CA2632515A1 - Wire comb - Google Patents

Wire comb Download PDF

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Publication number
CA2632515A1
CA2632515A1 CA002632515A CA2632515A CA2632515A1 CA 2632515 A1 CA2632515 A1 CA 2632515A1 CA 002632515 A CA002632515 A CA 002632515A CA 2632515 A CA2632515 A CA 2632515A CA 2632515 A1 CA2632515 A1 CA 2632515A1
Authority
CA
Canada
Prior art keywords
wire
circuit board
comb
wire comb
over mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002632515A
Other languages
French (fr)
Other versions
CA2632515C (en
Inventor
Steven F. Brown
Robert V. Seifert, Jr.
Philip M. Kirshtein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vertiv IT Systems Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CA2714089A priority Critical patent/CA2714089C/en
Priority to CA2714086A priority patent/CA2714086C/en
Publication of CA2632515A1 publication Critical patent/CA2632515A1/en
Application granted granted Critical
Publication of CA2632515C publication Critical patent/CA2632515C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/026—Spark gaps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/942—Comblike retainer for conductor

Abstract

An improved approach is provided for mounting individual wires from multi-wire cables onto circuit boards. A wire comb is mounted adjacent one or more ends of the circuit board to permit a rapid yet positive way to space apart individual wires, to hold them in place; and to permit welding or soldering of the wires to the appropriate connections or the circuit board during an overmolding process.

Claims (38)

1. A wire comb comprising:
a base, at least one mounting pin extending outwardly from said base, and at least one wire mount area defined by a shaped opening that is constructed and adapted to receive and hold a portion of a wire.
2. The wire comb of claim 1, wherein the wire mount area comprises an upstanding wall having a plurality of spaced apart shaped wire openings formed therein.
3. The wire comb of claim 1, wherein the shaped opening is provided in the base.
4. The wire comb of claim 1, wherein the shaped opening includes a wire engaging portion.
5. The wire comb of claim 1, wherein the shaped opening includes an upper constricted portion and a lower wire engaging portion.
6. The wire comb of claim 6, wherein the constricted portion includes opposing parallel surfaces.
7. The wire comb of claim 6, wherein the wire engaging portion includes a circular shaped recess.
8. The wire comb of claim 2, further including two parallel spaced apart upstanding wall each containing a plurality of shaped wire openings therein.
9. The wire comb of claim 8, wherein the wire openings in each of the two parallel spaced apart upstanding walls include openings that are directly aligned with one another.
10. The wire comb of claim 8, wherein three pairs of opposing wire openings are provided.
11. The wire comb of claim 8, wherein six pairs of opposing wire openings are provided.
12. The wire comb of claim 8, wherein eight pairs of opposing wire openings are provided.
13. A circuit board assembly comprising a board having upper and lower surfaces, opposing ends and side edges, at least one wire comb mounted on said upper surface and adjacent one end thereof.
14. The circuit board assembly of claim 13, further including a second wire comb on said upper surface adjacent an opposite end thereof.
15. The circuit board assembly of claim 13, further including a third wire comb on the bottom surface adjacent said opposite end.
16. The circuit board assembly of claim 13 wherein said at least one wire comb includes a base, at least one mounting pin extending outwardly from said base, and at least one wire mount area defined by a shaped opening that receives and holds a portion of a wire.
17. The circuit board assembly of claim 16 wherein the base overlies said circuit board and a plurality of spark gaps formed in the surface of said circuit board.
18. The circuit board assembly of claim 16 further including a plurality of spark gaps formed in the circuit board adjacent at least one of the opposing ends and wherein the wire comb overlies said plurality of spark gaps.
19. The circuit board assembly of claim 18 wherein the at least one wire comb forms a chamber between the base and the circuit board at each of the plurality of spark gaps.
20. The circuit board assembly of claim 18, further including a plurality of wire combs mounted at spaced apart locations around side edges of the circuit board.
21. A method of manufacturing a cable system having an electronic circuit therein, the circuit being on a circuit board, the method comprising:
attaching at least one wire comb to the circuit board;
inserting at least one wire into said at least one comb, and electrically connecting said at least one wire to said circuit board; and forming an over mold of said circuit board.
22. The method of manufacturing as in claim 21, further including the step of mounting the wire comb in a flush manner relative to the circuit board so that the wire comb overlies at least one spark gap formed in the circuit board thereby providing a seal over the at least one spark gap.
23. The method of manufacturing as in claim 21, wherein the circuit board includes a plurality of spark gaps adjacent at least one end thereof and the step of attaching at least one wire comb provides a seal between the wire comb and the circuit board thereby protecting the spark gaps.
24. The method as in claim 21, wherein the step of forming of an over mold includes the steps of:

