 (en) | 2001-02-09 | 2003-09-30 | Bsst Llc | Thermoelectric power generation systems |
JP3394996B2 (en) | 2001-03-09 | 2003-04-07 | 独立行政法人産業技術総合研究所 | Maximum power operating point tracking method and device |
DE20107112U1 (en) * | 2001-04-25 | 2001-07-05 | Abb Patent Gmbh | Device for supplying energy to field devices |
DE10125058B4 (en) * | 2001-05-22 | 2014-02-27 | Enocean Gmbh | Thermally fed transmitter and sensor system |
JP2002369554A (en) | 2001-06-06 | 2002-12-20 | Nec Tokin Corp | Indicator |
DE10128447A1 (en) | 2001-06-12 | 2003-01-02 | Abb Patent Gmbh | Electropneumatic actuator drive has position sensor and is fitted with wireless communications interface corresponding to that of position sensor |
US6564859B2 (en) * | 2001-06-27 | 2003-05-20 | Intel Corporation | Efficient heat pumping from mobile platforms using on platform assembled heat pipe |
US20030012563A1 (en) * | 2001-07-10 | 2003-01-16 | Darrell Neugebauer | Space heater with remote control |
JP2003051894A (en) | 2001-08-08 | 2003-02-21 | Mitsubishi Electric Corp | Work management system for plant |
US6781249B2 (en) * | 2001-08-29 | 2004-08-24 | Hewlett-Packard Development Company, L.P. | Retrofittable power supply |
EP1293853A1 (en) | 2001-09-12 | 2003-03-19 | ENDRESS + HAUSER WETZER GmbH + Co. KG | Transceiver module for a field device |
US20030134161A1 (en) | 2001-09-20 | 2003-07-17 | Gore Makarand P. | Protective container with preventative agent therein |
US6995685B2 (en) * | 2001-09-25 | 2006-02-07 | Landis+Gyr, Inc. | Utility meter power arrangements and methods |
JP4114334B2 (en) * | 2001-10-09 | 2008-07-09 | 株式会社ジェイテクト | Rolling bearing |
JP3815603B2 (en) | 2001-10-29 | 2006-08-30 | 横河電機株式会社 | Communications system |
CA2460290A1 (en) * | 2001-11-01 | 2003-05-08 | Bliss C. Carkhuff | Techniques for monitoring health of vessels containing fluids |
JP2003149058A (en) * | 2001-11-14 | 2003-05-21 | Toshiba Corp | Temperature sensor and plant temperature measuring device |
JP2003168182A (en) | 2001-12-04 | 2003-06-13 | Nsk Ltd | Wireless sensor |
US7301454B2 (en) * | 2001-12-21 | 2007-11-27 | Bae Systems Plc | Sensor system |
US7002800B2 (en) * | 2002-01-25 | 2006-02-21 | Lockheed Martin Corporation | Integrated power and cooling architecture |
US6778100B2 (en) | 2002-03-06 | 2004-08-17 | Automatika, Inc. | Conduit network system |
US7035773B2 (en) | 2002-03-06 | 2006-04-25 | Fisher-Rosemount Systems, Inc. | Appendable system and devices for data acquisition, analysis and control |
US6839546B2 (en) * | 2002-04-22 | 2005-01-04 | Rosemount Inc. | Process transmitter with wireless communication link |
US20030204371A1 (en) | 2002-04-30 | 2003-10-30 | Chevron U.S.A. Inc. | Temporary wireless sensor network system |
US20040203984A1 (en) * | 2002-06-11 | 2004-10-14 | Tai-Her Yang | Wireless information device with its transmission power lever adjustable |
JP2004021877A (en) | 2002-06-20 | 2004-01-22 | Yokogawa Electric Corp | Field apparatus |
US6843110B2 (en) * | 2002-06-25 | 2005-01-18 | Fluid Components International Llc | Method and apparatus for validating the accuracy of a flowmeter |
AU2003279616A1 (en) | 2002-06-28 | 2004-01-19 | Advanced Bionics Corporation | Microstimulator having self-contained power source and bi-directional telemetry system |
US20040140002A1 (en) | 2002-07-05 | 2004-07-22 | Brown Jacob E. | Apparatus, system, and method of mechanically coupling photovoltaic modules |
US7709766B2 (en) * | 2002-08-05 | 2010-05-04 | Research Foundation Of The State University Of New York | System and method for manufacturing embedded conformal electronics |
US6838859B2 (en) * | 2002-08-13 | 2005-01-04 | Reza H. Shah | Device for increasing power of extremely low DC voltage |
US7063537B2 (en) * | 2002-08-15 | 2006-06-20 | Smar Research Corporation | Rotatable assemblies and methods of securing such assemblies |
AU2002357654A1 (en) * | 2002-09-13 | 2004-04-30 | Proton Energy Systems, Inc. | Method and system for balanced control of backup power |
US6910332B2 (en) * | 2002-10-15 | 2005-06-28 | Oscar Lee Fellows | Thermoacoustic engine-generator |
