CA973979A - Firing process for forming a multilayer glass-metal module - Google Patents

Firing process for forming a multilayer glass-metal module

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Publication number
CA973979A
CA973979A CA150,293A CA150293A CA973979A CA 973979 A CA973979 A CA 973979A CA 150293 A CA150293 A CA 150293A CA 973979 A CA973979 A CA 973979A
Authority
CA
Canada
Prior art keywords
forming
firing process
multilayer glass
metal module
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA150,293A
Other versions
CA150293S (en
Inventor
Melvin N. Turetzky
Perry R. Langston (Jr.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of CA973979A publication Critical patent/CA973979A/en
Expired legal-status Critical Current

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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing
CA150,293A 1971-08-27 1972-08-24 Firing process for forming a multilayer glass-metal module Expired CA973979A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17553071A 1971-08-27 1971-08-27
US05/175,529 US3968193A (en) 1971-08-27 1971-08-27 Firing process for forming a multilayer glass-metal module

Publications (1)

Publication Number Publication Date
CA973979A true CA973979A (en) 1975-09-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
CA150,293A Expired CA973979A (en) 1971-08-27 1972-08-24 Firing process for forming a multilayer glass-metal module

Country Status (7)

Country Link
US (2) US3726002A (en)
BE (1) BE787292A (en)
CA (1) CA973979A (en)
CH (1) CH542569A (en)
ES (1) ES406107A1 (en)
FR (1) FR2150923B1 (en)
GB (2) GB1366601A (en)

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Also Published As

Publication number Publication date
GB1366601A (en) 1974-09-11
FR2150923B1 (en) 1976-05-21
BE787292A (en) 1972-12-01
CH542569A (en) 1973-09-30
US3726002A (en) 1973-04-10
ES406107A1 (en) 1976-01-16
US3968193A (en) 1976-07-06
GB1366602A (en) 1974-09-11
FR2150923A1 (en) 1973-04-13

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