CA2597284A1 - Diamond tool - Google Patents
Diamond tool Download PDFInfo
- Publication number
- CA2597284A1 CA2597284A1 CA002597284A CA2597284A CA2597284A1 CA 2597284 A1 CA2597284 A1 CA 2597284A1 CA 002597284 A CA002597284 A CA 002597284A CA 2597284 A CA2597284 A CA 2597284A CA 2597284 A1 CA2597284 A1 CA 2597284A1
- Authority
- CA
- Canada
- Prior art keywords
- diamond
- cutting
- diamond particles
- tool according
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910003460 diamond Inorganic materials 0.000 title claims abstract 72
- 239000010432 diamond Substances 0.000 title claims abstract 72
- 239000002245 particle Substances 0.000 claims abstract 39
- 230000000994 depressogenic effect Effects 0.000 claims 3
- 239000000945 filler Substances 0.000 claims 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 229910052593 corundum Inorganic materials 0.000 claims 1
- 229910001845 yogo sapphire Inorganic materials 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
- B24D5/123—Cut-off wheels having different cutting segments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/12—Saw-blades or saw-discs specially adapted for working stone
- B28D1/121—Circular saw blades
Abstract
The invention provides a segment type diamond tool capable of improving cutting rate and reducing the amount of fine debris generated during cutting by properly arranging diamond particles in a cutting segment of the diamond tool. In the invention, the layers of diamond particles are arranged such that cutting grooves formed on a workpiece by trailing layers of diamond particles are arranged between cutting grooves formed thereon by leading layers of diamond particles, respectively, in cutting of the work piece. The cutting segment has high-concentration and low-concentration areas. The high-concentration area shows a concentration higher than an average concentration and the low concentration area shows a concentration lower than the average concentration. Also, at least one low concentration area is formed on the leading and/or trailing section of the cutting segment. The diamond tool of the invention ensures superior cutting rate and reduced amount of fine debris generated during cutting.
Claims (28)
- [1] A diamond tool comprising a plurality of cutting segments, wherein each of the segments has a single plate-shaped layer or a plurality of plate-shaped layers of diamond particles arranged therein, wherein the layers of diamond particles are arranged in the cutting segment such that cutting grooves formed on a workpiece by trailing layers of diamond particles are arranged between cutting grooves formed thereon by leading layers of diamond particles, respectively, in cutting of the work piece, wherein the cutting segments each are divided into at least two sections such that n layers of diamond particles are arranged in a leading section in a cutting direction and n' layers of diamond particles are arranged in a trailing section in the cutting direction, where n' <= n, and wherein the layers of diamond particles in the leading section are arranged between the layers of diamond particles in the trailing section, respectively, in the cutting direction, by forming depressed portions at lateral sides of the segment in the cutting direction, wherein the cutting segment has a high-concentration area and a low-concentration area, the high-concentration area showing a concentration higher than an average concentration of the diamond particles, the low concentration area showing a concentration lower than the average concentration, and at least one low concentration area formed on the leading and/or trailing section of the cutting segment.
- [2] The diamond tool according to claim 1, wherein the depressed portions are formed on one or both lateral sides of the cutting segment.
- [3] The diamond tool according to claim 2, wherein at least one of the depressed portions is formed on each lateral side of the cutting segment.
- [4] The diamond tool according to any one of claims 1 to 3, wherein the low-concentration area is parallel in a direction perpendicular to the cutting direction.
- [5] The diamond tool according to any one of claims 1 to 3, wherein the low-concentration area is tilted in a direction perpendicular to the cutting direction.
- [6] The diamond tool according to any one of claims 1 to 3, the high-concentration area is formed across the leading and trailing sections of the cutting segment.
- [7] The diamond tool according to claim 4, wherein the high-concentration area is formed across the leading and trailing sections of the cutting segment.
- [8] The diamond tool according to claim 5, wherein the high-concentration area is formed across the leading and trailing sections of the cutting segment.
- [9] The diamond tool according to any one of claims 1 to 3, the layers of diamond particles positioned on at least one lateral side of the cutting segment have diamond particles uniformly spaced from each other.
- [10] The diamond tool according to claim 4, wherein the layers of diamond particles positioned on at least one lateral side of the cutting segment have diamond particles uniformly spaced from each other.
- [11] The diamond tool according to claim 5, wherein the layers of diamond particles positioned on at least one lateral side of the cutting segment have diamond particles uniformly spaced from each other.
- [12] The diamond tool according to claim 6, wherein the layers of diamond particles positioned on at least one lateral side of the cutting segment have diamond particles uniformly spaced from each other.
- [13] The diamond tool according to claim 7 or 8, wherein the layers of diamond particles positioned on at least one lateral side of the cutting segment have diamond particles uniformly spaced from each other.
- [14] The diamond tool according to any one of claims 1 to 3, wherein the low-concentration area has no diamond particles.
- [15] The diamond tool according to claim 4, wherein the low-concentration area has no diamond particles.