US7440735B2 (en) | 2002-10-23 | 2008-10-21 | Rosemount Inc. | Virtual wireless transmitter |
US20040081872A1 (en) * | 2002-10-28 | 2004-04-29 | Herman Gregory S. | Fuel cell stack with heat exchanger |
US6926440B2 (en) * | 2002-11-01 | 2005-08-09 | The Boeing Company | Infrared temperature sensors for solar panel |
WO2004043843A1 (en) | 2002-11-12 | 2004-05-27 | Mitsubishi Denki Kabushiki Kaisha | Rope for elevator and elevator equipment |
JP2004208476A (en) | 2002-12-26 | 2004-07-22 | Toyota Motor Corp | Waste heat power generator |
US20040159235A1 (en) * | 2003-02-19 | 2004-08-19 | Marganski Paul J. | Low pressure drop canister for fixed bed scrubber applications and method of using same |
AU2003212340A1 (en) * | 2003-03-12 | 2004-09-30 | Abb Research Ltd. | Arrangement and method for continuously supplying electric power to a field device in a technical system |
US6904476B2 (en) | 2003-04-04 | 2005-06-07 | Rosemount Inc. | Transmitter with dual protocol interface |
US7326851B2 (en) | 2003-04-11 | 2008-02-05 | Basf Aktiengesellschaft | Pb-Ge-Te-compounds for thermoelectric generators or Peltier arrangements |
US6891477B2 (en) * | 2003-04-23 | 2005-05-10 | Baker Hughes Incorporated | Apparatus and methods for remote monitoring of flow conduits |
US20040214543A1 (en) * | 2003-04-28 | 2004-10-28 | Yasuo Osone | Variable capacitor system, microswitch and transmitter-receiver |
JP2004350479A (en) | 2003-05-26 | 2004-12-09 | Hitachi Powdered Metals Co Ltd | Thermoelectric conversion power generating unit and tunnel type furnace equipped with same |
US7272454B2 (en) | 2003-06-05 | 2007-09-18 | Fisher-Rosemount Systems, Inc. | Multiple-input/multiple-output control blocks with non-linear predictive capabilities |
US7460865B2 (en) | 2003-06-18 | 2008-12-02 | Fisher-Rosemount Systems, Inc. | Self-configuring communication networks for use with process control systems |
US7436797B2 (en) | 2003-06-18 | 2008-10-14 | Fisher-Rosemount Systems, Inc. | Wireless architecture and support for process control systems |
US7275213B2 (en) * | 2003-08-11 | 2007-09-25 | Ricoh Company, Ltd. | Configuring a graphical user interface on a multifunction peripheral |
US20050046595A1 (en) * | 2003-08-26 | 2005-03-03 | Mr.John Blyth | Solar powered sign annunciator |
US8481843B2 (en) * | 2003-09-12 | 2013-07-09 | Board Of Trustees Operating Michigan State University | Silver-containing p-type semiconductor |
US7627441B2 (en) * | 2003-09-30 | 2009-12-01 | Rosemount Inc. | Process device with vibration based diagnostics |
US6932561B2 (en) * | 2003-10-01 | 2005-08-23 | Wafermasters, Inc. | Power generation system |
US7508671B2 (en) * | 2003-10-10 | 2009-03-24 | Intel Corporation | Computer system having controlled cooling |
US20050082949A1 (en) * | 2003-10-21 | 2005-04-21 | Michio Tsujiura | Piezoelectric generator |
US7655331B2 (en) * | 2003-12-01 | 2010-02-02 | Societe Bic | Fuel cell supply including information storage device and control system |
US20050139250A1 (en) * | 2003-12-02 | 2005-06-30 | Battelle Memorial Institute | Thermoelectric devices and applications for the same |
US8455751B2 (en) * | 2003-12-02 | 2013-06-04 | Battelle Memorial Institute | Thermoelectric devices and applications for the same |
US7330695B2 (en) * | 2003-12-12 | 2008-02-12 | Rosemount, Inc. | Bus powered wireless transmitter |
US7234084B2 (en) | 2004-02-18 | 2007-06-19 | Emerson Process Management | System and method for associating a DLPDU received by an interface chip with a data measurement made by an external circuit |
US6984899B1 (en) * | 2004-03-01 | 2006-01-10 | The United States Of America As Represented By The Secretary Of The Navy | Wind dam electric generator and method |
CA2552615C (en) | 2004-03-02 | 2014-08-26 | Rosemount Inc. | Process device with improved power generation |
US20050201349A1 (en) | 2004-03-15 | 2005-09-15 | Honeywell International Inc. | Redundant wireless node network with coordinated receiver diversity |
US7515977B2 (en) | 2004-03-30 | 2009-04-07 | Fisher-Rosemount Systems, Inc. | Integrated configuration system for use in a process plant |