forming a first over mold from a first molding material covering the circuit board and the at least one wire comb, and forming a second over mold from a second molding material covering at least the first over mold material.
25. The method of manufacturing as in claim 24, wherein the first and second molding materials comprise the same material.
26. The method of manufacturing as in claim 24, wherein the first and second molding materials comprise different materials.
27. The method as in claim 21, wherein the step of forming of an over mold includes the steps of:
forming a first over mold from a first molding material covering the circuit board and the at least one wire comb, and forming a second over mold from a second molding material covering at least the first over mold material.
28. The method of manufacturing as in claim 27, wherein the first and second molding materials comprise the same material.
29. The method of manufacturing as in claim 27, wherein the first and second molding, materials comprise different materials.
30. The method as in claim 23, wherein the step of forming of an over mold includes the steps of:

forming a first over mold from a first molding material covering the circuit board and the at least one wire comb, and forming a second over mold from a second molding material covering at least the first over mold material.
31. The method of manufacturing as in claim 30, wherein the first and second molding materials comprise the same material.
32. The method of manufacturing as in claim 30, wherein the first and second molding materials comprise different materials.
33. A circuit board assembly comprising:
a board having upper and lower surfaces;
opposing ends and side edges;

at least one wire comb mounted on said upper surface and adjacent one end thereof;

a second wire comb on said upper surface adjacent an opposite end thereof;
a third wire comb on the bottom surface adjacent said opposite end.
34. The circuit board assembly of claim 33, wherein said at least one wire comb includes a base, at least one mounting pin extending outwardly from said base, and at least one wire mount area defined by a shaped opening that receives and holds a portion of a wire.
35. A method of manufacturing a cable system having an electronic circuit therein, the circuit being on a circuit board, the method comprising:
attaching at least one wire comb to the circuit board;

inserting at least one wire into said at least one comb, and electrically connecting said at least one wire to said circuit board;
forming a first over mold from a first molding material covering the circuit board and the at least one wire comb, and forming a second over mold from a second molding material covering at least the first over mold material.
36. The method of manufacturing as in claim 35, wherein the first and second molding materials comprise the same material.
37. The method of manufacturing as in claim 35, wherein the first and second molding materials comprise different materials.
38. The method of manufacturing as in claim 35, wherein the first molding material comprises a polyurethane material and wherein the second molding material comprises a PVC material.
CA2632515A 2005-12-07 2006-12-05 Wire comb Active CA2632515C (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CA2714089A CA2714089C (en) 2005-12-07 2006-12-05 Wire comb
CA2714086A CA2714086C (en) 2005-12-07 2006-12-05 Wire comb

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US11/295,441 US7189103B1 (en) 2005-12-07 2005-12-07 Wire comb overlying spark gap
US11/295,441 2005-12-07
US11/497,317 2006-08-02
US11/497,317 US7275953B2 (en) 2005-12-07 2006-08-02 Wire comb
US11/518,995 US7229310B1 (en) 2005-12-07 2006-09-12 Circuit board assembly with wire comb
US11/518,995 2006-09-12
PCT/US2006/046194 WO2007067468A2 (en) 2005-12-07 2006-12-05 Wire comb

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CA2714086A Division CA2714086C (en) 2005-12-07 2006-12-05 Wire comb
CA2714089A Division CA2714089C (en) 2005-12-07 2006-12-05 Wire comb

Publications (2)

Publication Number Publication Date
CA2632515A1 true CA2632515A1 (en) 2007-06-14
CA2632515C CA2632515C (en) 2011-11-08

Family

ID=37833336

Family Applications (3)

Application Number Title Priority Date Filing Date
CA2632515A Active CA2632515C (en) 2005-12-07 2006-12-05 Wire comb
CA2714086A Active CA2714086C (en) 2005-12-07 2006-12-05 Wire comb
CA2714089A Active CA2714089C (en) 2005-12-07 2006-12-05 Wire comb

Family Applications After (2)

Application Number Title Priority Date Filing Date
CA2714086A Active CA2714086C (en) 2005-12-07 2006-12-05 Wire comb
CA2714089A Active CA2714089C (en) 2005-12-07 2006-12-05 Wire comb

Country Status (7)

Country Link
US (3) US7189103B1 (en)
EP (1) EP1969677A4 (en)
CA (3) CA2632515C (en)
IL (1) IL191985A0 (en)
MY (1) MY148624A (en)
TW (1) TW200805832A (en)
WO (1) WO2007067468A2 (en)

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Also Published As

Publication number Publication date
EP1969677A2 (en) 2008-09-17
CA2714089C (en) 2013-06-25
US7229310B1 (en) 2007-06-12
US20070128923A1 (en) 2007-06-07
WO2007067468A2 (en) 2007-06-14
MY148624A (en) 2013-05-15
WO2007067468A3 (en) 2009-04-30
IL191985A0 (en) 2008-12-29
EP1969677A4 (en) 2012-11-28
CA2714089A1 (en) 2007-06-14
US20070128920A1 (en) 2007-06-07
CA2632515C (en) 2011-11-08
US7189103B1 (en) 2007-03-13
US7275953B2 (en) 2007-10-02
CA2714086A1 (en) 2007-06-14
TW200805832A (en) 2008-01-16
CA2714086C (en) 2013-06-11

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