- [16] The diamond tool according to claim 5, wherein the low-concentration area has no diamond particles.
- [17] The diamond tool according to claim 6, wherein the low-concentration area has no diamond particles.
- [18] The diamond tool according to claim 7 or 8, wherein the low-concentration area has no diamond particles.
- [19] The diamond tool according to claim 9, wherein the low-concentration area has no diamond particles.
- [20] The diamond tool according to any one of claims 10 to 12, wherein the low con-centration area has no diamond particles.
- [21] The diamond tool according to claim 13, wherein the low-concentration area has no diamond particles.
- [22] The diamond tool according to any one of claims 1 to 3, wherein the diamond particles are arranged at a predetermined tilt angle with respect to a line connecting upper vertices or a line connecting lower vertices of a cross section, cut parallel in a cutting direction and perpendicular to a cutting surface so that the diamond particles are protruded and uniformly spaced from each other on the cutting surface of the segment in cutting of the work piece.
- [23] The diamond tool according to claim 22, wherein the tilt angle is in the range of 15 to 45°.
- [24] The diamond tool according to any one of claims 1 to 3, wherein the leading layers of diamond particles are spaced from each other by a distance less than or equal to a thickness of each trailing layer of diamond particles.
- [25] The diamond tool according to any one of claims 1 to 3, further comprising at least one cutting segment having diamond particles randomly dispersed therein along with the cutting segments each having a single plate-shaped layer or a plurality of plate-shaped layers of diamond particles arranged therein.
- [26] The diamond tool according to any one of claims 1 to 3, wherein each of the segments has fillers dispersed therein.
- [27] The diamond tool according to claim 26, wherein the fillers comprise at least one selected from a group consisting of SiC, WC, BN, Al2O3 and diamond.
- [28] The diamond tool according to claim 27, wherein the fillers are diamond particles, which have a concentration that is 10% to 60% of the concentration of the diamond particles for cutting.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050012458A KR100597717B1 (en) | 2005-02-15 | 2005-02-15 | Diamond tool |
| KR10-2005-0012458 | 2005-02-15 | ||
| PCT/KR2006/000507 WO2006088302A1 (en) | 2005-02-15 | 2006-02-13 | Diamond tool |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2597284A1 true CA2597284A1 (en) | 2006-08-24 |
| CA2597284C CA2597284C (en) | 2010-06-15 |
Family
ID=36916676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2597284A Expired - Fee Related CA2597284C (en) | 2005-02-15 | 2006-02-13 | Diamond tool |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US8028687B2 (en) |
| EP (1) | EP1937437B1 (en) |
| JP (1) | JP4724185B2 (en) |
| KR (1) | KR100597717B1 (en) |
| CN (1) | CN100563890C (en) |
| AU (1) | AU2006214879B2 (en) |
| BR (1) | BRPI0607295B1 (en) |
| CA (1) | CA2597284C (en) |
| MX (1) | MX2007009851A (en) |
| WO (1) | WO2006088302A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1830978A4 (en) * | 2004-12-30 | 2012-04-04 | Ehwa Diamond Ind Co Ltd | Cutting segment of cutting tool and cutting tool |
| KR100773606B1 (en) | 2006-01-24 | 2007-11-05 | 이창현 | Processing tool by using super-abrasive preform and fabricating method therefor |
| AT511967B1 (en) * | 2011-12-01 | 2013-04-15 | Swarovski Tyrolit Schleif | GRINDING TOOL AND METHOD FOR THE PRODUCTION THEREOF |
| US9555485B2 (en) * | 2014-04-25 | 2017-01-31 | Gws Tool, Llc | Diamond plated grinding endmill for advanced hardened ceramics machining |
| CN107671752A (en) * | 2017-11-01 | 2018-02-09 | 青岛百瑞福橡塑有限公司 | A kind of polishing Carborundum wheel and device |
| CN112008884B (en) * | 2019-05-29 | 2022-02-22 | 江苏友和工具有限公司 | 3D arranged diamond saw blade |
| USD995585S1 (en) | 2020-08-28 | 2023-08-15 | Husqvarna Ab | Cutting blade |