US6971274B2 (en) * | 2004-04-02 | 2005-12-06 | Sierra Instruments, Inc. | Immersible thermal mass flow meter |
US8538560B2 (en) | 2004-04-29 | 2013-09-17 | Rosemount Inc. | Wireless power and communication unit for process field devices |
US7620409B2 (en) | 2004-06-17 | 2009-11-17 | Honeywell International Inc. | Wireless communication system with channel hopping and redundant connectivity |
US7262693B2 (en) | 2004-06-28 | 2007-08-28 | Rosemount Inc. | Process field device with radio frequency communication |
US8929228B2 (en) * | 2004-07-01 | 2015-01-06 | Honeywell International Inc. | Latency controlled redundant routing |
US20060063522A1 (en) * | 2004-09-21 | 2006-03-23 | Mcfarland Norman R | Self-powering automated building control components |
KR20060027578A (en) * | 2004-09-23 | 2006-03-28 | 삼성에스디아이 주식회사 | System for controlling temperature of secondary battery module |
US20060077917A1 (en) * | 2004-10-07 | 2006-04-13 | Honeywell International Inc. | Architecture and method for enabling use of wireless devices in industrial control |
JP4792851B2 (en) * | 2004-11-01 | 2011-10-12 | 横河電機株式会社 | Field equipment |
AU2005316972B2 (en) * | 2004-11-24 | 2011-11-10 | Abbvie Inc. | Chromanylurea compounds that inhibit vanilloid receptor subtype 1 (VR1) receptor and uses thereof |
US7680460B2 (en) | 2005-01-03 | 2010-03-16 | Rosemount Inc. | Wireless process field device diagnostics |
US7173343B2 (en) * | 2005-01-28 | 2007-02-06 | Moshe Kugel | EMI energy harvester |
US9184364B2 (en) * | 2005-03-02 | 2015-11-10 | Rosemount Inc. | Pipeline thermoelectric generator assembly |
US20060227729A1 (en) | 2005-04-12 | 2006-10-12 | Honeywell International Inc. | Wireless communication system with collision avoidance protocol |
US7649138B2 (en) | 2005-05-25 | 2010-01-19 | Hi-Z Technology, Inc. | Thermoelectric device with surface conforming heat conductor |
US7742394B2 (en) | 2005-06-03 | 2010-06-22 | Honeywell International Inc. | Redundantly connected wireless sensor networking methods |
US7848223B2 (en) | 2005-06-03 | 2010-12-07 | Honeywell International Inc. | Redundantly connected wireless sensor networking methods |
KR100635405B1 (en) * | 2005-06-10 | 2006-10-19 | 한국과학기술연구원 | Micro power generator |
US8463319B2 (en) | 2005-06-17 | 2013-06-11 | Honeywell International Inc. | Wireless application installation, configuration and management tool |
ES2420805T3 (en) * | 2005-06-28 | 2013-08-26 | Afognak Native Corporation | Method and apparatus for biomass power generation, modular, automated |
US7271679B2 (en) | 2005-06-30 | 2007-09-18 | Intermec Ip Corp. | Apparatus and method to facilitate wireless communications of automatic data collection devices in potentially hazardous environments |
US20070030816A1 (en) * | 2005-08-08 | 2007-02-08 | Honeywell International Inc. | Data compression and abnormal situation detection in a wireless sensor network |
US7801094B2 (en) * | 2005-08-08 | 2010-09-21 | Honeywell International Inc. | Integrated infrastructure supporting multiple wireless devices |
US8204078B2 (en) | 2006-03-31 | 2012-06-19 | Honeywell International Inc. | Apparatus, system, and method for integration of wireless devices with a distributed control system |
US7848827B2 (en) | 2006-03-31 | 2010-12-07 | Honeywell International Inc. | Apparatus, system, and method for wireless diagnostics |
KR100744902B1 (en) * | 2006-05-24 | 2007-08-01 | 삼성전기주식회사 | Mobile wireless manipulator |
US7644633B2 (en) * | 2006-12-18 | 2010-01-12 | Rosemount Inc. | Vortex flowmeter with temperature compensation |
-
2005
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US20050208908A1 (en) | 2005-09-22 |
JP5058785B2 (en) | 2012-10-24 |
CN1954138B (en) | 2011-02-16 |
EP1721067A2 (en) | 2006-11-15 |
RU2347921C2 (en) | 2009-02-27 |
US7957708B2 (en) | 2011-06-07 |
CA2552615C (en) | 2014-08-26 |
DE602005018749D1 (en) | 2010-02-25 |
WO2005086331A3 (en) | 2006-09-21 |
RU2006134646A (en) | 2008-04-10 |
WO2005086331A2 (en) | 2005-09-15 |
EP1721067B1 (en) | 2010-01-06 |
JP2007526740A (en) | 2007-09-13 |
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