CA2561955A1 - Embedded capacitors using conductor filled vias - Google Patents

Embedded capacitors using conductor filled vias Download PDF

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Publication number
CA2561955A1
CA2561955A1 CA002561955A CA2561955A CA2561955A1 CA 2561955 A1 CA2561955 A1 CA 2561955A1 CA 002561955 A CA002561955 A CA 002561955A CA 2561955 A CA2561955 A CA 2561955A CA 2561955 A1 CA2561955 A1 CA 2561955A1
Authority
CA
Canada
Prior art keywords
bore
electrode
dielectric substrate
conductor
conductive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002561955A
Other languages
French (fr)
Other versions
CA2561955C (en
Inventor
Terry M. Provo
Andrew J. Thomson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harris Corp
Original Assignee
Harris Corporation
Terry M. Provo
Andrew J. Thomson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corporation, Terry M. Provo, Andrew J. Thomson filed Critical Harris Corporation
Publication of CA2561955A1 publication Critical patent/CA2561955A1/en
Application granted granted Critical
Publication of CA2561955C publication Critical patent/CA2561955C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/26—Folded capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination

Abstract

Embedded capacitors and a method for manufacturing the embedded capacitors.
The method can include the steps of forming at least one bore (115) in a dielectric substrate (100). The dielectric substrate can be mechanically punched or laser cut to form the bore. The bore can be filled with a conductive material (250) to form a first electrode (470). A conductor (360) can be formed on the dielectric substrate, the conductor not being electrically continuous with the first electrode. A depth and/or cross sectional area of the bore can be selected to provide a desired amount of capacitive coupling between the electrode and the conductor. At least a second bore can be formed in the dielectric substrate and filled with a conductive material to form a second electrode. The second electrode can be electrically connected to the first electrode.

Claims (5)

1. A method for manufacturing embedded capacitors comprising:
forming at least one bore in a dielectric substrate;
filling said bore with a conductive material to form a first electrode; and disposing a conductor on said dielectric substrate, said conductor not being electrically continuous with said first electrode;
wherein at least one of a depth and a cross sectional area of said bore is selected to provide a desired amount of capacitive coupling between said electrode and said conductor.
2. The method of claim 1, further comprising disposing a second conductor on said dielectric substrate in electrical contact with said first electrode.
3. The method of claim 1, further comprising:
forming at least a second bore in said dielectric substrate;
filling said second bore with a conductive material to form a second electrode; and electrically connecting said first electrode and said second electrode.
4. The method of claim 1, further comprising:
forming at least a second bore in said dielectric substrate;
filling said second bore with a conductive material to form a second electrode; and electrically connecting said second electrode to said conductor.
5. The method of claim 1, said first bore being formed in a first layer of said dielectric substrate, said method further comprising:
forming a second bore in a second dielectric layer;
filling said second bore with a conductive material;
and joining said first and second dielectric layers such that said conductive material in said first bore is electrically continuous with said conductive material in said second bore, said conductive material in said first and second bores forming an extended electrode.
CA2561955A 2004-04-02 2005-03-28 Embedded capacitors using conductor filled vias Expired - Fee Related CA2561955C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/816,637 US6908809B1 (en) 2004-04-02 2004-04-02 Embedded capacitors using conductor filled vias
US10/816,637 2004-04-02
PCT/US2005/010300 WO2005099028A2 (en) 2004-04-02 2005-03-28 Embedded capacitors using conductor filled vias

Publications (2)

Publication Number Publication Date
CA2561955A1 true CA2561955A1 (en) 2005-10-20
CA2561955C CA2561955C (en) 2011-01-04

Family

ID=34654428

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2561955A Expired - Fee Related CA2561955C (en) 2004-04-02 2005-03-28 Embedded capacitors using conductor filled vias

Country Status (8)