| USD994737S1 (en) | 2020-08-28 | 2023-08-08 | Husqvarna Ab | Cutting blade |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1488912A (en) * | 1922-09-16 | 1924-04-01 | Foerster Emanuel | Saw tooth |
| US1866356A (en) * | 1930-12-01 | 1932-07-05 | Homer V Jones | Saw tooth |
| US2811960A (en) * | 1957-02-26 | 1957-11-05 | Fessel Paul | Abrasive cutting body |
| JPH03161278A (en) * | 1989-11-15 | 1991-07-11 | Asahi Daiyamondo Kogyo Kk | Diamond saw blade |
| JPH05345280A (en) * | 1992-06-12 | 1993-12-27 | Noritake Dia Kk | Tip structure of diamond cutting grinding wheel |
| JPH07266239A (en) * | 1994-03-25 | 1995-10-17 | Hitachi Koki Co Ltd | Diamond core bit |
| DE19653975A1 (en) * | 1995-12-31 | 1997-10-30 | Kimiko Sueta | Disk type wheel cutter for metal processing |
| TW394723B (en) | 1997-04-04 | 2000-06-21 | Sung Chien Min | Abrasive tools with patterned grit distribution and method of manufacture |
| KR100231361B1 (en) * | 1997-07-25 | 1999-11-15 | 김세광 | Segment for diamond tool |
| KR100285415B1 (en) * | 1998-09-03 | 2001-04-02 | 김세광 | Segment type diamond saw blade |
| KR100285413B1 (en) * | 1998-09-03 | 2001-04-02 | 김세광 | Rim type diamond blade |
| KR20010060680A (en) | 1999-12-27 | 2001-07-07 | 구자홍 | Evaporator for refrigerator |
| JP3739304B2 (en) | 2001-07-26 | 2006-01-25 | 株式会社ノリタケスーパーアブレーシブ | Rotating disc grinding wheel |
| KR100428947B1 (en) * | 2001-09-28 | 2004-04-29 | 이화다이아몬드공업 주식회사 | Diamond Tool |
| KR100554755B1 (en) | 2001-12-27 | 2006-02-24 | 주식회사 포스코 | Method for Manufacturing Electro-Galvanized Steel Sheets with Superior Surface Hardness and Appearance |
| KR100531499B1 (en) * | 2002-02-08 | 2005-11-28 | 이화다이아몬드공업 주식회사 | Cutting Tip for Diamond Tool and Diamond Tool |
| KR100527395B1 (en) * | 2003-08-11 | 2005-11-09 | 이화다이아몬드공업 주식회사 | Diamond Tool |
| US7134430B2 (en) * | 2004-04-21 | 2006-11-14 | Ehwa Diamond Industrial Co. Ltd. | Cutting segment, method of manufacturing cutting segment, and cutting tool |
| JP4409365B2 (en) | 2004-06-03 | 2010-02-03 | 株式会社ガステック | indicator |
| KR100556189B1 (en) | 2004-12-30 | 2006-03-06 | 이화다이아몬드공업 주식회사 | Cutting segment for cutting tool and cutting tools |
| KR100680850B1 (en) * | 2005-04-20 | 2007-02-09 | 이화다이아몬드공업 주식회사 | Segment for Diamond Tool and Diamond Tool Having the Segment |
| AU2006237767B8 (en) * | 2005-04-21 | 2011-12-01 | Ehwa Diamond Industrial Co., Ltd. | Cutting segment for cutting tool and cutting tools |
| US7178517B1 (en) * | 2006-01-31 | 2007-02-20 | Fang-Chun Yu | Diamond saw blade for milling |
-
2005
- 2005-02-15 KR KR1020050012458A patent/KR100597717B1/en active IP Right Grant
-
2006
- 2006-02-13 US US11/908,067 patent/US8028687B2/en not_active Expired - Fee Related
- 2006-02-13 CA CA2597284A patent/CA2597284C/en not_active Expired - Fee Related
- 2006-02-13 CN CNB2006800050517A patent/CN100563890C/en not_active Expired - Fee Related
- 2006-02-13 JP JP2007555028A patent/JP4724185B2/en not_active Expired - Fee Related
- 2006-02-13 EP EP06715958.2A patent/EP1937437B1/en not_active Expired - Fee Related
- 2006-02-13 AU AU2006214879A patent/AU2006214879B2/en not_active Ceased
- 2006-02-13 BR BRPI0607295-0A patent/BRPI0607295B1/en not_active IP Right Cessation
- 2006-02-13 MX MX2007009851A patent/MX2007009851A/en active IP Right Grant
- 2006-02-13 WO PCT/KR2006/000507 patent/WO2006088302A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| AU2006214879B2 (en) | 2011-09-29 |
| BRPI0607295B1 (en) | 2020-02-11 |
| CA2597284C (en) | 2010-06-15 |
| MX2007009851A (en) | 2007-10-03 |
| AU2006214879A1 (en) | 2006-08-24 |
| BRPI0607295A2 (en) | 2009-08-25 |
| JP2008529844A (en) | 2008-08-07 |
| JP4724185B2 (en) | 2011-07-13 |
| KR100597717B1 (en) | 2006-07-10 |
| EP1937437A4 (en) | 2012-04-11 |
| EP1937437B1 (en) | 2016-04-13 |
| WO2006088302A1 (en) | 2006-08-24 |
| EP1937437A1 (en) | 2008-07-02 |
| US8028687B2 (en) | 2011-10-04 |
| CN101119822A (en) | 2008-02-06 |
| CN100563890C (en) | 2009-12-02 |
| US20080163857A1 (en) | 2008-07-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |
Effective date: 20210831 |
|
| MKLA | Lapsed |
Effective date: 20200213 |