Country Link
US (2) US6908809B1 (en)
EP (1) EP1738431A4 (en)
JP (2) JP2007531326A (en)
KR (1) KR100859894B1 (en)
CN (1) CN1938799B (en)
CA (1) CA2561955C (en)
TW (1) TWI258203B (en)
WO (1) WO2005099028A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7456459B2 (en) * 2005-10-21 2008-11-25 Georgia Tech Research Corporation Design of low inductance embedded capacitor layer connections
US7619872B2 (en) * 2006-05-31 2009-11-17 Intel Corporation Embedded electrolytic capacitor
US8506826B2 (en) 2011-08-02 2013-08-13 Harris Corporation Method of manufacturing a switch system
CN107591256B (en) * 2017-07-14 2019-07-19 电子科技大学 A kind of board-like array capacitor chip of large capacity gradient and preparation method thereof
US20230070377A1 (en) * 2021-09-09 2023-03-09 Onano Industrial Corp. Integrated structure of circuit mold unit of ltcc electronic device

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0625031Y2 (en) * 1987-07-21 1994-06-29 株式会社村田製作所 Multilayer substrate with built-in capacitor
JP2646091B2 (en) * 1987-08-12 1997-08-25 新光電気工業株式会社 Substrates for electronic components
JPH02303091A (en) * 1989-05-17 1990-12-17 Nippon Oil & Fats Co Ltd Board with built-in capacitor
US5055966A (en) * 1990-12-17 1991-10-08 Hughes Aircraft Company Via capacitors within multi-layer, 3 dimensional structures/substrates
US5396397A (en) * 1992-09-24 1995-03-07 Hughes Aircraft Company Field control and stability enhancement in multi-layer, 3-dimensional structures
US5339212A (en) * 1992-12-03 1994-08-16 International Business Machines Corporation Sidewall decoupling capacitor
JP3368664B2 (en) * 1994-04-14 2003-01-20 株式会社村田製作所 Multilayer ceramic parts
JP3363651B2 (en) * 1994-04-21 2003-01-08 キヤノン株式会社 Printed wiring board and its design method
JPH08181453A (en) * 1994-12-22 1996-07-12 Fujitsu Ltd Capacitor containing circuit board
US5618185A (en) * 1995-03-15 1997-04-08 Hubbell Incorporated Crosstalk noise reduction connector for telecommunication system
JPH098427A (en) 1995-06-19 1997-01-10 Canon Inc Printed substrate selfcontaining capacitor
US6061228A (en) 1998-04-28 2000-05-09 Harris Corporation Multi-chip module having an integral capacitor element
JPH11312855A (en) * 1998-04-28 1999-11-09 Kyocera Corp Board with incorporated capacitor
KR20000034924A (en) * 1998-11-17 2000-06-26 제닌 엠. 데이비스 Passive electronic components in a multi-layered low temperature co-fired ceramic
US6205032B1 (en) * 1999-03-16 2001-03-20 Cts Corporation Low temperature co-fired ceramic with improved registration
JP2001217519A (en) * 2000-02-03 2001-08-10 Ibiden Co Ltd Capacitor structure and capacitor sheet of wiring board
JP2004072034A (en) * 2002-08-09 2004-03-04 Toppan Printing Co Ltd Capacitor, interposer or printed circuit board incorporating the same
US20040099999A1 (en) * 2002-10-11 2004-05-27 Borland William J. Co-fired capacitor and method for forming ceramic capacitors for use in printed wiring boards
KR100543239B1 (en) * 2005-07-25 2006-01-20 한국과학기술원 Method for fabricating capacitor using polymer/ceramic composite paste for embedded capacitor
JP2007207948A (en) * 2006-01-31 2007-08-16 Ngk Spark Plug Co Ltd Capacitor structure, wiring board using it and its manufacturing method

Also Published As

Publication number Publication date
JP2007531326A (en) 2007-11-01
US20050221555A1 (en) 2005-10-06
WO2005099028A2 (en) 2005-10-20
CN1938799B (en) 2010-12-08
US7154139B2 (en) 2006-12-26
WO2005099028A3 (en) 2005-12-22
US6908809B1 (en) 2005-06-21
JP5156048B2 (en) 2013-03-06
KR20060135859A (en) 2006-12-29
CA2561955C (en) 2011-01-04
JP2010199599A (en) 2010-09-09
EP1738431A2 (en) 2007-01-03
EP1738431A4 (en) 2010-04-07
KR100859894B1 (en) 2008-09-23
TWI258203B (en) 2006-07-11
CN1938799A (en) 2007-03-28
TW200611374A (en) 2006-04-01

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Effective date: 20140328